CN212365938U

CN212365938U - Etching cleaning device

Info

Publication number: CN212365938U
Application number: CN202021342884.6U
Authority: CN
Inventors: 兰升友; 熊超超; 李瑶
Original assignee: Chongqing Kangjia Photoelectric Technology Research Institute Co Ltd
Current assignee: Chongqing Kangjia Optoelectronic Technology Co ltd
Priority date: 2020-07-09
Filing date: 2020-07-09
Publication date: 2021-01-15
Anticipated expiration: 2030-07-09

Abstract

The utility model relates to an etching belt cleaning device, include: the spraying assembly is arranged in the accommodating cavity and does swinging motion in the accommodating cavity, and the spraying assembly is used for spraying liquid; the conveying assembly is accommodated in the accommodating cavity and used for bearing the semiconductor plate, the conveying assembly drives the semiconductor plate to move in the accommodating cavity, and the spraying assembly sprays liquid towards the semiconductor plate. The semiconductor plate material spraying device has the advantages that the spraying assembly is arranged to swing, the transmission assembly drives the semiconductor plate material to move, so that the sprayed liquid of the spraying assembly can completely cover the semiconductor plate material, the semiconductor plate material is not required to be soaked in a spraying mode, the liquid using amount can be saved, the spraying liquid using amount, the spraying time and the like are easy to control, the etching degree is easy to control, and the semiconductor plate material is prevented from being scrapped due to insufficient etching or over etching.

Description

Etching cleaning device

Technical Field

The utility model relates to a semiconductor processing procedure technical field especially relates to an etching belt cleaning device.

Background

In semiconductor processing, etching and cleaning are essential process steps. Wet etching is a process of contacting the device with a chemical solution that dissolves the unwanted metal, leaving behind the desired pattern. Cleaning is a process of removing residual substances on a device using a cleaning liquid.

Etching and cleaning are typically performed in a chamber, and prior art etching processes typically involve immersing the device in a chemical solution, and cleaning involves immersing the device in a cleaning solution. The chemical solution or cleaning solution required by the existing etching cleaning is large in amount, and the device is required to be soaked in the liquid by overflowing the device and a structure for supporting the device. In addition, the soaking process is not easy to control the etching degree, and is easy to cause the phenomena of insufficient etching or over etching, thereby causing the rejection of the device.

Therefore, how to save the liquid consumption and easily control the etching degree is an urgent problem to be solved.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned shortcomings of the prior art, the present application aims to provide an etching cleaning apparatus, which aims to solve the problems of saving the amount of liquid and easily controlling the etching degree.

An etching cleaning apparatus comprising: a housing including a receiving cavity; the spraying assembly is accommodated in the accommodating cavity and performs swinging motion in the accommodating cavity; the conveying assembly is accommodated in the accommodating cavity and used for bearing the semiconductor plate, the conveying assembly drives the semiconductor plate to move in the accommodating cavity, and the spraying assembly is used for spraying liquid towards the semiconductor plate.

The semiconductor plate material spraying device has the advantages that the spraying assembly is arranged to swing, the transmission assembly drives the semiconductor plate material to move, so that the sprayed liquid of the spraying assembly can completely cover the semiconductor plate material, the semiconductor plate material is not required to be soaked in a spraying mode, the liquid using amount can be saved, the spraying liquid using amount, the spraying time and the like are easy to control, the etching degree is easy to control, and the semiconductor plate material is prevented from being scrapped due to insufficient etching or over etching.

Optionally, the spray assembly includes a spray pipe and a plurality of nozzles disposed on the spray pipe, and the spray pipe and/or the plurality of nozzles perform a swinging motion. The spray pipe and/or the plurality of nozzles are/is arranged to perform swinging motion, so that the liquid sprayed by the plurality of nozzles can cover the whole area of the semiconductor plate, and the semiconductor plate can be comprehensively etched or cleaned.

Optionally, the spraying assembly includes a plurality of spraying pipes arranged side by side, and each spraying pipe is provided with a plurality of nozzles. By providing a plurality of spray pipes arranged side by side, a larger area can be covered by the liquid sprayed by the plurality of nozzles.

Optionally, the conveying assembly includes a driving shaft, a plurality of rollers and a supporting member, the plurality of rollers are connected to the driving shaft, and form a flush supporting surface, the supporting member is disposed on the supporting surface, the semiconductor board is disposed on the supporting member, and the driving shaft rotates to drive the supporting member to move. Drive support piece through setting up the drive shaft rotation and remove to drive semiconductor panel and remove, make semiconductor panel remove to suitable position, so that with the better cooperation of the liquid that the subassembly sprays, make semiconductor panel by reasonable etching or washing.

Optionally, the support member is a planar mesh structure. The planar mesh structure has good support on the one hand, and on the other hand, liquid can flow down from the fretwork among the planar mesh structure, avoids the liquid that is detained on the support piece too much and causes the overetching phenomenon to semiconductor plate.

Optionally, the etching cleaning device further includes a recovery tank, the recovery tank includes a cavity, the transfer assembly is accommodated in the cavity, and the liquid sprayed by the spray assembly flows into the cavity. The recovery tank is used for collecting the etched or cleaned liquid, so that subsequent treatment is facilitated, and the environment pollution is avoided.

Optionally, the etching cleaning device further comprises a liquid storage, a first infusion tube and a second infusion tube, wherein two ends of the first infusion tube are respectively communicated with the cavity and the liquid storage, and two ends of the second infusion tube are respectively communicated with the liquid storage and the spraying assembly. Through setting up liquid storage ware and first transfer line and second transfer line, can collect the liquid in the accumulator and reuse, can practice thrift the quantity of liquid, practice thrift the cost.

Optionally, a liquid pump is further disposed on the second infusion tube. Liquid pumps are used to pump liquids to increase the flow rate of the liquid.

Optionally, the liquid reservoir includes a filter element, and the liquid input by the first liquid conveying pipe is filtered by the filter element and then output from the second liquid conveying pipe. The filtering piece is arranged to filter impurities, so that the purity of the recycled liquid is high, and the etching or cleaning efficiency can be improved.

Optionally, the casing includes the top cap, the top cap is middle high structure low all around, and the liquid that is convenient for sputter the top cap slips around from the top cap, avoids from the top cap middle part drippage and cause the pollution.

Drawings

Fig. 1 is a schematic structural diagram of an etching cleaning apparatus according to an embodiment.

Description of reference numerals:

10-a housing; 11-a containment chamber; 12-a top cover;

20-a transfer assembly; 21-a drive shaft; 22-a roller; 23-a support;

30-a spray assembly; 31-a spray pipe; 32-a nozzle;

40-a semiconductor plate;

50-a recovery tank; 51-a base plate; 52-side plate, 53-cavity;

60-a liquid reservoir;

71-a first infusion tube; 72-a second infusion tube; 73-liquid pump.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

Based on this, the present application intends to provide a solution to the above technical problem, the details of which will be explained in the following embodiments.

Referring to fig. 1, an etching cleaning apparatus according to an embodiment of the present disclosure includes a housing 10, a shower assembly 30, and a transfer assembly 20. The housing 10 includes a receiving chamber 11, and the environment inside the receiving chamber 11 can be set according to different requirements of etching or cleaning, for example, the receiving chamber 11 can be set to be vacuum. The side wall of the housing 10 may be provided with a port communicated with the accommodating cavity 11 for connecting with an external infusion tube or the like so as to input liquid into the accommodating cavity 11. In this embodiment, the casing 10 may include a top cover 12, and the top cover 12 is a structure with a high middle part and a low periphery, so that the liquid splashed onto the top cover 12 slides down from the periphery of the top cover 12, and pollution caused by dripping from the middle part of the top cover 12 is avoided.

The spraying assembly 30 is accommodated in the accommodating cavity 11, and the spraying assembly 30 performs a swinging motion in the accommodating cavity. The spray assembly 30 is used to spray a liquid. The type of the liquid sprayed by the spraying assembly 30 can be selected according to the requirement, and the liquid can be a chemical solution such as an acidic solution, an alkaline solution and the like, and can also be a cleaning solution such as common water or an organic solvent and the like.

The conveying assembly 20 is accommodated in the accommodating cavity 11, and the conveying assembly 20 is used for carrying the semiconductor plate 40. The transfer assembly 20 moves the semiconductor sheet 40 in the accommodating chamber 11, and the spray assembly 30 is used for spraying liquid toward the semiconductor sheet 40. The semiconductor plate material 40 is, for example, a wafer (wafer), a substrate (glass), or the like.

The spraying assembly 30 is arranged to swing, the transmission assembly 20 drives the semiconductor plate 40 to move, so that the liquid sprayed by the spraying assembly 30 can completely cover the semiconductor plate 40, the semiconductor plate 40 does not need to be soaked in a spraying mode, the liquid using amount can be saved, the spraying liquid using amount, the spraying time and the like are easy to control, the etching degree is easy to control, and the semiconductor plate 40 is prevented from being scrapped due to insufficient etching or over etching.

In one embodiment, spray assembly 30 includes a spray tube 31 and a plurality of spray nozzles 32 disposed on spray tube 31, and spray tube 31 and/or plurality of spray nozzles 32 are configured to perform a rocking motion.

In this embodiment, the shower pipe 31 may be rotatably connected to the housing 10, so that the shower pipe 31 may rotate around its axis to drive the plurality of nozzles 32 to swing. Alternatively, the shower pipe 31 is fixed, and the plurality of nozzles 32 are swung with respect to the shower pipe 31, and the swinging direction may be along the axial direction or the circumferential direction of the shower pipe 31. Alternatively, both the shower pipe 31 and the plurality of nozzles 32 are moved, i.e., the shower pipe 31 is rotated while the plurality of nozzles 32 are oscillated. The shower 31 is used to deliver liquid and the nozzle 32 is used to spray the liquid out. The shower pipe 31 may be connected to an external liquid storage tank (not shown) that delivers liquid to the shower pipe 31 through a pipe.

In this embodiment, the swing angle of the shower pipe 31 and/or the plurality of nozzles 32 is not limited. Alternatively, the plurality of nozzles 32 may be angled-180 to-180 with respect to the semiconductor sheet 40.

In this embodiment, the shower pipe 31 may be disposed on a horizontal plane, and the semiconductor board 40 is also disposed on the horizontal plane. Besides the rotation of the shower pipe 31 around its own axis, the shower pipe 31 can also move in the horizontal plane, so that the shower pipe 31 brings a plurality of nozzles 32 to cover the whole area of the semiconductor plate 40.

In this embodiment, the plurality of nozzles 32 may be disposed on the shower pipe 31 at equal intervals. The plurality of nozzles 32 may be arranged in the same line. Alternatively, the plurality of nozzles 32 may be staggered along a straight line, i.e., the plurality of nozzles 32 are not arranged along a straight line, but some of the nozzles 32 are located on one side of the straight line, and the remaining nozzles 32 are located on the other side of the straight line.

In this embodiment, the shower pipe 31 and/or the plurality of nozzles 32 are provided to perform a swinging motion, so that the liquid sprayed from the plurality of nozzles 32 can cover the entire area of the semiconductor sheet 40, and the semiconductor sheet 40 can be etched or cleaned in its entirety.

In one embodiment, the spray assembly 30 includes a plurality of spray pipes 31 arranged side by side, and each spray pipe 31 has a plurality of spray nozzles 32.

In this embodiment, the plurality of shower pipes 31 may be configured to be rotatable, and the plurality of nozzles 32 may be configured to be swingable.

By providing a plurality of spray pipes 31 arranged side by side, a larger area can be covered by the liquid sprayed from the plurality of spray nozzles 32.

In one embodiment, the conveyor assembly 20 includes a drive shaft 21, a plurality of rollers 22, and a support 23. The plurality of rollers 22 are connected with the driving shaft 21, the plurality of rollers 22 form a flush supporting surface, the supporting member 23 is arranged on the supporting surface, the semiconductor plate 40 is arranged on the supporting member 23, and the driving shaft 21 rotates to drive the supporting member 23 to move so as to drive the semiconductor plate 40 to move.

In this embodiment, the driving shaft 21 may be connected to a driving member such as a motor, and the driving shaft 21 rotates to drive the rollers 22 to rotate, so as to move the processing component 23. The rollers 22 are fixedly connected with the driving shaft 21. The support 23 may be a conveyor belt or the like.

In this embodiment, the driving shaft 21 is arranged to rotate to drive the supporting member 23 to move so as to drive the semiconductor plate 40 to move, so that the semiconductor plate 40 moves to a proper position, and the liquid sprayed by the spraying assembly 30 is better matched with the semiconductor plate 40, so that the semiconductor plate 40 is reasonably etched or cleaned. Reasonable etching or cleaning means that etching is carried out at the position where etching is needed, and cleaning is carried out at the position where cleaning is needed, so that the etching or cleaning can be more flexible.

In one embodiment, the support member 23 is a planar mesh structure. The planar mesh structure has good support, and on the other hand, liquid can flow down from the hollow-out holes in the planar mesh structure, so that the phenomenon of over-etching of the semiconductor plate 40 caused by too much liquid retained on the support 23 is avoided.

In one embodiment, the etching cleaning apparatus further includes a recycling tank 50, the recycling tank 50 includes a cavity 53, the transfer assembly 20 is accommodated in the cavity 53, and the liquid sprayed by the spray assembly 30 flows into the cavity 53.

In this embodiment, the recycling tank 50 is used to collect the etched or cleaned liquid, so as to facilitate subsequent processing and avoid environmental pollution.

In this embodiment, the recycling bin 50 includes a bottom plate 51 and a plurality of side plates 52, and the plurality of side plates 52 surround the bottom plate 51, so that the recycling bin 50 forms a box shape with one side open, and the opening direction faces the shower assembly 30. The recovery tank 50 may be connected to the inner wall of the case 10 such that the liquid sliding down from the top cover 12 may also be collected by the recovery tank 50.

In one embodiment, the etching cleaning apparatus further includes a liquid reservoir 60, a first infusion line 71, and a second infusion line 72. Two ends of the first infusion tube 71 are respectively communicated with the cavity 53 and the liquid storage 60, and two ends of the second infusion tube 72 are respectively communicated with the liquid storage 60 and the spraying assembly 30.

In this embodiment, the first liquid pipe 71 is connected to the bottom plate 50 of the recovery tank 50 to transfer the liquid in the recovery tank 50 to the liquid reservoir 60, and the second liquid pipe 72 is connected to the shower pipe 31 of the shower unit 30 to transfer the liquid in the liquid reservoir 60 to the shower pipe 31.

In this embodiment, by providing the liquid reservoir 60 and the first and second

liquid transport tubes

71 and 72, the liquid in the recovery tank 50 can be collected and reused, and the amount of liquid used can be reduced, thereby reducing the cost.

In this embodiment, the liquid reservoir 60 is disposed outside the housing 10. In other embodiments, the liquid reservoir 60 may also be disposed within the housing 10.

In one embodiment, a liquid pump 73 is also provided on the second infusion tube 72. The liquid pump 73 is used to pump liquid to increase the flow rate of the liquid.

In one embodiment, the fluid reservoir 60 includes a filter (not shown), and the fluid input from the first fluid line 71 is filtered by the filter and output from the second fluid line 72. Since the liquid etched or cleaned on the semiconductor board 40 may contain impurities, the filtering member is provided to filter out the impurities, so that the purity of the recovered and reused liquid is high, and the etching or cleaning efficiency can be improved. The filtering piece can be a filter screen, a filter element and the like.

It is to be understood that the invention is not limited to the above-described embodiments, and that modifications and variations may be made by those skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.

Claims

1. An etching cleaning apparatus, comprising:

a housing including a receiving cavity;

the spraying assembly is accommodated in the accommodating cavity and performs swinging motion in the accommodating cavity; and

the conveying assembly is accommodated in the accommodating cavity and used for bearing the semiconductor plate, the conveying assembly drives the semiconductor plate to move in the accommodating cavity, and the spraying assembly is used for spraying liquid towards the semiconductor plate.

2. The etch cleaning apparatus of claim 1, wherein the shower assembly comprises a shower and a plurality of nozzles disposed on the shower, the shower and/or the plurality of nozzles being in a rocking motion.

3. The etch cleaning apparatus of claim 2, wherein the shower assembly comprises a plurality of shower pipes arranged side by side, each of the shower pipes having a plurality of the nozzles disposed thereon.

4. The etching cleaning apparatus of claim 1, wherein the transport assembly comprises a drive shaft, a plurality of rollers coupled to the drive shaft and forming a flush support surface, and a support member disposed on the support surface, the semiconductor sheet being disposed on the support member, the drive shaft rotating to move the support member.

5. The etching cleaning apparatus of claim 4, wherein the support member is a planar mesh structure.

6. The etching cleaning apparatus according to any one of claims 1 to 5, further comprising a recovery tank, wherein the recovery tank comprises a cavity, the transfer assembly is accommodated in the cavity, and the liquid sprayed by the spray assembly flows into the cavity.

7. The etching cleaning device according to claim 6, further comprising a liquid reservoir, a first liquid transport tube and a second liquid transport tube, wherein two ends of the first liquid transport tube are respectively communicated with the cavity and the liquid reservoir, and two ends of the second liquid transport tube are respectively communicated with the liquid reservoir and the spraying component.

8. The etching cleaning apparatus according to claim 7, wherein a liquid pump is further provided to the second liquid transport tube.

9. The etching cleaning apparatus of claim 7, wherein the fluid reservoir comprises a filter element, and the fluid input from the first fluid line is filtered by the filter element and output from the second fluid line.

10. The etching cleaning apparatus of any one of claims 1 to 5, wherein the housing comprises a top cover, the top cover having a configuration with a middle height and a periphery height.