CN212343758U - Built-in SIM card chip structure - Google Patents
Built-in SIM card chip structure Download PDFInfo
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- CN212343758U CN212343758U CN202021134504.XU CN202021134504U CN212343758U CN 212343758 U CN212343758 U CN 212343758U CN 202021134504 U CN202021134504 U CN 202021134504U CN 212343758 U CN212343758 U CN 212343758U
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- sim card
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- base plate
- chip structure
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Abstract
The utility model relates to a built-in SIM card chip architecture, it is mainly when the SIM card inserts to the cavity of base plate in, the sliding friction when the SIM card can reduce the insertion through protruding grain on it, and after the SIM card enters into the cavity of base plate completely, the SIM card can receive the downward pressure of propping the clamp plate promptly and is impressed to the low groove in, make the SIM card can be because of the restriction of low groove leads to long-time use in, the SIM card does not have the slip and has the bad thing of contact to take place, therefore outside having increased reliability and security, and more stop the emergence of cladding material wearing and tearing, and then can improve the bad problem of traditional technical data transmission quality.
Description
Technical Field
The utility model relates to a chip architecture especially indicates a built-in SIM card chip architecture.
Background
SIM (subscriber Identity module) card is an icc (integrated Circuit card) smart card, which is widely used in the identification card of a general mobile phone system or a portable electronic device at present, however, the existing SIM card is usually a carrier in the form of a plastic sheet, and a chip is disposed on the carrier, and the chip stores data such as identification data of a user, storage content, etc., so that when the SIM card is inserted into a mobile phone, a terminal on the chip will contact with a contact in the mobile phone, and an antenna of the mobile phone itself is used to transmit data messages and send telecommunication data.
However, when the existing SIM card is used on a Printed Circuit Board (PCB) of an electronic device, the SIM card not only occupies a large area, but also has poor contact due to sliding of the SIM card after frequent insertion and removal for a long time, which reduces reliability and safety, and the wear of the plating layer thereon often causes poor data transmission quality, which is a major drawback of the conventional technology.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical scheme who adopts does: a built-in SIM card chip structure, comprising: a base plate and a SIM card, wherein the base plate is provided with a cavity, one side edge of the base plate is provided with an insertion opening communicated with the cavity, the SIM card is inserted into the cavity through the insertion opening, two opposite side wall surfaces of the cavity sliding into relative to the SIM card are respectively provided with a slide rail, the SIM card is provided with a plurality of convex particles for reducing sliding friction relative to the slide rail, the cavity is provided with an upper groove relative to the top of the SIM card, the upper groove is provided with a plurality of first elastic pieces, the free end of each first elastic piece is provided with a lower pressing plate, the cavity is provided with a lower groove relative to the bottom surface of the SIM card, the bottom of the lower groove is provided with a plurality of first contact points, the SIM card is provided with a second contact point connected with the first contact points, the bottom of the groove relative to the insertion opening is provided with a second elastic piece, and one end of the SIM card is provided with a handle, and the handle protrudes out of the insertion opening of the substrate by a distance.
In one embodiment, the first elastic member and the second elastic member are both compression springs.
When the SIM card pressing device is implemented, a first chamfer is arranged on the front edge of the pressing plate, a second chamfer is arranged at the position, corresponding to the first chamfer of the pressing plate, of the SIM card, and the SIM card is inserted into the cavity without collision and damage to the pressing plate through the arrangement of the first chamfer and the second chamfer.
In a specific implementation, the protruding particles of the SIM card are semicircular.
The utility model has the advantages that: the utility model discloses in the during operation, it is mainly when this SIM card inserts to this cavity of this base plate in, this SIM card can reduce the sliding friction when inserting through this protruding grain, and when this SIM card get into this cavity in back completely, this SIM card can receive this downwards of propping the clamp plate to check and is impressed to this low groove promptly, consequently this SIM card receives the restriction of this low groove and can not have the slip and have the bad touch to take place in long-time use, therefore outside having increased reliability and security, and more stop the emergence of cladding material wearing and tearing, and then can improve the bad problem of traditional technical data transmission quality.
Drawings
Fig. 1 is one of the assembled schematic cross-sectional views of the present invention.
Fig. 2 is a second schematic sectional view of the assembled device of the present invention.
Detailed Description
As shown in fig. 1 to 2, a built-in SIM card chip structure includes: a base plate (10) and a SIM card (20), wherein the base plate (10) is provided with a cavity (11), one side edge of the base plate (10) is provided with an insertion opening (12) communicated with the cavity (11), the SIM card (20) is inserted into the cavity (11) through the insertion opening (12), two opposite side wall surfaces of the cavity (11) sliding into relative to the SIM card (20) are respectively provided with a slide rail (13), the SIM card (20) is provided with a plurality of convex particles (21) for reducing sliding friction relative to the slide rail (13), the cavity (11) is provided with an upper groove (14) relative to the top of the SIM card (20), the upper groove (14) is provided with a plurality of first elastic pieces (15), the free end of the first elastic piece (15) is provided with a pressing plate (16), the cavity (11) is provided with a lower groove (17) relative to the bottom surface of the SIM card (20), the bottom of the lower groove (17) is provided with a plurality of first contacts (18), the SIM card (20) is provided with second contacts (22) which are connected with the first contacts (18), the bottom of the lower groove (17) which is opposite to the insertion opening (12) is provided with a second elastic piece (171), one end of the SIM card (20) is provided with a handle (23), and the handle (23) protrudes out of the insertion opening (12) of the substrate (10) for a distance.
In one embodiment, the first elastic member (15) and the second elastic member (171) are both compression springs.
In the specific implementation, a first chamfer (161) is arranged on the front edge of the pressing plate (16) and a second chamfer (24) is arranged at the position, corresponding to the first chamfer (161), of the SIM card (20) and opposite to the pressing plate (16), and through the arrangement of the first chamfer (161) and the second chamfer (24), when the SIM card (20) is inserted into the cavity (11), the SIM card does not collide with the pressing plate (16) and is damaged.
In the implementation, the convex particles (21) of the SIM card (20) are semicircular.
The utility model discloses in the during operation, it is mainly when this SIM card (20) inserts in this cavity (11) of this base plate (10), this SIM card (20) can reduce the sliding friction when inserting through this protruding grain (21), and after this SIM card (20) entered into this cavity (11) completely, this SIM card (20) can receive the downward pressure of this pressure board (16) promptly and is impressed in this low groove (17), consequently this SIM card (20) receive the restriction of this low groove (17) and can not have the slip and have the condition emergence of contact failure in long-time use, therefore outside having increased reliability and security, and more stop the emergence of cladding material wearing and tearing, and then can improve the problem of traditional technical data transmission quality failure.
Claims (4)
1. A built-in SIM card chip structure is characterized in that: comprises a base plate and a SIM card, wherein the base plate is provided with a cavity, one side edge of the base plate is provided with an insertion opening communicated with the cavity, the SIM card is inserted into the cavity through the insertion opening, two opposite side wall surfaces of the cavity sliding into relative to the SIM card are respectively provided with a slide rail, the SIM card is provided with a plurality of convex particles for reducing sliding friction relative to the slide rail, the cavity is provided with an upper groove relative to the top of the SIM card, the upper groove is provided with a plurality of first elastic pieces, the free end of each first elastic piece is provided with a pressing plate, the cavity is provided with a lower groove relative to the bottom surface of the SIM card, the bottom of the lower groove is provided with a plurality of first contact points, the SIM card is provided with a second contact point connected with the first contact points, the bottom of the handle groove relative to the insertion opening is provided with a second elastic piece, and one end of the SIM card is provided with a handle, and the handle protrudes out of the insertion opening of the substrate by a distance.
2. A built-in SIM card chip structure as claimed in claim 1, wherein: the first elastic piece and the second elastic piece are both compression springs.
3. A built-in SIM card chip structure as claimed in claim 1, wherein: the front edge of the pressing plate is provided with a first chamfer and the SIM card is provided with a second chamfer corresponding to the first chamfer of the pressing plate.
4. A built-in SIM card chip structure as claimed in claim 1, wherein: the convex particles of the SIM card are semicircular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021134504.XU CN212343758U (en) | 2020-06-18 | 2020-06-18 | Built-in SIM card chip structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021134504.XU CN212343758U (en) | 2020-06-18 | 2020-06-18 | Built-in SIM card chip structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212343758U true CN212343758U (en) | 2021-01-12 |
Family
ID=74077896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021134504.XU Active CN212343758U (en) | 2020-06-18 | 2020-06-18 | Built-in SIM card chip structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212343758U (en) |
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2020
- 2020-06-18 CN CN202021134504.XU patent/CN212343758U/en active Active
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