CN212381553U

CN212381553U - Power supply device

Info

Publication number: CN212381553U
Application number: CN202020843029.7U
Authority: CN
Inventors: 吕菲; 杨永国
Original assignee: 8mm Technology Guangdong Co ltd
Current assignee: 8mm Technology Guangdong Co ltd
Priority date: 2020-05-19
Filing date: 2020-05-19
Publication date: 2021-01-19
Anticipated expiration: 2030-05-19

Abstract

A power supply device comprises a substrate, a circuit external member, a protective sleeve member and a heat dissipation external member, wherein the circuit external member comprises a circuit board, an interface end and a plurality of buffer columns, the protective sleeve member comprises a housing, an interface baffle plate and a strip-shaped cover plate, the heat dissipation external member comprises a baffle plate and a heat dissipation fan, each buffer column is used for supporting the circuit board, the circuit board can be effectively prevented from being damaged by vibration by the buffer columns, the housing is buckled on the substrate, the interface baffle plate, the housing and the baffle plate jointly form a relatively sealed accommodating channel, the heat dissipation fan is arranged on the baffle plate, the heat dissipation fan is used for ventilating and dissipating heat of the accommodating channel, the interface end passes through the interface baffle plate, the strip-shaped cover plate is arranged on the interface baffle plate, and the strip-shaped cover plate is used for shielding the interface end, thereby shielding and protecting the, meanwhile, the interface end can be effectively protected.

Description

Power supply device

Technical Field

The utility model relates to a technical field of power especially relates to a power supply unit.

Background

The rest cabin is a small-sized closed device capable of providing sleep for people, and facilities such as a bed, a digital television, an air conditioner, a sound equipment and the like are usually arranged in the rest cabin. The rest cabin is usually installed in public areas to provide temporary rest services for public people, and the shared rest cabin is gradually known by the public along with the development of sharing technology.

Since the rest compartment is provided with various electric equipment, such as an air conditioner, an oxygen supply facility, and the like, the rest compartment needs to be supplied with power, however, the current power supply mode for the rest compartment has the following problems:

firstly, because the rest cabin has more electric facilities and the power required by various electric facilities is larger, the power supply device can generate larger heat after working for a long time, the heat is overlarge, electronic devices and surrounding circuits are easy to burn, and finally the rest cabin is stopped due to faults;

secondly, the rest cabin is installed in a public area and needs to move according to the number of service people, namely, the rest cabin can move irregularly, an internal power supply device can be vibrated certainly in the moving process, and the current rest cabin lacks a damping measure aiming at the power supply device;

finally, the power supply interface of the current power supply device lacks effective protective measures, foreign matters easily fall into the power supply interface, and once the conductive foreign matters fall into the power supply interface, the problem of short circuit can be caused, so that potential safety hazards exist.

SUMMERY OF THE UTILITY MODEL

The utility model aims at overcoming the weak point among the prior art, providing one kind and can dispel the heat, prevent that the heat is too big, possess shock-absorbing function moreover, can also carry out the power supply unit of effective protection to power supply interface simultaneously.

The purpose of the utility model is realized through the following technical scheme:

a power supply apparatus comprising:

a substrate;

the circuit assembly comprises a circuit board, an interface end and a plurality of buffer columns, wherein each buffer column is arranged on the substrate respectively and is connected with the circuit board, and the interface end is arranged on the circuit board;

the protective sleeve piece comprises a housing, an interface baffle and a strip-shaped cover plate, wherein the housing is used for buckling the substrate so as to enable the housing and the substrate to form an accommodating channel, the circuit board is positioned in the accommodating channel, the housing is provided with an air inlet hole, the air inlet hole is communicated with the accommodating channel, the interface baffle is respectively connected with the substrate and the housing, the interface baffle is provided with a through hole, the interface end penetrates through the through hole, and the strip-shaped cover plate is used for being arranged on the interface baffle so as to enable the strip-shaped cover plate to shield the interface end; and

the heat dissipation sleeve comprises a partition plate and a heat dissipation fan, the partition plate is respectively connected with the substrate and the housing, heat dissipation holes are formed in the partition plate, and the heat dissipation fan is arranged on the partition plate.

In one embodiment, the interface baffle is provided with two protruding blocks, and the two protruding blocks are respectively located at one side of the through hole.

In one embodiment, the protruding block is provided with a limiting groove.

In one embodiment, the strip-shaped cover plate is provided with a limiting bulge, and the limiting bulge is accommodated in the limiting groove.

In one embodiment, the buffer post is provided with a locking groove, the circuit board is provided with a locking hole, and the buffer post is used for penetrating the locking hole so that the side wall part of the locking hole is locked in the locking groove.

In one embodiment, the substrate is provided with a plurality of mounting holes, and a space is arranged between the mounting holes.

In one embodiment, the buffer posts are plastic buffer posts.

In one embodiment, the protective sleeve further comprises a plurality of heat dissipation ribs, and each heat dissipation rib is arranged on the housing respectively.

In one embodiment, each of the heat dissipating ribs and the housing are integrally formed.

In one embodiment, the air inlet holes are arranged in a plurality, and intervals are arranged among the air inlet holes.

Compared with the prior art, the utility model discloses at least, following advantage has:

the utility model discloses a power supply unit, including base plate, circuit external member, protection sleeve spare and heat dissipation external member, the circuit external member includes circuit board, interface end and a plurality of buffering post, protection sleeve spare includes housing, interface baffle and bar apron, the heat dissipation external member includes baffle and radiator fan, each buffering post is used for supporting circuit board, utilize the buffering post can effectively prevent the circuit board to receive the vibrations damage, the housing is buckled on the base plate, interface baffle, housing and baffle have formed the relatively sealed accommodation channel jointly, radiator fan installs on the baffle, radiator fan is used for ventilating the accommodation channel and dispels the heat, interface end passes interface baffle, the bar apron is installed on interface baffle, the bar apron is used for sheltering from the interface end, thereby can shelter from the protection to the interface end, the utility model discloses a power supply unit, can dispel the heat, prevent the heat too big, and possess shock-absorbing function, meanwhile, the interface end can be effectively protected.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a power supply device according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a portion of the power supply apparatus shown in FIG. 1;

fig. 3 is a schematic structural view of the heat dissipation assembly shown in fig. 1.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

It is noted that as used herein, reference to an element being "connected" to another element also means that the element is "in communication" with the other element, and fluid can be in exchange communication between the two.

Referring to fig. 1, a power device 10 includes a substrate 100, a circuit assembly 200, a protective sleeve 300 and a heat dissipation assembly 400, wherein the circuit assembly 200 is mounted on the substrate 100, the protective sleeve 300 is also mounted on the substrate 100, the protective sleeve 300 is used for shielding and protecting the circuit assembly 200, and the heat dissipation assembly 400 is mounted on the substrate 100, wherein the substrate 100, the protective sleeve 300 and the heat dissipation assembly 400 can form a closed space, the circuit assembly 200 is located in the closed space, and then the closed space is subjected to circulating air supply and heat dissipation by the heat dissipation assembly 400, so that the closed space does not burn the circuit assembly 200 due to over-high temperature, and the circuit assembly 200 is provided with a shock-proof assembly, so as to effectively prevent the power device 10 from being damaged by vibration, and the protective sleeve 300 can protect a circuit interface of the circuit assembly 200 to prevent foreign matters from falling into the circuit interface, the short circuit problem of the power supply device 10 is prevented, and the safety of the power supply device 10 is improved.

Referring to fig. 1 again, the circuit assembly 200 includes a circuit board 210, an interface end 220 and a plurality of buffer posts 230, wherein each buffer post 230 is disposed on the substrate 100, each buffer post 230 is connected to the circuit board 210, and the interface end 220 is disposed on the circuit board 210.

It should be noted that each buffer post 230 is respectively installed on the substrate 100, and then each buffer post 230 is used to support the circuit board 210, it should be noted that the buffer posts 230 are made of a flexible material, for example, the buffer posts 230 may be made of plastic, and the circuit board 210 is supported by the buffer posts 230, in one embodiment, the substrate 100 is a metal plate, and the circuit board 210 is supported by the buffer posts 230, so that a safety gap can be maintained between the buffer posts 230 and the substrate 100, and an electronic device or a circuit on the circuit board 210 can be prevented from contacting the substrate 100, thereby effectively preventing a short circuit problem, and improving the safety of the power supply apparatus 10; the interface end 220 is installed on the circuit board 210, the interface end 220 is used for providing an externally inserted port and providing a power interface for external electric equipment, in one embodiment, an insertion port facilitating insertion of a wire rod is formed in the interface end 220, a screw used for tightly pushing the wire rod is also arranged, and the screw is connected with the insertion port through a thread.

Referring to fig. 2, in an embodiment, the buffer post 230 has a locking groove 231, the circuit board 210 has a locking hole 211, and the buffer post 230 is used for penetrating the locking hole 211, so that a sidewall portion of the locking hole 211 is locked in the locking groove 231.

It should be noted that each of the buffer posts 230 is provided with a plurality of retaining grooves 231, and then the circuit board 210 is provided with a plurality of retaining holes 211, in one embodiment, each of the buffer posts 230 respectively penetrates through each of the retaining holes 211 in a one-to-one correspondence manner, so that the sidewall portion of each of the retaining holes 211 is retained in the retaining groove 231 of each of the buffer posts 230, and finally the circuit board 210 is retained on the buffer post 230, and it should be noted that the buffer posts 230 are made of a soft colloid, so that the circuit board can be more easily inserted into the retaining holes 211; in one embodiment, the buffer post 230 and the circuit board 210 may be screwed together, and specifically, the circuit board 210 is fixed on the buffer post 230 by screwing the screw into the buffer post 230 after passing through the fastening hole 211.

Referring to fig. 1 again, the protective cover 300 includes a cover 310, an interface baffle 320 and a strip-shaped cover plate 330, the cover 310 is used for fastening the substrate 100, so that the cover 310 and the substrate 100 form an accommodating channel, the circuit board 210 is located in the accommodating channel, the cover 310 is provided with an air inlet 311, the air inlet 311 is communicated with the accommodating channel, the interface baffle 320 is respectively connected with the substrate 100 and the cover 310, the interface baffle 320 is provided with a through hole 321, the interface end 220 penetrates through the through hole 321, and the strip-shaped cover plate 330 is used for being disposed on the interface baffle 320, so that the strip-shaped cover plate 330 shields the interface end 220.

It should be noted that, the housing 310 and the substrate 100 are fastened together, a receiving channel with two ends connected to each other is formed between the housing 310 and the substrate 100, the circuit board 210 is located in the receiving channel, the circuit board 210 is protected by the housing 310, the interface baffle 320 is connected to the substrate 100 and the housing 310, and the interface baffle 320 is located at one end of the receiving channel, that is, one end of the receiving channel is blocked by the interface baffle 320, so that only one opening remains in the receiving channel, the heat dissipation assembly 400 is installed on the remaining opening, the housing 310 is provided with an air inlet 311, air can flow into the receiving channel from the air inlet 311 and flow out to the outside through the heat dissipation assembly 400, and thus, by using the flow of air, heat can be dissipated in time in the receiving channel, and excessive heat can be prevented from being accumulated on the circuit board 210; a through hole 321 is formed in the interface baffle 320, and the interface end 220 passes through the through hole 321, so that external electric equipment can be connected to the interface end 220; the strip-shaped cover plate 330 is disposed on the interface baffle 320, and the strip-shaped cover plate 330 is disposed at the through hole 321, so that the strip-shaped cover plate 330 can shield the interface end 220 disposed at the through hole 321 to protect the interface end 220, specifically, since the interface end 220 is used for connecting with the external wire of the electric device, that is, there is a bare wire at the position of the interface end 220, in an embodiment, since the wire is tightly fixed by using a screw, and the strip-shaped cover plate 330 is used for shielding and protecting the interface end 220, the foreign matter can be effectively prevented from falling onto the screw, thereby preventing the short circuit problem.

Referring to fig. 1 and 3, the heat dissipation assembly 400 includes a partition 410 and a heat dissipation fan 420, the partition 410 is connected to the substrate 100 and the housing 310, the partition 410 is provided with a heat dissipation hole 411, and the heat dissipation fan 420 is disposed on the partition 410.

It should be noted that, the housing 310, the substrate 100 and the interface baffle 320 make the accommodating channel have only one opening, the partition 410 is located on the opening to make the accommodating channel become a relatively closed space, then the partition 410 is provided with the heat dissipating hole 411, the heat dissipating fan 420 is installed on the partition 410, and the heat dissipating fan 420 is located at the heat dissipating hole 411, so that when the heat dissipating fan 420 rotates, air enters the accommodating channel from the air inlet 311 of the housing 310, and then flows through the heat dissipating fan 420 from the heat dissipating hole 411 to return to the outside again, so that the circuit board 210 located in the accommodating channel can be effectively dissipated by air flow, and the circuit board is prevented from being burnt out due to over-high temperature.

Referring to fig. 3 again, in an embodiment, the heat dissipation assembly 400 further includes a protection net 430, the protection net is disposed in the heat dissipation holes 411, and the protection net 430 is disposed to protect the heat dissipation fan 420.

Referring to fig. 1 again, the interface baffle 320 is provided with two protruding blocks 322, the two protruding blocks 322 are respectively located at one side of the through hole 321, in one protruding block 322, a limiting groove 322a is formed on the protruding block 322, a limiting protrusion 331 is arranged on the strip-shaped cover plate 330, and the limiting protrusion 331 is accommodated in the limiting groove 322 a.

It should be noted that, the two protruding blocks 322 are respectively located at one side of the through hole 321, when the interface end 220 extends out of the through hole 321, the interface end 220 is just located between the two protruding blocks 322, the two ends of the strip-shaped cover plate 330 are respectively connected with the two protruding blocks 322 in a one-to-one correspondence, that is, the strip-shaped cover plate 330 is installed on the two protruding blocks 322, thereby allowing the strip-shaped cover plate 330 to shield the interface end 220 between the two protruding blocks 322, preventing foreign materials from falling into the interface end 220, and further, a limit groove 322a is disposed on the sidewall of the protrusion 322, and a limit protrusion 331 is disposed on the sidewall of the strip-shaped cover plate 330 abutting against the protrusion 322, and the limiting protrusion 331 can just be accommodated in the limiting groove 322a, so that the bar-shaped cover plate 330 is clamped by the limiting groove 322a, and the firmness of the bar-shaped cover plate 330 and the interface baffle 320 can be enhanced.

Referring to fig. 1 again, the substrate 100 is formed with a plurality of mounting holes 110, and a space is formed between the mounting holes 110. The plurality of mounting holes 110 are provided so that the power supply apparatus 10 can be mounted on the front side or the side, and the power supply apparatus 10 can be mounted in accordance with the actual mounting environment.

Referring to fig. 1 again, the protective cover 300 further includes a plurality of heat dissipating ribs 340, and each heat dissipating rib 340 is disposed on the cover 310. It should be noted that, each heat dissipating rib 340 is installed on the housing 310, in one embodiment, each heat dissipating rib 340 and the housing 310 are an integral structure, which is favorable for heat transfer; on the one hand, each heat dissipation rib 340 can increase the surface area outside the housing 310, increasing the heat dissipation area, thereby improving the heat dissipation efficiency, and on the other hand, the heat dissipation ribs 340 can enhance the structural strength of the housing 310, thereby effectively preventing the housing 310 from deforming.

In one embodiment, the air inlet holes 311 are provided in plurality, and a space is provided between the air inlet holes 311. It should be noted that, by providing a plurality of air inlet holes 311, the flow speed of air can be increased, thereby increasing the heat dissipation efficiency.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A power supply device, comprising:

a substrate;

2. The power supply device according to claim 1, wherein the interface baffle is provided with two protruding blocks, and the two protruding blocks are respectively located at one side of the through hole.

3. The power supply device according to claim 2, wherein the protruding block is provided with a limiting groove.

4. The power supply device according to claim 3, wherein the strip cover plate is provided with a limiting protrusion, and the limiting protrusion is accommodated in the limiting groove.

5. The power supply unit according to claim 1, wherein the buffer post has a locking groove, the circuit board has a locking hole, and the buffer post is used for passing through the locking hole, so that a sidewall of the locking hole is locked in the locking groove.

6. The power supply device according to claim 1, wherein the substrate has a plurality of mounting holes, and a space is provided between the mounting holes.

7. The power device of claim 1, wherein the posts are plastic posts.

8. The power supply device according to claim 1, wherein the protective sheath member further includes a plurality of heat dissipation ribs, each of the heat dissipation ribs being provided on the housing, respectively.

9. The power supply device according to claim 8, wherein each of the heat dissipating ribs is formed integrally with the housing.

10. The power supply device according to claim 1, wherein the air intake hole is provided in plurality with a space provided therebetween.