CN212436175U

CN212436175U - Dust absorption heat dissipation formula electronic components encapsulation

Info

Publication number: CN212436175U
Application number: CN202021224949.7U
Authority: CN
Inventors: 陈凯伦
Original assignee: Riyue Technology Liaoyang Co ltd
Current assignee: Riyue Technology Liaoyang Co ltd
Priority date: 2020-06-29
Filing date: 2020-06-29
Publication date: 2021-01-29
Anticipated expiration: 2030-06-29

Abstract

The utility model discloses a dust absorption heat dissipation formula electronic components encapsulation, including encapsulation room and encapsulation lid, the front surface mounting of encapsulation room has the encapsulation lid, the inside bottom rigid coupling of encapsulation room has the encapsulation base, electronic components is installed to the top of encapsulation base. This dust absorption heat dissipation formula electronic components encapsulation, through the encapsulation room, the encapsulation lid, the encapsulation base, electronic components, drive hot mechanism, the dust remover, the fan, the cooperation between dust cover and the exhaust hole, the heat that the during period can produce electronic components because of the heat conduction function that the heat conduction cover possesses the excellence can conduct and drive hot, can carry out the excellent heat dissipation to electronic components, the less high-usage of cooling structure laying range, and inside need not to use the sensor, can not increase electronic components's heat dissipation burden, can reduce the holistic cost of making of encapsulation, practicality can promote to do benefit to and use widely.

Description

Dust absorption heat dissipation formula electronic components encapsulation

Technical Field

The utility model relates to an electronic components encapsulates technical field, specifically is a dust absorption heat dissipation formula electronic components encapsulation.

Background

Electronic components encapsulation is used for saving electronic components's use, and present electronic components encapsulation is mostly closed shell structure, in case electronic components takes place to damage because of overheated and need maintain the time, just need carry out the tweezers through appurtenance and get, nevertheless to electronic components encapsulation be slim and long and thin type, will have when the tweezers get the inconvenient problem of tweezers get, if certain region need carry out the damaged maintenance operation of large tracts of land, the work degree of difficulty will greatly increased. Therefore, how in time to cool down electronic components encapsulation is a problem of treating promptly, for example application number is 201620723189.1's patent, encircle the room including encapsulation room and water-cooling, the water-cooling encircles the roof portion and is equipped with inlet port and exhaust hole, the indoor gaseous heat conduction spiral pipe that is equipped with of water-cooling encircleing, though can obviously promote the heat dissipation effect of the inside electronic components of encapsulation, but still there is certain drawback at the practical application in-process, for example it is great to lay the face at the inside cooling structure scope of encapsulation setting, the higher heat dissipation utilization ratio of running cost is ideal inadequately, and inside a large amount of sensors that set up, certain heat can be sent in sensor operation self, increase electronic components's heat dissipation burden, point out the higher practicality of cost and generally be unfavorable for using widely simultaneously.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a dust absorption heat dissipation formula electronic components encapsulation to the setting that proposes in solving above-mentioned background art is laid the face great at the inside cooling structure scope of encapsulation, and the higher heat dissipation utilization ratio of running cost is ideal inadequately, and inside sets up a large amount of sensors, and sensor operation self can send certain heat, increases electronic components's heat dissipation burden, points out the higher practicality of cost simultaneously and is unfavorable for generally using problem widely.

In order to achieve the above object, the utility model provides a following technical scheme: a dust absorption heat dissipation type electronic component package comprises a package chamber and a package cover, wherein the package cover is mounted on the front surface of the package chamber, a package base is fixedly connected to the bottom end of the interior of the package chamber, an electronic component is mounted above the package base, a heat dissipation mechanism is arranged on the outer side of the electronic component, a dust remover is mounted on the rear side surface of the package chamber, a fan is mounted at the bottom end of the left side of the inner wall of the package chamber, dust covers are fixedly connected to the bottom ends of the left side and the right side of the package chamber, and a plurality of exhaust holes are formed in the bottom end of the right side of the;

the heat dissipation mechanism comprises a heat conduction cover, a vertical rod, a cavity box, a spongy cushion and a cotton rope;

the heat conduction cover cup joints the outer wall at electronic components, the equal rigid coupling in lower surface four corners of heat conduction cover has the pole setting, the other end rigid coupling of pole setting has the cavity box, the foam-rubber cushion has been placed to the upper surface of cavity box, the lower surface rigid coupling of foam-rubber cushion has a plurality of cotton ropes, a part of cotton rope runs through the cavity box. Can carry out excellent heat dissipation to electronic components, the less high-usage of scope is laid to the cooling structure, and inside need not to use the sensor, can not increase electronic components's heat dissipation burden, can reduce the holistic cost of making of encapsulation, and practicality can promote and do benefit to using widely.

Preferably, a plurality of through holes are formed in the outer side surface of the spongy cushion. The through holes can increase the contact area of the spongy cushion and the air flow, and heat dissipation is facilitated.

Preferably, a viewing window is installed on a front surface of the encapsulation cover. The observation window is made for transparent PVC material, and the operating personnel of being convenient for observes the inside condition of encapsulation room.

Preferably, the heat conduction cover and the center point of the spongy cushion are both positioned on the same horizontal vertical line. The sponge cushion can uniformly absorb heat of the heat conducting cover.

Preferably, four of the vertical rods are centrosymmetric relative to the central point of the heat conducting cover. The vertical rod can uniformly apply force to the heat conducting cover.

Preferably, a water injection mechanism is arranged on the right side of the cavity box;

the water injection mechanism comprises a cavity block, a water injection port, a connecting pipe and a transparent strip;

the cavity piece is located the right side of cavity box, the left side bottom rigid coupling of cavity piece has the connecting pipe, the other end and the cavity box of connecting pipe are fixed to be linked to each other, the water filling port has been seted up on the front surface top of cavity piece, the front surface left side of cavity piece is provided with the transparent strip. The operation of adding water to the inside of the cavity box is convenient for operators to timely, and the stable operation of the heat dissipation mechanism can be guaranteed.

Preferably, scales are processed on the outer side of the transparent strip. The operating personnel of being convenient for knows cavity block inside water level.

Preferably, a protection mechanism is arranged on the outer side of the heat conduction cover;

the protection mechanism comprises a cover plate and a rubber strip;

the cover plate is sleeved on the outer wall of the heat conduction cover, rubber strips are fixedly connected to the inner wall and the outer wall of the cover plate, the rubber strips are tightly abutted to the inner wall of the packaging chamber, and the rubber strips are tightly abutted to the outer wall of the heat conduction cover. Can prevent to encapsulate and contact between indoor moisture and the electronic components, do benefit to electronic components's permanent use.

Compared with the prior art, the beneficial effects of the utility model are that: this dust absorption heat dissipation formula electronic components encapsulation for the conventional art, has following advantage:

through the cooperation between the packaging chamber, the packaging cover, the packaging base, the electronic component, the heat dissipation mechanism, the dust remover, the fan, the dust cover and the exhaust holes, when the electronic component is installed and used, the fan is electrified to enable the right side of the fan to generate gas flow to be exhausted from the inside of the exhaust holes, clear water in the cavity box can be transferred to the spongy cushion through a cotton rope during the use, the spongy cushion can be relatively wet, residual water stains in the spongy cushion can be evaporated during the gas blowing period to absorb a large amount of heat energy around, heat generated by the electronic component can be conducted and dissipated due to the excellent heat conduction function of the heat conduction cover during the period, the electronic component can be excellently dissipated, the laying range of the cooling structure is small, the utilization rate is high, a sensor is not required to be used inside, the heat dissipation burden of the electronic component cannot be increased, and the manufacturing cost of the whole packaging can be reduced, the practicality can be promoted and is favorable for popularization and use.

Through the cooperation between encapsulation room, encapsulation lid, heat driving mechanism and the water injection mechanism, operating personnel can be through the clear water surplus of the comparatively audio-visual control portion of knowing cavity box of transparent strip in the permanent use, and the timely operation of adding water to the cavity box of operating personnel of being convenient for can ensure the steady operation of heat driving mechanism.

Through the cooperation between encapsulation room, encapsulation lid, encapsulation base, electronic components, heat dissipation mechanism and the protection machanism, cover plate and the rubber sleeve of setting between heat conduction cover and encapsulation room inner wall can effectually carry out the separation with the moisture of bottom, can prevent to contact between encapsulation room inside moisture and the electronic components, do benefit to electronic components's permanent use.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a front cross-sectional view of FIG. 1;

FIG. 3 is a schematic view of a connection structure of the package base, the heat conductive cap and the cavity box of FIG. 2

Fig. 4 is a schematic view of a connection structure of the package base, the heat conducting cover and the protection mechanism in fig. 2.

In the figure: 1. encapsulation room, 2, encapsulation lid, 3, encapsulation base, 4, electronic components, 5, heat driving mechanism, 501, heat conduction cover, 502, pole setting, 503, cavity box, 504, foam-rubber cushion, 505, cotton rope, 6, water injection mechanism, 601, cavity piece, 602, water filling port, 603, connecting pipe, 604, transparent strip, 7, protection mechanism, 701, cover plate, 702, rubber strip, 8, dust remover, 9, fan, 10, dust cover, 11, through-hole, 12, scale, 13, observation window, 14, exhaust hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a dust absorption heat dissipation type electronic component package comprises a package chamber 1 and a package cover 2, the package cover 2 is installed on the front surface of the package chamber 1, a package base 3 is fixedly connected to the bottom end inside the package chamber 1, an electronic component 4 is installed above the package base 3, a heat dissipation mechanism 5 is arranged on the outer side of the electronic component 4, a dust remover 8 is installed on the rear side surface of the package chamber 1, a fan 9 is installed at the bottom end of the left side of the inner wall of the package chamber 1, the fan 9 is a micro fan of which the model is RFB1804, the power line of the fan 9 is in butt joint with an external power supply device, dust covers 10 are fixedly connected to the bottom ends of the left side and the right side of the package chamber 1, a plurality of exhaust holes 14 are formed in the bottom end of the right side of the inner wall of the package chamber 1, the heat dissipation mechanism 5 comprises a heat conduction cover 501, a vertical rod 502, a cavity box 503, a, the heat conducting cover has excellent heat conducting performance, four corners of the lower surface of the heat conducting cover 501 are fixedly connected with upright posts 502, the other ends of the upright posts 502 are fixedly connected with cavity boxes 503, a proper amount of clear water is injected into the cavity boxes 503, the upper surface of the cavity boxes 503 is provided with a sponge cushion 504, the lower surface of the sponge cushion 504 is fixedly connected with a plurality of cotton ropes 505, the cotton ropes 505 are contacted with the clear water in the cavity boxes 503, one part of the cotton ropes 505 penetrates through the cavity boxes 503, the outer side surface of the sponge cushion 504 is provided with a plurality of through holes 11, the through holes 11 can increase the contact area of the sponge cushion 504 and air flow, heat dissipation is facilitated, the front surface of the packaging cover 2 is provided with an observation window 13, the observation window 13 is made of transparent PVC material, operators can observe the internal conditions of the packaging chamber 1 conveniently, the center points of the heat conducting cover 501 and the sponge cushion 504 are positioned on the same horizontal vertical, the four vertical rods 502 are centrosymmetric with respect to the center point of the heat conducting cover 501, so that the vertical rods 502 can uniformly apply force to the heat conducting cover 501.

Cavity box 503's right side is equipped with water injection mechanism 6, water injection mechanism 6 includes cavity piece 601, water filling port 602, connecting pipe 603 and transparency 604, cavity piece 601 is located cavity box 503's right side, cavity piece 601's left side bottom rigid coupling has connecting pipe 603, connecting pipe 603 all communicates with cavity piece 601 and cavity box 503 each other, connecting pipe 603's the other end and cavity box 503 are fixed continuous, water filling port 602 has been seted up on cavity piece 601's front surface top, cavity piece 601's front surface left side is provided with transparency 604, transparency 604 is made for the PVC material, be convenient for operating personnel knows the inside water level of cavity piece 601, the outside processing of transparency 604 has scale 12, be convenient for operating personnel knows the inside water level of cavity piece 601.

The outside of heat conduction cover 501 is equipped with protection machanism 7, and protection machanism 7 includes cover plate 701 and rubber strip 702, and cover plate 701 cup joints the outer wall at heat conduction cover 501, and the equal rigid coupling of two inside and outside walls of cover plate 701 has rubber strip 702, and outside rubber strip 702 offsets tightly with the inner wall of encapsulation room 1, and inboard rubber strip 702 offsets tightly with heat conduction cover 501's outer wall, and rubber strip 702 makes for the rubber material, has certain toughness.

When dust absorption heat dissipation formula electronic components encapsulation, in-process using, when electronic components 4 installation is accomplished the use, operating personnel is circular telegram fan 9, can make the right side of fan 9 produce the inside discharge of gas flow from exhaust hole 14, and the dust cover 10 in the outside can reduce outside dust impurity and enter into encapsulation room 1 inside probability, the inside clear water part of cavity box 503 can pass to foam-rubber cushion 504 through cotton rope 505 during, can make foam-rubber cushion 504 comparatively moist, can make remain the inside water stain of foam-rubber cushion 504 during gas blows and evaporate and can absorb a large amount of heat energy to around, set up cover plate 701 and rubber sleeve 702 between heat conduction cover 501 and encapsulation room 1 inner wall, can effectually obstruct the moisture of bottom, can prevent to contact between encapsulation room 1 inside moisture and electronic components 4, during because of heat conduction cover 501 possesses excellent heat conduction function can conduct the heat that electronic components 4 produced Dispel the heat, can carry out excellent heat dissipation to electronic components 4, the less high-usage of scope is laid to the cooling structure, and inside need not to use the sensor, can not increase electronic components 4's heat dissipation burden, can reduce the holistic cost of making of encapsulation, in the permanent use process operating personnel can be through the clear water surplus of comparatively audio-visual control portion of knowing cavity box 503 of transparent strip 604, the timely operation of adding water to cavity box 503 of operating personnel of being convenient for, can ensure the steady operation of dispelling heat mechanism 5.

In the description of the present invention, it is to be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top", "inner", "front", "center", "both ends", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "disposed," "connected," "fixed," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a dust absorption heat dissipation formula electronic components encapsulation, includes encapsulation room (1) and encapsulation lid (2), the front surface mounting of encapsulation room (1) has encapsulation lid (2), its characterized in that: the bottom end of the inner part of the packaging chamber (1) is fixedly connected with a packaging base (3), an electronic component (4) is installed above the packaging base (3), a heat dissipation mechanism (5) is arranged on the outer side of the electronic component (4), a dust remover (8) is installed on the rear side surface of the packaging chamber (1), a fan (9) is installed at the bottom end of the left side of the inner wall of the packaging chamber (1), dust covers (10) are fixedly connected to the bottoms of the left side and the right side of the packaging chamber (1), and a plurality of exhaust holes (14) are formed in the bottom end of the right side of the inner wall of the packaging chamber (1);

the heat dissipation mechanism (5) comprises a heat conduction cover (501), a vertical rod (502), a cavity box (503), a sponge pad (504) and a cotton rope (505);

the outer wall at electronic components (4) is cup jointed in heat conduction cover (501), the equal rigid coupling in lower surface four corners of heat conduction cover (501) has pole setting (502), there is cavity box (503) the other end rigid coupling of pole setting (502), foam-rubber cushion (504) have been placed to the upper surface of cavity box (503), the lower surface rigid coupling of foam-rubber cushion (504) has a plurality of cotton ropes (505), cavity box (503) is run through to a part of cotton rope (505).

2. The dust-absorbing heat-dissipating electronic component package according to claim 1, wherein: the outer side surface of the spongy cushion (504) is provided with a plurality of through holes (11).

3. The dust-absorbing heat-dissipating electronic component package according to claim 1, wherein: and an observation window (13) is arranged on the front surface of the packaging cover (2).

4. The dust-absorbing heat-dissipating electronic component package according to claim 1, wherein: the heat conducting cover (501) and the center point of the spongy cushion (504) are both positioned on the same horizontal vertical line.

5. The dust-absorbing heat-dissipating electronic component package according to claim 1, wherein: the four vertical rods (502) are in central symmetry relative to the central point of the heat conducting cover (501).

6. The dust-absorbing heat-dissipating electronic component package according to claim 1, wherein: a water injection mechanism (6) is arranged on the right side of the cavity box (503);

the water injection mechanism (6) comprises a cavity block (601), a water injection port (602), a connecting pipe (603) and a transparent strip (604);

cavity piece (601) are located the right side of cavity box (503), the left side bottom rigid coupling of cavity piece (601) has connecting pipe (603), the other end and the cavity box (503) of connecting pipe (603) are fixed continuous, water filling port (602) have been seted up on the front surface top of cavity piece (601), the front surface left side of cavity piece (601) is provided with transparent strip (604).

7. The dust-absorbing heat-dissipating electronic component package according to claim 6, wherein: scales (12) are processed on the outer side of the transparent bar (604).

8. The dust-absorbing heat-dissipating electronic component package according to claim 1, wherein: a protection mechanism (7) is arranged on the outer side of the heat conduction cover (501);

the protection mechanism (7) comprises a cover plate (701) and a rubber strip (702);

the cover plate (701) is sleeved on the outer wall of the heat conduction cover (501), the inner wall and the outer wall of the cover plate (701) are fixedly connected with rubber strips (702), the outer side of each rubber strip (702) is tightly abutted to the inner wall of the packaging chamber (1), and the inner side of each rubber strip (702) is tightly abutted to the outer wall of the heat conduction cover (501).