CN212302242U - Construction site environment detector - Google Patents

Construction site environment detector Download PDF

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Publication number
CN212302242U
CN212302242U CN202020239162.1U CN202020239162U CN212302242U CN 212302242 U CN212302242 U CN 212302242U CN 202020239162 U CN202020239162 U CN 202020239162U CN 212302242 U CN212302242 U CN 212302242U
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pin
path
resistor
sensor
grounded
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翟越
刘艺
屈璐
高甲艳
王会峰
侯亚楠
李艳
孟凡东
李宇白
高欢
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Xi'an Beyond Intelligence Technique Co ltd
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Xi'an Beyond Intelligence Technique Co ltd
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Abstract

The utility model discloses a job site environment detector, including casing and liquid crystal display and the alarm of setting in the outside one side of casing, the top outside of casing is equipped with air velocity transducer, be provided with electronic circuit board in the casing, the last integration of electronic circuit board has microcontroller, power module, sensor group and wireless transmission module, sensor group is including ambient temperature sensor, ambient humidity sensor, harmful gas sensor and smoke transducer to and PM2.5 sensor, noise sensor, vibration sensor and digital output type biax inclination sensor, be provided with solar cell panel on the casing. The utility model discloses simple structure realizes solar energy and battery power supply, can realize conveniently shifting the acquisition of environmental parameter such as temperature, humidity, wind speed, noise, harmful gas, combustible gas, dust concentration, is convenient for make precautionary measure, improves construction safety factor.

Description

Construction site environment detector
Technical Field
The utility model belongs to the technical field of the job site environment detects, concretely relates to job site environment detector.
Background
The current society develops rapidly, and high-rise building layer is endlessly, and the high place that comes with falls the accident and takes place frequently, and high temperature, rainfall, conflagration, haze, poison gas influence human body and construction operation are very wide, therefore, it is very necessary to the real-time supervision of construction environment, but present job site environmental detection has some problems:
firstly, the parameters for detecting the environment of a construction site are single, and only temperature, humidity and the like can be displayed;
secondly, the construction site environment detector depends on an alternating current 220V power supply, and the energy consumption is large;
and thirdly, the construction site environment detector depends on an alternating current 220V power supply, so that the detection is inconvenient to transfer. Therefore, at present, a construction site environment detector with simple structure and reasonable design is lacked, the size is small, the power supply of solar energy and a storage battery is realized, the energy consumption is low, the cost is low, the acquisition of environment parameters such as temperature, humidity, wind speed, noise, harmful gas, combustible gas and dust concentration can be realized, the portability is realized, the convenience in transfer is realized, the precautionary measure is convenient to take, the construction safety coefficient is improved, and the practicability is high.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that not enough among the above-mentioned prior art is directed at, provide a job site environment detector, its simple structure, reasonable in design, it is small, realize solar energy and battery power supply, the power consumption is little, and is with low costs, can realize having the portability to the acquirement of environmental parameter such as temperature, humidity, wind speed, noise, harmful gas, combustible gas, dust concentration, conveniently shifts, is convenient for make precautionary measure, improves construction safety factor, and the practicality is strong.
In order to solve the technical problem, the utility model discloses a technical scheme is: the utility model provides a job site environment detector which characterized in that: the wind speed sensor is arranged on the outer side of the top of the shell, an upright column is arranged at the edge of the bottom of the shell, an electronic circuit board and a lithium battery are arranged in the shell, a microcontroller, a power supply module, a sensor group connected with the microcontroller and a wireless transmission module are integrated on the electronic circuit board, and the sensor group comprises an environment temperature sensor, an environment humidity sensor, a harmful gas sensor and a smoke sensor, a PM2.5 sensor, a noise sensor, a vibration sensor and a digital output type double-shaft inclination angle sensor; ambient temperature sensor, ambient humidity sensor, harmful gas sensor, smoke transducer, air velocity transducer, PM2.5 sensor, noise transducer, vibration sensor and digital output type biax tilt angle sensor's output all meets with microcontroller's input, be provided with solar cell panel on the casing, solar cell panel's the output and the power module of lithium cell meet, microcontroller is STM32F103VET6 microcontroller.
The construction site environment detector is characterized in that: the environment temperature sensor comprises a PT100 temperature sensor P9 and a temperature signal amplifying circuit connected with the output end of the PT100 temperature sensor, the temperature signal amplifying circuit comprises an operational amplifier U5 with the model number of LM358, a No. 3 pin of the operational amplifier U5 is divided into two paths, one path is grounded through a capacitor C21, and the other path is connected with one end of a resistor R23; the 4 th pin of the operational amplifier U5 is grounded; the 5 th pin of the operational amplifier U5 is divided into two paths, one path is grounded through a resistor R26, and the other path is connected with the output end of a 3.3V power supply through a resistor R20; the 6 th pin of the operational amplifier U5 is divided into two paths, one path is connected with one end of a resistor R24, and the other path is connected with one end of a resistor R18; the 7 th pin of the operational amplifier U5 is divided into two paths, one path is connected with the other end of the resistor R23, and the other path is connected with the other end of the resistor R18; the 8 pins of the operational amplifier U5 are connected with a 3.3V power supply output end, the other end of the resistor R24 is divided into two paths, one path is grounded through the resistor R28 and the resistor R27 which are connected in series, the other path is connected with the output end of a PT100 temperature sensor P9, and the connecting ends of the 1 st pin and the 2 nd pin of the operational amplifier U5 are connected with a PC2 pin of a microcontroller.
The construction site environment detector is characterized in that: the environment humidity sensor is an HM1500 humidity sensor, and the output end of the environment humidity sensor is connected with a PC1 pin of the microcontroller;
the harmful gas sensor is an MQ135 gas sensor P13, a VCC pin of the MQ135 gas sensor P13 is connected with a 5V power supply output end, a GND pin of the MQ135 gas sensor P13 is grounded, a DO pin of the MQ135 gas sensor P13 is divided into two paths, one path is connected with the 5V power supply output end through a resistor R34, and the other path is connected with a drain electrode of a MOS field effect transistor Q2; the source electrode of the MOS field effect transistor Q2 is divided into two paths, one path is connected with one end of a resistor R35, and the other path is connected with a PE15 pin of the microcontroller; the grid of the MOS field effect transistor Q2 is connected with one end of a resistor R32, the connection end of the other end of the resistor R32 and the other end of the resistor R35 is connected with a 3.3V power output end, and the AO pin of the MQ135 gas sensor P13 is connected with the PB1 pin of the microcontroller.
The construction site environment detector is characterized in that: the smoke sensor is an MQ2 smoke sensor P7, a VCC pin of the MQ2 smoke sensor P7 is connected with a 5V power supply output end, a GND pin of the MQ2 smoke sensor P7 is grounded, a DO pin of the MQ2 smoke sensor P7 is divided into two paths, one path is connected with the 5V power supply output end through a resistor R21, and the other path is connected with a drain electrode of an MOS field effect transistor Q1; the source electrode of the MOS field effect transistor Q1 is divided into two paths, one path is connected with one end of a resistor R22, and the other path is connected with a PD0 pin of the microcontroller; the grid of the MOS field effect transistor Q1 is connected with one end of a resistor R19, the connection end of the other end of the resistor R19 and the other end of the resistor R22 is connected with a 3.3V power output end, and the AO pin of the MQ2 smoke sensor P7 is connected with the PB0 pin of the microcontroller.
The construction site environment detector is characterized in that: the PM2.5 sensor is a GP2Y1014AU0F dust sensor P14, a Vled pin of the GP2Y1014AU0F dust sensor P14 is divided into two paths, one path is connected with a 5V power supply output end through a resistor R52, and the other path is grounded through a capacitor C51; the LED-GND pin of the GP2Y1014AU0F dust sensor P14 is grounded with the S-GND pin of the GP2Y1014AU0F dust sensor P14, the LED pin of the GP2Y1014AU0F dust sensor P14 is connected with the collector of a triode Q6, the base of the triode Q6 is divided into two paths, one path is connected with the PE14 pin of the microcontroller through a resistor R59, and the other path is grounded through a resistor R61; the emitter of the triode Q6 is grounded, the VO pin of the GP2Y1014AU0F dust sensor P14 is connected with the PA7 pin of the microcontroller, and the VCC pin of the GP2Y1014AU0F dust sensor P14 is connected with the 5V power output end.
The construction site environment detector is characterized in that: the noise sensor comprises a BYZ-08 noise sensor P3 and a communication chip U4 with the model number of SP485EEN-L/TR, a GND pin of the BYZ-08 noise sensor P3 is grounded, a V + pin of the BYZ-08 noise sensor P3 is connected with a 5V power output end, a B/R pin of the BYZ-08 noise sensor P3 is divided into three paths, one path is connected with one end of a resistor R9, the other path is grounded through a resistor R7, and the third path is connected with a7 th pin of the communication chip U4; the A/T pin of the BYZ-08 noise sensor P3 is divided into three paths, one path is connected with the other end of the resistor R9, the other path is connected with the 3.3V power output end through the resistor R15, and the third path is connected with the 6 th pin of the communication chip U4; the 1 st pin of communication chip U4 meets with microcontroller's PC10 pin, the 2 nd pin of communication chip U4 with the link of the 3 rd pin of communication chip U4 meets with microcontroller's PE0 pin, the 4 th pin of communication chip U4 meets with microcontroller's PC11 pin, the 5 th pin ground connection of communication chip U4, the 8 th pin of communication chip U4 divides two the tunnel, and one way connects 3.3V power output end, and another way is through electric capacity C17 ground connection.
The construction site environment detector is characterized in that: the vibration sensor comprises an SZ-6B vibration sensor P17 and a vibration signal amplifying circuit, wherein the vibration signal amplifying circuit comprises an operational amplifier U12 with the model of LM358, the output end of the SZ-6B vibration sensor P17 is connected with one end of a resistor R60, a No. 2 pin of the operational amplifier U12 is divided into two paths, one path is connected with one end of a resistor R55, and the other path is connected with one end of a capacitor C52; the 1 st pin of the operational amplifier U12 is divided into four paths, one path is connected with the other end of a resistor R55, the other path is connected with the other end of a capacitor C52, the third path is grounded through a resistor R54, and the fourth path is connected with one end of a resistor R53; the other end of the resistor R53 is divided into two paths, one path is grounded through a resistor R58, and the other path is connected with a PC5 pin of the microcontroller; the 3 rd pin of the operational amplifier U12 is divided into two paths, one path is connected with the other end of the resistor R60, and the other path is grounded through the capacitor C57; the 8 th pin of the operational amplifier U12 is divided into two paths, one path is connected with the output end of a 3.3V power supply, and the other path is grounded through a capacitor C53.
The construction site environment detector is characterized in that: the digital output type double-shaft inclination angle sensor comprises an LCA326T double-shaft inclination angle sensor P20 and a communication chip U1 with the model of MAX232ESE, wherein an RXD pin of the LCA326T double-shaft inclination angle sensor P20 is connected with a 13 th pin of the communication chip U1, a TXD pin of the LCA326T double-shaft inclination angle sensor P20 is connected with a 14 th pin of the communication chip U1, a GND pin of the LCA326T double-shaft inclination angle sensor P20 is grounded, a VCC pin of the LCA326T double-shaft inclination angle sensor P20 is connected with a 5V power supply output end, a1 st pin of the communication chip U1 is connected with a3 rd pin of the communication chip U1 through a capacitor C1, a 4 th pin of the communication chip U1 is connected with a 5 th pin of the communication chip U1 through a capacitor C8, a 11 th pin of the communication chip U1 is connected with a PA9 pin of a microcontroller, a 12 th pin of the communication chip U828653 and the communication chip 8615, the 6 th pin of the communication chip U1 is grounded through a capacitor C12, the 16 th pin of the communication chip U1 is divided into two paths, one path is connected with the 3.3V power output end, and the other path is grounded through a capacitor C9; the 2 nd pin of the communication chip U1 is grounded through a capacitor C7;
the wind speed sensor is composed of a DP-FS485 wind speed sensor P1 and a communication chip U3 with the model number of SP485EEN-L/TR, a GND pin of the DP-FS485 wind speed sensor P1 is grounded, a VCC pin of the DP-FS485 wind speed sensor P1 is connected with a 12V power supply output end, a 485-B pin of the DP-FS485 wind speed sensor P1 is divided into three paths, one path is connected with one end of a resistor R8, the other path is grounded through a resistor R6, and the third path is connected with a7 th pin of the communication chip U3; the 485-A pin of the DP-FS485 wind speed sensor P1 is divided into three paths, one path is connected with the other end of the resistor R8, the other path is connected with the 3.3V power output end through the resistor R14, and the third path is connected with the 6 th pin of the communication chip U3; the 1 st pin of communication chip U3 meets with microcontroller's PD6 pin, the 2 nd pin of communication chip U3 with the link of the 3 rd pin of communication chip U3 meets with microcontroller's PE1 pin, the 4 th pin of communication chip U3 meets with microcontroller's PD5 pin, the 5 th pin ground connection of communication chip U3, the 8 th pin of communication chip U3 divides two the tunnel, and one way connects 3.3V power output end, and another way is through electric capacity C16 ground connection.
The construction site environment detector is characterized in that: the wireless transmission module comprises a chip USR-LTE-7S4, a SIM card P18 and an A-type USB interface P16, wherein the 3 rd pin of the chip USR-LTE-7S4 is divided into two paths, one path is connected with one end of a resistor R57, and the other path is connected with the cathode of a voltage regulator tube D4; the 4 th pin of the chip USR-LTE-7S4 is divided into two paths, one path is connected with one end of a resistor R56, and the other path is connected with the cathode of a voltage regulator tube D5; the anode of the voltage regulator tube D4 and the anode of the voltage regulator tube D5 are both grounded, the other end of the resistor R57 is connected with the D-pin of the A-type USB interface P16, the other end of the resistor R56 is connected with the D + pin of the A-type USB interface P16, the 6 th pin of the chip USR-LTE-7S4 is connected with the PD9 pin of the microcontroller, the 7 th pin of the chip USR-LTE-7S4 is connected with the PD8 pin of the microcontroller, the 9 th pin of the chip USR-LTE-7S4 is connected with one end of the resistor R46, the other end of the resistor R46 is connected with the base of a triode Q4, the emitter of the triode Q4 is grounded, the collector of the triode Q4 is connected with the cathode of a light emitting diode LED5, the anode of the light emitting diode LED5 is connected with the 3.8V power supply output end through the resistor R42, the first end of the chip USR-LTE-7S4 is connected with the resistor R43, the other end of the resistor R43 is divided into two paths, one path is connected with the output end of a 3.3V power supply, and the other path is connected with the collector of a triode Q5; the emitter of the triode Q5 is grounded, the base of the triode Q5 is divided into two paths, one path is connected with a PE13 pin of the microcontroller through a resistor R47, and the other path is grounded through a resistor R51; the 11 th pin and the 12 th pin of the chip USR-LTE-7S4 are grounded, the 23 rd pin of the chip USR-LTE-7S4 is connected with the 3 rd pin of the SIM card P18, the 22 nd pin of the chip USR-LTE-7S4 is connected with the 5 th pin of the SIM card P18, the 21 st pin of the chip USR-LTE-7S4 is connected with the 6 th pin of the SIM card P18, the 1 st pin and the 4 th pin of the SIM card P18 are connected with a 1.8V power output end, the 16 th pin of the chip USR-LTE-7S4 is divided into two paths, one path is grounded through a capacitor C46, a capacitor C47 and a capacitor C48 which are connected in parallel, and the other path is connected with a 3.8V power output end; the 15 th pin of the chip USR-LTE-7S4 is connected with one end of a resistor R48, the other end of the resistor R48 is connected with the base electrode of a triode Q3, the emitting electrode of the triode Q3 is grounded, the collecting electrode of the triode Q3 is connected with the cathode of a light-emitting diode LED4, and the anode of the light-emitting diode LED4 is connected with the 3.8V power output end through the resistor R41.
The construction site environment detector is characterized in that: the power supply module comprises a 12V-to-5V voltage module, a 5V-to-3.3V voltage module, a 5V-to-3.8V voltage module and a 5V-to-1.8V voltage module;
the 12V-to-5V voltage module comprises a chip LM596-5V, a1 st pin of the chip LM596-5V is divided into two paths, one path is connected with the output ends of the solar cell panel and the lithium battery, and the other path is grounded through a capacitor C28, a capacitor C29 and a capacitor C30 which are connected in parallel; the No. 3 pin and the No. 5 pin of the chip LM596-5V are grounded, the No. 2 pin of the chip LM596-5V is divided into two paths, one path is connected with the cathode of a voltage regulator tube D3, and the other path is connected with one end of an inductor L2; the 4 th pin of the chip LM596-5V is divided into four paths, the first path is connected with the other end of the inductor L2, the second path is grounded through a capacitor C31 and a capacitor C32 which are connected in parallel, the third path is connected with one end of a resistor R33, and the fourth path is connected with one end of a resistor R31; the other end of the resistor R31 is a 5V power supply output end, the other end of the resistor R33 is connected with the anode of the light-emitting diode LED2, and the cathode of the light-emitting diode LED2 is grounded;
the 5V-to-3.3V voltage module comprises a chip LM1117-3.3V, a1 st pin of the chip LM1117-3.3V is grounded, a3 rd pin of the chip LM1117-3.3V is divided into two paths, one path is connected with a 5V power supply output end, and the other path is grounded through a capacitor C36 and a capacitor C33 which are connected in parallel; the 2 nd pin of the chip LM1117-3.3V is divided into four paths, the first path is connected with the 4 th pin of the chip LM1117-3.3V, the second path is grounded through a capacitor C34 and a capacitor C37 which are connected in parallel, the third path is connected with one end of a resistor R37, and the fourth path is connected with one end of a resistor R36; the other end of the resistor R36 is a 3.3V power supply output end, the other end of the resistor R37 is connected with the anode of the light-emitting diode LED3, and the cathode of the light-emitting diode LED3 is grounded;
the 5V-to-3.8V voltage module comprises a chip MP1482, a1 st pin of the chip MP1482 is connected with one end of a capacitor C35, a 2 nd pin of the chip MP1482 is divided into three paths, one path is connected with a 5V power supply output end, the other path is grounded through a capacitor C38, a capacitor C39 and a capacitor C40 which are connected in parallel, and the third path is connected with one end of a resistor R39; the 7 th pin of the chip MP1482 is connected with the other end of the resistor R39, the 8 th pin of the chip MP1482 is grounded through a capacitor C41, the 4 th pin of the chip MP1482 is grounded, the 6 th pin of the chip MP1482 is divided into two paths, one path is grounded through the resistor R49 and the capacitor C45 which are connected in series, and the other path is grounded through the capacitor C44; the 5 th pin of the chip MP1482 is divided into two paths, one path is grounded through a resistor R50, and the other path is connected with one end of a resistor R44; the 3 rd pin of the chip MP1482 is divided into two paths, one path is connected with the other end of the capacitor C35, and the other path is connected with one end of the inductor L3; the other end of the inductor L3 is divided into five paths, the first path is connected with the other end of the resistor R44, the second path is grounded through a capacitor C42, the third path is grounded through a capacitor C43, the fourth path is connected with one end of the resistor R45, and the fifth path is connected with one end of the resistor R40; the other end of the resistor R45 is connected with the anode of the light-emitting diode LED6, the other end of the resistor R40 is a 3.8V power output end, and the cathode of the light-emitting diode LED6 is grounded;
the 5V to 1.8V voltage module comprises a chip LP5900SD-1.8, a pin 4 of the chip LP5900SD-1.8 is divided into two paths, one path is connected with a 5V power output end, and the other path is grounded through a capacitor C65; the 2 nd pin of the chip LP5900SD-1.8 is divided into two paths, one path is connected with the output end of a 3.3V power supply, and the other path is grounded through a resistor R65; the 1 st pin of the chip LP5900SD-1.8 is divided into two paths, one path is a 1.8V power supply output end, and the other path is grounded through a capacitor C66; the 3 rd pin of the chip LP5900SD-1.8 is grounded.
Compared with the prior art, the utility model has the following advantage:
1. the utility model has small volume and light weight, and compared with a commercial power 220V power supply, the energy consumption of the adopted solar cell panel and the lithium battery is low; in addition, the power supply does not depend on an alternating current 220V power supply, is convenient to transfer and can be repeatedly used.
2. The utility model discloses a sensor group include ambient temperature sensor, ambient humidity sensor, harmful gas sensor and smoke transducer, and PM2.5 sensor, noise transducer and wind speed sensor, be for detecting and acquireing environmental parameter such as the temperature to the construction environment, humidity, harmful gas, combustible gas, dust concentration, noise, wind speed, set up vibration sensor, be for whether take place the vibration in the real-time supervision construction environment, in time make the adjustment to the construction process, avoid the operator to be in dangerous condition.
3. The wireless transmission module adopted by the utility model is in wireless connection with the monitoring mobile phone through the wireless transmission module, realizes the remote monitoring of the construction site environment detector and the acquisition of environmental parameter data, and ensures the safety of the construction site environment; on the other hand, the monitoring mobile phone can conveniently monitor a plurality of construction site environment detectors through the wireless transmission module, so that a plurality of construction sites can be managed conveniently.
To sum up, the utility model discloses simple structure, reasonable in design, it is small, realize solar energy and battery power supply, the power consumption is little, and is with low costs, can realize having the portability to the acquirement of environmental parameter such as temperature, humidity, wind speed, noise, harmful gas, combustible gas, dust concentration, conveniently shifts, is convenient for make precautionary measure, improves construction safety factor, and the practicality is strong.
The technical solution of the present invention is further described in detail by the accompanying drawings and examples.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic block diagram of the circuit of the present invention.
Fig. 3 is an original circuit diagram of the ambient temperature sensor of the present invention.
Fig. 4 is a schematic circuit diagram of the harmful gas sensor of the present invention.
Fig. 5 is a schematic circuit diagram of the smoke sensor of the present invention.
Fig. 6 is a schematic circuit diagram of the PM2.5 sensor of the present invention.
Fig. 7 is a schematic circuit diagram of the noise sensor of the present invention.
Fig. 8 is a schematic circuit diagram of the vibration sensor of the present invention.
Fig. 9 is a schematic circuit diagram of the digital output type dual-axis tilt sensor of the present invention.
Fig. 10 is a schematic circuit diagram of the wind speed sensor according to the present invention.
Fig. 11 is a schematic circuit diagram of the wireless transmission module of the present invention.
Fig. 12 is a schematic circuit diagram of the 12V to 5V voltage module according to the present invention.
Fig. 13 is a schematic circuit diagram of the voltage module of the present invention for converting 5V to 3.3V.
Fig. 14 is a schematic circuit diagram of the voltage module of the present invention for converting 5V to 3.8V.
Fig. 15 is a schematic circuit diagram of the voltage module of the present invention for converting 5V to 1.8V.
Fig. 16 is a left side view of fig. 1.
Fig. 17 is a schematic circuit block diagram of the power module of the present invention.
Fig. 18 is a schematic circuit diagram of the relay of the present invention.
Fig. 19 is a schematic circuit diagram of the solar voltage stabilization module according to the present invention.
Description of reference numerals:
1-a housing; 2-liquid crystal display screen; 3-a vertical column;
4-solar panel; 4-1, a solar voltage stabilizing module;
5-a wind speed sensor; 6, a bracket;
7, a camera; 8-louver; 9-electronic circuit board;
10-ambient temperature sensor; 11-ambient humidity sensor; 12-an alarm;
13-a harmful gas sensor; 14-a smoke sensor; 15-a microcontroller;
16-PM 2.5 sensor; 17-a noise sensor; 18-a power supply module;
a voltage module for converting 18-1-12V to 5V; a voltage module for converting 18-2-5V to 3.3V;
a voltage module for converting 18-3-5V to 3.8V; a voltage module for converting 18-4-5V to 1.8V;
19-a vibration sensor; 20-a wireless transmission module;
21-digital output type biaxial inclination angle sensor; 22-a lithium battery;
22-1-relay.
Detailed Description
As shown in fig. 1, fig. 2 and fig. 16, the utility model discloses a casing 1 and set up in casing 1 outside one side and be used for showing the liquid crystal display 2 of detecting information and alarm 12 of real-time warning, the top outside of casing 1 is equipped with wind speed sensor 5, the bottom edge of casing 1 is equipped with upright post 3, be provided with electronic circuit board 9 and lithium cell 22 in the casing 1, integrated microcontroller 15, power module 18 and the sensor group and the wireless transmission module 20 that connect with microcontroller 15 on the electronic circuit board 9, the sensor group includes ambient temperature sensor 10, ambient humidity sensor 11, harmful gas sensor 13 and smoke transducer 14, and PM2.5 sensor 16, noise sensor 17, vibration sensor 19 and digital output type biax tilt sensor 21; ambient temperature sensor 10, ambient humidity sensor 11, harmful gas sensor 13, smoke transducer 14, air velocity transducer 5, PM2.5 sensor 16, noise sensor 17, vibration sensor 19 and digital output type biax tilt angle sensor 21's output all meets with microcontroller 15's input, be provided with solar cell panel 4 on the casing 1, solar cell panel 4's output and lithium cell 22's output meet with power module 18, microcontroller 15 is STM32F103VET6 microcontroller.
As shown in fig. 3, in this embodiment, the ambient temperature sensor 10 includes a PT100 temperature sensor P9 and a temperature signal amplifying circuit connected to an output terminal of the PT100 temperature sensor, the temperature signal amplifying circuit includes an operational amplifier U5 with a model number LM358, a3 rd pin of the operational amplifier U5 is divided into two paths, one path is grounded through a capacitor C21, and the other path is connected to one end of a resistor R23; the 4 th pin of the operational amplifier U5 is grounded; the 5 th pin of the operational amplifier U5 is divided into two paths, one path is grounded through a resistor R26, and the other path is connected with the output end of a 3.3V power supply through a resistor R20; the 6 th pin of the operational amplifier U5 is divided into two paths, one path is connected with one end of a resistor R24, and the other path is connected with one end of a resistor R18; the 7 th pin of the operational amplifier U5 is divided into two paths, one path is connected with the other end of the resistor R23, and the other path is connected with the other end of the resistor R18; the 8 pins of the operational amplifier U5 are connected with a 3.3V power supply output end, the other end of the resistor R24 is divided into two paths, one path is grounded through the resistor R28 and the resistor R27 which are connected in series, the other path is connected with the output end of a PT100 temperature sensor P9, and the connecting ends of the 1 st pin and the 2 nd pin of the operational amplifier U5 are connected with a PC2 pin of the microcontroller 15.
In this embodiment, STM32F103VET6 microcontroller, the IO mouth is more, and the sensor group of being convenient for connects, and the low power dissipation, and contain the AD module, reduce the peripheral circuit design.
As shown in fig. 4, in this embodiment, the ambient humidity sensor 11 is an HM1500 humidity sensor, and an output terminal of the ambient humidity sensor 11 is connected to a pin PC1 of the microcontroller 15;
the harmful gas sensor 13 is an MQ135 gas sensor P13, a VCC pin of the MQ135 gas sensor P13 is connected with a 5V power supply output end, a GND pin of the MQ135 gas sensor P13 is grounded, a DO pin of the MQ135 gas sensor P13 is divided into two paths, one path is connected with the 5V power supply output end through a resistor R34, and the other path is connected with a drain electrode of a MOS field effect transistor Q2; the source electrode of the MOS field effect transistor Q2 is divided into two paths, one path is connected with one end of a resistor R35, and the other path is connected with a PE15 pin of the microcontroller 15; the grid of the MOS field effect transistor Q2 is connected with one end of a resistor R32, the connection end of the other end of the resistor R32 and the other end of the resistor R35 is connected with a 3.3V power output end, and the AO pin of the MQ135 gas sensor P13 is connected with the PB1 pin of the microcontroller 15.
As shown in fig. 5, in this embodiment, the smoke sensor 14 is an MQ2 smoke sensor P7, a VCC pin of the MQ2 smoke sensor P7 is connected to a 5V power output terminal, a GND pin of the MQ2 smoke sensor P7 is grounded, a DO pin of the MQ2 smoke sensor P7 is divided into two paths, one path is connected to the 5V power output terminal through a resistor R21, and the other path is connected to a drain of a MOS field effect transistor Q1; the source electrode of the MOS field effect transistor Q1 is divided into two paths, one path is connected with one end of a resistor R22, and the other path is connected with a PD0 pin of the microcontroller 15; the grid of the MOS field effect transistor Q1 is connected with one end of a resistor R19, the connection end of the other end of the resistor R19 and the other end of the resistor R22 is connected with a 3.3V power output end, and the AO pin of the MQ2 smoke sensor P7 is connected with the PB0 pin of the microcontroller 15.
As shown in fig. 6, in this embodiment, the PM2.5 sensor 16 is a GP2Y1014AU0F dust sensor P14, a Vled pin of the GP2Y1014AU0F dust sensor P14 is divided into two paths, one path is connected to a 5V power output terminal through a resistor R52, and the other path is grounded through a capacitor C51; the LED-GND pin of the GP2Y1014AU0F dust sensor P14 is grounded with the S-GND pin of the GP2Y1014AU0F dust sensor P14, the LED pin of the GP2Y1014AU0F dust sensor P14 is connected with the collector of a triode Q6, the base of the triode Q6 is divided into two paths, one path is connected with the PE14 pin of the microcontroller 15 through a resistor R59, and the other path is grounded through a resistor R61; the emitter of the triode Q6 is grounded, the VO pin of the GP2Y1014AU0F dust sensor P14 is connected with the PA7 pin of the microcontroller 15, and the VCC pin of the GP2Y1014AU0F dust sensor P14 is connected with the 5V power output end.
As shown in fig. 7, in this embodiment, the noise sensor 17 includes a BYZ-08 noise sensor P3 and a communication chip U4 with model number SP485EEN-L/TR, a GND pin of the BYZ-08 noise sensor P3 is grounded, a V + pin of the BYZ-08 noise sensor P3 is connected to a 5V power output terminal, a B/R pin of the BYZ-08 noise sensor P3 is divided into three paths, one path is connected to one end of a resistor R9, the other path is grounded via a resistor R7, and the third path is connected to a7 th pin of the communication chip U4; the A/T pin of the BYZ-08 noise sensor P3 is divided into three paths, one path is connected with the other end of the resistor R9, the other path is connected with the 3.3V power output end through the resistor R15, and the third path is connected with the 6 th pin of the communication chip U4; the 1 st pin of communication chip U4 meets with microcontroller 15's PC10 pin, the 2 nd pin of communication chip U4 with the link of the 3 rd pin of communication chip U4 meets with microcontroller 15's PE0 pin, the 4 th pin of communication chip U4 meets with microcontroller 15's PC11 pin, the 5 th pin ground connection of communication chip U4, the 8 th pin of communication chip U4 divides two the tunnel, and one way connects 3.3V power output end, and another way is through electric capacity C17 ground connection.
As shown in fig. 8, in this embodiment, the vibration sensor 19 includes an SZ-6B vibration sensor P17 and a vibration signal amplifying circuit, the vibration signal amplifying circuit includes an operational amplifier U12 with a model number LM358, an output terminal of the SZ-6B vibration sensor P17 is connected to one end of a resistor R60, a 2 nd pin of the operational amplifier U12 is divided into two paths, one path is connected to one end of a resistor R55, and the other path is connected to one end of a capacitor C52; the 1 st pin of the operational amplifier U12 is divided into four paths, one path is connected with the other end of a resistor R55, the other path is connected with the other end of a capacitor C52, the third path is grounded through a resistor R54, and the fourth path is connected with one end of a resistor R53; the other end of the resistor R53 is divided into two paths, one path is grounded through a resistor R58, and the other path is connected with a PC5 pin of the microcontroller 15; the 3 rd pin of the operational amplifier U12 is divided into two paths, one path is connected with the other end of the resistor R60, and the other path is grounded through the capacitor C57; the 8 th pin of the operational amplifier U12 is divided into two paths, one path is connected with the output end of a 3.3V power supply, and the other path is grounded through a capacitor C53.
As shown in fig. 9 and 10, in the present embodiment, the digital output type dual-axis tilt sensor 21 includes an LCA326T dual-axis tilt sensor P20 and a communication chip U1 with a model MAX232ESE, the RXD pin of the LCA326T dual-axis tilt sensor P20 is connected to the 13 th pin of the communication chip U1, the TXD pin of the LCA326T dual-axis tilt sensor P20 is connected to the 14 th pin of the communication chip U1, the GND pin of the LCA326T dual-axis tilt sensor P20 is grounded, the VCC pin of the LCA326T dual-axis tilt sensor P20 is connected to the 5V power output terminal, the 1 st pin of the communication chip U1 is connected to the 3 rd pin of the communication chip U1 through a capacitor C1, the 4 th pin of the communication chip U1 is connected to the 5 th pin of the communication chip U1 through a capacitor C8, the 11 th pin of the communication chip U1 is connected to the PA pin 15, the communication chip U5912 th pin of the microcontroller P9 is connected to the communication chip PA9, the 15 th pin of the communication chip U1 is grounded, the 6 th pin of the communication chip U1 is grounded through a capacitor C12, the 16 th pin of the communication chip U1 is divided into two paths, one path is connected with the 3.3V power output end, and the other path is grounded through a capacitor C9; the 2 nd pin of the communication chip U1 is grounded through a capacitor C7;
the wind speed sensor 5 comprises a DP-FS485 wind speed sensor P1 and a communication chip U3 with the model number of SP485EEN-L/TR, a GND pin of the DP-FS485 wind speed sensor P1 is grounded, a VCC pin of the DP-FS485 wind speed sensor P1 is connected with a 12V power output end, a 485-B pin of the DP-FS485 wind speed sensor P1 is divided into three paths, one path is connected with one end of a resistor R8, the other path is grounded through a resistor R6, and the third path is connected with a7 th pin of the communication chip U3; the 485-A pin of the DP-FS485 wind speed sensor P1 is divided into three paths, one path is connected with the other end of the resistor R8, the other path is connected with the 3.3V power output end through the resistor R14, and the third path is connected with the 6 th pin of the communication chip U3; the 1 st pin of the communication chip U3 is connected with the PD6 pin of the microcontroller 15, the 2 nd pin of the communication chip U3 and the connecting end of the 3 rd pin of the communication chip U3 are connected with the PE1 pin of the microcontroller 15, the 4 th pin of the communication chip U3 is connected with the PD5 pin of the microcontroller 15, the 5 th pin of the communication chip U3 is grounded, the 8 th pin of the communication chip U3 is divided into two paths, one path is connected with the 3.3V power output end, and the other path is grounded through the capacitor C16.
As shown in fig. 11, in this embodiment, the wireless transmission module 20 includes a chip USR-LTE-7S4, a SIM card P18, and an a-type USB interface P16, the 3 rd pin of the chip USR-LTE-7S4 is divided into two paths, one path is connected to one end of a resistor R57, and the other path is connected to the cathode of a voltage regulator D4; the 4 th pin of the chip USR-LTE-7S4 is divided into two paths, one path is connected with one end of a resistor R56, and the other path is connected with the cathode of a voltage regulator tube D5; the anode of the voltage regulator tube D4 and the anode of the voltage regulator tube D5 are both grounded, the other end of the resistor R57 is connected with the D-pin of the type-A USB interface P16, the other end of the resistor R56 is connected with the D + pin of the type-A USB interface P16, the 6 th pin of the chip USR-LTE-7S4 is connected with the PD9 pin of the microcontroller 15, the 7 th pin of the chip USR-LTE-7S4 is connected with the PD8 pin of the microcontroller 15, the 9 th pin of the chip USR-LTE-7S4 is connected with one end of the resistor R46, the other end of the resistor R46 is connected with the base of the triode Q4, the emitter of the triode Q4 is grounded, the collector of the triode Q4 is connected with the cathode of the light emitting diode LED5, the anode of the light emitting diode LED5 is connected with the 3.8V power output end through the resistor R42, and the first end of the chip USR-LTE-7S4 is connected with the pin 43, the other end of the resistor R43 is divided into two paths, one path is connected with the output end of a 3.3V power supply, and the other path is connected with the collector of a triode Q5; the emitter of the triode Q5 is grounded, the base of the triode Q5 is divided into two paths, one path is connected with a PE13 pin of the microcontroller 15 through a resistor R47, and the other path is grounded through a resistor R51; the 11 th pin and the 12 th pin of the chip USR-LTE-7S4 are grounded, the 23 rd pin of the chip USR-LTE-7S4 is connected with the 3 rd pin of the SIM card P18, the 22 nd pin of the chip USR-LTE-7S4 is connected with the 5 th pin of the SIM card P18, the 21 st pin of the chip USR-LTE-7S4 is connected with the 6 th pin of the SIM card P18, the 1 st pin and the 4 th pin of the SIM card P18 are connected with a 1.8V power output end, the 16 th pin of the chip USR-LTE-7S4 is divided into two paths, one path is grounded through a capacitor C46, a capacitor C47 and a capacitor C48 which are connected in parallel, and the other path is connected with a 3.8V power output end; the 15 th pin of the chip USR-LTE-7S4 is connected with one end of a resistor R48, the other end of the resistor R48 is connected with the base electrode of a triode Q3, the emitting electrode of the triode Q3 is grounded, the collecting electrode of the triode Q3 is connected with the cathode of a light-emitting diode LED4, and the anode of the light-emitting diode LED4 is connected with the 3.8V power output end through the resistor R41.
As shown in fig. 12, 13, 14, 15 and 17, in the present embodiment, the power module 18 includes a 12V to 5V voltage module 18-1, a 5V to 3.3V voltage module 18-2, a 5V to 3.8V voltage module 18-3 and a 5V to 1.8V voltage module 18-4;
the 12V-to-5V voltage module 18-1 comprises a chip LM596-5V, a1 st pin of the chip LM596-5V is divided into two paths, one path is connected with the output ends of the solar panel 4 and the lithium battery 22, and the other path is grounded through a capacitor C28, a capacitor C29 and a capacitor C30 which are connected in parallel; the No. 3 pin and the No. 5 pin of the chip LM596-5V are grounded, the No. 2 pin of the chip LM596-5V is divided into two paths, one path is connected with the cathode of a voltage regulator tube D3, and the other path is connected with one end of an inductor L2; the 4 th pin of the chip LM596-5V is divided into four paths, the first path is connected with the other end of the inductor L2, the second path is grounded through a capacitor C31 and a capacitor C32 which are connected in parallel, the third path is connected with one end of a resistor R33, and the fourth path is connected with one end of a resistor R31; the other end of the resistor R31 is a 5V power supply output end, the other end of the resistor R33 is connected with the anode of the light-emitting diode LED2, and the cathode of the light-emitting diode LED2 is grounded;
the 5V to 3.3V voltage module 18-2 comprises a chip LM1117-3.3V, a1 st pin of the chip LM1117-3.3V is grounded, a3 rd pin of the chip LM1117-3.3V is divided into two paths, one path is connected with a 5V power output end, and the other path is grounded through a capacitor C36 and a capacitor C33 which are connected in parallel; the 2 nd pin of the chip LM1117-3.3V is divided into four paths, the first path is connected with the 4 th pin of the chip LM1117-3.3V, the second path is grounded through a capacitor C34 and a capacitor C37 which are connected in parallel, the third path is connected with one end of a resistor R37, and the fourth path is connected with one end of a resistor R36; the other end of the resistor R36 is a 3.3V power supply output end, the other end of the resistor R37 is connected with the anode of the light-emitting diode LED3, and the cathode of the light-emitting diode LED3 is grounded;
the 5V to 3.8V voltage module 18-3 comprises a chip MP1482, a1 st pin of the chip MP1482 is connected with one end of a capacitor C35, a 2 nd pin of the chip MP1482 is divided into three paths, one path is connected with a 5V power output end, the other path is grounded through a capacitor C38, a capacitor C39 and a capacitor C40 which are connected in parallel, and the third path is connected with one end of a resistor R39; the 7 th pin of the chip MP1482 is connected with the other end of the resistor R39, the 8 th pin of the chip MP1482 is grounded through a capacitor C41, the 4 th pin of the chip MP1482 is grounded, the 6 th pin of the chip MP1482 is divided into two paths, one path is grounded through the resistor R49 and the capacitor C45 which are connected in series, and the other path is grounded through the capacitor C44; the 5 th pin of the chip MP1482 is divided into two paths, one path is grounded through a resistor R50, and the other path is connected with one end of a resistor R44; the 3 rd pin of the chip MP1482 is divided into two paths, one path is connected with the other end of the capacitor C35, and the other path is connected with one end of the inductor L3; the other end of the inductor L3 is divided into five paths, the first path is connected with the other end of the resistor R44, the second path is grounded through a capacitor C42, the third path is grounded through a capacitor C43, the fourth path is connected with one end of the resistor R45, and the fifth path is connected with one end of the resistor R40; the other end of the resistor R45 is connected with the anode of the light-emitting diode LED6, the other end of the resistor R40 is a 3.8V power output end, and the cathode of the light-emitting diode LED6 is grounded;
the 5V to 1.8V voltage module 18-4 comprises a chip LP5900SD-1.8, wherein a pin 4 of the chip LP5900SD-1.8 is divided into two paths, one path is connected with a 5V power supply output end, and the other path is grounded through a capacitor C65; the 2 nd pin of the chip LP5900SD-1.8 is divided into two paths, one path is connected with the output end of a 3.3V power supply, and the other path is grounded through a resistor R65; the 1 st pin of the chip LP5900SD-1.8 is divided into two paths, one path is a 1.8V power supply output end, and the other path is grounded through a capacitor C66; the 3 rd pin of the chip LP5900SD-1.8 is grounded.
In the embodiment, the output end of the solar cell panel 4 is connected with a solar voltage stabilizing module 4-1, and the output ends of the solar voltage stabilizing module 4-1 and the lithium battery 22 are connected with the input end of a 12V to 5V voltage module 18-1 through a relay 22-1.
As shown in fig. 18, in this embodiment, the relay 22-1 is a relay K1-1, one end of a coil of the relay K1-1 is divided into three paths, one path is connected to a 12V power output terminal, the other path is connected to an anode of a light emitting diode D1-4 through a resistor R1-5, and the third path is connected to a cathode of a diode D1-3; the other end of the coil of the relay K1-1 is divided into three paths, one path is connected with the cathode of the light emitting diode D1-4, the other path is connected with the anode of the diode D1-3, and the third path is connected with the emitting electrode of the triode Q1-1; the base electrode of the triode Q1-1 is connected with a PA15 pin of the microcontroller 15 through a resistor R1-6, the collector electrode of the triode Q1-1 is grounded, the common contact of the relay K1-1 is connected with a Vin pin of the chip LM596-5V, the normally open contact of the relay K1-1 is connected with the output end of the lithium battery 22, and the normally closed contact of the relay K1-1 is connected with the output end of the solar voltage stabilizing module 4-1.
As shown in fig. 19, in this embodiment, the solar voltage stabilizing module 4-1 includes a chip MAX1771, a1 st pin of the chip MAX1771 is connected to a gate of an NMOS transistor Q41, a 2 nd pin of the chip MAX1771 is divided into three paths, a first path is connected to a cathode of a schottky diode D31, a second path is grounded via a capacitor C2, and a third path is an output terminal vo1 of the solar voltage stabilizing module 4-1; the 3 rd pin and the 4 th pin of the chip MAX1771 are grounded, the 5 th pin of the chip MAX1771 is grounded through a capacitor C3, the 6 th pin and the 7 th pin of the chip MAX1771 are grounded, the 8 th pin of the chip MAX1771 is divided into two paths, one path is grounded through a resistor R7, and the other path is connected with the source electrode of an NMOS transistor Q41; the anode of the Schottky diode D31 is divided into two paths, one path is connected with the drain of an NMOS tube Q41, and the other path is connected with one end of an inductor L21; the other end of the inductor L21 is divided into two paths, one path is connected with the 1 st pin of the two-end interface JP1, the other path is grounded through a capacitor C4, and the 2 nd pin of the two-end interface JP1 is grounded.
In this embodiment, it should be noted that the output end of the solar voltage stabilizing module 4-1 outputs a 12V power supply, the lithium battery 22 is a 12V lithium battery, and the output end of the lithium battery 22 outputs a 12V power supply, which is convenient for the voltage conversion of the 12V to 5V voltage module 18-1.
In this embodiment, in actual use, the 1 st pin of the two-end interface JP1 is connected to the positive output terminal of the solar panel 4, and the 2 nd pin of the two-end interface JP1 is connected to the negative output terminal of the solar panel 4.
In this embodiment, when it needs to be described, one end of the coil of the relay K1-1 is connected to the 12V power output terminal, that is, the output terminal of the lithium battery 22, and stably supplies power to the coil of the relay K1-1, so that the relay 22-1 is ensured to complete power supply switching between the solar cell panel 4 and the lithium battery 22, so that power is supplied through the lithium battery 22 when solar energy is insufficient in cloudy days, and the application range is expanded.
In the practical use process, the temperature signal amplifying circuit adopts an LM358 integrated operational amplifier, in order to prevent the nonlinear error caused by the overhigh single-stage amplification factor, the temperature signal amplifying circuit adopts two-stage amplification, the stability of an output voltage signal is ensured, the A/D module of the microcontroller 15 can conveniently process the signal, and the construction environment temperature is obtained.
In this embodiment, the MQ135 gas sensor is provided because the gas-sensitive material used by the MQ135 gas sensor is tin dioxide with low conductivity in clean air, when the MQ135 gas sensor is in an environment where a pollutant gas exists, the conductivity of the sensor increases with the increase of the concentration of the pollutant gas in the air, and the change of the conductivity is converted into an output signal corresponding to the concentration of the pollutant gas, so as to realize the detection of the pollutant gas in the air, and the MQ135 gas sensor has high sensitivity to ammonia gas, sulfide gas and benzene series steam, low cost and long service life.
In the embodiment, the gas-sensitive material used by the MQ2 smoke sensor is tin dioxide with lower conductivity in clean air, when combustible gas exists in the environment where the MQ2 smoke sensor is located, the conductivity of the sensor is increased along with the increase of the concentration of the combustible gas in the air, and the change of the conductivity is converted into an output signal corresponding to the concentration of the combustible gas, so that the detection of the combustible gas in the air is realized, and the MQ135 gas sensor has high sensitivity to liquefied gas, propane and hydrogen, is low in cost, and further detects various combustible gases.
In this embodiment, an infrared light emitting diode and a phototransistor are arranged in the GP2Y1014AU0F dust sensor, the opposite angles are arranged to allow the sensor to detect the dust reflection light in the air, a hole is arranged in the center of the GP2Y1014AU0F dust sensor to allow the air to freely flow through, the LED light is emitted in a directional manner, the dust content is determined by detecting the light refracted by the dust in the air, that is, an analog voltage proportional to the measured dust concentration is output.
In this embodiment, the BYZ-08 noise sensor is a noise sensor with a built-in electret condenser microphone sensitive to sound, and the sound wave vibrates an electret film in the microphone to cause a change in capacitance and generate a small voltage that changes correspondingly, so that conversion from an optical signal to an electrical signal is realized, and detection of noise is realized.
When the vibration sensor is actually installed, the SZ-6B vibration sensor is vertically installed in the shell 1, when the construction environment vibrates, a moving coil in the SZ-6B vibration sensor cuts a magnetic line of force to output voltage, and whether the vibration occurs or not is obtained through an output voltage signal, so that early warning is facilitated; and the vibration signal amplifying circuit is used for linearly amplifying the voltage signal output by the SZ-6B vibration sensor and eliminating interference signals, and ensuring the stability of the output voltage signal, so that the a/D module of the microcontroller 15 can process the voltage signal to obtain the amplitude of vibration.
In this embodiment, DP-FS485 air velocity transducer, the appearance is small and exquisite light, portable and equipment, can effectively obtain external environment information, and its casing adopts high-quality aluminum alloy ex-trusions, and the spraying plastics processing is electroplated to the outside, has characteristics such as good anticorrosive, anti-corrosion, can guarantee that the instrument uses the rustless carving phenomenon for a long time, cooperates inside smooth bearing system simultaneously, has ensured information acquisition's accuracy nature, by the wide application in the wind speed measurement of environment such as greenhouse, environmental protection, weather station, boats and ships, pier, breed.
In the embodiment, the solar cell panel 4 outputs 12V direct current to supply power to the power module 18, so that the dependence on an alternating current 220V power supply is avoided, the energy consumption is low, the transfer is convenient, the solar cell panel can be repeatedly used, and the solar cell panel is effectively suitable for a construction site.
In this embodiment, casing 1 includes that the cross section is the lower casing of rectangle and sets up casing top and the transversal isosceles trapezoid's of personally submitting last casing down are favorable to the inclination of drainage, solar cell panel 4 installs the waist edge of going up the casing, wind speed sensor 5 is located the top of going up the casing.
In this embodiment, the shell 1 is made of a stainless steel alloy material or a basalt fiber board with good waterproof and external force resistance, a moisture-resistant and corrosion-resistant protective material coating is arranged outside the shell, the surface of the lower shell is provided with louver strips 8 for increasing internal air circulation and facilitating temperature, humidity and toxic and harmful gas detection, and the bottom of the lower shell is provided with a support 6 for fixing.
In this embodiment, the upright post 3 and the bracket 6 are provided for easy mounting and fixing.
In this embodiment, set up digital output type biax angular transducer 21, be in order to detect the inclination of casing 1, be convenient for adjust casing 1 to the level, avoid casing 1 to receive the wind speed to influence to take place the slope to fall, influence the construction environment test.
In this embodiment, the bottom of the casing 1 is provided with a camera 7, and an output end of the camera 7 is connected with an input end of the microcontroller 1; the camera 7 is arranged for collecting construction site images and sending the detected construction site images to the microcontroller 1, so that the construction site environment can be conveniently observed by remote people.
When the utility model is used, the construction site environment detector is installed on a construction site, a 12V power supply output by a solar cell panel 4 or a lithium battery 22 is converted into a 5V power supply through a 12V to 5V voltage module 18-1, the 5V power supply is converted into a 3.3V power supply through a 5V to 3.3V voltage module 18-2, the 5V power supply is converted into a 3.8V power supply through a 5V to 3.8V voltage module 18-3, the 5V power supply is converted into a 1.8V power supply through a 5V to 1.8V voltage module 18-4, the 3.3V power supply supplies power for a microcontroller 15, the 5V power supply and the 3.3V power supply power for a sensor group, the 3.3V power supply, the 3.8V power supply and the 1.8V power supply power for a wireless transmission module 20, the microcontroller 15, the sensor group and the wireless transmission module 20 enter a working state, the wind speed sensor 5 detects the wind, the detected construction environment wind speed is sent to the microcontroller 15, the environment temperature sensor 10 detects the temperature of the construction environment in real time and sends the detected construction environment temperature to the microcontroller 15, the environment humidity sensor 11 detects the humidity of the construction environment in real time and sends the detected construction environment humidity to the microcontroller 15, the harmful gas sensor 13 detects the harmful gas of the construction environment in real time and sends the detected construction environment harmful gas to the microcontroller 15, the smoke sensor 14 detects the combustible gas of the construction environment in real time and sends the detected construction environment combustible gas to the microcontroller 15, the PM2.5 sensor 16 detects the dust concentration of the construction environment in real time and sends the detected construction environment dust concentration to the microcontroller 15, the noise sensor 17 detects the noise of the construction environment in real time, and the construction environment noise that will detect sends to microcontroller 15, microcontroller 15 control liquid crystal display 2 is to the construction environment wind speed received, construction environment temperature, construction environment humidity, construction environment harmful gas, construction environment combustible gas, construction environment dust concentration and construction environment noise show, thereby be convenient for to the temperature of construction environment, humidity, harmful gas, combustible gas, dust concentration, the noise, environmental parameter such as wind speed detect and acquire, in time make the adjustment to the construction process, avoid the operator to be in dangerous condition. The vibration sensor 19 detects the vibration amplitude of the construction environment in real time, and sends the detected construction vibration amplitude to the microcontroller 15, and when the construction vibration amplitude received by the microcontroller 15 is greater than a vibration amplitude set value, the microcontroller 15 controls the alarm 12 to give an alarm for reminding, so that collapse is prevented; in addition, the microcontroller 15 sends the received wind speed of the construction environment, the temperature of the construction environment, the humidity of the construction environment, harmful gases of the construction environment, combustible gases, dust concentration, noise of the construction environment, construction vibration amplitude and the like to the monitoring mobile phone through the wireless transmission module 20, and the wireless transmission module 20 is in wireless connection with the monitoring mobile phone, so that remote monitoring of the construction site environment detector and acquisition of environment parameter data are realized, and the safety of the construction site environment is ensured; the monitoring mobile phone can conveniently monitor a plurality of construction site environment detectors through the wireless transmission module 20, so that a plurality of construction sites can be managed conveniently, and the system is convenient to use, low in cost and high in safety factor.
The above, only be the utility model discloses a preferred embodiment, it is not right the utility model discloses do any restriction, all according to the utility model discloses the technical entity all still belongs to any simple modification, change and the equivalent structure change of doing above embodiment the utility model discloses technical scheme's within the scope of protection.

Claims (10)

1. The utility model provides a job site environment detector which characterized in that: comprises a shell (1), a liquid crystal display screen (2) arranged on one side of the outside of the shell (1) and used for displaying detection information, and an alarm (12) for real-time alarming, the top outer side of the shell (1) is provided with a wind speed sensor (5), the bottom edge of the shell (1) is provided with a vertical column (3), an electronic circuit board (9) and a lithium battery (22) are arranged in the shell (1), a microcontroller (15), a power module (18), a sensor group connected with the microcontroller (15) and a wireless transmission module (20) are integrated on the electronic circuit board (9), the sensor group comprises an ambient temperature sensor (10), an ambient humidity sensor (11), a harmful gas sensor (13) and a smoke sensor (14), and a PM2.5 sensor (16), a noise sensor (17), a vibration sensor (19) and a digital output type biaxial inclination angle sensor (21); the output of ambient temperature sensor (10), ambient humidity sensor (11), harmful gas sensor (13), smoke transducer (14), air velocity transducer (5), PM2.5 sensor (16), noise sensor (17), vibration sensor (19) and digital output type biax angular transducer (21) all meets with the input of microcontroller (15), be provided with solar cell panel (4) on casing (1), the output of solar cell panel (4) and the output of lithium cell (22) meet with power module (18), microcontroller (15) are STM32F103VET6 microcontroller.
2. The construction site environment detecting instrument according to claim 1, wherein: the environment temperature sensor (10) comprises a PT100 temperature sensor P9 and a temperature signal amplifying circuit connected with the output end of the PT100 temperature sensor, the temperature signal amplifying circuit comprises an operational amplifier U5 with the model number of LM358, a No. 3 pin of the operational amplifier U5 is divided into two paths, one path is grounded through a capacitor C21, and the other path is connected with one end of a resistor R23; the 4 th pin of the operational amplifier U5 is grounded; the 5 th pin of the operational amplifier U5 is divided into two paths, one path is grounded through a resistor R26, and the other path is connected with the output end of a 3.3V power supply through a resistor R20; the 6 th pin of the operational amplifier U5 is divided into two paths, one path is connected with one end of a resistor R24, and the other path is connected with one end of a resistor R18; the 7 th pin of the operational amplifier U5 is divided into two paths, one path is connected with the other end of the resistor R23, and the other path is connected with the other end of the resistor R18; the 8-pin of the operational amplifier U5 is connected with a 3.3V power supply output end, the other end of the resistor R24 is divided into two paths, one path is grounded through the resistor R28 and the resistor R27 which are connected in series, the other path is connected with the output end of a PT100 temperature sensor P9, and the connecting end of the 1 st pin and the 2 nd pin of the operational amplifier U5 is connected with a PC2 pin of a microcontroller (15).
3. The construction site environment detecting instrument according to claim 1 or 2, wherein: the environment humidity sensor (11) is an HM1500 humidity sensor, and the output end of the environment humidity sensor (11) is connected with a PC1 pin of the microcontroller (15);
the harmful gas sensor (13) is an MQ135 gas sensor P13, a VCC pin of the MQ135 gas sensor P13 is connected with a 5V power supply output end, a GND pin of the MQ135 gas sensor P13 is grounded, a DO pin of the MQ135 gas sensor P13 is divided into two paths, one path is connected with the 5V power supply output end through a resistor R34, and the other path is connected with a drain electrode of a MOS field effect transistor Q2; the source electrode of the MOS field effect transistor Q2 is divided into two paths, one path is connected with one end of a resistor R35, and the other path is connected with a PE15 pin of the microcontroller (15); the grid of the MOS field effect transistor Q2 is connected with one end of a resistor R32, the connection end of the other end of the resistor R32 and the other end of the resistor R35 is connected with a 3.3V power output end, and the AO pin of the MQ135 gas sensor P13 is connected with the PB1 pin of the microcontroller (15).
4. The construction site environment detecting instrument according to claim 1 or 2, wherein: the smoke sensor (14) is an MQ2 smoke sensor P7, a VCC pin of the MQ2 smoke sensor P7 is connected with a 5V power supply output end, a GND pin of the MQ2 smoke sensor P7 is grounded, a DO pin of the MQ2 smoke sensor P7 is divided into two paths, one path is connected with the 5V power supply output end through a resistor R21, and the other path is connected with a drain electrode of a MOS field effect transistor Q1; the source electrode of the MOS field effect transistor Q1 is divided into two paths, one path is connected with one end of a resistor R22, and the other path is connected with a PD0 pin of the microcontroller (15); the grid of the MOS field effect transistor Q1 is connected with one end of a resistor R19, the connection end of the other end of the resistor R19 and the other end of the resistor R22 is connected with a 3.3V power output end, and the AO pin of the MQ2 smoke sensor P7 is connected with the PB0 pin of the microcontroller (15).
5. The construction site environment detecting instrument according to claim 1 or 2, wherein: the PM2.5 sensor (16) is a GP2Y1014AU0F dust sensor P14, a Vled pin of the GP2Y1014AU0F dust sensor P14 is divided into two paths, one path is connected with a 5V power supply output end through a resistor R52, and the other path is grounded through a capacitor C51; the LED-GND pin of the GP2Y1014AU0F dust sensor P14 is grounded with the S-GND pin of the GP2Y1014AU0F dust sensor P14, the LED pin of the GP2Y1014AU0F dust sensor P14 is connected with the collector of a triode Q6, the base of the triode Q6 is divided into two paths, one path is connected with the PE14 pin of a microcontroller (15) through a resistor R59, and the other path is grounded through a resistor R61; the emitting electrode of the triode Q6 is grounded, the VO pin of the GP2Y1014AU0F dust sensor P14 is connected with the PA7 pin of the microcontroller (15), and the VCC pin of the GP2Y1014AU0F dust sensor P14 is connected with the 5V power output end.
6. The construction site environment detecting instrument according to claim 1 or 2, wherein: the noise sensor (17) comprises a BYZ-08 noise sensor P3 and a communication chip U4 with the model number of SP485EEN-L/TR, a GND pin of the BYZ-08 noise sensor P3 is grounded, a V + pin of the BYZ-08 noise sensor P3 is connected with a 5V power output end, a B/R pin of the BYZ-08 noise sensor P3 is divided into three paths, one path is connected with one end of a resistor R9, the other path is grounded through a resistor R7, and the third path is connected with a7 th pin of the communication chip U4; the A/T pin of the BYZ-08 noise sensor P3 is divided into three paths, one path is connected with the other end of the resistor R9, the other path is connected with the 3.3V power output end through the resistor R15, and the third path is connected with the 6 th pin of the communication chip U4; the 1 st pin of communication chip U4 meets with microcontroller (15) PC10 pin, the 2 nd pin of communication chip U4 with the link of the 3 rd pin of communication chip U4 meets with microcontroller (15) PE0 pin, the 4 th pin of communication chip U4 meets with microcontroller (15) PC11 pin, the 5 th pin ground connection of communication chip U4, the 8 th pin of communication chip U4 divides two the tunnel, and one tunnel connects 3.3V power output end, and another tunnel is through electric capacity C17 ground connection.
7. The construction site environment detecting instrument according to claim 1 or 2, wherein: the vibration sensor (19) comprises an SZ-6B vibration sensor P17 and a vibration signal amplifying circuit, the vibration signal amplifying circuit comprises an operational amplifier U12 with the model number of LM358, the output end of the SZ-6B vibration sensor P17 is connected with one end of a resistor R60, a No. 2 pin of the operational amplifier U12 is divided into two paths, one path is connected with one end of a resistor R55, and the other path is connected with one end of a capacitor C52; the 1 st pin of the operational amplifier U12 is divided into four paths, one path is connected with the other end of a resistor R55, the other path is connected with the other end of a capacitor C52, the third path is grounded through a resistor R54, and the fourth path is connected with one end of a resistor R53; the other end of the resistor R53 is divided into two paths, one path is grounded through a resistor R58, and the other path is connected with a PC5 pin of the microcontroller (15); the 3 rd pin of the operational amplifier U12 is divided into two paths, one path is connected with the other end of the resistor R60, and the other path is grounded through the capacitor C57; the 8 th pin of the operational amplifier U12 is divided into two paths, one path is connected with the output end of a 3.3V power supply, and the other path is grounded through a capacitor C53.
8. The construction site environment detecting instrument according to claim 1 or 2, wherein: the digital output type double-shaft inclination angle sensor (21) comprises an LCA326T double-shaft inclination angle sensor P20 and a communication chip U1 with the model of MAX232ESE, wherein an RXD pin of the LCA326T double-shaft inclination angle sensor P20 is connected with a 13 th pin of the communication chip U1, a TXD pin of the LCA326T double-shaft inclination angle sensor P20 is connected with a 14 th pin of the communication chip U1, a GND pin of the LCA326T double-shaft inclination angle sensor P20 is grounded, a VCC pin of the LCA326T double-shaft inclination angle sensor P20 is connected with a 5V power supply output end, a1 st pin of the communication chip U1 is connected with a3 rd pin of the communication chip U1 through a capacitor C1, a 4 th pin of the communication chip U5 is connected with a 5 th pin of the communication chip U1 through a capacitor C8, a 11 th pin of the communication chip U1 is connected with a PA9 pin of a microcontroller (15), a 12 th pin 10) of the microcontroller U639, the 15 th pin of the communication chip U1 is grounded, the 6 th pin of the communication chip U1 is grounded through a capacitor C12, the 16 th pin of the communication chip U1 is divided into two paths, one path is connected with the 3.3V power output end, and the other path is grounded through a capacitor C9; the 2 nd pin of the communication chip U1 is grounded through a capacitor C7;
the wind speed sensor (5) is a DP-FS485 wind speed sensor P1 and a communication chip U3 with the model number of SP485EEN-L/TR, a GND pin of the DP-FS485 wind speed sensor P1 is grounded, a VCC pin of the DP-FS485 wind speed sensor P1 is connected with a 12V power supply output end, a 485-B pin of the DP-FS485 wind speed sensor P1 is divided into three paths, one path is connected with one end of a resistor R8, the other path is grounded through a resistor R6, and the third path is connected with a7 th pin of the communication chip U3; the 485-A pin of the DP-FS485 wind speed sensor P1 is divided into three paths, one path is connected with the other end of the resistor R8, the other path is connected with the 3.3V power output end through the resistor R14, and the third path is connected with the 6 th pin of the communication chip U3; the 1 st pin of the communication chip U3 is connected with the PD6 pin of the microcontroller (15), the 2 nd pin of the communication chip U3 and the connecting end of the 3 rd pin of the communication chip U3 are connected with the PE1 pin of the microcontroller (15), the 4 th pin of the communication chip U3 is connected with the PD5 pin of the microcontroller (15), the 5 th pin of the communication chip U3 is grounded, the 8 th pin of the communication chip U3 is divided into two paths, one path is connected with the 3.3V power output end, and the other path is grounded through the capacitor C16.
9. The construction site environment detecting instrument according to claim 1 or 2, wherein: the wireless transmission module (20) comprises a chip USR-LTE-7S4, a SIM card P18 and an A-type USB interface P16, wherein the 3 rd pin of the chip USR-LTE-7S4 is divided into two paths, one path is connected with one end of a resistor R57, and the other path is connected with the cathode of a voltage stabilizing tube D4; the 4 th pin of the chip USR-LTE-7S4 is divided into two paths, one path is connected with one end of a resistor R56, and the other path is connected with the cathode of a voltage regulator tube D5; the anode of the voltage regulator tube D4 and the anode of the voltage regulator tube D5 are both grounded, the other end of the resistor R57 is connected with the D-pin of the type-A USB interface P16, the other end of the resistor R56 is connected with the D + pin of the type-A USB interface P16, the 6 th pin of the chip USR-LTE-7S4 is connected with the PD9 pin of the microcontroller (15), the 7 th pin of the chip USR-LTE-7S4 is connected with the PD8 pin of the microcontroller (15), the 9 th pin of the chip USR-LTE-7S4 is connected with one end of the resistor R46, the other end of the resistor R46 is connected with the base of the triode Q4, the emitter of the triode Q4 is grounded, the collector of the triode Q4 is connected with the cathode of the light emitting diode LED5, the anode of the light emitting diode LED5 is connected with the 3.8V power output end through the resistor R42, the first pin of the USR-LTE-7S4 is connected with the first pin 85R 43, the other end of the resistor R43 is divided into two paths, one path is connected with the output end of a 3.3V power supply, and the other path is connected with the collector of a triode Q5; the emitting electrode of the triode Q5 is grounded, the base electrode of the triode Q5 is divided into two paths, one path is connected with a PE13 pin of the microcontroller (15) through a resistor R47, and the other path is grounded through a resistor R51; the 11 th pin and the 12 th pin of the chip USR-LTE-7S4 are grounded, the 23 rd pin of the chip USR-LTE-7S4 is connected with the 3 rd pin of the SIM card P18, the 22 nd pin of the chip USR-LTE-7S4 is connected with the 5 th pin of the SIM card P18, the 21 st pin of the chip USR-LTE-7S4 is connected with the 6 th pin of the SIM card P18, the 1 st pin and the 4 th pin of the SIM card P18 are connected with a 1.8V power output end, the 16 th pin of the chip USR-LTE-7S4 is divided into two paths, one path is grounded through a capacitor C46, a capacitor C47 and a capacitor C48 which are connected in parallel, and the other path is connected with a 3.8V power output end; the 15 th pin of the chip USR-LTE-7S4 is connected with one end of a resistor R48, the other end of the resistor R48 is connected with the base electrode of a triode Q3, the emitting electrode of the triode Q3 is grounded, the collecting electrode of the triode Q3 is connected with the cathode of a light-emitting diode LED4, and the anode of the light-emitting diode LED4 is connected with the 3.8V power output end through the resistor R41.
10. The construction site environment detecting instrument according to claim 1 or 2, wherein: the power supply module (18) comprises a 12V to 5V voltage module (18-1), a 5V to 3.3V voltage module (18-2), a 5V to 3.8V voltage module (18-3) and a 5V to 1.8V voltage module (18-4);
the 12V-to-5V voltage module (18-1) comprises a chip LM596-5V, a1 st pin of the chip LM596-5V is divided into two paths, one path is connected with the output ends of the solar panel (4) and the lithium battery (22), and the other path is grounded through a capacitor C28, a capacitor C29 and a capacitor C30 which are connected in parallel; the No. 3 pin and the No. 5 pin of the chip LM596-5V are grounded, the No. 2 pin of the chip LM596-5V is divided into two paths, one path is connected with the cathode of a voltage regulator tube D3, and the other path is connected with one end of an inductor L2; the 4 th pin of the chip LM596-5V is divided into four paths, the first path is connected with the other end of the inductor L2, the second path is grounded through a capacitor C31 and a capacitor C32 which are connected in parallel, the third path is connected with one end of a resistor R33, and the fourth path is connected with one end of a resistor R31; the other end of the resistor R31 is a 5V power supply output end, the other end of the resistor R33 is connected with the anode of the light-emitting diode LED2, and the cathode of the light-emitting diode LED2 is grounded;
the 5V-to-3.3V voltage module (18-2) comprises a chip LM1117-3.3V, a1 st pin of the chip LM1117-3.3V is grounded, a3 rd pin of the chip LM1117-3.3V is divided into two paths, one path is connected with a 5V power output end, and the other path is grounded through a capacitor C36 and a capacitor C33 which are connected in parallel; the 2 nd pin of the chip LM1117-3.3V is divided into four paths, the first path is connected with the 4 th pin of the chip LM1117-3.3V, the second path is grounded through a capacitor C34 and a capacitor C37 which are connected in parallel, the third path is connected with one end of a resistor R37, and the fourth path is connected with one end of a resistor R36; the other end of the resistor R36 is a 3.3V power supply output end, the other end of the resistor R37 is connected with the anode of the light-emitting diode LED3, and the cathode of the light-emitting diode LED3 is grounded;
the 5V-to-3.8V voltage module (18-3) comprises a chip MP1482, a1 st pin of the chip MP1482 is connected with one end of a capacitor C35, a 2 nd pin of the chip MP1482 is divided into three paths, one path is connected with a 5V power supply output end, the other path is grounded through a capacitor C38, a capacitor C39 and a capacitor C40 which are connected in parallel, and the third path is connected with one end of a resistor R39; the 7 th pin of the chip MP1482 is connected with the other end of the resistor R39, the 8 th pin of the chip MP1482 is grounded through a capacitor C41, the 4 th pin of the chip MP1482 is grounded, the 6 th pin of the chip MP1482 is divided into two paths, one path is grounded through the resistor R49 and the capacitor C45 which are connected in series, and the other path is grounded through the capacitor C44; the 5 th pin of the chip MP1482 is divided into two paths, one path is grounded through a resistor R50, and the other path is connected with one end of a resistor R44; the 3 rd pin of the chip MP1482 is divided into two paths, one path is connected with the other end of the capacitor C35, and the other path is connected with one end of the inductor L3; the other end of the inductor L3 is divided into five paths, the first path is connected with the other end of the resistor R44, the second path is grounded through a capacitor C42, the third path is grounded through a capacitor C43, the fourth path is connected with one end of the resistor R45, and the fifth path is connected with one end of the resistor R40; the other end of the resistor R45 is connected with the anode of the light-emitting diode LED6, the other end of the resistor R40 is a 3.8V power output end, and the cathode of the light-emitting diode LED6 is grounded;
the 5V to 1.8V voltage module (18-4) comprises a chip LP5900SD-1.8, a pin 4 of the chip LP5900SD-1.8 is divided into two paths, one path is connected with a 5V power supply output end, and the other path is grounded through a capacitor C65; the 2 nd pin of the chip LP5900SD-1.8 is divided into two paths, one path is connected with the output end of a 3.3V power supply, and the other path is grounded through a resistor R65; the 1 st pin of the chip LP5900SD-1.8 is divided into two paths, one path is a 1.8V power supply output end, and the other path is grounded through a capacitor C66; the 3 rd pin of the chip LP5900SD-1.8 is grounded.
CN202020239162.1U 2020-03-02 2020-03-02 Construction site environment detector Active CN212302242U (en)

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CN202020239162.1U CN212302242U (en) 2020-03-02 2020-03-02 Construction site environment detector

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CN202020239162.1U CN212302242U (en) 2020-03-02 2020-03-02 Construction site environment detector

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CN212302242U true CN212302242U (en) 2021-01-05

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