CN212324349U

CN212324349U - Loudspeaker with planar coil diaphragm and side sound outlet

Info

Publication number: CN212324349U
Application number: CN202020575656.7U
Authority: CN
Inventors: 颜君玲
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-04-17
Filing date: 2020-04-17
Publication date: 2021-01-08
Anticipated expiration: 2030-04-17

Abstract

The utility model discloses a loudspeaker with a plane coil vibrating diaphragm side sounding, which comprises a shell, wherein a vibrating component and a magnet component are encapsulated in the shell, the vibrating component comprises a vibrating diaphragm, an upper supporting component and a lower supporting component, and the vibrating diaphragm is arranged between the upper supporting component and the lower supporting component; the magnet assembly at least comprises a group of combinations of external magnets and internal magnets, and the external magnets are arranged outside the internal magnets in a surrounding mode; the vibrating diaphragm comprises a vibrating diaphragm body, at least one coil is attached to the upper surface and the lower surface of the vibrating diaphragm body, and a bonding pad located inside the coil and a bonding pad located outside the coil are respectively arranged at two ends of the coil. Has the following advantages: the problem of how to effectively connect the internal end point of the closed coil with the outside is solved, the product membrane area after the scheme is adopted is utilized to the maximum extent, the vibration mass is light, the connection is reliable, the assembly process is simple, the method is suitable for large-scale industrial automatic production, the product performance is excellent, and the cost is low.

Description

Loudspeaker with planar coil diaphragm and side sound outlet

Technical Field

The utility model relates to a plane coil vibrating diaphragm side goes out sound speaker belongs to electro-acoustic technology field.

Background

The loudspeaker is commonly called as a loudspeaker, and is widely applied to equipment or facilities which need to make sound, such as sound boxes, earphones, mobile phones, wearable equipment, robots, household appliances and the like. Current loudspeakers include moving coil loudspeakers, electrostatic loudspeakers and planar coil diaphragm loudspeakers in their operating principle.

The moving-coil loudspeaker is the loudspeaker which is most widely applied at present because of simple structure, mature process and good performance, but the moving-coil loudspeaker has the defect that transient characteristics are poor because of large vibration mass of coils and the like; due to uneven mass distribution and asymmetric BL electromagnetic driving force, different degrees of swinging vibration are generated; because only the bonding part of the coil and the membrane is completely synchronous (the surface of the soft membrane is not rigid enough and deforms) on the membrane surface for pushing air to generate sound, other parts of the membrane surface cannot vibrate synchronously with the coil, and therefore, the membrane surface generates segmentation vibration (the membrane surface for pushing air to generate sound at a certain moment is not synchronous) under different frequencies, so that a frequency response curve generates serious peaks and valleys. Such problems lead to high product distortion, poor loudspeaker frequency response, and great challenges to acoustic performance improvement.

The structure of a conventional moving-coil loudspeaker is shown in fig. 1, in which D1-a diaphragm body; d2-magnetically permeable (metal) sheet; d3-coil; d4-magnetic shield (magnetically permeable metal sheet); d5-magnet; d6-the coil and the membrane bonding part, the moving coil loudspeaker includes D3 coil, the coil of the traditional moving coil loudspeaker is the "cylinder" form spatial structure, this "cylinder" form coil receives the electromagnetic force and does the reciprocating motion in the vertical direction in the magnetic gap, drive the vibrating diaphragm body and promote the air to produce the sound.

As shown in fig. 2, the electrostatic speaker has the following advantages: because the film is extremely light, the transient response is good, the resolving power is excellent, the high-frequency response characteristic is very good, and can exceed 40 KHz; because the large area plane force is driven, the distortion is low, and the sound is natural and comfortable. But has the following disadvantages: since the driving force is inversely proportional to the square of the membrane-to-plate distance, the electrostatic force F ∈ S (U) acting on the electrostatic membrane²/d²) Epsilon dielectric constant, S film area, signal voltage between the U film and the polar plate, d is the distance between the film and the polar plate,the electrostatic force is proportional to the square of the signal voltage magnitude and inversely proportional to the square of the membrane-to-plate distance, so that low-frequency sound is insufficient; the alternating audio signal must be boosted to several hundred volts to make the sound acceptable to consumers, and the boosting process of broad frequency, low distortion and high boosting ratio greatly increases the product cost, which is also the reason why the sound box and the earphone using the electrostatic speaker are tens of thousands yuan or tens of thousands yuan.

The planar coil diaphragm loudspeaker, as the name suggests, is to spread the coil into a plane, it is no longer a three-dimensional "cylinder" structure like moving coil loudspeaker, but a closed curve structure similar to a circular or snake-shaped wire, the snake-shaped wire closed curve coil is attached to the surface as large as possible of the diaphragm body and becomes a vibrating body with the diaphragm body. The coil in the orthogonal magnetic field is acted by electromagnetic force in the vertical direction to drive the diaphragm body to do reciprocating motion near a balance position, so that air is pushed to produce sound.

As shown in fig. 3, the magnetization direction of the P1 magnet in the drawing is N-pole in the left arrow direction, and S-pole in the right arrow direction; 6P 2 magnets; p3-magnet gap (sound ingress and egress); p4 plane diaphragm body; p5 film support; p6 film support; the direction of current flow in the P7 coil is out of the plane of the paper (pointing to the reader); the direction of the current in the P8 coil is vertically into the page (away from the reader); a planar coil group of the lower surface of the P9 film; 6 magnets are arranged below the P10 film.

Since the coil of the planar coil speaker is spread out in a plane and is adhesively distributed over the entire plane of the diaphragm body, this structural change brings about the following advantages: firstly, the coil and the diaphragm body are both thin layers, the mass is very small, the vibration mass is very light, and thus the transient and high-frequency characteristics are very good; secondly, the coils are uniformly distributed on the surface of the membrane, when alternating current audio current flows, the whole surface of the membrane can synchronously vibrate under the action of electromagnetic force, and the swinging and the segmentation vibration are avoided or reduced; thirdly, heat distributed on the plane of the coil is easy to dissipate (the heat is not easy to dissipate because the coil of the moving coil loudspeaker is vertically stacked with a plurality of layers), so that various negative effects caused by heating of the coil, such as instability of a vibration system caused by softening of a film, are avoided; fourthly, extra independent power amplification boosting drive like an electrostatic loudspeaker is not needed, the overall cost of the product is low, and the cost is easily reduced to realize mass sale. The planar coil loudspeaker not only develops the advantages of small mass and planar driving of the planar diaphragm body of the electrostatic loudspeaker, but also avoids the design and structural defects of the moving coil loudspeaker, and also overcomes the defects of difficult driving and high cost of the electrostatic loudspeaker, thereby being the next generation of directional products and solutions for upgrading the traditional electric field device technology.

However, planar coil loudspeakers also have the disadvantage that primarily the planar coil operates less efficiently in the magnetic field formed by the planar magnet. In order to improve efficiency, the larger the electromagnetic force, the better, according to the formula F ═ BLI (where B is the magnetic field strength, L is the coil wire length in the magnetic field, and I is the alternating current magnitude), it is necessary to increase the effective magnetic field strength B as much as possible while maximizing the coil wire length L in the effective magnetic field as much as possible. The current planar coil loudspeaker has two implementation schemes, namely a bar magnet scheme and a planar coil which is a snake-shaped wire; the other is a concentric circle magnet scheme, and the planar coil is a concentric circle, or an approximate concentric circle, or a spiral line structure. Both structures face the challenge of how to lead out the coil outlet end or the coil inlet end while the coil is routed in the longest mode, and the free vibration problem of the membrane is not influenced, so far, no effective solution is provided. This had both restricted the improvement of plane coil speaker performance, had also made the production efficiency of this type of product low, and product material cost and manufacturing cost have high down, and final high price has restricted the popularization of product, makes the product that a hope large tracts of land was promoted in a large number fall into a high price and a little product.

The prior art method for solving the disadvantages of the planar coil speaker includes the following aspects:

1. the patent publication number "CN 204206457" and the patent name "spiral pressurization plane vibrating diaphragm body speaker" applied by the applicant "Guangdong European mobile communication Limited company" adopt a circular coaxial magnetic ring scheme, and the 8 th paragraph of the patent specification discloses that "specifically, the vibration system is observed along the same direction, if the front spiral winding plate is wound along the clockwise direction, the back spiral winding plate is wound along the counterclockwise direction; if the front spiral winding plate is coiled along the anticlockwise direction, the back spiral winding plate is coiled along the clockwise direction, and the 14 th section of the specification discloses that "it is specific, vibrating diaphragm body central point puts and is provided with the through-hole that runs through vibrating diaphragm body both sides face, the first end of front spiral winding plate with the first end of back spiral winding plate is passed through the through-hole is connected with spot welding's mode and is formed the route", its specification attached drawing 10 is its patent membrane structure. The scheme of this patent is summarized as follows: the front spiral wound plate 120 thereof must have the coil ends in the middle of the film if it is wound in the clockwise direction from the outside to the inside, and the rear spiral wound plate 130 thereof must have the coil ends in the middle of the film if it is wound in the counterclockwise direction. The two coils on both surfaces of the membrane are connected up and down by "spot welding" at their middle ends, so that the two coils on both surfaces are connected together in series from the middle circuit (line length L is maximized). The spiral coils on the two surfaces have opposite winding directions when viewed in the same direction, so that the current directions in the coils in the same magnetic field at the same position are the same, and the acting forces in the same direction are applied to realize the superposition of the forces, but not the reaction forces.

The spot welding technique used in the above patent is a welding method in which a welding spot is formed between the contact surfaces of two overlapped workpieces by using a columnar electrode during welding. During spot welding, pressure is applied to make the workpieces closely contact, then current is switched on, the contact position of the workpieces is melted under the action of resistance heat, and a welding spot is formed after cooling. In order to reduce the vibration mass, the film and coil thickness of the planar coil loudspeaker are extremely thin, and the film thickness in practical products is often less than 10 micrometers, namely 1x10^-5And (4) rice. The spot welding on both sides of the thin film is very easy to break down or not welded, resulting in very low product yieldThe product cost is extremely high, and the membrane is provided with holes, so that when the product vibrates, connection points are easy to break, product failure is generated, and the condition that the loudspeaker does not have sound and is seriously bad is caused. The winding directions on the two surfaces of the film are opposite, so that the film is not beneficial to consistent processing, and the production efficiency is improved.

2. In the patent entitled "planar voice coil speaker" and published under the number "CN 110278514A" filed by the applicant "twitter technologies ltd", the 64 th paragraph of the description thereof describes "fig. 9 is a schematic diagram of a second embodiment of a planar diaphragm body coil. As shown in fig. 9, the second surface 23 is further provided with a back coil 35, and the back coil 35 is electrically connected to the planar coil 30. The back side coil 35 may be connected to the planar coil 30 at the periphery of the planar coil diaphragm 20. Or may be connected to each other through the communication hole 25 of the planar coil diaphragm 20. The communication hole 25 penetrates the first surface 21 and the second surface 23, and a conductive adhesive may be disposed in the communication hole 25, so that the back coil 35 is electrically connected to the planar coil 30. As shown in fig. 9, the planar coil diaphragm 20 is a circular diaphragm body, the communication hole 25 is formed in the center of the circular diaphragm body, and the conductive adhesive electrically connects the back coil 35 and the planar coil 30. In addition, the back coil 35 and the planar coil 30 in fig. 8 and 9 are all archimedean spiral coils, so that when the current signal is passed through the planar coil 30, it can be flowed out from the back coil 35, or reversed. "

According to the above invention, the connection of the coils on the upper and lower surfaces of the film is achieved by connecting the coils on the upper and lower surfaces of the film with the ends of the coils at the center of the film through the hole at the center of the film by using conductive adhesive. The disadvantage of this connection is that the center of the membrane is the part with the largest amplitude (the circular membrane with fixed periphery has the largest middle amplitude when vibrating, and the smaller the amplitude towards the outer edge part, the smallest zero edge), and the tension consistency of the membrane is damaged when the middle of the membrane is perforated; when the conductive adhesive is used for bonding the coils on the upper surface and the lower surface, the adhesive is suspended in the hole due to the through hole in the middle, so that the bonding is easy to be insecure; the conductive adhesive has a thickness, which reduces the vibration space of the membrane and increases the vibration mass.

In the patent of "a flat plate sound generator and an earphone" filed by the applicant, "national photovoltaic device corporation," with the publication number "CN 209964299U," how to realize the up-and-down series connection of spiral coils on the upper and lower surfaces of a film, a method similar to the above-mentioned patent of the siebol te technologies corporation is adopted, that is, a hole is drilled in the middle of the film, and the central ends of the spiral coils respectively located on the upper and lower surfaces of the film are connected together in series through a conductive adhesive.

3. In the patent with the patent name "planar diaphragm body horn" of the applicant, "girendelong electronics limited, shenzhen," CN207475867U, the patent publication discloses that a coil wire is in a serpentine shape to match a bar magnet, and from the summary of the patent, for a coil with a serpentine coil wire, because the coil is a conductor, and a short circuit occurs between the conductor and the conductor due to the crossing of the conductor and the short circuit, the beginning end and the ending end of the coil are always one inside the coil and the other end outside the coil, so that a space has to be additionally added, such as the wire winding segment 106 in fig. 2 of the specification, which is a space additionally added to the two ends to match other components to connect the two ends with an external circuit. Thus, space is wasted, the product is difficult to miniaturize, and the product material and production cost are increased. In addition, the length of the coil in the routing winding line segment 106 is not under the effective magnetic field, so that the length of the coil is only increased, that is, only the resistance is increased, and the current is reduced, thereby reducing the output sound of the product and reducing the product performance. This patent scheme uses only one side of the membrane, i.e. there is a coil on only one side of the membrane, which undoubtedly reduces the sensitivity by 3dBSPL compared to the double-sided routing scheme. However, to use a double-sided routing scheme, how to connect the coils on the upper and lower surfaces of the film is also a significant challenge that is not effectively solved.

In summary, in the prior art of the planar coil speaker, no matter the planar coil speaker is a spiral coil scheme or a serpentine coil scheme, the coils are definitely a plurality of groups of closed concentric-circle-like curves, spiral lines or serpentine curves, which are connected in series end to end, and the closed group always has a "start end" and a "stop end"; because the coils are usually conductors, any two coils cannot be connected, so that one end of each of the two ends is inside the closed coil, and the other end of each of the two ends is outside the closed coil; the terminal located outside the closed coil is very easy to connect with external circuits, such as a PCB pad, but how to lead out the terminal located inside the closed coil and connect with the external circuits faces a great challenge. From the above analysis, the current solutions of spot welding, punching the middle of the film and connecting the coil ends of the upper and lower surfaces of the film by means of conductive glue, and the solutions of coil routing in serpentine shape all have their own drawbacks.

No matter what coil scheme, how to effectively derive the end point inside the closed coil, and reliably connect the end point with an external circuit, so that the best acoustic performance is realized, the production efficiency can be improved, the product cost is reduced, and the technical bottleneck to be solved in the industry is formed.

Disclosure of Invention

The to-be-solved technical problem of the utility model is not enough more than to, provide a plane coil vibrating diaphragm side play sound speaker, solved the inside extreme point of closed coil how effectively with external connection, product membrane area after this scheme of adoption obtains the at utmost utilization, the vibrating mass is light, connect reliably, assembly process is simple, be fit for big batch industrial automation production, product property can be excellent, and is with low costs, especially adapted use as the speaker of cell-phone, earphone, the audio amplifier, the computer, electronic products such as TV.

For solving the technical problem, the utility model discloses a following technical scheme:

a loudspeaker with a planar coil diaphragm and a lateral sound outlet comprises a shell, wherein a vibration assembly and a magnet assembly are encapsulated in the shell, the vibration assembly comprises a diaphragm, an upper support assembly and a lower support assembly, and the diaphragm is arranged between the upper support assembly and the lower support assembly;

the magnet assembly at least comprises a group of combinations of external magnets and internal magnets, and the external magnets are arranged outside the internal magnets in a surrounding mode;

the vibrating diaphragm comprises a vibrating diaphragm body, wherein at least one of the upper surface and the lower surface of the vibrating diaphragm body is attached with a coil, and two ends of the coil are respectively provided with a bonding pad positioned inside the coil and a bonding pad positioned outside the coil;

and the upper supporting assembly and the lower supporting assembly are respectively provided with a bonding pad connected with the coil bonding pad, and an input bonding pad and an output bonding pad of an external power amplifier circuit electric signal.

Furthermore, a first coil and a second coil are respectively attached to the upper surface and the lower surface of the plane diaphragm body, and the first coil and the second coil are arranged in mirror symmetry by taking the central plane of the plane diaphragm body as a symmetry plane.

Further, go up the supporting component and include the support ring, go up the support breach has been seted up to the wherein square one side of support ring, and the opposite side of going up the support ring relative with the one side that is equipped with the support breach is equipped with and supports boss and second and go up support metallization hole, goes up the side protrusion of support boss for going up the support ring.

Furthermore, a first upper support bonding pad is arranged on the upper surface of the upper support boss, a third upper support bonding pad is arranged on the lower surface of the upper support boss, and a first upper support metallization hole which penetrates through the third upper support bonding pad and the first upper support bonding pad is arranged on the third upper support bonding pad and the first upper support bonding pad;

and the third upper support bonding pad is connected with a second coil bonding pad of the first coil, the second coil bonding pad is positioned outside the first coil, and the first upper support bonding pad is used as an input end or an output end of an electric signal.

Furthermore, a second upper support bonding pad is arranged on the lower surface of the upper support ring where the second upper support metallization hole is arranged, and the second upper support bonding pad is connected with the second upper support metallization hole;

the second upper supporting pad is connected with a first coil pad, and the first coil pad is arranged on the upper surface of the planar diaphragm body and located outside the first coil.

Furthermore, the lower support assembly comprises a lower support ring, wherein a lower support metalized hole, a first lower support boss and a second lower support boss are arranged on one square side of the lower support ring, and the lower support metalized hole is positioned between the first lower support boss and the second lower support boss.

Furthermore, a second lower support bonding pad is arranged on the upper surface of the lower support ring where the lower support metalized hole is arranged, and the second lower support bonding pad is connected with the lower support metalized hole;

the second lower support bonding pad is connected with a sixth coil bonding pad of the second coil, and the sixth coil bonding pad is located outside the second coil.

Furthermore, a first lower support bonding pad is arranged on the second lower support boss, a third lower support bonding pad is arranged on the upper surface of the other side, adjacent to one side of the lower support ring adjacent to the lower support metalized hole, of the second lower support boss, and the first lower support bonding pad and the third lower support bonding pad are connected through a square bonding pad connecting line;

the first lower support bonding pad is used as an output end or an input end of an electric signal;

the third lower support bonding pad is connected with a seventh coil bonding pad, and the seventh coil bonding pad is arranged on the lower surface of the planar diaphragm body and is positioned outside the second coil.

Further, the lower support metallization hole and the second upper support metallization hole are connected through an inter-hole conductor;

the first lower supporting boss is aligned with and closely contacted with the upper supporting boss.

Furthermore, the first coil also comprises a fourth coil pad, the fourth coil pad is positioned inside the first coil, the upper surface of the planar diaphragm body is also provided with a third coil pad, the third coil pad is positioned outside the first coil, a first insulating layer is arranged between the first coil pad and the fourth coil pad, the first insulating layer completely covers the first coil between the first coil pad and the fourth coil pad, and an insulating area is formed on the first insulating layer;

the surface of the first insulating layer is provided with a first conducting layer, and two ends of the first conducting layer are respectively connected with the first coil bonding pad and the fourth coil bonding pad.

Furthermore, the second coil also comprises an eighth coil bonding pad, the eighth coil bonding pad is positioned inside the second coil, a fifth coil bonding pad is also arranged on the lower surface of the planar diaphragm body, the fifth coil bonding pad is positioned outside the second coil, a second insulating layer is arranged between the eighth coil bonding pad and the seventh coil bonding pad, and the second insulating layer completely covers the second coil between the eighth coil bonding pad and the seventh coil bonding pad to form an insulating area on the second coil bonding pad;

and a second conducting layer is arranged on the surface of the second insulating layer, and the two ends of the second conducting layer are respectively connected with the eighth coil bonding pad and the seventh coil bonding pad.

Further, the shell comprises a lower shell and an upper shell, wherein the lower shell is provided with a lower shell pressure equalizing hole, and the upper shell is provided with an upper shell sound outlet;

the lower surface of the upper shell is fixed with the upper surfaces of the upper outer magnet and the upper inner magnet, and the lower surfaces of the upper outer magnet and the upper inner magnet are tightly contacted with the upper support ring;

the upper surface of the lower shell is fixed with the lower surfaces of a lower external magnet and a lower internal magnet, and the upper surfaces of the lower external magnet and the lower internal magnet are in close contact with the lower support ring;

the upper outer magnet and the upper inner magnet, and the lower outer magnet and the lower inner magnet are respectively arranged on the upper part and the lower part of the vibration assembly.

The utility model adopts the above technical scheme, compare with prior art, have following technological effect:

1. have at least one side to adhere to in the upper and lower surface of vibrating diaphragm body and have the coil, the both ends of coil are equipped with one respectively and are located the inside extreme point of coil and one and are located the outside extreme point of coil, and it has the insulating layer to adhere to on the coil, and it has the conducting layer to adhere to on the insulating layer, and the conducting layer is used for drawing forth the inside extreme point that will be located the coil and is connected with the outside electrically conductive of coil, and the advantage:

1) all operations are all carried out on the membrane surface, have avoided the spot welding or have perforated the damage of prior art scheme such as bonding to the membrane, and the vibrating diaphragm body tension of this scheme of adoption is stable, and the uniformity is good, can effectively avoid cutting apart the vibration or sway the vibration, and the speaker distortion is low.

2) The insulating layer is made of Parylene insulating material, the thickness of the insulating layer is usually several microns, the insulating layer is very thin, the tension and the quality of a film are hardly influenced, the adhesion firmness and the insulating property are excellent, and the insulating layer is the future technical direction of an insulating coating.

3) The method for printing the conductive ink on the conductive layer by adopting ink-jet printing or printing is simple, the precision is high, the industrial batch high-efficiency operation is easy, the quality of the cured conductive layer is small, the adhesion firmness is high, and the conductive performance is excellent, thereby representing the future direction of the 3D printing technology.

2. The upper surface and the lower surface of vibrating diaphragm body are adhered to respectively and are had positive coil and reverse side coil, and positive coil and reverse side coil use the central plane of vibrating diaphragm body to set up as the mirror symmetry of plane of symmetry (be about to the coil of upper surface duplicate the translation under the membrane, the orientation is unchangeable), can utilize laser etching membrane surface metal to realize once taking shape like this, and the coil that adopts this scheme adheres to the firmness height, and the product uniformity is good, and production efficiency improves one time or more.

3. The supporting component is used for supporting the vibrating diaphragm and conducting electricity with the coil bonding pad of the vibrating diaphragm, and is also provided with an input bonding pad and an output bonding pad of an electric signal of an external power amplifier circuit.

It is above-mentioned to synthesize, the utility model provides a solve inside extreme point of closed coil how effectively with external connection, the membrane area of the product after this scheme of adoption obtains the at utmost utilization, and the vibrating mass is light, connects reliably, and assembly process is simple, and this method is fit for big batch industrial automation production, and product property can be excellent, and is with low costs, and the speaker that is fit for electronic product such as cell-phone, earphone, audio amplifier, computer, TV uses very much.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.

Fig. 1 is a schematic structural diagram of a conventional moving-coil speaker in the background art of the present invention;

fig. 2 is a schematic structural diagram of an electrostatic speaker according to the background art of the present invention;

fig. 3 is a schematic structural diagram of a planar coil speaker in the background art of the present invention;

fig. 4 is an exploded view of a speaker according to an embodiment of the present invention;

fig. 5 is an oblique view of a speaker according to an embodiment of the present invention;

fig. 6 is a front view of a speaker according to an embodiment of the present invention;

fig. 7 is a rear view of a speaker according to an embodiment of the present invention;

fig. 8 is a front view of a diaphragm in an embodiment of the present invention;

fig. 9 is a rear view of a diaphragm in an embodiment of the present invention;

fig. 10 is a cross-sectional view of a speaker according to an embodiment of the present invention;

fig. 11 is an exploded view (from top to bottom) of a vibration assembly in an embodiment of the present invention;

fig. 12 is an exploded view (from below to above) of a vibration assembly in an embodiment of the present invention;

fig. 13 is an oblique view of a vibration assembly in an embodiment of the present invention.

Detailed Description

Examples

As shown in fig. 4 to 13, a planar coil diaphragm side out-of-range speaker includes a housing, and a vibration assembly and a magnet assembly are enclosed in the housing, where the vibration assembly includes a diaphragm, an upper support assembly and a lower support assembly.

The housing includes a lower case 400 and an upper case 490, and the lower case 400 and the upper case 490 are fixed together by spot welding or a mechanical method thereof, and the lower case 400 and the upper case 490.

The lower shell 400 is provided with a lower shell equalizing hole 401, and the upper shell 490 is provided with an upper shell sound outlet 491.

The lower case 400, the upper case 490, the vibration assembly and the magnet assembly are square.

The diaphragm comprises a planar diaphragm body 440, a first coil 446 and a second coil 446b are respectively attached to the upper surface and the lower surface of the planar diaphragm body 440, and the first coil 446 and the second coil 446b are arranged in mirror symmetry by taking the central plane of the planar diaphragm body 440 as a symmetry plane.

The first coil 446 and the second coil 446b are wound in a spiral manner.

The two ends of the first coil 446 are respectively provided with a second coil pad 444 and a fourth coil pad 447, the upper surface of the planar diaphragm body 440 is further provided with a first coil pad 443 and a third coil pad 445, the fourth coil pad 447 is located inside the first coil 446, the first coil pad 443, the second coil pad 444 and the third coil pad 445 are located outside the first coil 446, a first insulating layer 441 is arranged between the first coil pad 443 and the fourth coil pad 447, and the first insulating layer 441 completely covers the first coil 446 between the first coil pad 443 and the fourth coil pad 447 to form an insulating region thereon.

The first conductive layer 442 is disposed on the surface of the first insulating layer 441, and both ends of the first conductive layer 442 are connected to the first coil pad 443 and the fourth coil pad 447, respectively.

A sixth coil pad 444b and an eighth coil pad 447b are respectively arranged at two ends of the second coil 446b, a fifth coil pad 443b and a seventh coil pad 445b are further arranged on the lower surface of the planar diaphragm body 440, the eighth coil pad 447b is located inside the second coil 446b, the sixth coil pad 444b, the fifth coil pad 443b and the seventh coil pad 445b are located outside the second coil 446b, a second insulating layer 441b is arranged between the eighth coil pad 447b and the seventh coil pad 445b, and the second insulating layer 441b completely covers the second coil 446b between the eighth coil pad 447b and the seventh coil pad 445b, and an insulating region is formed thereon.

A second conductive layer 442b is disposed on the surface of the second insulating layer 441b, and the eighth coil pad 447b and the seventh coil pad 445b are connected to both ends of the second conductive layer 442b, respectively.

The coil and the pad are both conductors capable of conducting electricity.

The first insulating layer 441 and the second insulating layer 441b are preferably long, but are not limited to long, and may cover the entire coil surface or most of the coil surface.

The insulating layers and the conductive layers respectively positioned on the two surfaces of the planar diaphragm body 440 are symmetrical left and right with respect to the center of the planar diaphragm body 440, so that the vibration mass distribution of the final diaphragm body product is symmetrical with respect to the center of the planar diaphragm body 440.

The planar diaphragm body 440 is usually a plastic film with a thickness of several micrometers to several tens of micrometers, and the film material is usually PEN, PET, PPS, or the like, or may be a multi-layer composite diaphragm body.

The first coil 446 and the second coil 446b may be formed by depositing a thin conductive layer on the upper and lower surfaces of the diaphragm body in a physical vapor deposition manner, for example, by a magnetron sputtering coating process, and then processing a spiral coil on the upper and lower surfaces of the diaphragm body to which the conductive coating is attached by laser etching, wherein the coating material may be a metal material such as aluminum, nickel, silver, gold, or the like, or two or more of the above metals, or a conductive non-metal material such as graphene, or the like.

The first coil 446 and the second coil 446b may also be formed by printing or spraying other conductive materials on the surface of the planar diaphragm body 440, or by adhering processed conductive materials of coils, such as aluminum foil, on the surface of the diaphragm body.

The insulating material of the first insulating layer 441 and the second insulating layer 441b may be Parylene (Parylene) insulating material deposited by vacuum vapor deposition, preferably Parylene C in the present case, or N-type, D-type or HT-type material, so as to form an insulating layer with a thickness of several to several tens of micrometers.

The first insulating layer 441 and the second insulating layer 441b can also be made of insulating materials such as insulating paint which is brushed or sprayed on the surface of the conductive coil, and the insulating layers are formed after the insulating materials are cured.

The first and second

conductive layers

442 and 442b are preferably formed by inkjet printing or printed conductive ink, or by printing, brushing or spraying conductive paste or other conductive material, or by performing a second vacuum vapor deposition on a specific area, such as gold, silver, or aluminum.

The upper supporting component comprises an upper supporting ring 450, an upper supporting notch 456 is formed in one square side of the upper supporting ring 450, the other side, opposite to the side with the upper supporting notch 456, of the upper supporting ring 450 is provided with an upper supporting boss 457 and a second upper supporting metalized hole 455, the side face of the upper supporting boss 457, relative to the upper supporting ring 450, protrudes, the upper surface of the upper supporting boss 457 is provided with a first upper supporting bonding pad 451, the lower surface of the upper supporting boss 457 is provided with a third upper supporting bonding pad 454, the third upper supporting bonding pad 454 and the first upper supporting bonding pad 451 are provided with a first upper supporting metalized hole 452 penetrating through, the lower surface, provided with the second upper supporting metalized hole 455, of the upper supporting ring 450 is provided with a second upper supporting bonding pad 453, and the second upper supporting metalized hole 455 are connected.

The lower support assembly comprises a lower support ring 430, wherein a lower support metalized hole 433, a first lower support boss 432 and a second lower support boss 437 are arranged on one square side of the lower support ring 430, the position of the first lower support boss 432 is matched with that of the upper support boss 457, and the lower support metalized hole 433 is positioned between the first lower support boss 432 and the second lower support boss 437.

The upper surface of the lower support ring 430 where the lower support metalized hole 433 is formed is provided with a second lower support pad 434, the second lower support pad 434 is connected with the lower support metalized hole 433, a first lower support pad 431 is arranged on a second lower support boss 437, a third lower support pad 435 is arranged on the upper surface of the other side of the lower support ring 430 adjacent to the lower support metalized hole 433, and the first lower support pad 431 is connected with the third lower support pad 435 through a square inter-pad connecting line 436.

The lower support metallization hole 433 and the second upper support metallization hole 455 are connected by an inter-hole conductor 492.

When the vibration module is assembled, the first lower support projection 432 is positioned to be aligned and closely contacted with the upper support projection 457, the third upper support pad 454 is aligned and closely contacted and connected with the second coil pad 444, the second upper support pad 453 is aligned and closely contacted and connected with the first coil pad 443, the second lower support pad 434 is aligned and closely contacted and connected with the sixth coil pad 444b, and the third lower support pad 435 is aligned and closely contacted and connected with the seventh coil pad 445 b.

The magnet assembly comprises two groups of outer magnetic assemblies and inner magnetic assemblies which are arranged up and down, and the vibration assembly is positioned between the two groups of outer magnetic assemblies and the inner magnetic assemblies.

The magnet assembly includes an upper outer magnet 460 and an upper inner magnet 470, the upper outer magnet 460 surrounding the exterior of the upper inner magnet 470, and an acoustic filler material 480 filled between the upper outer magnet 460 and the upper inner magnet 470.

The magnet assembly further includes a lower outer magnet 410 and a lower inner magnet 420, the lower outer magnet 410 surrounding an exterior of the lower inner magnet 420.

The upper surfaces of the upper outer magnet 460 and the upper inner magnet 470 are fixed to the upper case 490, the lower surfaces of the upper outer magnet 460 and the upper inner magnet 470 are in close contact with the upper support ring 450, the lower surfaces of the lower outer magnet 410 and the lower inner magnet 420 are fixed to the lower case 400, and the upper surfaces of the lower outer magnet 410 and the lower inner magnet 420 are in close contact with the lower support ring 430.

The electrical signal provided by the external power amplifier circuit is connected to the first lower support pad 431 and the first upper support pad 451, and if the electrical signal flows from the pad 451 at a certain moment, the current flowing in the product flows in the sequence and through the nodes as follows: the first upper support pad 451 → the first upper support metallization hole 452 → the third upper support pad 454 → the second coil pad 444 → the first coil 446 → the fourth coil pad 447 → the first conductive layer 442 → the first coil pad 443 → the second upper support pad 453 → the second upper support metallization hole 455 → the inter-hole conductor 492 → the lower support metallization hole 433 → the second lower support pad 434 → the sixth coil pad 444b → the second coil 446b → the eighth coil pad 447b → the second conductive layer 442b → the seventh coil pad 445b → the third lower support pad 435 → the inter-pad wiring 436, and finally, the closed loop is formed through the first lower support pad output 431.

The speaker can regard as the microphone to use, if when being used in the in-ear earphone, the speaker can regard as loudspeaker to make a sound, also can pick up the pronunciation of people in the duct when the speech, this speech signal falls the algorithm speech signal input reference as the chip, eliminates ambient noise through the algorithm, reinforcing pronunciation definition.

The description of the present invention has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to practitioners skilled in this art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.

Claims

1. The utility model provides a plane coil vibrating diaphragm side goes out sound speaker which characterized in that: the vibration component comprises a vibrating diaphragm, an upper supporting component and a lower supporting component, wherein the vibrating diaphragm is arranged between the upper supporting component and the lower supporting component;

the vibrating diaphragm comprises a vibrating diaphragm body (440), at least one of the upper surface and the lower surface of the vibrating diaphragm body (440) is attached with a coil, and two ends of the coil are respectively provided with a bonding pad positioned inside the coil and a bonding pad positioned outside the coil;

2. The planar coil diaphragm side-out speaker of claim 1, wherein: the upper surface and the lower surface of the diaphragm body (440) are respectively attached with a first coil (446) and a second coil (446 b).

3. The planar coil diaphragm side-out speaker of claim 2, wherein: the first coil (446) and the second coil (446b) are arranged in a mirror symmetry mode by taking the central plane of the plane diaphragm body (440) as a symmetry plane.

4. The planar coil diaphragm side-out speaker of claim 2, wherein: go up the supporting component and include support ring (450) on, support breach (456) have been seted up to the square one side wherein of going up support ring (450), and support boss (457) and support metallization hole (455) on the second are equipped with to support ring (450) opposite side on one side that is equipped with support breach (456), go up support boss (457) and for the side protrusion of last support ring (450).

5. The planar coil diaphragm side-out speaker of claim 4, wherein: a first upper support bonding pad (451) is arranged on the upper surface of the upper support boss (457), a third upper support bonding pad (454) is arranged on the lower surface of the upper support boss (457), and a first upper support metallization hole (452) penetrating through the third upper support bonding pad (454) and the first upper support bonding pad (451) is arranged;

the third upper support bonding pad (454) is connected with a second coil bonding pad (444) of the first coil (446), the second coil bonding pad (444) is positioned outside the first coil (446), and the first upper support bonding pad (451) is used as an input end or an output end of an electric signal.

6. The planar coil diaphragm side-out speaker of claim 4, wherein: a second upper support bonding pad (453) is arranged on the lower surface of the upper support ring (450) where the second upper support metallization hole (455) is arranged, and the second upper support bonding pad (453) is connected with the second upper support metallization hole (455);

the second upper support pad (453) is connected with a first coil pad (443), and the first coil pad (443) is arranged on the upper surface of the planar diaphragm body (440) and is positioned outside the first coil (446).

7. The planar coil diaphragm side-out speaker of claim 4, wherein: the lower support assembly comprises a lower support ring (430), wherein a lower support metalized hole (433), a first lower support boss (432) and a second lower support boss (437) are formed in one square side of the lower support ring (430), and the lower support metalized hole (433) is located between the first lower support boss (432) and the second lower support boss (437).

8. The planar coil diaphragm side-out speaker of claim 7, wherein: a second lower support bonding pad (434) is arranged on the upper surface of the lower support ring (430) where the lower support metalized hole (433) is arranged, and the second lower support bonding pad (434) is connected with the lower support metalized hole (433);

the second lower support pad (434) is connected with a sixth coil pad (444b) of the second coil (446b), and the sixth coil pad (444b) is located outside the second coil (446 b).

9. The planar coil diaphragm side-out speaker of claim 7, wherein: a first lower support pad (431) is arranged on the second lower support boss (437), a third lower support pad (435) is arranged on the upper surface of the other side, adjacent to one side of the lower support ring (430) adjacent to the side provided with the lower support metallization hole (433), and the first lower support pad (431) and the third lower support pad (435) are connected through a square inter-pad connecting line (436);

the first lower support pad (431) serves as an output end or an input end of an electrical signal;

the third lower support bonding pad (435) is connected with a seventh coil bonding pad (445b), and the seventh coil bonding pad (445b) is arranged on the lower surface of the planar diaphragm body (440) and is positioned outside the second coil (446 b).

10. The planar coil diaphragm side-out speaker of claim 7, wherein: the lower support metallization hole (433) and the second upper support metallization hole (455) are connected by an inter-hole conductor (492);

the first lower support boss (432) is positioned in alignment with and in close contact with the upper support boss (457).

11. The planar coil diaphragm side-out speaker of claim 5 or 6, wherein: the first coil (446) further comprises a fourth coil pad (447), the fourth coil pad (447) is located inside the first coil (446), the third coil pad (445) is further arranged on the upper surface of the planar diaphragm body (440), the third coil pad (445) is located outside the first coil (446), a first insulating layer (441) is arranged between the first coil pad (443) and the fourth coil pad (447), and the first insulating layer (441) completely covers the first coil (446) between the first coil pad (443) and the fourth coil pad (447) to form an insulating region thereon;

a first conductive layer (442) is arranged on the surface of the first insulating layer (441), and two ends of the first conductive layer (442) are respectively connected with the first coil pad (443) and the fourth coil pad (447).

12. A flat coil diaphragm side-out speaker as claimed in claim 8 or 9, wherein: the second coil (446b) further comprises an eighth coil pad (447b), the eighth coil pad (447b) is located inside the second coil (446b), a fifth coil pad (443b) is further arranged on the lower surface of the planar diaphragm body (440), the fifth coil pad (443b) is located outside the second coil (446b), a second insulating layer (441b) is arranged between the eighth coil pad (447b) and the seventh coil pad (445b), and the second insulating layer (441b) completely covers the second coil (446b) between the eighth coil pad (447b) and the seventh coil pad (445b) to form an insulating region thereon;

and a second conductive layer (442b) is arranged on the surface of the second insulating layer (441b), and the two ends of the second conductive layer (442b) are respectively connected with an eighth coil pad (447b) and a seventh coil pad (445 b).

13. The planar coil diaphragm side-out speaker of claim 4 or 7, wherein: the shell comprises a lower shell (400) and an upper shell (490), wherein the lower shell (400) is provided with a lower shell equalizing hole (401), and the upper shell (490) is provided with an upper shell sound outlet (491);

the lower surface of the upper shell (490) is fixed with the upper surfaces of an upper outer magnet (460) and an upper inner magnet (470), and the lower surfaces of the upper outer magnet (460) and the upper inner magnet (470) are tightly contacted with the upper support ring (450);

the upper surface of the lower shell (400) is fixedly provided with the lower surfaces of a lower outer magnet (410) and a lower inner magnet (420), and the upper surfaces of the lower outer magnet (410) and the lower inner magnet (420) are tightly contacted with a lower support ring (430);

the upper outer magnet (460), the upper inner magnet (470), the lower outer magnet (410) and the lower inner magnet (420) are respectively arranged on the upper side and the lower side of the vibration assembly.