CN212305693U - Heating device for be used for power electronic chip test - Google Patents

Heating device for be used for power electronic chip test Download PDF

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Publication number
CN212305693U
CN212305693U CN202021458599.0U CN202021458599U CN212305693U CN 212305693 U CN212305693 U CN 212305693U CN 202021458599 U CN202021458599 U CN 202021458599U CN 212305693 U CN212305693 U CN 212305693U
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aluminum plate
thermocouple
temperature controller
state relay
solid state
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CN202021458599.0U
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Chinese (zh)
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洪忠健
洪藏华
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Huangshan Hengyue Electronics Co ltd
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Huangshan Hengyue Electronics Co ltd
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Abstract

The utility model discloses a heating device for be used for power electronic chip test, including temperature controller, alternating current power supply, solid state relay, aluminum plate, thermocouple, a plurality of electric heat stick, a plurality of electric heat sticks bury in aluminum plate, and the thermocouple mounting is in aluminum plate, and the thermocouple is connected with temperature controller electricity, and alternating current power supply passes through solid state relay and is connected with each electric heat stick electricity, and temperature controller is connected with solid state relay's control end electricity. The utility model discloses energy-conserving, technical performance is more stable, and the structure has obtained simplifying, and manufacturing cost can reduce.

Description

Heating device for be used for power electronic chip test
Technical Field
The utility model relates to a chip testing device field specifically is a heating device for be used for power electronic chip to test.
Background
The power electronic chip is required to bear a certain blocking voltage, so a certain base region width is required to be designed in the diffusion process, and in addition, the minority carrier lifetime of any semiconductor material has a certain limit, so the voltage drop (on-state peak voltage) of the power electronic chip body cannot be avoided, and the power electronic chip body is required to generate heat during power-on operation, so the temperature of the chip body is increased. When the temperature of the chip body rises to a certain value, the chip body burns out and cannot work continuously, so the power electronic technology considers that: when the power electronic chip is electrified to work, the chip body generates heat normally. The national standard stipulates that: the normal working temperature of the rectification type power electronic chip is not higher than 150 ℃, and the normal working temperature of the thyristor type power electronic chip is not higher than 125 ℃.
In order to enable a power electronic chip manufactured by a power electronic chip manufacturer to meet national standards, a test for simulating a high-temperature environment working state is generally adopted in an electrical parameter test before the chip is put in storage. The specific method comprises the following steps: heating the chip to be tested to a specified value of national standard (such as heating the rectification type power electronic chip to 150 ℃ and the like), and then measuring the electrical parameters (such as blocking voltage URRM and the like of the rectification type power electronic chip).
Traditional heating device for be used for power electronic chip test generally adopts the structure shown in fig. 1, it includes cuboid thin aluminum plate 1, K type screw formula thermocouple 2, temperature controller 4, alternating current power supply 5, solid state relay 6, cuboid electric stove 7, mica sheet 8, wherein mica sheet 8 sets up on cuboid electric stove 7, cuboid thin aluminum plate 1 is arranged in on mica sheet 8, bear by cuboid thin aluminum plate 1 and treat the side chip, K type screw formula thermocouple 2 screw in cuboid thin aluminum plate 1 is with the detection temperature, temperature controller 4 is connected with solid state relay 6's control end through wire 3, alternating current power supply 5 supplies power respectively to temperature controller 4, solid state relay 6's input, cuboid electric stove 7 is connected to solid state relay 6's output. The working process is as follows: arranging a chip to be tested on a rectangular thin aluminum plate 1 → connecting an alternating current power supply 5 → adjusting a temperature controller 4 to a set temperature (at the moment, the maximum of the thermal electromotive force in a K-type screw thermocouple 2 loop) → outputting a control electric signal (voltage and current) to a solid state relay 6 → outputting a direct current by the temperature controller 4 → heating the rectangular thin aluminum plate 1 above the solid state relay 6 by electrifying an electric furnace wire of the rectangular electric furnace 7 → heating the chip to be tested arranged on the rectangular thin aluminum plate 1 → the temperature reaches a set value → the thermal electromotive force in the K-type screw thermocouple 2 loop is reduced to zero → the temperature controller 4 automatically cutting off the output control electric signal → stopping the solid state relay 6 from working → stopping the electric furnace wire from heating due to power failure → the rectangular thin aluminum plate 1 arranged above the electric furnace and the chip to be tested have a process of continuously rising temperature (usually 8 ℃ -15 ℃) (commonly called as temperature rush, the phenomenon comes from the fact that the temperature when the electric furnace is powered off is far higher than the temperature set by the temperature controller) → when the temperature drops to the temperature set by the temperature controller, the electric parameter starts to be measured. The chip heating test device with the structure has the problems of large heat loss and unstable heating test performance due to obvious temperature rush.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a heating device for be used for power electronic chip to solve the heat loss that prior art chip heating testing arrangement exists big, the unstable problem of heating test performance.
In order to achieve the above purpose, the utility model discloses the technical scheme who adopts is:
the utility model provides a heating device for be used for test of power electronic chip, includes temperature controller, alternating current power supply, solid state relay, aluminum plate, thermocouple, its characterized in that: the aluminum plate body for having certain thickness still includes a plurality of electric heat bars, and a plurality of electric heat bars bury respectively in aluminum plate, the thermocouple is installed in aluminum plate, and the thermocouple is connected with the signal input part electricity of temperature controller, and alternating current power supply is connected with solid state relay's power input part and temperature controller's power input end, and solid state relay's power output part is connected with each electric heat bar electricity parallelly connected respectively, the power output signal control end of temperature controller and solid state relay's power device signal of telecommunication control end electricity are connected.
The heating device for testing the power electronic chip is characterized in that: the method is characterized in that: a plurality of embedding holes are formed in the aluminum plate, and the electric heating rods are embedded into the embedding holes of the aluminum plate in a one-to-one correspondence manner; the electric heating rods are arranged along a straight line and are equidistant from one rod to another, and the distance from each of the head rod and the tail rod to the edge of the aluminum plate is 1/2 of the distance from one rod to another.
The heating device for testing the power electronic chip is characterized in that: the method is characterized in that: the aluminum plate is provided with a mounting hole, and the thermocouple is mounted in the mounting hole of the aluminum plate.
The heating device for testing the power electronic chip is characterized in that: the thermocouple is a K-type screw type thermocouple, the mounting hole in the aluminum plate is a threaded hole, and the thermocouple is screwed in and mounted in the mounting hole of the aluminum plate.
Compared with the prior art, the utility model discloses the advantage does:
1. energy is saved. The utility model discloses the technique adopts at cuboid aluminum plate internal heating, has reduced the heat loss to few one-tenth, through the contrast experiment repeatedly, adopts 4 electric rods to the aluminum plate heating effect with 1500W's electric stove heating effect match, saves output P =1500W-300W 4= 300W.
2. The technical performance is more stable. 4 electric heating rods with the rated power of 300W are adopted to replace an electric wire with the rated power of 1500W to heat the rectangular aluminum plate, the total resistance of the heating body is increased, the temperature rising speed of the heating body is slowed down, the temperature impact of the rectangular aluminum plate is well controlled, and the technical performance stability of the device is improved.
3. The structure of the device is simplified. The utility model discloses the shared space of cuboid electric stove has been saved to the technique after changing cuboid aluminum plate "external" heating into "internal" heating, makes whole device hold as an organic whole (install cuboid aluminum plate, temperature controller, solid state relay, K type screw formula thermocouple, power etc. in a cuboid box) more convenient realization.
4. The manufacturing cost is reduced. The utility model discloses the technique changes cuboid aluminum plate "external" heating into "internal" heating back, has saved the acquisition cost of insulating material (mica sheet) between electric stove and the aluminum plate.
Drawings
Fig. 1 is a schematic diagram of a prior art structure.
Fig. 2 is a schematic structural diagram of the present invention.
Detailed Description
The present invention will be further explained with reference to the drawings and examples.
As shown in fig. 2, a heating device for testing a power electronic chip includes a temperature controller 4, a 220V ac power supply 5, a solid-state relay 6 with an output current of 20A, an aluminum plate 9, a thermocouple 2, wherein the aluminum plate 9 is a rectangular parallelepiped aluminum plate with a power of 350 mm × 250 mm × 17 mm, and further includes a plurality of electrical bars 10, the electrical bars 10 have a rated power of 300W/piece, a length of 15 mm, a diameter of 9.5 mm, the plurality of electrical bars 10 are respectively embedded in the aluminum plate 9, the thermocouple 2 is installed in the aluminum plate 9, the thermocouple 2 is electrically connected to a signal input end of the temperature controller 4, the ac power supply 5 is electrically connected to a power input end of the solid-state relay 6, power output ends of the solid-state relay 6 are respectively electrically connected to the electrical bars 10, and a signal output end of the temperature controller 4 is electrically connected to a control end of the solid-state relay 6 through.
A plurality of embedding holes are formed in the aluminum plate 9, the electric heating rods 10 are embedded into the embedding holes of the aluminum plate 9 in a one-to-one correspondence mode, the electric heating rods 10 are arranged in a straight line and are equidistant from rod to rod, and the distance from the head rod to the edge of the aluminum plate 9 to the tail rod is 1/2 of the distance from the rod to the rod. The aluminum plate 9 is provided with a mounting hole therein, and the thermocouple 2 is mounted in the mounting hole of the aluminum plate 9.
Thermocouple 2 is K type screw formula thermocouple, and the mounting hole in aluminum plate 9 is the screw hole, and thermocouple 2 screw in is installed in the mounting hole of aluminum plate 9.
The utility model discloses the working process does: the chip to be measured is arranged on the aluminum plate 9 → the alternating current power supply 5 is switched on → the temperature controller 4 is adjusted to a set temperature (at the moment, the thermoelectromotive force in the thermocouple loop is maximum) → the temperature controller 4 outputs a control electric signal (voltage and current) to the solid state relay 6 → the solid state relay 6 outputs direct current → the electric heating rod 10 is electrified to heat the aluminum plate 9 from the inside of the aluminum plate 9 → the aluminum plate 9 heats the chip to be measured arranged on the aluminum plate 9 → the temperature reaches the set value → the thermoelectromotive force in the thermocouple 2 loop is reduced to zero → the temperature controller 4 automatically cuts off the output control electric signal → the solid state relay 6 stops working → the electric heating rod 10 stops heating due to power failure → the aluminum plate 9 and the chip to be measured have a small-amplitude temperature flushing process (generally not more than.
The embodiments of the present invention are only descriptions of the preferred embodiments of the present invention, not right the present invention is designed and limited, without departing from the design concept of the present invention, the technical personnel in the field should fall into the protection scope of the present invention for various modifications and improvements made by the technical solution of the present invention, and the technical contents of the present invention are all recorded in the claims.

Claims (4)

1. The utility model provides a heating device for be used for test of power electronic chip, includes temperature controller, alternating current power supply, solid state relay, aluminum plate, thermocouple, its characterized in that: the aluminum plate body for having certain thickness still includes a plurality of electric heat bars, and a plurality of electric heat bars bury respectively in aluminum plate, the thermocouple is installed in aluminum plate, and the thermocouple is connected with the signal input part electricity of temperature controller, and alternating current power supply is connected with solid state relay's power input part and temperature controller's power input end, and solid state relay's power output part is connected with each electric heat bar electricity parallelly connected respectively, the power output signal control end of temperature controller and solid state relay's power device signal of telecommunication control end electricity are connected.
2. A heating device for power electronic chip testing according to claim 1, characterized in that: a plurality of embedding holes are formed in the aluminum plate, and the electric heating rods are embedded into the embedding holes of the aluminum plate in a one-to-one correspondence manner; the electric heating rods are arranged along a straight line and are equidistant from one rod to another, and the distance from each of the head rod and the tail rod to the edge of the aluminum plate is 1/2 of the distance from one rod to another.
3. A heating device for power electronic chip testing according to claim 1, characterized in that: the aluminum plate is provided with a mounting hole, and the thermocouple is mounted in the mounting hole of the aluminum plate.
4. A heating device for power electronic chip testing according to claim 1 or 3, characterized in that: the thermocouple is a K-type screw type thermocouple, the mounting hole in the aluminum plate is a threaded hole, and the thermocouple is screwed in and mounted in the mounting hole of the aluminum plate.
CN202021458599.0U 2020-07-22 2020-07-22 Heating device for be used for power electronic chip test Active CN212305693U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021458599.0U CN212305693U (en) 2020-07-22 2020-07-22 Heating device for be used for power electronic chip test

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021458599.0U CN212305693U (en) 2020-07-22 2020-07-22 Heating device for be used for power electronic chip test

Publications (1)

Publication Number Publication Date
CN212305693U true CN212305693U (en) 2021-01-05

Family

ID=73937219

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021458599.0U Active CN212305693U (en) 2020-07-22 2020-07-22 Heating device for be used for power electronic chip test

Country Status (1)

Country Link
CN (1) CN212305693U (en)

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