CN212350799U - Laser cutting device - Google Patents
Laser cutting device Download PDFInfo
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- CN212350799U CN212350799U CN202020331162.4U CN202020331162U CN212350799U CN 212350799 U CN212350799 U CN 212350799U CN 202020331162 U CN202020331162 U CN 202020331162U CN 212350799 U CN212350799 U CN 212350799U
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- laser cutting
- working surface
- assembly
- dust removing
- outlet
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- 238000003698 laser cutting Methods 0.000 title claims abstract description 71
- 238000005520 cutting process Methods 0.000 claims abstract description 28
- 239000000428 dust Substances 0.000 claims description 70
- 239000000463 material Substances 0.000 claims description 30
- 239000012535 impurity Substances 0.000 claims description 12
- 238000000605 extraction Methods 0.000 claims 1
- 238000003754 machining Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
The utility model relates to a laser cutting field discloses a laser cutting device, including first laser cutting subassembly and second laser cutting subassembly, first laser cutting subassembly and second laser cutting subassembly are all connected on the bottom plate, are equipped with first export on the first laser cutting subassembly, through first export, the outside laser that launches of first cutting subassembly, second laser cutting subassembly are equipped with the second export, through the second export, the outside laser that launches of second cutting subassembly, first export and second export lie in same one side of bottom plate, and the height of the relative bottom plate of first export and second export is the same. Because the first outlet and the second outlet are consistent in height relative to the base plate, the laser emitted through the first port and the second port can be used for enabling a technician to locate holes with consistent height on the pole lugs, and the position accuracy of the mark holes is higher.
Description
Technical Field
The utility model belongs to the technical field of laser cutting and specifically relates to a laser cutting device is related to.
Background
At present, in the process of processing the mark hole of the pole ear, a processing device is used for processing usually in a mode of processing for multiple times, but the processing mode can be easily adjusted due to the displacement of the processing device at each time, so that the height of the mark processed twice at the front and the back on the pole ear is different, and the processing precision of the mark hole is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a laser cutting device for the processing position precision in mark hole is higher.
There is provided a laser cutting device including:
the rack body comprises a bottom plate;
the cutting device comprises a first laser cutting assembly and a second laser cutting assembly, wherein the first laser cutting assembly and the second laser cutting assembly are connected onto the bottom plate, and are used for forming cutting points with the same height on materials.
As an improvement of the above technical solution, a first outlet is provided on the first laser cutting assembly, the first cutting assembly emits laser outwards through the first outlet, the second laser cutting assembly is provided with a second outlet, the second cutting assembly emits laser outwards through the second outlet, the first outlet and the second outlet are located on the same side of the bottom plate, and the first outlet and the second outlet have the same height relative to the bottom plate.
As a further improvement of the above technical solution, a first surface is provided on the first laser cutting assembly, the first outlet is located on the first surface, a second surface is provided on the second laser cutting assembly, the second outlet is located on the second surface, the first surface and the second surface are arranged in a relatively staggered manner, and a gap for material flow is provided between the first surface and the second surface.
As a further improvement of the technical scheme, the first laser cutting assembly comprises a first dust removal assembly.
As a further improvement of the technical scheme, the first dust removal assembly is provided with a plurality of working faces, all the working faces are sequentially and adjacently arranged, and a channel for material circulation is formed between each working face and the corresponding first face.
As a further improvement of the above technical solution, the first dust removing assembly includes a first dust removing device, a second dust removing device, and a third dust removing device, a first working surface of the first dust removing device is located on a side toward the first surface, the first working surface is parallel to the first surface, a second working surface of the second dust removing device and a third working surface of the third dust removing device are both perpendicular to the first surface, so that the first surface, the first working surface, the second working surface, and the third working surface form a gap for material flow.
As a further improvement of the above technical solution, a second working surface of the second dust removing device is disposed perpendicular to the first working surface, the third working surface is located at a position facing the second working surface and disposed opposite to the second working surface, and the second working surface is parallel to the third working surface.
As a further improvement of the above technical solution, the second laser cutting assembly includes a second dust removal assembly, the second dust removal assembly includes a fourth dust removal device and a cutting opening assembly, a face mask is disposed on the cutting opening assembly, a fourth working surface is disposed on the fourth dust removal device, the face mask covers the fourth working surface, and the fourth working surface is used for adsorbing impurities.
As a further improvement of the above technical solution, the device further comprises a filter screen, and at least one of the first working surface, the second working surface and the third working surface is provided with the filter screen.
As a further improvement of the technical scheme, the material conveying device further comprises a roller passing assembly, wherein the roller passing assembly comprises a first roller and a second roller, the first roller and the second roller are used for conveying materials, the first outlet and the second outlet face the materials between the first roller and the second roller, and the diameter between the second rollers is larger than that of the first roller.
Has the advantages that: because the first laser cutting assembly and the second laser cutting machining assembly are machined simultaneously, and the machining points of the first laser cutting assembly and the second laser cutting machining assembly, which fall on the material, are consistent in height, the mark hole can be more accurate in height position in the machining process.
Drawings
FIG. 1 is a front view of the first embodiment;
FIG. 2 is a schematic structural view;
FIG. 3 is a top view of FIG. 2;
FIG. 4 is a schematic diagram of the first laser cutting assembly of FIG. 1;
FIG. 5 is a schematic structural view of the third dust removing device in FIG. 4;
FIG. 6 is a schematic structural view of the first dust removing device in FIG. 4;
FIG. 7 is a schematic structural view of the second dust removing device in FIG. 4;
FIG. 8 is a schematic diagram of the second laser cutting assembly of FIG. 1;
FIG. 9 is a schematic structural view of the fourth dust removing device in FIG. 8;
FIG. 10 is a schematic structural view of the cutting assembly of FIG. 8;
FIG. 11 is a schematic structural view of the transition roller assembly of FIG. 1.
Reference numerals: the cutting device comprises a first laser cutting assembly 100, a first face 110, a first dust removal device 120, a first working face 121, a first pipeline 122, a second dust removal device 130, a second working face 131, a second pipeline 132, a third dust removal device 140, a third working face 141, a third pipeline 142, a second laser cutting assembly 200, a fourth dust removal device 210, a fourth working face 211, a fourth pipeline 212, a cutting opening assembly 220, a mask 221, a second face 230, a roller passing assembly 300, a first roller 310, a second roller 320, a bottom plate 400, a material 500, a filter screen 600 and a blanking channel 700.
Detailed Description
The conception and the resulting technical effects of the present invention will be described clearly and completely with reference to the following embodiments, so that the objects, features and effects of the present invention can be fully understood. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and other embodiments obtained by those skilled in the art without inventive labor based on the embodiments of the present invention all belong to the protection scope of the present invention.
In the description of the embodiments of the present invention, if an orientation description is referred to, for example, the directions or positional relationships indicated by "upper", "lower", "front", "rear", "left", "right", etc. are based on the directions or positional relationships shown in the drawings, only for convenience of description and simplification of description, but not for indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In the description of the embodiments of the present invention, if a feature is referred to as being "disposed", "fixed", "connected", or "mounted" on another feature, it can be directly disposed, fixed, or connected to the other feature or indirectly disposed, fixed, connected, or mounted on the other feature. In the description of the embodiments of the present invention, if "a plurality" is referred to, it means one or more, if "a plurality" is referred to, it means two or more, if "greater than", "less than" or "more than" is referred to, it is understood that the number is not included, and if "more than", "less than" or "within" is referred to, it is understood that the number is included. If reference is made to "first" or "second", this should be understood to distinguish between features and not to indicate or imply relative importance or to implicitly indicate the number of indicated features or to implicitly indicate the precedence of the indicated features.
Referring to fig. 1, 2 and 3, as an embodiment, the laser cutting apparatus includes a base, a first laser cutting assembly 100 and a second laser cutting assembly 200, the first laser cutting assembly 100 and the second laser cutting assembly 200 are both connected to the base 400, the first laser cutting assembly 100 is provided with a first surface 110, the first surface 110 is provided with a first outlet, the first laser cutting assembly 100 emits laser outwards through the first outlet, so as to cut the material 500, the second laser cutting assembly 200 is provided with a second surface 230, the second surface 230 is provided with a second outlet, and the second laser cutting assembly 200 emits laser outwards through the second outlet.
As an embodiment, as shown in fig. 2 and 3, the first face 110 and the second face 230 are respectively located at two sides of the material 500, and are arranged in a staggered manner in the Y-axis direction, the material 500 flows between the first face 110 and the second face 230, the first outlet and the second outlet are both located at one side of the base 400 along the Z-axis positive direction, and the heights of the first outlet and the second outlet relative to the base 400 are the same, which has the following beneficial effects: because the height of first export and second export is unanimous, then make through first export and second export to being located the punching of the material 500 between the two can be more accurate, improved the precision to material 500 simultaneous processing.
As another example, changing the positions of the first laser cutting assembly 100 and the second laser cutting assembly 200 can make the first side 110 and the second side 230 located on the same side of the material 500 and perform the cutting process on the material 500.
Referring to fig. 4, 5 and 6, the first laser cutting assembly 100 includes: the first dust removing device 120, the second dust removing device 130 and the third dust removing device 140, the first working surface 121 is arranged on the first dust removing device 120, the second working surface 131 is arranged on the second dust removing device 130, the third working surface 141 is arranged on the third dust removing device 140, the first working surface 121, the second working surface 131 and the third working surface 141 are all used for adsorbing impurities generated in cutting, and as an embodiment, the first dust removing device 120, the second dust removing device 130 and the third dust removing device 140 all adopt negative pressure to adsorb the impurities.
As shown in fig. 4, the first dust removing device 120 is located at a position where the first surface 110 extends along the negative direction of the X axis, and the first working surface 121 is disposed parallel to the first surface 110, so that a gap for the material 500 to flow is left between the first surface 110 and the first working surface 121, the second dust removing device 130 is located at a position where the gap is along the direction of the Y axis, and so that the second working surface 131 is parallel to a plane formed by the X axis and the Z axis, the third dust removing device 140 is located at a position where the second dust removing device 130 extends along the negative direction of the Y axis, and the third working surface 141 and the second working surface 131 are disposed parallel, so that a passage for the material 500 is formed by the first surface 110, the first working surface 121, the third working surface 141, and the fourth working surface 211.
As an example, the third dust removing device 140 and the second dust removing device 130 have a gap with the first surface 110, so that the material 500 can pass through the gap.
As another example, the third working surface 141 is parallel to the plane formed by the X-axis and the Y-axis such that the third working surface 141 is disposed toward the positive direction of the Z-axis as shown in FIG. 5.
As shown in fig. 5, the third dust removing device 140 includes a third working surface 141 and a third pipeline 142, the third pipeline 142 is communicated with the third working surface 141, so that a negative pressure is provided to the first pipeline 122, so that impurities and dust generated during cutting are absorbed by the third working surface 141, and as an embodiment, a filter screen 600 is provided on the third working surface 141.
As shown in fig. 6, the first dust removing device 120 includes a first working surface 121 and a first pipe 122, and negative pressure is applied to the first pipe 122, so that impurities and dust generated during cutting are adsorbed by the first working surface 121, and as an embodiment, a filter screen 600 may be disposed on the first working surface 121.
As shown in fig. 7, the second dust removing device 130 includes a second working surface 131 and a second pipe 132, and negative pressure is introduced into the second pipe 132, so that the second working surface 131 can adsorb impurities and dust generated during the cutting process.
In one embodiment, the first dust removing device 120, the second dust removing device 130 and the third dust removing device 140 are integrally connected to form a dust removing assembly, and the first working surface 121, the second working surface 131 and the third working surface 141 are located on the dust removing assembly.
As shown in fig. 8, the second laser cutting assembly 200 includes a second face 230, and a second outlet is provided on the second face 230, through which laser can be emitted to the outside, so as to cut the material 500.
Referring to fig. 8, 9 and 10, the second laser cutting assembly 200 further includes a fourth dust collector 210 and a cutting opening assembly 220, the fourth dust collector 210 adsorbs dust and impurities generated in the process of cutting the material 500 by the laser emitted from the outlet, a mask 221 is disposed on the cutting opening assembly 220, and a filter screen 600 is disposed on the mask 221, so that waste materials with a large volume can be collected by the blanking channel 700, and impurities with a small volume are adsorbed by the fourth dust collector 210.
As shown in fig. 9, the fourth dust removing device 210 includes a fourth pipe 212 and a fourth pipe 212, negative pressure is applied to the fourth pipe 212, so that the fourth working surface 211 connected to the fourth pipe 212 adsorbs impurities, and the fourth working surface 211 is covered with a mask 221 of the cutting port assembly 220.
As an example, the first dust removing device 120, the second dust removing device 130 and the third dust removing device 140 can adsorb not only the impurities generated during the cutting process of the first cutting assembly but also the impurities generated during the cutting process of the second cutting assembly.
As shown in fig. 11, the laser cutting assembly further includes a roller assembly 300, the roller assembly 300 includes a first roller 310 and a second roller 320, the center lines of the first roller 310 and the second roller 320 are parallel, and are parallel to the plane formed by the Z axis and the Y axis.
As an embodiment, the material 500 is a tab, and the tab is processed by the first laser cutting assembly 100 and the second laser cutting assembly 200 to form mark holes, and since the heights of the first outlet and the second outlet are the same, two mark holes processed at the same time have the same height precision.
As an embodiment, the diameter of the second roller 320 is larger than that of the first roller 310, as shown in fig. 2, so that the material 500 between the first roller 310 and the second roller 320 has a certain bevel angle with respect to the first face 110 and the second face 230, so that the material 500 moving from the first roller 310 to the second roller 320 is not bent by the larger angle generated in the process of being driven by the second roller 320 in the rotated configuration after being cut between the first roller 310 and the second roller 320, and the machined tab driven by the second roller 320 is not bent easily in the process of being driven by the second roller due to the larger diameter of the second roller 320, thereby reducing the possibility of bending the machined tab.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art. Furthermore, the embodiments of the present invention and features of the embodiments may be combined with each other without conflict.
Claims (10)
1. A laser cutting apparatus, comprising:
the rack body comprises a bottom plate;
the cutting device comprises a first laser cutting assembly and a second laser cutting assembly, wherein the first laser cutting assembly and the second laser cutting assembly are connected onto the bottom plate, and are used for forming cutting points with the same height on materials.
2. The laser cutting device according to claim 1, wherein the first laser cutting assembly is provided with a first outlet through which the first laser cutting assembly emits laser light, the second laser cutting assembly is provided with a second outlet through which the second laser cutting assembly emits laser light, the first outlet and the second outlet are located on the same side of the base plate, and the first outlet and the second outlet have the same height with respect to the base plate.
3. The laser cutting device according to claim 2, wherein the first laser cutting assembly is provided with a first face, the first outlet is located on the first face, the second laser cutting assembly is provided with a second face, the second outlet is located on the second face, the first face and the second face are arranged in a relatively staggered manner, and a gap for material flow is arranged between the first face and the second face.
4. The laser cutting apparatus of claim 3, wherein the first laser cutting assembly includes a first dust extraction assembly.
5. The laser cutting device according to claim 4, wherein the first dust removing assembly is provided with a plurality of working surfaces, all the working surfaces are arranged adjacent to each other in sequence, and a channel for material circulation is formed between the working surfaces and the first surface.
6. The laser cutting device of claim 4, wherein the first dust removing assembly comprises a first dust removing device, a second dust removing device and a third dust removing device, the first working surface of the first dust removing device is located on one side of the first surface facing, the first working surface is arranged in parallel with the first surface, the second working surface of the second dust removing device and the third working surface of the third dust removing device are arranged perpendicular to the first surface, and therefore the first surface, the first working surface, the second working surface and the third working surface form a gap for material to flow.
7. The laser cutting device according to claim 6, wherein the second working surface of the second dust removing device is disposed perpendicular to the first working surface, and the third working surface is disposed opposite to the second working surface at a position facing the second working surface, and the second working surface is parallel to the third working surface.
8. The laser cutting device according to claim 1, wherein the second laser cutting assembly comprises a second dust removing assembly, the second dust removing assembly comprises a fourth dust removing device and a cutting opening assembly, a face mask is arranged on the cutting opening assembly, a fourth working surface is arranged on the fourth dust removing device, the face mask covers the fourth working surface, and the fourth working surface is used for adsorbing impurities.
9. The laser cutting device according to any one of claims 6 or 7, further comprising a filter screen, wherein at least one of the first working surface, the second working surface, and the third working surface is provided with a filter screen.
10. The laser cutting device of claim 2, further comprising a roller assembly including a first roller and a second roller for driving material, the first outlet and the second outlet facing the material between the first roller and the second roller, the second roller having a diameter greater than the first roller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020331162.4U CN212350799U (en) | 2020-03-16 | 2020-03-16 | Laser cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020331162.4U CN212350799U (en) | 2020-03-16 | 2020-03-16 | Laser cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212350799U true CN212350799U (en) | 2021-01-15 |
Family
ID=74146389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020331162.4U Active CN212350799U (en) | 2020-03-16 | 2020-03-16 | Laser cutting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212350799U (en) |
-
2020
- 2020-03-16 CN CN202020331162.4U patent/CN212350799U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
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| CP03 | Change of name, title or address |
Address after: 518110 301, Building B, Comlong Science Park, Guansheng 5th Road, Luhu Community, Guanhu Street, Longhua District, Shenzhen City, Guangdong Province (one photo multiple site enterprise) Patentee after: Hymson Laser Technology Group Co., Ltd. Address before: 518000 No. 26, 101 Ring Road south of Guanzi street, Longhua District, Shenzhen, Guangdong Patentee before: SHENZHEN HYMSON LASER INTELLIGENT EQUIPMENTS Co.,Ltd. |