CN212341318U - Resistance temperature coefficient measuring device - Google Patents
Resistance temperature coefficient measuring device Download PDFInfo
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- CN212341318U CN212341318U CN202020745966.9U CN202020745966U CN212341318U CN 212341318 U CN212341318 U CN 212341318U CN 202020745966 U CN202020745966 U CN 202020745966U CN 212341318 U CN212341318 U CN 212341318U
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Abstract
The embodiment of the application provides a resistance temperature coefficient measuring device. The resistance temperature coefficient measuring device also comprises a heating circuit, a temperature measuring circuit and a resistance measuring circuit, wherein the heating circuit is connected with the heating element, and the temperature measuring circuit is connected with the temperature measuring element; the heating chamber further comprises: the resistance measuring electrode penetrates through the cavity wall of the heating cavity or penetrates through the jack of the cavity wall of the heating cavity, wherein the part of the resistance measuring electrode, which is positioned outside the heating cavity, is connected with the resistance measuring circuit, and the part of the resistance measuring electrode, which is positioned inside the heating cavity, is used for connecting an element to be measured. The device realizes the rapid and low-cost measurement of the resistance temperature coefficient.
Description
Technical Field
The application belongs to the technical field of measuring instruments, and particularly relates to a resistance temperature coefficient measuring device.
Background
As a typical resistance temperature coefficient measuring device, there are a water bath method, an oil bath method, and the like. The element to be measured is placed in the liquid after the liquid is heated, the heat of the liquid is conducted to the resistor, and the temperature of the resistor can be obtained by measuring the temperature of the liquid after the liquid is stabilized. Then, the resistance value is obtained by matching with a measuring circuit of the upper resistor, and then the temperature coefficient of the resistor can be calculated.
The existing methods for measuring the temperature coefficient of resistance by a water bath method and an oil bath method have the following defects: firstly, the liquid such as water, oil and the like is needed to be used, and a heating device for heating the liquid is matched, so that the volume is large, and the cost is increased; secondly, the heating of the liquid to the resistor requires time for temperature rise, which causes slow measuring rate.
SUMMERY OF THE UTILITY MODEL
The purpose of this application is to provide a resistance temperature coefficient measuring device to prior art's weak point.
In order to solve the technical problem, the following technical scheme is adopted in the application: a resistance temperature coefficient measuring device comprises a heating cavity, wherein the heating cavity comprises a heat insulation layer, a heating element and a temperature measuring element, the heating element is positioned on the inner side of the heat insulation layer, the temperature measuring element is positioned on the inner side of the heating element, electrodes of the heating element and the temperature measuring element are led out of the heating cavity, the resistance temperature coefficient measuring device further comprises a heating circuit, a temperature measuring circuit and a resistance measuring circuit, the heating circuit is connected with the heating element, and the temperature measuring circuit is connected with the temperature measuring element; the heating chamber further comprises: run through the resistance measurement electrode of the chamber wall in heating chamber or run through the jack of the chamber wall in heating chamber, wherein, the part that resistance measurement electrode is located outside the heating chamber is connected resistance measurement circuit, the part that resistance measurement electrode is located in the heating chamber is used for connecting the element that awaits measuring.
Optionally, the heating cavity further comprises a heat conducting layer located inside the heating element, and the temperature measuring element is located inside the heat conducting layer.
Optionally, the number of the temperature measuring elements is multiple.
Optionally, the temperature sensing elements are evenly distributed.
Optionally, the temperature measuring element comprises: any one of a thermal resistor, a thermocouple, and a thermistor.
Optionally, the material of the insulating layer comprises: at least one of silicate materials, polyurethane foam, polystyrene boards, phenolic foam, aerogel felt, glass wool, rock wool, expanded perlite and micro-nano heat insulation materials.
Optionally, the resistance temperature coefficient measuring device further includes a processing circuit, and the processing circuit is respectively connected to the heating circuit, the temperature measuring circuit, and the resistance measuring circuit; the processing circuitry is to: the heating circuit is controlled to heat the element to be measured, the real-time temperature of the element to be measured is determined according to the output of the temperature measuring circuit, the real-time resistance of the element to be measured is determined according to the output of the resistance measuring circuit, and the resistance temperature coefficient of the element to be measured is determined according to the real-time temperature of the element to be measured and the corresponding real-time resistance.
Compared with the prior art, the beneficial effect of this application is: the heating cavity is adopted to heat the element to be detected, the temperature rising speed of the element to be detected is high, the volume of the whole equipment is small, and the cost is low.
Drawings
Fig. 1 is a schematic structural diagram of a resistance temperature coefficient measuring apparatus according to an embodiment of the present application.
Fig. 2 is a schematic cross-sectional view of a heating chamber in the resistance temperature coefficient measuring apparatus shown in fig. 1.
Fig. 3 is a schematic structural diagram of a temperature coefficient of resistance measuring apparatus according to another embodiment of the present application.
Fig. 4 is a schematic diagram illustrating an operation method of a processing circuit in a resistance temperature coefficient measuring apparatus according to an embodiment of the present disclosure.
The reference signs are: 1. a heating cavity; 11. a heat-insulating layer; 12. a heating element; 13. a heat conductive layer; 14. a temperature measuring element; 1a, a jack; 2. a heating circuit; 3. a temperature measuring circuit; 4. a resistance measurement circuit; 4a, resistance measuring electrodes; 5. a processing circuit.
Detailed Description
In this application, it is to be understood that terms such as "including" or "having" are intended to indicate the presence of the disclosed features, numbers, steps, acts, components, parts, or combinations thereof, and are not intended to preclude the presence or addition of one or more other features, numbers, steps, acts, components, parts, or combinations thereof.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
The application is further described with reference to examples of embodiments shown in the drawings.
As shown in fig. 1, an embodiment of the present application provides a resistance temperature coefficient measuring device, including a heating cavity 1 that can be opened, the heating cavity 1 includes a heat insulating layer 11, a heating element 12 located inside the heat insulating layer 11, and a temperature measuring element 14 located inside the heating element 12, electrodes of both the heating element 12 and the temperature measuring element 14 are all led out to the outside of the heating cavity 1, the resistance temperature coefficient measuring device further includes a heating circuit 2 located outside the heating cavity 1, a temperature measuring circuit 3, and a resistance measuring circuit 4, the heating circuit 2 is connected to the heating element 12, and the temperature measuring circuit 3 is connected to the temperature measuring element 14.
The internal space of the heating chamber 1 is used for placing the components to be tested. The temperature sensing element 14 is closer to the central region of the heating chamber 1 than the heating element 12. The heating chamber 1 may be configured to hold one dut or a plurality of duts. The internal space of the heating chamber 1 may be slightly larger than the element to be tested. The heating element 12 generates heat for heating the device under test. The heat-insulating layer 11 is used for preventing heat dissipation and ensuring heat concentration and temperature stability of the element to be measured.
The heating element 12 is, for example, a resistance wire or an infrared heating coating, and the heating circuit 2 outside the heating cavity 1 provides power output for the heating element 12. The temperature measuring element 14 is, for example, a thermal resistor, a thermocouple or a thermistor, and the temperature inside the heating chamber 1 is inferred by measuring the properties of the temperature measuring element 14 by the temperature measuring circuit 3 outside the heating chamber 1.
The heating chamber 1 further comprises: a resistance measuring electrode 4a penetrating through the cavity wall of the heating cavity 1 or an insertion hole 1a penetrating through the cavity wall of the heating cavity 1, wherein the part of the resistance measuring electrode 4a positioned outside the heating cavity 1 is connected with a resistance measuring circuit 4, and the part of the resistance measuring electrode 4a positioned inside the heating cavity 1 is used for connecting an element to be measured. The jack 1a is used for leading out the electrode of the element to be measured in the heating cavity 1 to the outside of the heating cavity 1, so that the jack can be connected with the resistance measuring circuit 4. The jack 1a can be smaller and only allows an electrode of an element to be tested to be led out; the disassembly 1a may be slightly larger than the size of the component to be tested, so that the component to be tested is inserted into the heating cavity 1 from the insertion hole 1a as a whole and part or all of the electrodes are exposed. Thus, the resistance measuring circuit 4 outside the heating cavity 1 can be electrically connected with the element to be measured, so that the resistance value of the element to be measured can be measured.
According to the scheme, the temperature of the element to be measured can be quickly and accurately raised, the whole volume of the equipment is small, and the cost is low.
Optionally, the heating chamber 1 further comprises a heat conducting layer 13 located inside the heating element 12, and the temperature sensing element 14 is located inside the heat conducting layer 13. The heat conductive layer 13 functions to uniformly conduct heat to the internal space of the heating chamber 1. The material of the heat conducting layer may be selected from metals or alloys, for example. The temperature measuring element 14 can be located on the inner surface of the heat conducting layer 13 or can be separate from the heat conducting layer 13 (e.g. in the central region of the internal space of the heating chamber 1).
Alternatively, referring to FIGS. 1-3, the temperature sensing element 14 can be plural in number. The number of the temperature measuring circuits 3 is a plurality and is connected with the temperature measuring elements 14 in a one-to-one correspondence manner. The temperature measuring circuit 3 can be one, and is connected with all the temperature measuring elements 14 through a gating switch.
The plurality of temperature measuring elements 14 can be distributed at different positions, so that the temperature measuring elements 14 at different positions can detect the temperatures at different positions, and whether the temperatures of the elements to be detected are uniform or not can be judged accordingly.
Alternatively, the temperature sensing elements 14 are evenly distributed. Therefore, the obtained temperature of the element to be measured is more accurate. Of course, the temperature sensing elements 14 can be non-uniformly distributed. This allows flexible design according to the shape of the element to be measured.
Optionally, the operating temperature range of the temperature sensing element 14 includes: [0 ℃,600 ℃ C. ]. This temperature range encompasses the operating temperature range of most heaters (i.e., the components to be tested) used to heat non-combustible devices.
Optionally, the temperature sensing element 14 comprises: any one of a thermal resistor, a thermocouple, and a thermistor. These temperature measuring elements 14 are each adapted to be made in the inner space of the heating chamber 1.
Optionally, the material of the insulating layer 11 includes: at least one of silicate materials, polyurethane foam, polystyrene boards, phenolic foam, aerogel felt, glass wool, rock wool, expanded perlite and micro-nano heat insulation materials.
Alternatively, referring to fig. 1-3, the inner surface of the heat conductive layer 13 is in the shape of a cylinder with two open ends, and the heating elements 12 are evenly distributed on the outer surface of the heat conductive layer 13. Of course, the heat conductive layer 13 may have a cylindrical shape with both ends closed.
Optionally, the resistance temperature coefficient measuring device further includes a processing circuit 5, and the processing circuit 5 is respectively connected to the heating circuit 2, the temperature measuring circuit 3, and the resistance measuring circuit 4; the processing circuit 5 is configured to: the control heating circuit 2 heats the element to be measured, the real-time temperature of the element to be measured is determined according to the output of the temperature measuring circuit 3, the real-time resistance of the element to be measured is determined according to the output of the resistance measuring circuit, and the resistance temperature coefficient of the element to be measured is determined according to the real-time temperature of the element to be measured and the corresponding real-time resistance.
The processing circuit 5 comprises, for example, a Micro Control Unit (MCU) performing the tasks of data processing and control, allowing the automatic measurement of the temperature coefficient of resistance.
Optionally, when the number of the temperature measuring elements 14 is multiple, determining the real-time temperature of the element to be measured according to the output of the temperature measuring circuit 3 includes: when the maximum difference between the temperatures of the elements to be measured determined by the outputs of the respective temperature measuring circuits 3 is smaller than the set threshold, the average value of the temperatures of the elements to be measured determined by the outputs of the respective circuits to be measured is taken as the real-time temperature of the elements to be measured.
In other words, when the temperature values obtained from the plurality of temperature measurement elements 14 are not very different, it indicates that the temperature distribution of the element to be measured is relatively uniform, and the determined resistance value and temperature value of the element to be measured are relatively accurate. Therefore, the accuracy of resistance temperature coefficient measurement is improved.
Optionally, the set threshold is denoted as TaAnd satisfies the following conditions: t is not less than 0.2 DEG CaLess than or equal to 2 ℃. For the temperature variation range of hundreds of degrees centigrade, the temperature of the element to be measured can be basically determined to be uniform when the temperature difference obtained by different temperature measuring elements 14 is within 2 ℃. If the set threshold is set too small, it is difficult to achieve the actual measurement.
Alternatively, referring to fig. 4, the processing circuit 5 calculates the temperature coefficient of resistance specifically as follows.
And step S1, determining a plurality of temperature values and corresponding resistance values of the element to be tested.
And step S2, establishing a rectangular coordinate system by taking the temperature as a horizontal coordinate and the resistance as a vertical coordinate, taking the determined temperature value and the corresponding resistance value as measured data points, and fitting by using a least square method to obtain a fitting straight line.
Step S3, according to the formula TCR ═ k/R0Calculating the temperature coefficient of resistance TCR of the device to be measured, wherein k is the slope of the fitting line, R0And the resistance value corresponding to the lowest temperature in the measured data points.
According to the definition of the temperature coefficient of resistance: TCR ═ (R-R)0)/[R0*(T-T0)]R is a real-time resistance, R0Is the initial resistance (i.e., the resistance corresponding to the selected lowest temperature), T is the real-time temperature, T0Is the initial temperature (i.e., the lowest temperature selected). Further, a linear equation can be obtained: r ═ R0*T*TCR+(R0-T0*R0TCR). If a first straight line with the minimum error with the measured data point is fitted by using a least square method, the slope k of the first straight line is R0TCR, thus TCR k/R can be obtained0。
The above calculation is an estimate of the temperature coefficient of resistance, R0The reference resistance value, that is, the resistance value of the device under test at 20 ℃.
The processing circuit 5 calculates the temperature coefficient of the element to be measured by using the above calculation method, and the error is relatively small and is closer to the actual situation.
The embodiments in the present application are described in a progressive manner, and the same and similar parts among the embodiments can be referred to each other, and each embodiment focuses on the differences from the other embodiments.
The protective scope of the present application is not limited to the above-described embodiments, and it is apparent that various modifications and variations can be made to the present application by those skilled in the art without departing from the scope and spirit of the present application. It is intended that the present application also include such modifications and variations as come within the scope of the appended claims and their equivalents.
Claims (7)
1. The resistance temperature coefficient measuring device is characterized by comprising a heating cavity, wherein the heating cavity comprises a heat insulation layer, a heating element and a temperature measuring element, the heating element is positioned on the inner side of the heat insulation layer, the temperature measuring element is positioned on the inner side of the heating element, electrodes of the heating element and the temperature measuring element are led out of the heating cavity, the resistance temperature coefficient measuring device further comprises a heating circuit, a temperature measuring circuit and a resistance measuring circuit, the heating circuit is connected with the heating element, and the temperature measuring circuit is connected with the temperature measuring element;
the heating chamber further comprises: the resistance measuring circuit comprises a resistance measuring electrode penetrating through the cavity wall of the heating cavity or an insertion hole penetrating through the cavity wall of the heating cavity, wherein the part of the resistance measuring electrode, which is positioned outside the heating cavity, is connected with the resistance measuring circuit, and the part of the resistance measuring electrode, which is positioned inside the heating cavity, is used for connecting an element to be measured; alternatively, the electrode of the element to be tested can penetrate through the wall of the heating cavity.
2. The temperature coefficient of resistance measuring device of claim 1, wherein the heating cavity further comprises a thermally conductive layer located inside the heating element, and the temperature measuring element is located inside the thermally conductive layer.
3. The apparatus of claim 1, wherein the temperature measuring element is provided in plurality.
4. The device of claim 3, wherein the temperature measuring elements are evenly distributed.
5. The apparatus of claim 3, wherein the temperature measuring element comprises: any one of a thermal resistor, a thermocouple, and a thermistor.
6. The device of claim 1, wherein the insulating layer comprises a material comprising: at least one of silicate materials, polyurethane foam, polystyrene boards, phenolic foam, aerogel felt, glass wool, rock wool, expanded perlite and micro-nano heat insulation materials.
7. The resistance temperature coefficient measuring device according to any one of claims 1 to 6, further comprising a processing circuit, the processing circuit being connected to the heating circuit, the temperature measuring circuit and the resistance measuring circuit, respectively; the processing circuitry is to: the heating circuit is controlled to heat the element to be measured, the real-time temperature of the element to be measured is determined according to the output of the temperature measuring circuit, the real-time resistance of the element to be measured is determined according to the output of the resistance measuring circuit, and the resistance temperature coefficient of the element to be measured is determined according to the real-time temperature of the element to be measured and the corresponding real-time resistance.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020745966.9U CN212341318U (en) | 2020-05-08 | 2020-05-08 | Resistance temperature coefficient measuring device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202020745966.9U CN212341318U (en) | 2020-05-08 | 2020-05-08 | Resistance temperature coefficient measuring device |
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| CN212341318U true CN212341318U (en) | 2021-01-12 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112379168A (en) * | 2020-05-08 | 2021-02-19 | 湖北中烟工业有限责任公司 | Resistance temperature coefficient measuring device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112379168A (en) * | 2020-05-08 | 2021-02-19 | 湖北中烟工业有限责任公司 | Resistance temperature coefficient measuring device |
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