CN212277183U - Composite heat conducting gasket and chip heat dissipation device - Google Patents

Abstract

The utility model discloses a compound heat conduction gasket and chip heat abstractor, including box, driving motor and flabellum, the inside of box is provided with driving motor, one side of box is provided with dustproof construction, one side of box is provided with dismantles the structure. The utility model discloses a dustproof filter screen has been set gradually to inside that is provided with dustproof construction, the thread groove, fixed frame, fixing bolt, fixation nut, slot and card strip, the inside of slot is all inserted with the card strip on the fixed frame at both ends earlier after installing the device, and promote fixed frame to the centre, fixed frame about making merges, at this moment put into the inside of thread groove with fixing bolt again, and rotate downwards, twist fixation nut from the below after passing the thread groove of lower part, screw up back and fixing bolt with fixation nut and fix the thread groove from top to bottom, the monolithic stationary has been realized, the dustproof filter screen of fixed frame one side is dustproof to inside, realized can the dismouting dustproof.

Description

Composite heat conducting gasket and chip heat dissipation device

Technical Field

The utility model relates to a chip heat dissipation technical field specifically is a compound heat conduction gasket and chip heat abstractor.

Background

The operation center of a computer is also the most important processing mechanism, namely CPU, when a chip of the computer is used, the working efficiency of the processing mechanism determines the operation speed of the whole computer, so that the work of radiating the chip and improving the working efficiency of the chip is very important work, and the existing chip radiating device has some defects to be improved when in use.

In the process of implementing the present invention, the inventor finds that at least the following problems exist in the prior art and are not solved:

(1) in the conventional chip heat dissipation device, dust enters the interior of the device during operation, and the dust affects the service life of the device;

(2) in the traditional chip heat dissipation device, the fan blades of the traditional chip heat dissipation device cannot be detached in fixed connection, and is very troublesome when needing to be replaced or cleaned;

(3) the traditional chip heat dissipation device has poor heat conductivity, and cannot quickly conduct heat in a chip, so that the heat dissipation is slow.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a compound heat conduction gasket and chip heat abstractor to propose in solving above-mentioned background art and do not possess the dirt resistance, the unable dismantlement of flabellum and the slow problem of heat conduction.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a compound heat conduction gasket and chip heat abstractor, includes box, driving motor and flabellum, the inside of box is provided with driving motor, one side of box is provided with dustproof construction, one side of box is provided with dismantles the structure, it runs through one side and the driving motor fixed connection of box to dismantle the structure, dismantle one side fixedly connected with flabellum of structure, the equal fixedly connected with conducting strip structure in both ends of box.

Preferably, dustproof filter screen, thread groove, fixed frame, fixing bolt, fixation nut, slot and card strip have set gradually in dustproof construction's inside, the slot is inlayed in box both ends with the symmetric position department of one side, the equal swing joint in inside at slot both ends has the card strip, the fixed frame of one side fixedly connected with of card strip, the dustproof filter screen of one end fixedly connected with of fixed frame.

Preferably, one side of the fixing frame is fixedly connected with a thread groove, and a fixing bolt is movably connected inside the thread groove.

Preferably, the inside of dismantling the structure has set gradually connecting rod, spacing groove, sleeve, siphunculus, reset spring and location fixture block, connecting rod fixed connection is in one side of flabellum, the inside one side of connecting rod is provided with the siphunculus, the inside of siphunculus is provided with reset spring, the equal fixedly connected with location fixture block in reset spring's both ends, location fixture block and siphunculus swing joint.

Preferably, sleeve fixed connection is in one side of driving motor, the same one side at sleeve both ends is all inlayed and is had the spacing groove, spacing groove and positioning fixture block swing joint.

Preferably, the inside of conducting strip structure has set gradually bonding groove, viscidity heat conduction insulating layer, flat to heat-conducting layer and vertical heat-conducting layer, bonding groove fixed connection is at the both ends of box, the one end swing joint in bonding groove has viscidity heat conduction insulating layer, the one end fixedly connected with flat to heat-conducting layer of viscidity heat conduction insulating layer, the one end fixedly connected with vertical heat-conducting layer of flat to heat-conducting layer.

Compared with the prior art, the beneficial effects of the utility model are that: the composite heat conducting gasket and the chip heat radiating device not only realize the detachable dustproof structure, realize the detachable fan blades, but also realize the accelerated heat conduction;

(1) the dustproof filter screen, the thread groove, the fixing frame, the fixing bolt, the fixing nut, the inserting groove and the clamping strip are sequentially arranged in the dustproof structure, the clamping strips on the fixing frames at two ends are inserted into the inserting groove after the dustproof structure is installed, the fixing frame is pushed towards the middle, the upper fixing frame and the lower fixing frame are combined, the fixing bolt is placed into the thread groove and rotates downwards, the fixing nut is screwed in from the lower part after penetrating through the thread groove at the lower part, the upper thread groove and the lower thread groove are fixed by the fixing nut and the fixing bolt after the fixing nut is screwed down, the integral fixation is realized, the dustproof filter screen at one side of the fixing frame prevents dust in the inner part, and the dustproof function of disassembly and assembly is realized;

(2) the connecting rod, the limiting groove, the sleeve, the through pipe, the reset spring and the positioning fixture block are sequentially arranged in the dismounting structure, when the fan blade is mounted in the device, the positioning fixture blocks on the two sides of the through pipe are pressed to be retracted into the through pipe, then the connecting rod is inserted into the sleeve and pushed, when the positioning fixture blocks are aligned with the limiting groove, the reset spring pushes the positioning fixture blocks to reset and be clamped with the limiting groove to form fixation, when the positioning fixture blocks are dismounted, the connecting rod is taken out after the positioning fixture blocks are pressed, and the fan blade can be dismounted and cleaned and replaced;

(3) through set gradually the bonding groove in the inside at the conducting strip structure, viscidity heat conduction insulating layer, flat to heat-conducting layer and vertical heat-conducting layer, after the device installation, the inside heat of chip passes through vertical heat-conducting layer earlier and passes through flat to heat-conducting layer again, vertical heat-conducting layer and flat heat-conducting layer are the heat conduction material by force, viscidity heat conduction insulating layer is for both can heat conduction can also prevent inside electric leakage and improve the security, again by the flabellum discharge after the leading-in box of heat, realize improving the heat conduction radiating efficiency of device.

Drawings

Fig. 1 is a schematic front view of a cross-sectional structure of the present invention;

FIG. 2 is a schematic view of the top view of the dustproof structure of the present invention;

fig. 3 is an enlarged schematic structural view of a point a in fig. 1 according to the present invention;

fig. 4 is a schematic side view of the present invention.

In the figure: 1. a box body; 2. a drive motor; 3. a dust-proof structure; 301. a dustproof filter screen; 302. a thread groove; 303. a fixing frame; 304. fixing the bolt; 305. fixing a nut; 306. a slot; 307. clamping the strip; 4. disassembling the structure; 401. a connecting rod; 402. a limiting groove; 403. a sleeve; 404. pipe passing; 405. a return spring; 406. positioning a fixture block; 5. a fan blade; 6. a thermally conductive sheet structure; 601. an adhesive groove; 602. a viscous thermally conductive insulating layer; 603. a flat heat conducting layer; 604. a vertical heat conducting layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides an embodiment: a composite heat conducting gasket and chip heat dissipation device comprises a box body 1, a driving motor 2 and fan blades 5, wherein the driving motor 2 is arranged inside the box body 1, the model of the driving motor 2 is 50KTYZ, and a dustproof structure 3 is arranged on one side of the box body 1;

the dustproof structure 3 is internally provided with a dustproof filter screen 301, a thread groove 302, a fixing frame 303, a fixing bolt 304, a fixing nut 305, a slot 306 and a clamping strip 307 in sequence, the slot 306 is embedded at the symmetrical positions of the same side of the two ends of the box body 1, the clamping strip 307 is movably connected inside the two ends of the slot 306, the fixing frame 303 is fixedly connected to one side of the clamping strip 307, and one end of the fixing frame 303 is fixedly connected with the dustproof filter screen 301;

one side of the fixed frame 303 is fixedly connected with a thread groove 302, and the inside of the thread groove 302 is movably connected with a fixed bolt 304;

specifically, as shown in fig. 1, 2 and 4, when using the mechanism, first, after installing the device, the clamping strips 307 on the fixing frames 303 at both ends are inserted into the inside of the slots 306, and the fixing frames 303 are pushed toward the middle to merge the upper and lower fixing frames 303, at this time, the fixing bolts 304 are put into the inside of the thread grooves 302 and rotated downward, the fixing nuts 305 are screwed in from below after passing through the thread grooves 302 at the lower part, the fixing nuts 305 are screwed in and fixed to the upper and lower thread grooves 302 by the fixing bolts 304, so that the integral fixation is realized, and the dustproof filter screen 301 at one side of the fixing frame 303 prevents dust from the inside, so that the detachable dust is realized;

a dismounting structure 4 is arranged on one side of the box body 1;

a connecting rod 401, a limiting groove 402, a sleeve 403, a through pipe 404, a return spring 405 and a positioning fixture block 406 are sequentially arranged in the dismounting structure 4, the connecting rod 401 is fixedly connected to one side of the fan blade 5, the through pipe 404 is arranged on one side in the connecting rod 401, the return spring 405 is arranged in the through pipe 404, the positioning fixture block 406 is fixedly connected to both ends of the return spring 405, and the positioning fixture block 406 is movably connected with the through pipe 404;

the sleeve 403 is fixedly connected to one side of the driving motor 2, the limiting grooves 402 are embedded in the same side of the two ends of the sleeve 403, and the limiting grooves 402 are movably connected with the positioning fixture blocks 406;

specifically, as shown in fig. 1 and 3, when the mechanism is used, firstly, when the fan blade 5 is installed in the device, the positioning fixture blocks 406 on two sides of the through pipe 404 are pressed to retract into the through pipe 404, then the connecting rod 401 is inserted into the sleeve 403 and pushed, when the positioning fixture blocks 406 are aligned with the limiting groove 402, the return spring 405 pushes the positioning fixture blocks 406 to return and to be fastened with the limiting groove 402 to form a fixed state, when the positioning fixture blocks 406 are pressed during disassembly, the connecting rod 401 is taken out to be disassembled, and the fan blade 5 can be disassembled, cleaned and replaced;

the disassembly structure 4 penetrates through one side of the box body 1 and is fixedly connected with the driving motor 2, one side of the disassembly structure 4 is fixedly connected with a fan blade 5, and two ends of the box body 1 are fixedly connected with heat conducting fin structures 6;

an adhesive groove 601, an adhesive heat conduction insulating layer 602, a horizontal heat conduction layer 603 and a vertical heat conduction layer 604 are sequentially arranged in the heat conducting fin structure 6, the adhesive groove 601 is fixedly connected to two ends of the box body 1, one end of the adhesive groove 601 is movably connected with the adhesive heat conduction insulating layer 602, one end of the adhesive heat conduction insulating layer 602 is fixedly connected with the horizontal heat conduction layer 603, and one end of the horizontal heat conduction layer 603 is fixedly connected with the vertical heat conduction layer 604;

specifically, as shown in fig. 1, when the mechanism is used, firstly, after the device is installed, heat inside the chip firstly passes through the vertical heat conduction layer 604 and then passes through the horizontal heat conduction layer 603, the vertical heat conduction layer 604 and the horizontal heat conduction layer 603 are both strong heat conduction materials, the viscous heat conduction insulation layer 602 can conduct heat and can prevent internal electric leakage, safety is improved, and heat is discharged from the fan blades 5 after being conducted into the box body 1, so that heat conduction and heat dissipation efficiency of the device is improved.

The working principle is as follows: the utility model discloses when using, at first, insert the inside of slot 306 with the card strip 307 on the fixed frame 303 at both ends earlier behind the installation the device, and to the fixed frame 303 of centre promotion, make the fixed frame 303 about the messenger merge, at this moment put into the inside of thread groove 302 with fixing bolt 304 again, and rotate downwards, twist fixation nut 305 from the below after passing the thread groove 302 of lower part, screw up fixation nut 305 after and fixing bolt 304 fixes thread groove 302 from top to bottom, the monolithic stationary has been realized, dustproof filter screen 301 of fixed frame 303 one side is dustproof to inside, realized can the dismouting dustproof.

Afterwards, when the device is used for installing the fan blade 5, the positioning clamping blocks 406 on the two sides of the through pipe 404 are pressed to be retracted into the through pipe 404, the connecting rod 401 is inserted into the sleeve 403 and pushed, when the positioning clamping blocks 406 are aligned with the limiting groove 402, the reset spring 405 pushes the positioning clamping blocks 406 to reset and be clamped with the limiting groove 402 to form fixation, when the positioning clamping blocks 406 are pressed during disassembly, the connecting rod 401 is taken out, and the fan blade 5 can be disassembled, cleaned and replaced.

Finally, after the device is installed, heat inside the chip firstly passes through the vertical heat conduction layer 604 and then passes through the flat heat conduction layer 603, the vertical heat conduction layer 604 and the flat heat conduction layer 603 are both strong heat conduction materials, the viscous heat conduction insulation layer 602 can conduct heat and can prevent internal electric leakage, safety is improved, the heat is discharged by the fan blades 5 after being guided into the box body 1, and heat conduction and heat dissipation efficiency of the device is improved.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (6)

1. The utility model provides a compound heat conduction gasket and chip heat abstractor, includes box (1), driving motor (2) and flabellum (5), its characterized in that: the inside of box (1) is provided with driving motor (2), one side of box (1) is provided with dustproof construction (3), one side of box (1) is provided with dismantlement structure (4), dismantle one side and driving motor (2) fixed connection that structure (4) run through box (1), dismantle one side fixedly connected with flabellum (5) of structure (4), the equal fixedly connected with conducting strip structure (6) in both ends of box (1).

2. The composite thermal pad and chip heat sink of claim 1, wherein: dustproof filter screen (301), thread groove (302), fixed frame (303), fixing bolt (304), fixation nut (305), slot (306) and card strip (307) have been set gradually to the inside of dustproof construction (3), slot (306) are inlayed in box (1) both ends with the symmetric position department of one side, the equal swing joint in inside at slot (306) both ends has card strip (307), fixed frame (303) of one side fixedly connected with of card strip (307), the dustproof filter screen (301) of one end fixedly connected with of fixed frame (303).

3. The composite thermal pad and chip heat sink of claim 2, wherein: one side of the fixing frame (303) is fixedly connected with a thread groove (302), and a fixing bolt (304) is movably connected inside the thread groove (302).

4. The composite thermal pad and chip heat sink of claim 1, wherein: dismantle the inside of structure (4) and set gradually connecting rod (401), spacing groove (402), sleeve (403), siphunculus (404), reset spring (405) and location fixture block (406), connecting rod (401) fixed connection is in one side of flabellum (5), the inside one side of connecting rod (401) is provided with siphunculus (404), the inside of siphunculus (404) is provided with reset spring (405), the equal fixedly connected with location fixture block (406) in both ends of reset spring (405), location fixture block (406) and siphunculus (404) swing joint.

5. The composite thermal pad and chip heat sink of claim 4, wherein: sleeve (403) fixed connection is in one side of driving motor (2), the same one side at sleeve (403) both ends all inlays and has spacing groove (402), spacing groove (402) and location fixture block (406) swing joint.

6. The composite thermal pad and chip heat sink of claim 1, wherein: the inside of conducting strip structure (6) has set gradually bonding groove (601), viscidity heat conduction insulating layer (602), tie to heat conduction layer (603) and vertical heat conduction layer (604), bonding groove (601) fixed connection is at the both ends of box (1), the one end swing joint of bonding groove (601) has viscidity heat conduction insulating layer (602), the one end fixedly connected with of viscidity heat conduction insulating layer (602) is tie to heat conduction layer (603), the one end fixedly connected with vertical heat conduction layer (604) of tie to heat conduction layer (603).

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