CN212338010U - Shock absorption table of airborne hyperspectral imaging sensor pod - Google Patents

Shock absorption table of airborne hyperspectral imaging sensor pod Download PDF

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Publication number
CN212338010U
CN212338010U CN202021644610.2U CN202021644610U CN212338010U CN 212338010 U CN212338010 U CN 212338010U CN 202021644610 U CN202021644610 U CN 202021644610U CN 212338010 U CN212338010 U CN 212338010U
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connecting plate
holes
vibration isolator
locking device
damping
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CN202021644610.2U
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Chinese (zh)
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陈圣波
吴琼
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Jilin High Resolution Remote Sensing Applied Research Institute Co ltd
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Jilin High Resolution Remote Sensing Applied Research Institute Co ltd
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Abstract

The utility model discloses a shock attenuation platform of airborne hyperspectral imager sensor nacelle. This shock attenuation platform includes: the damping device comprises a first connecting plate, a damping device and a second connecting plate; the damping device is positioned between the upper surface of the first connecting plate and the lower surface of the second connecting plate; the damping device is respectively connected with the first connecting plate and the second connecting plate; the hyperspectral imaging sensor is positioned on the upper surface of the first connecting plate; the lower surface of the second connecting plate is arranged on the engine room. Adopt the utility model provides a shock attenuation platform can reduce vibrations to the influence of instrument, extension instrument life improves the measurement accuracy of instrument simultaneously.

Description

Shock absorption table of airborne hyperspectral imaging sensor pod
Technical Field
The utility model relates to a shock attenuation technical field especially relates to a shock attenuation platform of on-vehicle high spectrum imaging sensor nacelle.
Background
The airborne hyperspectral imaging sensor pod is a hyperspectral remote sensing imaging device, and has the characteristics of strong applicability, high spectral resolution, wide spectral range and the like compared with the traditional imaging device. Therefore, the onboard hyperspectral imaging sensor is more and more widely used. The hyperspectral remote sensing imaging device is a precise instrument and is loaded on the airplane, the airplane is influenced by airflow in the flying process to generate vibration, the vibration can be transmitted to the cabin, the imaging instrument in the cabin vibrates along with the vibration, and the measurement precision and the service life of the imaging instrument are influenced by the vibration borne by the instrument.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a shock attenuation platform of airborne hyperspectral imager sensor nacelle has the advantage that can reduce vibrations to influence, extension instrument life and the improvement measurement accuracy of instrument.
In order to achieve the above object, the utility model provides a following scheme:
a vibration-damping table comprising:
the damping device comprises a first connecting plate, a damping device and a second connecting plate;
the damping device is positioned between the lower surface of the first connecting plate and the upper surface of the second connecting plate; the damping device is respectively connected with the first connecting plate and the second connecting plate;
the hyperspectral imaging sensor is positioned on the upper surface of the first connecting plate;
the lower surface of the second connecting plate is arranged on the engine room.
Optionally, the number of the shock absorbing devices is multiple; the plurality of shock absorption devices are centrally and symmetrically distributed on the lower surface of the first connecting plate.
Optionally, the damping device specifically includes:
a vibration isolator and a vibration isolator base;
a first locking device is arranged at the top of the vibration isolator;
the top of the vibration isolator is connected with the first connecting plate through the first locking device; the bottom of the vibration isolator is connected with the vibration isolator base;
the vibration isolator base is disposed on an upper surface of the second connecting plate.
Optionally, the vibration isolator is a compound damping vibration isolator.
Optionally, the damping table further includes:
a base plate;
the bottom plate is positioned between the lower surface of the vibration isolator base and the upper surface of the second connecting plate, and the vibration isolator base is connected with the bottom plate through a second locking device; the bottom plate is connected with the second connecting plate through a third locking device.
Optionally, the first locking device, the second locking device and the third locking device are all bolts.
Optionally, a plurality of first through holes are formed in the first connecting plate;
the number of the first through holes is equal to that of the damping devices;
the first locking device penetrates through the first through hole and is connected with the nut; the nut is matched with the first locking device.
Optionally, a plurality of second through holes are formed in the vibration isolator base; the number of the second through holes is equal to that of the second locking devices;
a plurality of third through holes are formed in the bottom plate; the number of the third through holes is equal to the number of the second through holes; the third through hole is provided with a thread matched with the second locking device;
and the second locking device penetrates through the second through hole and the third through hole respectively to connect the vibration isolator base with the bottom plate.
Optionally, a plurality of fourth through holes are further arranged on the bottom plate; the number of the fourth through holes is equal to that of the third locking devices;
a plurality of fifth through holes are formed in the second connecting plate; the number of the fifth through holes is equal to the number of the fourth through holes; the fifth through hole is provided with a thread matched with the third locking device;
and the third locking device penetrates through the fourth through hole and the fifth through hole respectively to connect the bottom plate with the second connecting plate.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model provides a shock attenuation platform of airborne hyperspectral imager sensor nacelle, include: the damping device comprises a first connecting plate, a damping device and a second connecting plate; the damping device is positioned between the upper surface of the first connecting plate and the lower surface of the second connecting plate; the damping device is respectively connected with the first connecting plate and the second connecting plate; the hyperspectral imaging sensor is positioned on the upper surface of the first connecting plate; the lower surface of the second connecting plate is arranged on the engine room. The utility model provides a shock attenuation platform has reduced the influence of vibrations to the instrument, has prolonged instrument life and has improved instrument measurement accuracy simultaneously.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 is a schematic structural view of a shock absorbing platform of an airborne hyperspectral imaging sensor pod according to an embodiment of the present invention;
wherein, 1-a first connecting plate; 2-vibration isolator, 3-vibration isolator base; 4-a second locking device; 5-a bottom plate; 6-a third locking device; 7-a second connecting plate; 8-nut.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model aims at providing a shock attenuation platform of airborne hyperspectral imager sensor nacelle has the advantage that can reduce vibrations to influence, extension instrument life and the improvement measurement accuracy of instrument.
In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention is described in detail with reference to the accompanying drawings and the detailed description.
Fig. 1 is the embodiment of the utility model provides a shock attenuation platform structural schematic diagram of machine carries high spectral imaging sensor nacelle who provides, as shown in fig. 1, the utility model provides a shock attenuation platform includes: first connecting plate 1, damping device and second connecting plate 7. Damping device is located between the lower surface of first connecting plate 1 and the upper surface of second connecting plate 7, and damping device is connected with first connecting plate 1 and second connecting plate 7 respectively, and high spectral imaging sensor is located the upper surface of first connecting plate 7, and the cabin is arranged in to the lower surface of second connecting plate 7.
Wherein, damping device's quantity is a plurality of, and a plurality of damping device centrosymmetric distribution are at the lower surface of first connecting plate 1. Damping device specifically includes: vibration isolator 2 and vibration isolator base 3. The vibration isolator 2 is a composite damping vibration isolator (model ZF 200). The top of isolator 2 is provided with first locking device, and the top of isolator 2 is connected through first locking device with first connecting plate 1, and the bottom and the isolator base 3 of isolator 2 are connected, and isolator base 3 sets up on the upper surface of second connecting plate 7.
The utility model provides a shock attenuation platform still includes bottom plate 5. The bottom plate 5 is located between the lower surface of the vibration isolator base 3 and the upper surface of the second connecting plate 7, the vibration isolator base 3 is connected with the bottom plate 5 through the second locking device 4, and the bottom plate 5 is connected with the second connecting plate 7 through the third locking device 6.
Specifically, the first locking device, the second locking device 4 and the third locking device 6 are all bolts.
A plurality of first through holes are formed in the first connecting plate 1, and the number of the first through holes is equal to that of the damping devices; the first locking device penetrates through the first through hole and is connected with the nut 8; the nut 8 is matched with the first locking device.
A plurality of second through holes are formed in the vibration isolator base 3, and the number of the second through holes is equal to that of the second locking devices 4; a plurality of third through holes are formed in the bottom plate 5, the number of the third through holes is equal to that of the second through holes, and threads matched with the second locking devices 4 are arranged on the third through holes; and the second locking device 4 penetrates through the second through hole and the third through hole to connect the vibration isolator base 3 with the bottom plate 5.
A plurality of fourth through holes are further formed in the bottom plate 5, and the number of the fourth through holes is equal to that of the third locking devices 6; a plurality of fifth through holes are formed in the second connecting plate 7, the number of the fifth through holes is equal to that of the fourth through holes, and threads matched with the third locking devices 6 are arranged on the fifth through holes; and the third locking device 6 penetrates through the fourth through hole and the fifth through hole to connect the bottom plate 5 with the second connecting plate 7.
When the airplane flies, the bottom plate 5 transmits the excitation to the vibration isolator base 3, the vibration isolator base 3 transmits the excitation to the vibration isolator 2, relative displacement can be generated between the vibration isolator 3 and the first connecting plate 1 due to inertia and rigidity, the vibration isolator gradually consumes vibration energy, and the instrument is guaranteed to achieve an ideal damping effect.
The utility model provides a damping platform, the vibration isolator adopts the composite damping (air, hydraulic) vibration isolator, which can significantly reduce the influence of the airplane vibration on the equipment and ensure the stable operation of the instrument; the first connecting plate is connected with the bottom plate 5 through the composite damping vibration isolator, so that the vibration in the vertical direction can be greatly weakened, and the stress of equipment fixed on the first connecting plate 1 is balanced.
The utility model provides a shock attenuation platform can be applied to except that the multiple machine that carries high spectrum imaging sensor carries the instrument.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The principle and the implementation of the present invention are explained herein by using specific examples, and the above description of the embodiments is only used to help understand the method and the core idea of the present invention; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the concrete implementation and the application scope. In summary, the content of the present description should not be construed as a limitation of the present invention.

Claims (9)

1. A vibration-damping table, comprising:
the damping device comprises a first connecting plate, a damping device and a second connecting plate;
the damping device is positioned between the lower surface of the first connecting plate and the upper surface of the second connecting plate; the damping device is respectively connected with the first connecting plate and the second connecting plate;
the hyperspectral imaging sensor is positioned on the upper surface of the first connecting plate;
the lower surface of the second connecting plate is arranged on the engine room.
2. The damping table according to claim 1, characterized in that said damping means are in a plurality; the plurality of shock absorption devices are centrally and symmetrically distributed on the lower surface of the first connecting plate.
3. The damping table according to claim 1, characterized in that the damping device comprises in particular:
a vibration isolator and a vibration isolator base;
a first locking device is arranged at the top of the vibration isolator;
the top of the vibration isolator is connected with the first connecting plate through the first locking device; the bottom of the vibration isolator is connected with the vibration isolator base;
the vibration isolator base is disposed on an upper surface of the second connecting plate.
4. The vibration-damping table of claim 3, wherein the vibration isolator is a compound damping vibration isolator.
5. The shock absorbing station of claim 3, further comprising:
a base plate;
the bottom plate is positioned between the lower surface of the vibration isolator base and the upper surface of the second connecting plate, and the vibration isolator base is connected with the bottom plate through a second locking device; the bottom plate is connected with the second connecting plate through a third locking device.
6. The cushion table of claim 5, wherein the first locking device, the second locking device, and the third locking device are each bolts.
7. The cushion table of claim 3, wherein the first connecting plate is provided with a plurality of first through holes;
the number of the first through holes is equal to that of the damping devices;
the first locking device penetrates through the first through hole and is connected with the nut; the nut is matched with the first locking device.
8. The vibration damping table according to claim 6, wherein a plurality of second through holes are provided on the vibration isolator base; the number of the second through holes is equal to that of the second locking devices;
a plurality of third through holes are formed in the bottom plate; the number of the third through holes is equal to the number of the second through holes; the third through hole is provided with a thread matched with the second locking device;
and the second locking device penetrates through the second through hole and the third through hole respectively to connect the vibration isolator base with the bottom plate.
9. The shock absorbing table as claimed in claim 6, wherein a plurality of fourth through holes are further provided on the bottom plate; the number of the fourth through holes is equal to that of the third locking devices;
a plurality of fifth through holes are formed in the second connecting plate; the number of the fifth through holes is equal to the number of the fourth through holes; the fifth through hole is provided with a thread matched with the third locking device;
and the third locking device penetrates through the fourth through hole and the fifth through hole respectively to connect the bottom plate with the second connecting plate.
CN202021644610.2U 2020-08-10 2020-08-10 Shock absorption table of airborne hyperspectral imaging sensor pod Active CN212338010U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021644610.2U CN212338010U (en) 2020-08-10 2020-08-10 Shock absorption table of airborne hyperspectral imaging sensor pod

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021644610.2U CN212338010U (en) 2020-08-10 2020-08-10 Shock absorption table of airborne hyperspectral imaging sensor pod

Publications (1)

Publication Number Publication Date
CN212338010U true CN212338010U (en) 2021-01-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021644610.2U Active CN212338010U (en) 2020-08-10 2020-08-10 Shock absorption table of airborne hyperspectral imaging sensor pod

Country Status (1)

Country Link
CN (1) CN212338010U (en)

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