CN212351357U

CN212351357U - Silicon crystal cylinder processing device for semiconductor production

Info

Publication number: CN212351357U
Application number: CN202020816185.4U
Authority: CN
Inventors: 不公告发明人
Original assignee: Shanghai Xinpute Semiconductor Technology Co ltd
Current assignee: Shanghai Xinpute Semiconductor Technology Co ltd
Priority date: 2020-05-16
Filing date: 2020-05-16
Publication date: 2021-01-15
Anticipated expiration: 2030-05-16

Abstract

The utility model relates to a semiconductor production technical field just discloses a silicon wafer cylinder processingequipment for semiconductor production, including the device base, two centre gripping slewing mechanism that the upper end fixedly connected with symmetry of device base set up, and the upper end of device base is provided with slidable grinding device, centre gripping slewing mechanism includes the connecting rod, and the tip coaxial coupling of connecting rod has splint, is located two centre gripping slewing mechanism departments have the silicon wafer cylinder through the positioner centre gripping between the splint. This kind of silicon wafer post processingequipment for semiconductor manufacture through set up positioner between splint and silicon wafer cylinder for operating personnel can be through the mode of rotating ring body one, makes silicon wafer cylinder lateral wall receive the interference effect of three arc commentaries on classics piece inner wall, moves to a ring body center department gradually, ensures that the position of splint is located silicon wafer cylinder's axle center from this and is in order guaranteeing the steady rotation of silicon wafer cylinder.

Description

Silicon crystal cylinder processing device for semiconductor production

Technical Field

The utility model relates to a semiconductor production technical field specifically is a silicon crystal cylinder processingequipment for semiconductor production.

Background

The semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. Semiconductors are used in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting applications, high-power conversion, and the like.

The silicon wafer cylinder is a raw material for processing and producing semiconductors, generally, an operator polishes the side wall of the silicon wafer cylinder through a polishing device to polish the silicon wafer cylinder into a uniform cylinder, in the existing device, because a clamping and rotating mechanism for fixing the silicon wafer cylinder usually adopts a connecting rod and a clamping plate structure, and then the two end walls of the silicon wafer cylinder are fixed, the operator is difficult to ensure that the position of the clamping plate is located at the axis of the silicon wafer cylinder through a manual measurement method to ensure that the silicon wafer cylinder rotates smoothly, and therefore, the silicon wafer cylinder processing device for producing semiconductors is provided to solve the problems.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides a silicon wafer post processingequipment for semiconductor manufacture possesses through setting up positioner between splint and silicon wafer cylinder for operating personnel can be through the mode of rotating ring body one, makes silicon wafer cylinder lateral wall receive the supporting force effect of three arc commentaries on classics piece inner wall, moves to a ring body center department gradually, ensures that the position of splint is located silicon wafer cylinder's axle center from this and locates to guarantee advantages such as the steady rotation of silicon wafer cylinder, has solved the problem that the background art provided.

(II) technical scheme

For realize above-mentioned through setting up positioner between splint and silicon cylinder, make operating personnel can be through the mode of rotating ring body one for the silicon cylinder lateral wall receives the effect of the interference of three arc commentaries on classics piece inner wall, removes to a ring body center department gradually, ensures from this that the position of splint is located silicon cylinder's axle center and is in order guaranteeing the steady pivoted purpose of silicon cylinder, the utility model provides a following technical scheme:

the utility model provides a silicon wafer cylinder processingequipment for semiconductor production, includes the device base, two centre gripping slewing mechanism that the upper end fixedly connected with symmetry of device base set up, and the upper end of device base is provided with slidable grinding device, centre gripping slewing mechanism includes the connecting rod, and the tip coaxial coupling of connecting rod has splint, is located two centre gripping slewing mechanism departments hold the silicon wafer cylinder through the positioner centre gripping between the splint.

Preferably, the positioning device comprises a first ring body and a second ring body which are coaxially connected, the first ring body and the second ring body are rotatably connected through a bearing, and the first ring body is arranged on one side close to the clamping plate.

Preferably, a plurality of arc-shaped convex blocks are fixedly connected to the inner circumferential wall of the first ring body, an arc-shaped rotating block is rotatably connected to the inner circumferential wall of the second ring body through a rotating shaft, a convex rod is fixedly connected to one side wall of the arc-shaped rotating block, which is close to the first ring body, and the circumferential side wall of the convex rod is attached to the arc-shaped side wall of the arc-shaped convex block.

Preferably, the number of the arc-shaped convex blocks is three, and the three arc-shaped convex blocks are distributed in an annular equidistant manner along the inner wall of the circumference of the ring body.

Preferably, the surface of the device base is provided with a sliding groove matched with the polishing device, and the polishing device is connected with the sliding groove in a sliding manner.

Preferably, the bearing is a damping bearing, and two sides of the damping bearing are connected with the first ring body and the second ring body through welding.

(III) advantageous effects

Compared with the prior art, the utility model discloses possess following beneficial effect:

1. this kind of silicon wafer post processingequipment for semiconductor manufacture through set up positioner between splint and silicon wafer cylinder for operating personnel can be through the mode of rotating ring body one, makes silicon wafer cylinder lateral wall receive the interference effect of three arc commentaries on classics piece inner wall, moves to a ring body center department gradually, ensures that the position of splint is located silicon wafer cylinder's axle center from this and is in order guaranteeing the steady rotation of silicon wafer cylinder.

2. This kind of silicon wafer post processingequipment for semiconductor manufacture, rotate through the bearing between ring body one and the ring body two and be connected, the bearing is the damping bearing, and the damping bearing has certain rotational resistance, avoids the bearing to lead to the splint dislocation in the reverse gyration of splint rigidity back.

Drawings

Fig. 1 is a schematic perspective view of the present invention;

fig. 2 is a schematic front view of the positioning device of the present invention;

fig. 3 is a schematic side view of the positioning device of the present invention.

In the figure: 1. a device base; 2. a clamping and rotating mechanism; 3. a polishing device; 4. a positioning device; 5. a bearing; 6. a silicon crystal cylinder; 101. a chute; 201. a connecting rod; 202. a splint; 401. a ring body I; 402. a second ring body; 4011. an arc-shaped bump; 4021. a rotating shaft; 4022. an arc-shaped rotating block; 4023. a protruding rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Examples

Referring to fig. 1-3, a silicon wafer cylinder processing device for semiconductor production comprises a device base 1, two symmetrically arranged clamping rotating mechanisms 2 are fixedly connected to the upper end of the device base 1, the clamping rotating mechanisms 2 are box structures with motors arranged therein, the output ends of the motors penetrate through the side walls of the box bodies and extend to the outer sides of the box bodies, the output ends of the motors arranged on the outer sides of the box bodies are coaxially connected with a connecting rod 201, the connecting rod 201 can extend to the outer side to fix a silicon wafer cylinder 6 through a clamping plate 202, a slidable polishing device 3 is arranged at the upper end of the device base 1, a sliding groove 101 matched with the polishing device 3 is formed in the surface of the device base 1, the polishing device 3 is slidably connected with the sliding groove 101, the clamping rotating mechanisms 2 comprise connecting rods 201, the end portions of the connecting rods 201 are coaxially connected with the clamping plates 202, and the silicon wafer cylinders 6 are clamped between the, the positioning device 4 comprises a first ring body 401 and a second ring body 402 which are coaxially connected, a plurality of arc-shaped convex blocks 4011 are fixedly connected on the inner wall of the circumference of the first ring body 401, the number of the arc-shaped convex blocks 4011 is three, the three arc-shaped convex blocks 4011 are distributed along the circumferential inner wall of the first ring body 401 in an annular and equidistant manner, the circumferential inner wall of the second ring body 402 is rotationally connected with an arc-shaped rotating block 4022 through a rotating shaft 4021, and the side wall of the arc-shaped rotating block 4022 close to one side of the ring body I401 is fixedly connected with a convex rod 4023, and the circumferential side wall of the convex rod 4023 is attached to the arc-shaped side wall of the arc-shaped convex block 4011, the first ring body 401 and the second ring body 402 are rotatably connected through a bearing 5, the bearing 5 is a damping bearing, the damping bearing has certain rotation resistance, the clamping plate 202 is prevented from being dislocated due to the fact that the bearing 5 reversely rotates after the position of the clamping plate 202 is fixed, and the two sides of the damping bearing are connected with the first ring body 401 and the second ring body 402 through welding, and the first ring body 401 is arranged on one side close to the clamping plate 202.

The working principle is as follows: firstly, when an operator needs to polish the silicon wafer cylinder 6, firstly, the second ring body 402 on the positioning device 4 is sleeved at the end of the silicon wafer cylinder 6, then the first ring body 401 is sleeved on the circumferential side wall of the clamping plate 202, at this time, the first ring body 401 is rotated to enable the arc top side wall of the arc-shaped bump 4011 to be abutted against the convex rod 4023, so that the convex rod 4023 has an upward moving trend, at this time, the arc-shaped rotating block 4022 is driven by the convex rod 4023 to rotate along the rotating shaft 4021, so that the arc-shaped rotating block 4022 rotates upward, at this time, the side wall of the silicon wafer cylinder 6 located at the center of the first ring body 401 is subjected to the action of the abutting force of the inner walls of the three arc-shaped rotating blocks 4022, so that the silicon wafer cylinder 6 gradually moves to the center of the first ring body 401 and further extends outwards to connect the connecting rod 201 and the clamping.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A silicon crystal cylinder processing device for semiconductor production comprises a device base (1), wherein the upper end of the device base (1) is fixedly connected with two symmetrically-arranged clamping and rotating mechanisms (2), and the upper end of the device base (1) is provided with a slidable polishing device (3);

the method is characterized in that:

the clamping and rotating mechanism (2) comprises a connecting rod (201), the end part of the connecting rod (201) is coaxially connected with a clamping plate (202), and the clamping plate (202) located at the two clamping and rotating mechanisms (2) is clamped with a silicon crystal cylinder (6) through a positioning device (4).

2. The silicon wafer column processing apparatus for semiconductor production according to claim 1, characterized in that: the positioning device (4) comprises a first ring body (401) and a second ring body (402) which are coaxially connected, the first ring body (401) and the second ring body (402) are rotatably connected through a bearing (5), and the first ring body (401) is located on one side close to the clamping plate (202).

3. The silicon wafer column processing apparatus for semiconductor production according to claim 2, characterized in that: ring body (401) circumference inner wall fixedly connected with a plurality of arc lug (4011), the circumference inner wall of ring body two (402) rotates through pivot (4021) and is connected with arc commentaries on classics piece (4022), and arc commentaries on classics piece (4022) are close to one side lateral wall fixedly connected with protruding pole (4023) of ring body (401), and the circumference lateral wall of protruding pole (4023) sets up with the arc lateral wall laminating of arc lug (4011).

4. The silicon wafer column processing apparatus for semiconductor production according to claim 3, characterized in that: the number of the arc-shaped convex blocks (4011) is three, and the three arc-shaped convex blocks (4011) are distributed in an annular equidistant mode along the inner wall of the circumference of the ring body I (401).

5. The silicon wafer column processing apparatus for semiconductor production according to claim 1, characterized in that: the surface of the device base (1) is provided with a sliding groove (101) matched with the polishing device (3), and the polishing device (3) is connected with the sliding groove (101) in a sliding mode.

6. The silicon wafer column processing apparatus for semiconductor production according to claim 2, characterized in that: the bearing (5) is a damping bearing, and two sides of the damping bearing are connected with the first ring body (401) and the second ring body (402) through welding.