CN212342125U - Thermoelectric simulation experiment device - Google Patents
Thermoelectric simulation experiment device Download PDFInfo
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- CN212342125U CN212342125U CN202021391624.8U CN202021391624U CN212342125U CN 212342125 U CN212342125 U CN 212342125U CN 202021391624 U CN202021391624 U CN 202021391624U CN 212342125 U CN212342125 U CN 212342125U
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Abstract
A thermoelectric simulation experiment device determines boundary nodes of a resistance network board according to the thermal boundary conditions of a steady-state heat-conducting solid, and loads voltage within 10V to the boundary nodes of the resistance network board according to a simulation proportionality coefficient; sequentially placing the meter pen into the hexagonal binding posts on the measuring panel, measuring the voltage value, and sending the voltage value into the tablet personal computer through the data acquisition card; and calculating the temperature of the node according to the simulation proportionality coefficient to obtain the internal temperature field of the steady-state heat-conducting solid. The utility model discloses an it is integrated as an organic whole with analog engine, direct current constant voltage power supply, panel computer, data acquisition card, device compact structure, portable, the node on hexagonal terminal on the measurement panel and the resistance network board passes through printed circuit and winding displacement connector and links to each other, and the structure is firm, and the signal is stable is difficult for appearing opening circuit. The utility model discloses in through transforming measurement panel shape, resistance connection mode, can carry out the measurement of multiple research object and boundary condition, suitable using widely.
Description
Technical Field
The utility model relates to an experimental apparatus, in particular to thermoelectric simulation experimental apparatus.
Background
There are three types of heat transfer problems in engineering: to solve the three problems of heat transfer enhancement, heat transfer degradation and temperature control, it is necessary to be able to accurately calculate the amount of heat transferred in the process under study and accurately predict the temperature distribution in the object, wherein predicting the temperature distribution is critical. The internal temperature of the solid is difficult to directly measure, and particularly, the stable heat conduction problem of complex geometric shape is difficult to obtain the temperature distribution of the inside of an object.
For a steady state process, the differential equation for thermal conductivity, which describes the temperature distribution of an object, is similar to the differential equation for voltage distribution in a conductor, indicating that the temperature distribution can be modeled using a voltage distribution. During specific simulation solving, a resistance network equivalent to the researched heat conduction system is established according to a simulation principle, the total voltage of the resistance network corresponds to the total temperature difference of the heat conduction system, the voltage distribution represents the temperature distribution of the heat system, the current intensity represents the heat flow of the heat system, and the resistance represents the thermal resistance.
With the rapid development of computer technology, the numerical method for discrete solution of physical problems develops rapidly, including finite difference method, finite element method and boundary element method, wherein the finite difference method is widely applied and closely combined with the numerical solution of steady-state heat conduction in heat transfer science, but the difficulty of study and application of the science is large.
The prior thermoelectric simulation experiment device has some defects. The shape is single, and the measurement requirement of the internal temperature field of the solid under various thermal boundary conditions cannot be met; the measuring panel and the resistance network are established on the front and back surfaces of one plate, circuit connection is realized by welding, and breakpoints are easy to appear; the measuring panel, the power supply and the measuring instrument are arranged dispersedly, a universal meter is used for measuring and manually recording data, the device is not compact enough, and the informatization level is low.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a thermoelectric simulation experimental apparatus for the inside temperature field of research steady state heat conduction solid can realize automatic measurement, calculation and show temperature distribution in real time.
In order to achieve the above object, the utility model adopts the following technical scheme:
a thermoelectric simulation experiment device comprises a simulator, a direct current stabilized voltage power supply, a tablet personal computer and a data acquisition card; the analog machine is provided with an internal/external power supply change-over switch and an external power supply input interface;
the simulator is connected with an internal/external power supply change-over switch, and the internal/external power supply change-over switch is connected with a direct current stabilized power supply and an external power supply input interface;
the data acquisition card is connected with the tablet computer;
the simulator comprises a measuring panel and a resistance network board which are horizontally arranged, supporting columns are arranged between the measuring panel and the resistance network board, a plurality of hexagonal binding posts are uniformly arranged on the top surface of the measuring panel, a printed circuit is arranged on the bottom surface of the measuring panel, the hexagonal binding posts are connected with a data acquisition card through a meter pen, the printed circuit is arranged on the top surface of the resistance network board, a plurality of nodes are uniformly arranged on the bottom surface of the resistance network board, and the distances between adjacent nodes on the same row and the same column are equal; the adjacent nodes are connected through resistors, each node corresponds to each hexagonal wiring terminal, and the nodes right below each hexagonal wiring terminal and the hexagonal wiring terminals are connected through a printed circuit and a wiring connector.
The utility model discloses further improvement lies in, still includes open-top's casing, and the casing top is provided with the apron, and analog machine and direct current constant voltage power supply set up in the casing, and panel computer and data acquisition card set up on the apron.
The utility model discloses further improvement lies in, is equipped with the pressure regulating module on the direct current constant voltage power supply, and the pressure regulating module includes coarse adjustment knob and fine adjustment knob.
The utility model discloses further improvement lies in, and external power source input interface links to each other with external power supply.
The utility model discloses further improvement lies in, and measurement panel and resistance network board are the PCB circuit board.
Compared with the prior art, the utility model discloses following beneficial effect has: the utility model provides an experimental device for acquiring the internal temperature field of a steady-state heat-conducting solid by means of data acquisition and processing based on the thermoelectric similarity principle, which integrates a simulator, a direct-current stabilized voltage supply, a tablet personal computer and a data acquisition card into a whole, and has compact structure and convenient carrying; the hexagonal wiring terminal on the measuring panel is connected with the node on the resistance network board through the printed circuit and the wiring connector, so that the structure is firm, and the signal is stable and is not easy to break; the simulator is provided with a direct-current stabilized voltage supply and an external power supply interface is reserved at the same time, so that the device can meet the use requirement; the tablet personal computer and the data acquisition card can realize screen touch measurement and data acquisition and display a temperature curve in real time, and the technical level of the experimental teaching device is improved. The utility model discloses simple structure, the principle is clear, and the stable state heat conduction knowledge of "heat transfer science" of fastening is applicable to this branch of academic or vocational study student's experiment teaching.
The utility model discloses but the simulation proportionality coefficient of free choice voltage and temperature with simulator loading voltage value control within 10V, ensure the measurement process safety operation. The utility model provides a through the basic thinking that electric field analog temperature field and boundary condition handled, through transforming measurement panel shape, resistance, can carry out the measurement of multiple research object and boundary condition, suitable using widely. The utility model discloses in being applied to thermoelectric analog method with numerical value solution and regional discrete concept, when obtaining the inside temperature field of steady state heat conduction solid, the help student is deep to know abstract numerical value theory of calculation.
Drawings
Fig. 1 is a diagram of the experimental device of the present invention.
Fig. 2 is a schematic diagram of the structure of the simulator.
Fig. 3 is a schematic diagram of a discrete process.
FIG. 4 is a graph of resistance distribution around an internal node. Wherein (a) is an internal node and (b) is an internal resistance.
FIG. 5 is an adiabatic boundary condition resistance distribution plot. Wherein (a) is a thermal boundary and (b) is an electrical boundary.
FIG. 6 is a convective boundary condition resistance distribution plot. Wherein (a) is a thermal boundary and (b) is an electrical boundary.
FIG. 7 is a physical model.
Fig. 8 is a schematic diagram of a resistor network under isothermal boundary conditions according to example 1 of the present invention.
Fig. 9 is a schematic diagram of a printed circuit of isothermal boundary conditions according to example 1 of the present invention.
Fig. 10 is a wall internal temperature distribution diagram of example 1.
Fig. 11 is a schematic diagram of the resistance network of the convection boundary condition according to embodiment 2 of the present invention.
Fig. 12 is a schematic diagram of a printed circuit for convection boundary conditions of embodiment 2 of the present invention.
Fig. 13 is a wall internal temperature distribution diagram of example 2.
Wherein, 1 is a simulator; 2 is a DC stabilized voltage power supply; 3, a tablet computer; 4 is a data acquisition card; 5 is a coarse adjustment knob; 6 is a fine adjustment knob; 7 is a voltage display screen; 8 is an internal/external power supply change-over switch; 9 is an external power supply input port; 10 is a measuring panel; 11 is a resistance network board; 12 is a supporting column; 13 is a hexagonal binding post; 14 is a flat cable connector; and 15 is a meter pen.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings and examples.
The utility model relates to an automatic experimental teaching device for researching the internal temperature distribution and heat dissipation of a solid by utilizing the principle of thermoelectric similarity, which is shown in figure 1 and comprises a simulator 1, a direct current stabilized voltage power supply 2, a tablet computer 3 and a data acquisition card 4; the simulator 1 is connected with an internal/external power supply change-over switch 8, the internal/external power supply change-over switch 8 is connected with a direct current stabilized power supply 2 and an external power supply input interface 9, the external power supply input interface 9 is connected with an external power supply, can be powered by a direct current stabilized power supply 2 or an external power supply, the direct current stabilized power supply 2 is connected with a voltage display screen 7, a voltage regulating module is arranged on the direct current stabilized power supply 2, the voltage regulating module comprises a coarse regulating knob 5 and a fine regulating knob 6, the voltage can be adjusted to three decimal places through the coarse adjustment knob 5 and the fine adjustment knob 6 and is kept stable, the loading voltage value of the simulator is adjusted according to the boundary condition, the voltage value is displayed on a voltage display screen 7, an internal/external power supply change-over switch 8 can switch the power supply mode of the simulator 1, when the direct current stabilized voltage power supply 2 is abnormal, external power supply can be adopted, and the external power supply is connected with the external power supply input interface 9.
Preferably, the dc regulated power supply 2 is built in the analog machine 1, and the voltage range of the dc regulated power supply 2 does not exceed 10V.
Preferably, for convenience of carrying, the simulator 1 and the dc regulated power supply 2 may be disposed in a housing with an open top, and a cover plate may be disposed on the top of the housing and may cover the top of the housing. The utility model is an integrated design.
The meter pen 15 is placed in the hexagonal binding post 13 to measure the potential value of the corresponding node, the potential value is sent to the data acquisition card 4, the potential value is sent to the tablet personal computer 2 after A/D conversion, and the node temperature value is displayed on a screen after calculation by the tablet personal computer 2.
The measuring panel 10 and the resistor network plate 11 are identical in shape.
The core component of the simulator 1 is a resistance network board 11, the shape of the resistance network board 11 corresponds to a research object, the resistance network board is divided into a plurality of nodes according to a certain interval, and the nodes are connected by resistance elements to form a resistance network; hexagonal terminal 13 on the measurement panel corresponds the setting with the node on the resistance network board 11, realizes connecting through printed circuit and winding displacement connector, and resistive element adopts high accuracy digital voltmeter choice, and the resistance error is within 3%.
The data acquisition card 4 adopts more than one analog input channel, the conversion precision is 12 bits, and the sampling frequency is more than 20 ks/s.
Specifically, referring to fig. 2, the analog machine 1 includes a measurement panel 10 and a resistance network board 11 which are horizontally arranged, and both the measurement panel 10 and the resistance network board 11 are PCB circuit boards. A supporting column 12 is arranged between the measuring panel 10 and the resistance network board 11, a plurality of hexagonal binding posts 13 are uniformly arranged on the top surface of the measuring panel 10, a printed circuit is arranged on the bottom surface of the measuring panel, the hexagonal binding posts 13 are connected with the data acquisition card 4 through a meter pen 15, the printed circuit is arranged on the top surface of the resistance network board 11, a plurality of nodes are uniformly arranged on the bottom surface of the measuring panel, and the distances between adjacent nodes on the same row and the same column are equal; the adjacent nodes are connected through resistors, each node corresponds to each hexagonal binding post, and the nodes right below each hexagonal binding post are connected with the wiring connector 14 through printed circuits.
The thermoelectric simulation method based on the experimental device comprises the following steps:
1) determining boundary nodes of the resistance network board according to the thermal boundary conditions of the steady-state heat-conducting solid, and loading voltage within 10V to the boundary nodes of the resistance network board according to the analog proportionality coefficient;
2) a measuring area is arranged on the tablet personal computer, the shape of the measuring area is the same as that of a measuring panel of the simulator, measuring points are arranged in the measuring area, and the positions of the measuring points correspond to the positions of hexagonal binding posts on the measuring panel one by one. Placing a meter pen into the hexagonal binding post on the measuring panel, and measuring the next measuring point according to the same method after voltage data appear on the corresponding measuring point until the measurement is completely finished;
3) and calculating the temperature of the node according to the simulation proportionality coefficient to obtain the internal temperature field of the steady-state heat-conducting solid.
Wherein the temperature of the node is calculated by the following formula;
wherein e isiIs the potential of the ith node, e1Is the boundary node potential, tiIs the temperature of the i-th node, t1And C is the simulation scale factor.
The principle of the utility model is as follows:
the stable heat conduction process and the electric conduction process can be expressed by Laplace equations, which show that the two phenomena of heat conduction and electric conduction have similar laws and can be analogized, so that the stable temperature field can be simulated by using the stable potential field under the conditions of geometric similarity, physical similarity and boundary similarity.
During specific simulation solving, a resistance network equivalent to the researched heat conduction system is established according to a simulation principle, the total voltage of the resistance network corresponds to the total temperature difference of the heat conduction system, the voltage distribution represents the temperature distribution of the heat system, and the current intensity represents the heat flow of the heat system.
The utility model discloses the basic thought that device resistance network's establishment was based on heat conduction problem numerical value and was solved, is about to the temperature field of original continuous heat conduction object and replaces with the set of the value on the discrete point of finite. Firstly, carrying out area discretization, referring to fig. 3, dividing a solution area into a plurality of sub-areas by using a series of grid lines parallel to a coordinate axis, taking the intersection point of the grid lines as a space position needing to determine a temperature value, which is called a node, and the distance between two adjacent nodes is called a step length and is marked as Δ x and Δ y. The positions of the nodes are indicated by the reference numbers m, n of the points in both directions, and each node can be seen as being represented by a small area centered on it, such as the hatched small area in fig. 3, i.e. the area represented by the node (m, n), which is called the control volume. The continuous physical quantity after the dispersion is finished is replaced by nodes and boundary nodes positioned in the calculation area.
A method for establishing a resistance network on a resistance network board in a thermal-electrical simulation experiment device is to establish simulation of internal nodes according to a similar basis of differential equations. Referring to fig. 4, four nodes (as shown in fig. 4 (a)) are arranged around the internal node (i, j) and conduct heat and conduction, and a resistance network model is established according to the principles of resistance simulation thermal resistance, potential simulation temperature and current simulation heat conduction, as shown in fig. 4 (b).
The heat conduction equation of the steady-state heat conduction internal node is as follows:
ti+1,j+ti-1,j+ti,j+1+ti,j-1-4ti,j＝0
the corresponding conductivity equation is:
in the formula ti,jTo correspond to the temperature at the node, ei,jIs node potential value, R is resistance between nodes, and R is satisfied1＝R2＝R3＝R4And the two equations are similar to each other, so that the simulation processing of the internal node is realized.
The following are 3 methods for establishing the resistor network corresponding to the boundary conditions.
a. The isothermal boundary condition node simulation method is that boundary nodes of the resistance network model are kept at equal potential.
b. Adiabatic boundary condition node simulation method. Referring to fig. 5, the boundary node (i, j) represents one half of the control volume, and three nodes (fig. 5(a)) surround the boundary node and conduct heat, and a resistance network model is built according to the principles of resistance simulation thermal resistance, potential simulation temperature and current simulation heat conduction amount (fig. 5 (b)).
The heat conduction equation for the adiabatic boundary node is:
the corresponding conductivity equation is:
in the formula ti,jTo correspond to the temperature at the node, ei,jIs node potential value, R is resistance between nodes, and R is satisfied2＝R3＝2R1And the two equations are similar to realize the simulation processing of the adiabatic boundary node.
c. Provided is a convection boundary condition node simulation method. Referring to FIG. 6, the boundary node (i, j) represents one-half of the control volume, and the surrounding temperature, in addition to the three nodes (FIG. 6(a)) and its conductive heat transfer, isIs t∞And carrying out convection heat transfer on the fluid with the heat convection coefficient h and the fluid, and establishing a resistance network model according to the principles of resistance simulation thermal resistance, potential simulation temperature and current simulation heat conduction (figure 6 (b)).
The heat conduction equation for the convection boundary node is:
the corresponding conductivity equation is:
in the formula ti,jTo correspond to the temperature at the node, ei,jIs a value of node potential, RiFor the resistance between nodes, l is the grid spacing (i.e., step size) of the thermal system. Simultaneously satisfy R2＝R3＝2R1And
and the two are similar to each other, so that the simulation processing of the flow boundary node is realized.
A certain wall body is taken as a research object, the width of the outer wall is 2.2m, the length of the outer wall is 3m, the width of the inner wall is 1.2m, and the length of the inner wall is 2m, and the picture is shown in figure 7. The thermal conductivity of the wall is λ 0.53W/(m · K), and the temperature distribution inside the wall under different boundary conditions was studied.
Example 1: isothermal boundary conditions
Assuming that the wall body is a residential wall in the northeast region, the inner wall of the wall body is provided with an electric heater, and the temperature of the inner wall is kept to be t135 ℃ and the outer wall temperature t2And (5 ℃), researching the heat dissipation capacity of the furnace wall, and determining whether the wall needs to be thickened. Because the cross section of the wall is symmetrical in geometric shape and the peripheral boundary conditions are the same, for simplification of processing, only 1/4 is taken as a research object according to the symmetry, and the shape of the research object is the same as that of the measurement panel 10 and the resistance network board 11 on the simulator 1, as shown in the shaded part in FIG. 7.
The thickness of the wall body is 0.5m, the nodes are divided into 6 rows according to the distance between l and 0.1m on the resistance network board, referring to fig. 8, 12 nodes are arranged on the first boundary a, 16 nodes are arranged on the second boundary B, 6 nodes are arranged on the third boundary C and the sixth boundary F, the internal nodes are uniformly distributed, and 132 nodes are arranged in total, wherein 80 nodes are arranged in the internal nodes, and 52 nodes are arranged on the boundary.
Each internal node is provided with 4 resistors R with the same resistance value1(ii) a The temperature of the nodes on the first boundary A is equal to that of the nodes on the second boundary B, the temperature of the nodes on the fourth boundary D is equal to that of the nodes on the fifth boundary E, and the nodes with the same temperature are connected through thick copper wires to represent that the potentials of the nodes are equal; due to symmetry, the nodes on the third boundary C and the sixth boundary F are insulated from the surroundings, the resistance value of the resistors between the boundary nodes is 2 times that of the resistors between the internal nodes, and two resistors R are connected in series1The total number of the resistors is 204. 6 rows of binding posts are arranged on the measuring panel of the simulator 1, the corresponding resistance network board 11 is shown in figure 8, and the printed circuit connection mode is shown in figure 9.
Selecting analog proportionality coefficient
The applied voltage Δ e is 3.000V, the voltage is applied to the simulator 1, the potential of each node is measured, and the temperature distribution inside the wall is obtained as shown in fig. 10.
Example 2: convection boundary conditions
Assuming that the wall is a cold storage, the temperature of the fluid outside the cold storage is t∞120 ℃ and convection heat transfer coefficient h2＝10.6W/(m2K) temperature of fluid in the cold store is t ∞20 deg.C, convection heat transfer coefficient h1＝3.975W/(m2K), researching the temperature distribution and the cold loss in the wall body, and determining whether the wall body needs to be subjected to heat preservation treatment.
Because the cross section of the wall is symmetrical in geometric shape and the peripheral boundary conditions are the same, for simplification of processing, only 1/4 is taken as a research object according to the symmetry, and the shape of the research object is the same as that of the measurement panel 10 and the resistance network board 11 on the simulator 1, as shown in the shaded part in FIG. 7.
The thickness of the wall body is 0.5m, the nodes are divided into 6 rows on the resistance network board according to the distance of 0.1m, fluid is arranged on the outer side of the wall body, and the nodes for simulating the fluid need to be arranged, so that 8 rows of binding posts are arranged on the measuring panel 10 of the simulator 1. Referring to fig. 11, 13 nodes are arranged on the first boundary a, 17 nodes are arranged on the second boundary B, 8 nodes are arranged on each of the third boundary C and the sixth boundary F, and the internal nodes are uniformly distributed, and there are 176 nodes in total, wherein there are 120 internal nodes and 56 boundary nodes.
Each internal node is provided with 4 resistors R with the same resistance value1(ii) a Fluid nodes are arranged on the first boundary A and the second boundary B, the temperatures of the nodes are equal, fluid nodes are arranged on the fourth boundary D and the fifth boundary E, the temperatures of the nodes are equal, and the nodes with the same temperatures are connected through thick copper wires to represent that the potentials of the nodes are equal; nodes arranged inwards in a row respectively on the first boundary A, the second boundary B, the fourth boundary D and the fifth boundary E represent solid boundaries, and resistors R are arranged between fluid nodes and solid boundary nodes on the first boundary A and the second boundary B42A resistor R is arranged between the fluid node and the solid boundary node on the fourth boundary D and the fifth boundary E41Two resistors R connected in series between adjacent nodes on the solid boundary1The resistance between the fluid node and the solid boundary node at the corner points (b, f) is 2R42The resistance between the fluid node and the solid boundary node at the corner points (c, e) is 2R41(ii) a Due to symmetry, the nodes on the third boundary C and the sixth boundary F are insulated from the surroundings, the resistance value of the resistors between the boundary nodes is 2 times that of the resistors between the internal nodes, and two resistors R are connected in series1The number of resistors is 336 in total. Corresponding resistor network board 11 see fig. 11 and printed circuit connection means see fig. 12.
Selecting analog proportionality coefficient
The applied voltage Δ e is 2.000V, the simulator 1 is applied with a voltage, the potentials of the nodes are measured, and the temperature distribution inside the wall is as shown in fig. 13.
Claims (5)
1. A thermoelectric simulation experiment device is characterized by comprising a simulator (1), a direct-current stabilized power supply (2), a tablet personal computer (3) and a data acquisition card (4); the analog machine (1) is provided with an internal/external power supply change-over switch (8) and an external power supply input interface (9);
the analog machine (1) is connected with an internal/external power supply change-over switch (8), and the internal/external power supply change-over switch (8) is connected with a direct current stabilized power supply (2) and an external power supply input interface (9);
the data acquisition card (4) is connected with the tablet computer (3);
the simulator (1) comprises a measuring panel (10) and a resistance network board (11) which are horizontally arranged, a supporting column (12) is arranged between the measuring panel (10) and the resistance network board (11), a plurality of hexagonal binding posts (13) are uniformly arranged on the top surface of the measuring panel (10), a printed circuit is arranged on the bottom surface of the measuring panel, the hexagonal binding posts (13) are connected with a data acquisition card (4) through a meter pen (15), the printed circuit is arranged on the top surface of the resistance network board (11), a plurality of nodes are uniformly arranged on the bottom surface of the resistance network board, and the distances between adjacent nodes on the same row and the same column are equal; the adjacent nodes are connected through resistors, each node corresponds to each hexagonal wiring terminal, and the nodes right below each hexagonal wiring terminal and the hexagonal wiring terminals are connected through a printed circuit and a wiring connector (14).
2. The thermoelectric simulation experiment device as claimed in claim 1, further comprising a housing with an open top, wherein a cover plate is arranged on the top of the housing, the simulator (1) and the DC stabilized power supply (2) are arranged in the housing, and the tablet computer (3) and the data acquisition card (4) are arranged on the cover plate.
3. The thermoelectric simulation experiment device according to claim 1, wherein the voltage regulation module is installed on the DC stabilized voltage power supply (2), and the voltage regulation module comprises a coarse regulation knob (5) and a fine regulation knob (6).
4. The device according to claim 1, wherein the external power input interface (9) is connected to an external power source.
5. A thermal electric simulation experiment apparatus according to claim 1, wherein the measuring panel (10) and the resistor network board (11) are PCB boards.
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