CN212303355U - Transformer grading ring and voltage transformer using same - Google Patents
Transformer grading ring and voltage transformer using same Download PDFInfo
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- CN212303355U CN212303355U CN202021252821.1U CN202021252821U CN212303355U CN 212303355 U CN212303355 U CN 212303355U CN 202021252821 U CN202021252821 U CN 202021252821U CN 212303355 U CN212303355 U CN 212303355U
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Abstract
The utility model relates to a mutual-inductor equalizer ring and use voltage transformer of this equalizer ring. The voltage transformer comprises a high-voltage coil and a grading ring arranged on the high-voltage coil, wherein the grading ring comprises a metal substrate, a semiconductor adhesive tape and semiconductor paper; the semiconductor adhesive tape is arranged at the side edge of the metal substrate in the width direction; the semiconductor paper is encapsulated on the side edge of the metal substrate and the semiconductor adhesive tape at the side edge; the semiconductor strip has an overhanging portion in the width direction of the metal substrate, the overhanging portion being located outside the side edge in the width direction of the metal substrate. The semiconductor paper of equalizer ring can be followed metal substrate and is connected with the overhanging part of semiconductor adhesive tape directly to one side face of semiconductor adhesive tape dorsad, and transition department forms one section smooth face between metal substrate and semiconductor adhesive tape to eliminate the influence on metal substrate right angle limit, avoided producing partial discharge because of the right angle limit easily, influenced voltage transformer insulating properties's problem.
Description
Technical Field
The utility model relates to a mutual-inductor equalizer ring and use voltage transformer of this equalizer ring.
Background
The voltage transformer is a high-voltage component, mainly comprising a high-voltage coil, a low-voltage coil and an iron core, wherein the high-voltage coil has thin wires and many turns, and insulating paper is padded between each layer of wires. Because the high-voltage coil has thin wires and many turns, the width of each layer of wires is difficult to be completely consistent during winding, the end surfaces formed by the head and the tail of each layer of wires cannot be completely flat, and the surface of the electrode is equivalent to have uneven burrs, so that the electric field is unevenly distributed, and the discharge is easily generated to the outside.
In addition, the curvature radius of the thin wires is small, the electric field intensity is concentrated, particularly, the electric field intensity is concentrated at two ends of each layer of wire, the electric field intensity of the outermost layer of the high-voltage coil of the voltage transformer is the largest, the outermost layer of the wire bears the largest electric field, and the high-voltage electric field distribution of two end faces of the high-voltage coil is uneven.
In order to improve the uniformity of the electric field distribution of the high-voltage coil of the voltage transformer and improve the insulation performance of the voltage transformer, a scheme of arranging a grading ring on the high-voltage coil is generally adopted in the prior art.
Chinese patent with publication number CN208352109U discloses a transformer grading ring, which comprises a metal substrate and semiconductor tapes arranged on the edges of two sides of the metal substrate in the width direction, wherein the semiconductor tapes are bridged on the metal substrate and the semiconductor tapes along the width direction of the metal substrate, and the metal substrate, the semiconductor tapes and the semiconductor tapes are bonded together and wound into a ring.
However, the semiconductor adhesive tape of the grading ring is located at the edge of the metal substrate close to the inner side, and after the semiconductor adhesive tape is folded, adhered and attached, a right-angle edge exists at the edge of the grading ring, so that partial discharge is easily generated on the right-angle edge, and the insulation performance of the voltage transformer is affected.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a transformer grading ring to solve the problem that the transformer grading ring in the prior art is easy to generate partial discharge; an object of the utility model is to provide a voltage transformer still to the equalizer ring of solving the voltage transformer among the prior art produces partial discharge easily, influences the problem of voltage transformer insulating properties.
The utility model discloses a mutual-inductor equalizer ring adopts following technical scheme:
mutual-inductor equalizer ring includes:
a metal substrate;
the semiconductor adhesive tape is arranged at the side edge of the metal substrate in the width direction;
the semiconductor paper is encapsulated on the side edge of the metal substrate and the semiconductor adhesive tape at the side edge;
the semiconductor adhesive tape has an overhanging portion in the width direction of the metal substrate;
the overhanging portion is located outside the side edge of the metal substrate in the width direction.
Has the advantages that: the semiconductor paper of mutual-inductor equalizer ring can be followed metal substrate and is connected with the overhanging part of semiconductor adhesive tape directly to one side face of semiconductor adhesive tape dorsad, and transition department forms one section smooth surface between metal substrate and semiconductor adhesive tape to eliminate the influence on metal substrate right angle limit, avoided producing partial discharge because of the right angle limit easily, influenced the problem of voltage transformer insulating properties.
Furthermore, the outer peripheral surface of the semiconductor rubber strip is a smooth curved surface.
Has the advantages that: the edge of mutual-inductor equalizer ring forms the smooth surface of being convenient for, avoids having sharp limit.
Furthermore, the cross section of the semiconductor adhesive tape is circular, and the bottom of the semiconductor adhesive tape corresponds to the edge of the side edge of the metal substrate.
Has the advantages that: the edge of the transformer grading ring is smoother.
Further, in the circumferential direction of the semiconductor adhesive tape, the attaching length of the semiconductor paper and the semiconductor adhesive tape is larger than half of the circumferential length of the semiconductor adhesive tape.
Has the advantages that: the semiconductor adhesive tape is better positioned, and the fixing effect is ensured.
Furthermore, the semiconductor paper is a whole piece, the middle part of the semiconductor paper in the width direction is attached to the surface of the metal substrate, which is back to the semiconductor adhesive tape, and the parts of the two sides of the semiconductor paper in the width direction are folded towards the surface of the metal substrate, which is provided with the semiconductor adhesive tape, and are attached to the surface of the metal substrate.
Has the advantages that: the bonding is convenient, and the bonding strength can be ensured.
Furthermore, the metal substrate is connected with the connecting part of the semiconductor adhesive tape in an adhering mode.
Has the advantages that: the semiconductor adhesive tape is better positioned and is convenient to manufacture.
Furthermore, the metal substrate is formed by a copper foil, and the metal substrate and the semiconductor paper are connected in an adhering mode through a double-sided adhesive tape.
Has the advantages that: the pressure equalizing effect is good, and the manufacture is convenient.
Furthermore, the semiconductor paper is provided with an adhesive tape inner side transition part, and the adhesive tape inner side transition part is connected between one side of the adhesive tape, which is close to the middle part of the metal substrate in the width direction, and the metal substrate; the transition part at the inner side of the rubber strip is arc-shaped.
Has the advantages that: the bonding is convenient, avoids producing sharp edge, influences the voltage-sharing effect.
The utility model discloses a voltage transformer adopts following technical scheme:
the voltage transformer comprises a high-voltage coil and a grading ring arranged on the high-voltage coil,
a grading ring, comprising:
a metal substrate;
the semiconductor adhesive tape is arranged at the side edge of the metal substrate in the width direction;
the semiconductor paper is encapsulated on the side edge of the metal substrate and the semiconductor adhesive tape at the side edge;
the semiconductor adhesive tape has an overhanging portion in the width direction of the metal substrate;
the overhanging portion is located outside the side edge of the metal substrate in the width direction.
Has the advantages that: the semiconductor paper of equalizer ring can be followed metal substrate and is connected with the overhanging part of semiconductor adhesive tape directly to one side face of semiconductor adhesive tape dorsad, and transition department forms one section smooth face between metal substrate and semiconductor adhesive tape to eliminate the influence on metal substrate right angle limit, avoided producing partial discharge because of the right angle limit easily, influenced voltage transformer insulating properties's problem.
Furthermore, the outer peripheral surface of the semiconductor rubber strip is a smooth curved surface.
Has the advantages that: the edge of the grading ring is convenient to form a smooth surface, and sharp edges are avoided.
Furthermore, the cross section of the semiconductor adhesive tape is circular, and the bottom of the semiconductor adhesive tape corresponds to the edge of the side edge of the metal substrate.
Has the advantages that: the edge of the grading ring is smoother.
Further, in the circumferential direction of the semiconductor adhesive tape, the attaching length of the semiconductor paper and the semiconductor adhesive tape is larger than half of the circumferential length of the semiconductor adhesive tape.
Has the advantages that: the semiconductor adhesive tape is better positioned, and the fixing effect is ensured.
Furthermore, the semiconductor paper is a whole piece, the middle part of the semiconductor paper in the width direction is attached to the surface of the metal substrate, which is back to the semiconductor adhesive tape, and the parts of the two sides of the semiconductor paper in the width direction are folded towards the surface of the metal substrate, which is provided with the semiconductor adhesive tape, and are attached to the surface of the metal substrate.
Has the advantages that: the bonding is convenient, and the bonding strength can be ensured.
Furthermore, the metal substrate is connected with the connecting part of the semiconductor adhesive tape in an adhering mode.
Has the advantages that: the semiconductor adhesive tape is better positioned and is convenient to manufacture.
Furthermore, the metal substrate is formed by a copper foil, and the metal substrate and the semiconductor paper are connected in an adhering mode through a double-sided adhesive tape.
Has the advantages that: the pressure equalizing effect is good, and the manufacture is convenient.
Furthermore, the semiconductor paper is provided with an adhesive tape inner side transition part, and the adhesive tape inner side transition part is connected between one side of the adhesive tape, which is close to the middle part of the metal substrate in the width direction, and the metal substrate; the transition part at the inner side of the rubber strip is arc-shaped.
Has the advantages that: the bonding is convenient, avoids producing sharp edge, influences the voltage-sharing effect.
Furthermore, the high-voltage coil is wound in a step shape, the width of the first-order coil on the radial outer side is smaller than that of the first-order coil on the inner side, equalizing rings are arranged on the coils of all steps, and the radial sizes of the semiconductor adhesive tapes on the coils of all steps are sequentially increased.
Has the advantages that: the high-voltage coil is wound in a step shape, so that the electric field is uniformly distributed; the grading rings are arranged on the coils of all steps, so that the high-voltage-sharing effect is achieved, the radial sizes of the semiconductor adhesive tapes on the coils of all steps are sequentially increased, the voltage-sharing effect is further improved, and the electric field is uniformly distributed.
Drawings
Fig. 1 is a schematic cross-sectional view of a matching structure of a high-voltage coil and a grading ring in a first embodiment of a medium-voltage transformer according to the present invention;
FIG. 2 is a schematic cross-sectional view of the grading ring of FIG. 1;
figure 3 is a schematic view of an expanded configuration of the grading ring of figure 1.
The names of the components corresponding to the corresponding reference numerals in the drawings are:
11-a first-order high-voltage coil, 12-a second-order high-voltage coil, 2-a high-voltage coil framework, 3-insulating paper, 4-a grading ring, 5-a metal substrate, 6-a semiconductor adhesive tape and 7-semiconductor paper.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention, i.e., the described embodiments are only some, but not all embodiments of the invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiment of the present invention, all other embodiments obtained by the person skilled in the art without creative work belong to the protection scope of the present invention.
It is noted that relational terms such as the terms first and second, and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the recitation of "comprising an … …" may occur without the exclusion of additional like elements present in the process, method, article, or apparatus that comprises the element.
In the description of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" when they are used are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, or may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those skilled in the art from the specific situation.
In the description of the present invention, unless otherwise explicitly specified or limited, the term "provided" may be used in a broad sense, for example, the object of "provided" may be a part of the body, or may be arranged separately from the body and connected to the body, and the connection may be a detachable connection or a non-detachable connection. The specific meaning of the above terms in the present invention can be understood by those skilled in the art from the specific situation.
The present invention will be described in further detail with reference to examples.
The utility model discloses embodiment 1 of well voltage transformer:
as shown in fig. 1, the voltage transformer includes a high-voltage coil bobbin 2, and two groups of high-voltage coils are wound on the high-voltage coil bobbin 2, each group of high-voltage coils including a first-order high-voltage coil 11 and a second-order high-voltage coil 12. Insulating paper 3 is arranged between each layer of wires of the first-order high-voltage coil 11 and the second-order high-voltage coil 12, and equalizing rings 4 are respectively arranged on the peripheral surfaces of the first-order high-voltage coil 11 and the second-order high-voltage coil 12. The equalizing rings 4 have different sizes and the same structure, and the equalizing ring 4 on the second-order high-voltage coil 12 is taken as an example in the present embodiment for detailed description.
As shown in fig. 2 and 3, the grading ring 4 includes a metal substrate 5, a semiconductor strip 6, and a semiconductor paper 7.
The metal substrate 5 is made of copper foil, the width of the metal substrate 5 is equal to the width of the insulation paper 3 on the second-order high-voltage coil 12, and the length of the metal substrate 5 is smaller than the circumference length of the outermost layer of the second-order high-voltage coil 12, so that the metal substrate 5 is wound to form an open-loop structure. The metal substrate 5 is provided on the semiconductor paper 7, and is bonded to the semiconductor paper 7 by a double-sided adhesive tape, and the paper surface of the semiconductor paper 7 is bonded to one plate surface of the metal substrate 5.
The semiconductor paper 7 is a whole piece of paper, and the length of the semiconductor paper 7 and the length of the metal substrate 5 can be equal or slightly different, and the shielding effect is not affected. The width of the semiconductor paper 7 is larger than the width of the metal base plate 5, and the metal base plate 5 is provided in the middle of the semiconductor paper 7 in the width direction.
The semiconductor adhesive tape 6 is a circular silicone rubber tape, and is provided with two strips, which are respectively located at two side edges in the width direction of the metal substrate 5 and are located on one side plate surface which is not attached to the semiconductor paper 7. The semiconductor strip 6 has an overhanging portion in the width direction of the metal substrate 5, and the overhanging portion of the semiconductor strip 6 is located outside the side edge in the width direction of the metal substrate 5. The semiconductor adhesive tape 6 is adhered to two side edges of the metal substrate 5 through a double-sided adhesive tape, and the bottom of the semiconductor adhesive tape 6 corresponds to the side edge of the metal substrate 5.
The semiconductor paper 7 is folded at both sides in the width direction toward the side of the metal substrate 5 on which the semiconductor tape 6 is provided, covers the ends of the semiconductor tape 6 and the metal substrate 5 in the width direction, and is bonded to the surface of the metal substrate 5 by a double-sided adhesive tape. Thereby bonding and fixing the metal substrate 5, the semiconductor strip 6 and the semiconductor paper 7 together. The semiconductor paper 7 has an arc-shaped adhesive tape inner side transition portion connected between one side of the semiconductor adhesive tape 6 near the middle of the metal substrate 5 in the width direction and the metal substrate 5.
At the joint of the metal substrate 5 and the semiconductor adhesive tape 6, the semiconductor paper 7 is directly attached to the outer part of the edge of the semiconductor adhesive tape 6 suspended on the metal substrate 5 from the surface of one side of the metal substrate 5 facing away from the semiconductor adhesive tape 6, and is not affected by the right-angle side of the metal substrate 5. So that a smooth surface is formed at the joint between the metal substrate 5 and the semiconductor strip 6 to avoid the problem of partial discharge which may be caused by a sharp edge at a right angle.
The parts of the two sides of the semiconductor paper 7 in the width direction are folded and adhered to the surface, provided with the semiconductor adhesive tape 6, of the metal substrate 5 and are tightly adhered to the semiconductor adhesive tape 6, in the circumferential direction of the semiconductor adhesive tape 6, the adhering length of the semiconductor paper 7 and the semiconductor adhesive tape 6 is larger than half of the circumference of the semiconductor adhesive tape 6, and a good positioning effect can be achieved on the semiconductor adhesive tape 6. After the edges of the semiconductor paper 7 on both sides in the width direction are folded in half, the metal substrate 5 has a space in the width direction, and a part of the surface of the metal substrate 1 is exposed in the space.
The equalizing ring 4 is formed into a ring shape by winding. As shown in fig. 1, the side of the grading ring 4 provided with the semiconductor strip 6 faces the outside of the high-voltage coil of the corresponding step, and the semiconductor strip 6 is located at both ends in the width direction of the high-voltage coil of the corresponding step. The radial dimension of the semiconductor rubber strip 6 on the second-order high-voltage coil 12 is larger than that of the semiconductor rubber strip 6 on the first-order high-voltage coil 11.
During assembly, the metal substrate 5 is bonded on the semiconductor paper 7, the semiconductor adhesive tape 6 is bonded on the metal substrate 5, and then two side parts of the semiconductor paper 7 are folded in half and bonded on the metal substrate 5 to form the grading ring 4. A first-order high-voltage coil 11 is wound on the high-voltage coil framework 2, a grading ring 4 is wound on the outer peripheral surface of the high-voltage coil after the winding is finished, then a second-order high-voltage coil 12 is wound, and a grading ring 4 is further wound on the outer peripheral surface of the high-voltage coil after the winding is finished. Thereby guaranteeing the voltage-sharing effect and avoiding the occurrence of partial discharge.
The utility model discloses well voltage transformer's embodiment 2, this embodiment and embodiment 1's difference lie in, and the cross sectional shape of the semiconductor adhesive tape in embodiment 1 is circular, and in this embodiment, the cross sectional shape of semiconductor adhesive tape is oval.
The utility model discloses well voltage transformer's embodiment 3, this embodiment and embodiment 1's difference lie in, use double faced adhesive tape bonding connection between the metal substrate in embodiment 1 and the semiconductor paper, and in this embodiment, the semiconductor paper is the semiconductor sticky tape, directly bonds with the metal substrate.
The utility model discloses well voltage transformer's embodiment 4, this embodiment and embodiment 1's difference lie in, and the semiconductor adhesive tape among embodiment 1 bonds on metal substrate through the double faced adhesive tape, and in this embodiment, the semiconductor adhesive tape passes through glue to be fixed on metal substrate. In other embodiments, the semiconductor adhesive tape can be directly adhered and fixed on the metal substrate by wrapping the semiconductor adhesive tape with the semiconductor paper, and the semiconductor adhesive tape does not need to be pre-adhered and positioned on the metal substrate.
The utility model discloses well voltage transformer's embodiment 5, this embodiment and embodiment 1's difference lie in, and the semiconductor paper in embodiment 1 is a whole paper, crosses semiconductor adhesive tape bonding on another face from one side face fifty percent discount of metal substrate, and in this embodiment, has two semiconductor papers, bonds in metal substrate's both sides with the semiconductor adhesive tape that corresponds respectively, and after the bonding was accomplished, two faces of metal substrate all had exposed part.
The utility model discloses embodiment of well mutual-inductor equalizer ring:
the grading ring described in the embodiment of the transformer grading ring, i.e., in any of embodiments 1 to 5 of the above-described voltage transformer, will not be described in detail here.
The above description is only for the preferred embodiment of the present invention, and the present invention is not limited thereto, the protection scope of the present invention is defined by the claims, and all structural changes equivalent to the contents of the description and drawings of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. Mutual-inductor equalizer ring includes:
a metal substrate;
the semiconductor adhesive tape is arranged at the side edge of the metal substrate in the width direction;
the semiconductor paper is encapsulated on the side edge of the metal substrate and the semiconductor adhesive tape at the side edge;
it is characterized in that the preparation method is characterized in that,
the semiconductor adhesive tape has an overhanging portion in the width direction of the metal substrate;
the overhanging portion is located outside the side edge of the metal substrate in the width direction.
2. The transformer grading ring of claim 1, wherein: the peripheral surface of the semiconductor adhesive tape is a smooth curved surface.
3. The transformer grading ring of claim 2, wherein: the cross section of the semiconductor adhesive tape is circular, and the bottom of the semiconductor adhesive tape corresponds to the edge of the side edge of the metal substrate.
4. The transformer grading ring of claim 3, wherein: in the circumferential direction of the semiconductor adhesive tape, the attaching length of the semiconductor paper and the semiconductor adhesive tape is larger than half of the circumferential length of the semiconductor adhesive tape.
5. The transformer grading ring of claim 4, wherein: the semiconductor paper is a whole piece, the middle part of the semiconductor paper in the width direction is attached to the surface of the metal substrate, which is back to the semiconductor adhesive tape, and the parts of the two sides of the semiconductor paper in the width direction are folded to the surface of one side of the metal substrate, which is provided with the semiconductor adhesive tape, and are attached to the surface of the metal substrate.
6. The transformer grading ring according to any of claims 1-5, wherein: and the metal substrate is connected with the connecting part of the semiconductor adhesive tape in an adhesive manner.
7. The transformer grading ring according to any of claims 1-5, wherein: the metal substrate is formed by copper foil, and the metal substrate is connected with the semiconductor paper through double-sided adhesive tape in a bonding mode.
8. The transformer grading ring according to any of claims 1-5, wherein: the semiconductor paper is provided with an adhesive tape inner side transition part, and the adhesive tape inner side transition part is connected between one side of the adhesive tape, which is close to the middle part of the metal substrate in the width direction, and the metal substrate;
the transition part at the inner side of the rubber strip is arc-shaped.
9. Voltage transformer, including high-voltage coil and setting equalizer ring on high-voltage coil, its characterized in that: the grading ring is the transformer grading ring according to any one of claims 1 to 8.
10. The voltage transformer of claim 9, wherein: the high-voltage coil is wound in a step shape, the width of a first-order coil on the radial outer side is smaller than that of a first-order coil on the inner side, equalizing rings are arranged on the first-order coils, and the radial size of a semiconductor adhesive tape on each first-order coil is increased in sequence.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021252821.1U CN212303355U (en) | 2020-07-01 | 2020-07-01 | Transformer grading ring and voltage transformer using same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021252821.1U CN212303355U (en) | 2020-07-01 | 2020-07-01 | Transformer grading ring and voltage transformer using same |
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| CN212303355U true CN212303355U (en) | 2021-01-05 |
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| CN202021252821.1U Active CN212303355U (en) | 2020-07-01 | 2020-07-01 | Transformer grading ring and voltage transformer using same |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113838654A (en) * | 2021-09-24 | 2021-12-24 | 大连第二互感器集团有限公司 | High-voltage end screen manufacturing method and high-voltage end screen |
-
2020
- 2020-07-01 CN CN202021252821.1U patent/CN212303355U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113838654A (en) * | 2021-09-24 | 2021-12-24 | 大连第二互感器集团有限公司 | High-voltage end screen manufacturing method and high-voltage end screen |
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