CN212259683U - Computer lab rack heat abstractor - Google Patents
Computer lab rack heat abstractor Download PDFInfo
- Publication number
- CN212259683U CN212259683U CN202021400804.8U CN202021400804U CN212259683U CN 212259683 U CN212259683 U CN 212259683U CN 202021400804 U CN202021400804 U CN 202021400804U CN 212259683 U CN212259683 U CN 212259683U
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- Prior art keywords
- wall
- water
- cabinet
- cooling
- heat dissipation
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- 238000001816 cooling Methods 0.000 claims abstract description 65
- 230000017525 heat dissipation Effects 0.000 claims abstract description 42
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 39
- 239000007788 liquid Substances 0.000 claims description 19
- 239000004065 semiconductor Substances 0.000 claims description 9
- 238000005086 pumping Methods 0.000 claims description 7
- 238000000605 extraction Methods 0.000 claims description 2
- 238000013508 migration Methods 0.000 abstract description 2
- 230000005012 migration Effects 0.000 abstract description 2
- 241001233242 Lontra Species 0.000 abstract 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a computer lab rack heat abstractor, which comprises a base, the top outer wall fixedly connected with rack of base, one side outer wall of rack passes through hinge fixedly connected with cabinet door, the top outer wall middle part of rack is equipped with the convection current otter board, and the top inner wall middle part fixedly connected with of rack goes up the draught fan, the inner wall fixedly connected with backplate of rack, and the outer wall equidistance parallel distribution of backplate has the cutting, the outer wall fixedly connected with water-cooling board of backplate, and the tip wall connection of water-cooling board has the water-cooling connecting pipe. The utility model discloses combine water-cooling, forced air cooling and the multiple radiating mode of water-cooling forced air cooling for heat exchange between rack and the external world, through the contact of U type heat dissipation water-cooling pipe between water-cooling and the forced air cooling, mutual assistance between the two, when one of them is higher, another then is auxiliary structure, guarantees heat migration between the two and exchanges rapider, improves holistic temperature drop efficiency.
Description
Technical Field
The utility model relates to a computer lab rack heat dissipation technical field especially relates to a computer lab rack heat abstractor.
Background
The machine room now refers to a computer learning room; in the IT industry, a machine room generally refers to a place where a server is stored to provide IT services for users and employees, such as telecommunications, internet communications, mobile, two-wire, power, and government or enterprise.
Can have a lot of cabinets to arrange in current computer lab for place equipment such as server, but concentrate and placed the rack after, the cabinet heat dissipation is not enough in the computer lab, makes the heat of rack can't discharge, causes a lot of equipment efficiency to reduce, and the condition such as equipment overload operation appears.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a heat dissipation device of a machine room cabinet.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a machine room cabinet heat dissipation device comprises a base, wherein a cabinet is fixedly connected to the outer wall of the top of the base, a cabinet door is fixedly connected to the outer wall of one side of the cabinet through a hinge, a convection net plate is arranged in the middle of the outer wall of the top of the cabinet, an upper pumping fan is fixedly connected to the middle of the inner wall of the top of the cabinet, a back plate is fixedly connected to the inner wall of the cabinet, inserting strips are distributed on the outer wall of the back plate in parallel at equal intervals, a water cooling plate is fixedly connected to the outer wall of the back plate, a water cooling connecting pipe is connected to the outer wall of the end portion of the water cooling plate, a liquid tank is connected to the other end of the water cooling connecting pipe, a U-shaped heat dissipation water cooling pipe is arranged on the outer wall of the top end of the liquid tank, a water pump is arranged on, the other end of the exhaust pipe is connected with a fan, the inner wall of the U-shaped heat dissipation water-cooling pipe is clamped on the outer wall of the exhaust pipe, and the inner wall of the bottom end of the cabinet is provided with a lower convection fan.
As a further scheme of the utility model, the both sides outer wall bottom of rack all is equipped with the radiating groove, and the inner wall joint of radiating groove has the filter screen.
As a further aspect of the present invention, the inner wall of the liquid tank is provided with a distribution valve, and the other side of the distribution valve is connected to the water-cooling connection pipe through a pipe.
As a further scheme of the utility model, one side inner wall of liquid case is equipped with the semiconductor radiator, and the opposite side inner wall of liquid case is equipped with temperature sensor, temperature sensor's signal end is connected between signal line and the semiconductor radiator.
As a further proposal of the utility model, the outer wall of one side of the distribution valve is connected with a circulating pipe in a butt-clamping way, and the other end of the circulating pipe is connected with the pipeline of the water pump.
As a further scheme of the utility model, go up pumping fan, water pump, fan, lower convection fan, distributing valve and semiconductor radiator and all be connected with the switch, and the switch is connected with the PLC controller through the wire.
As a further proposal, the utility model also comprises a spiral water-cooling tube, the inner wall of the spiral water-cooling tube is sleeved on the outer wall of the exhaust pipe, and the bottom outer wall of the spiral water-cooling tube is connected with the end part of the distribution valve.
The utility model has the advantages that:
1. the heat dissipation device of the machine room cabinet combines a plurality of heat dissipation modes of water cooling, air cooling and water cooling and air cooling, accelerates heat exchange between the cabinet and the outside, ensures that heat dissipation in the cabinet is accelerated, reduces accumulation of heat in the cabinet body, and enables internal equipment to operate at a better working temperature;
2. the air cooling in the heat dissipation device of the machine room cabinet is convected from bottom to top, meanwhile, the middle part of the heat dissipation device pumps the flow to form a T-shaped heat dissipation structure, and the wind power is carried away from the top and the middle part of the heat dissipation device, so that the smooth circulation of the gas in the cabinet body is ensured, and the heat dissipation device has good ventilation;
3. the heat dissipation device of the machine room cabinet is water-cooled, and a water cooling plate on the back plate circularly dissipates heat through a liquid tank and a water pump to be attached to operating equipment in the machine room, so that the full exchange between the equipment temperature and heat of a water cooling pipe is ensured, and the heat exchange efficiency is improved;
4. water cooling and air cooling are connected through U type heat dissipation water-cooling pipe in this computer lab rack heat abstractor, mutually assist between the two, and when one of them was higher, another item was then auxiliary structure, guaranteed that heat migration and exchange between the two are rapider, improved holistic temperature drop efficiency.
Drawings
Fig. 1 is a schematic perspective view of a heat dissipation device of a machine room cabinet according to an embodiment 1 of the present invention;
fig. 2 is a schematic front view of a heat dissipation device of a machine room cabinet according to an embodiment 1 of the present invention;
fig. 3 is a schematic sectional view of a liquid tank of a heat dissipation device of a machine room cabinet according to embodiment 1 of the present invention;
fig. 4 is a schematic perspective view of a heat dissipation device of a machine room cabinet according to an embodiment 2 of the present invention.
In the figure: the heat dissipation device comprises a base 1, a cabinet 2, a heat dissipation groove 3, a water cooling connecting pipe 4, a water pump 5, a liquid tank 6, a fan 7, a heat dissipation water cooling pipe 8U-shaped, an air exhaust pipe 9, a convection net plate 10, a cabinet door 11, an upper convection fan 12, a cutting 13, a water cooling plate 14, a lower convection fan 15, a temperature sensor 16, a circulating pipe 17, a distribution valve 18 and a spiral water cooling pipe 19.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Example 1
Referring to fig. 1-3, a heat dissipation device for machine room cabinets, comprising a base 1, a cabinet 2 fixedly connected to the top outer wall of the base 1, a cabinet door 11 fixedly connected to one side outer wall of the cabinet 2 through a hinge, a convection net plate 10 arranged in the middle of the top outer wall of the cabinet 2, an upper pumping fan 12 fixedly connected to the middle of the top inner wall of the cabinet 2, a back plate fixedly connected to the inner wall of the cabinet 2, and a plurality of insertion strips 13 distributed in parallel and equidistantly on the outer wall of the back plate, a water cooling plate 14 fixedly connected to the outer wall of the back plate, a water cooling connection pipe 4 connected to the outer wall of the end of the water cooling plate 14, a liquid tank 6 connected to the other end of the water cooling connection pipe 4, a U-shaped heat dissipation water cooling pipe 8 arranged on the top outer wall of the liquid tank 6, a water pump 5 arranged on the other side, the other end of the air pipe is connected with an exhaust pipe 9, the other end of the exhaust pipe 9 is connected with a fan 7, the inner wall of a U-shaped heat-dissipation water-cooling pipe 8 is clamped on the outer wall of the exhaust pipe 9, the inner wall of the bottom end of the cabinet 2 is provided with a lower convection fan 15, the bottom ends of the outer walls of the two sides of the cabinet 2 are respectively provided with a heat dissipation groove 3, the inner wall of the heat dissipation groove 3 is clamped with a filter screen, the inner wall of the liquid tank 6 is provided with a distribution valve 18, the other side of the distribution valve 18 is connected with the water-cooling connecting pipe 4 through a pipeline, one side of the inner wall of the liquid tank 6 is provided with a semiconductor radiator, the other side of the liquid tank 6 is provided with a temperature sensor 16, the signal end of the temperature sensor 16 is connected with the semiconductor radiator through a signal wire, one side of the outer wall of the, The lower convection fan 15, the distribution valve 18 and the semiconductor radiator are all connected with switches, and the switches are connected with a PLC controller through leads.
The working principle of the embodiment is as follows: when the heat dissipation device of the machine room cabinet works, the heat of the inner wall of the whole cabinet body is taken away from the lower part to the upper part by the lower convection fan 15 and the upper pumping fan 12, meanwhile, the middle part pumps out partial hot air through the pumping pipe 9, the water cooling plate 14 of the equipment laminating of the insert 13 fixed connection on the back plate in the inner part circularly dissipates heat, the heat between the equipment temperature and the water cooling pipe is fully exchanged, the water cooling and the air cooling are connected through the U-shaped heat dissipation water cooling pipe 8, the water cooling and the air cooling are mutually assisted, when any one of the water cooling and the air cooling is higher, the other one is an auxiliary structure, the heat transfer and exchange between the water cooling and the air cooling are more rapid, and the.
Example 2
Referring to fig. 4, a heat dissipation apparatus for a machine room cabinet, which is different from embodiment 1, mainly includes a spiral water-cooling tube 19, an inner wall of the spiral water-cooling tube 19 is sleeved on an outer wall of an air extraction pipe 9, and an outer wall of a bottom end of the spiral water-cooling tube 19 is connected to an end of a distribution valve 18.
The working principle of the embodiment is as follows: based on the working principle in embodiment 1, the structure of the U-shaped heat dissipation water-cooling pipe 8 is replaced by a spiral water-cooling pipe 19 which is sleeved on the outer wall of the exhaust pipe 9, so that the heat exchange area is enlarged, and the heat exchange efficiency is improved.
In the description of the present invention, it is to be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top", "inner", "front", "center", "both ends", "first", "second", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (7)
1. A machine room cabinet heat dissipation device comprises a base (1) and is characterized in that the top outer wall of the base (1) is fixedly connected with a cabinet (2), the outer wall of one side of the cabinet (2) is fixedly connected with a cabinet door (11) through a hinge, the middle of the top outer wall of the cabinet (2) is provided with a convection net plate (10), the middle of the top inner wall of the cabinet (2) is fixedly connected with an upper pumping fan (12), the inner wall of the cabinet (2) is fixedly connected with a back plate, inserting strips (13) are distributed on the outer wall of the back plate in parallel at equal intervals, the outer wall of the back plate is fixedly connected with a water cooling plate (14), the outer wall of the end part of the water cooling plate (14) is connected with a water cooling connecting pipe (4), the other end of the water cooling connecting pipe (4) is connected with a liquid tank (6), the outer wall of the top end of the liquid tank (6), and the output of water pump (5) is connected through the inner wall of pipeline and liquid case (6), the inner wall equidistance parallel arrangement tuber pipe of backplate, and the other end of tuber pipe is connected with exhaust column (9), the other end of exhaust column (9) is connected with fan (7), and the inner wall joint of U type heat dissipation water-cooling pipe (8) is on the outer wall of exhaust column (9), the bottom inner wall of rack (2) is equipped with down convection current fan (15).
2. The heat dissipation device of the machine room cabinet as claimed in claim 1, wherein the bottom ends of the outer walls of the two sides of the machine cabinet (2) are respectively provided with a heat dissipation groove (3), and the inner wall of the heat dissipation groove (3) is clamped with a filter screen.
3. The heat sink of machine room cabinet as claimed in claim 1, wherein the inner wall of the liquid tank (6) is provided with a distribution valve (18), and the other side of the distribution valve (18) is connected with the water-cooled connecting pipe (4) through a pipeline.
4. The heat dissipation device of the machine room cabinet as claimed in claim 3, wherein a semiconductor heat sink is disposed on an inner wall of one side of the liquid tank (6), and a temperature sensor (16) is disposed on an inner wall of the other side of the liquid tank (6), and a signal end of the temperature sensor (16) is connected to the semiconductor heat sink through a signal line.
5. The heat dissipation device of machine room and cabinet as claimed in claim 3, wherein the circulation pipe (17) is connected to the outer wall of one side of the distribution valve (18) in a clamping manner, and the other end of the circulation pipe (17) is connected with the pipeline of the water pump (5).
6. The heat dissipation device of the machine room cabinet as claimed in claim 1, wherein the upper pumping fan (12), the water pump (5), the fan (7), the lower convection fan (15), the distribution valve (18) and the semiconductor heat sink are all connected with switches, and the switches are connected with a PLC controller through wires.
7. The heat dissipation device of the machine room cabinet as claimed in claim 1, further comprising a spiral water-cooling pipe (19), wherein the inner wall of the spiral water-cooling pipe (19) is sleeved on the outer wall of the air extraction pipe (9), and the outer wall of the bottom end of the spiral water-cooling pipe (19) is connected with the end of the distribution valve (18).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021400804.8U CN212259683U (en) | 2020-07-16 | 2020-07-16 | Computer lab rack heat abstractor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021400804.8U CN212259683U (en) | 2020-07-16 | 2020-07-16 | Computer lab rack heat abstractor |
Publications (1)
Publication Number | Publication Date |
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CN212259683U true CN212259683U (en) | 2020-12-29 |
Family
ID=73980154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202021400804.8U Active CN212259683U (en) | 2020-07-16 | 2020-07-16 | Computer lab rack heat abstractor |
Country Status (1)
Country | Link |
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CN (1) | CN212259683U (en) |
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2020
- 2020-07-16 CN CN202021400804.8U patent/CN212259683U/en active Active
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