CN212259664U

CN212259664U - Heat dissipation device, heat dissipation assembly and mobile platform

Info

Publication number: CN212259664U
Application number: CN202021236279.0U
Authority: CN
Inventors: 桑晓庆; 张雅文
Original assignee: SZ DJI Technology Co Ltd
Current assignee: SZ DJI Technology Co Ltd
Priority date: 2020-06-29
Filing date: 2020-06-29
Publication date: 2020-12-29
Anticipated expiration: 2030-06-29

Abstract

The application discloses a heat dissipation device. The heat dissipation device is used for dissipating heat of the first circuit board and comprises a first support, a second support and a heat dissipation piece. The first bracket is used for mounting a first circuit board; the second support is connected with the first support, and the plane where the second support is located is intersected with the plane where the first support is located; the heat dissipation member is connected with the second bracket, so that heat generated by the first circuit board can be dissipated through the heat dissipation member after passing through the first bracket and the second bracket in sequence. The application also discloses a heat dissipation assembly and a mobile platform. The first support and the second support are not in the same plane, so that the heat dissipation device can dissipate heat for elements arranged on at least two different planes, and the heat dissipation device is suitable for dissipating heat for equipment with more elements and a plurality of elements distributed on at least two different planes.

Description

Heat dissipation device, heat dissipation assembly and mobile platform

Technical Field

The application relates to the technical field of cooling and heat dissipation, in particular to a heat dissipation device, a heat dissipation assembly and a mobile platform.

Background

The inside device of current highly integrated unmanned aerial vehicle integrates gradually, and the protection is inside unmanned aerial vehicle, leads to the heat of device to concentrate and unable natural heat dissipation, need install the radiating part additional and initiatively dispel the heat. Simultaneously, the inside device of unmanned aerial vehicle is more complicated, has arranged at least one heating element on a plurality of planes the equipartition, and heating element on a plurality of planes probably generates heat simultaneously, and heating element's temperature is higher leads to damaging easily.

But present heat radiation structure can only transversely arrange or longitudinal arrangement, can only dispel the heat to the heating element that lies in on same plane, to this kind of existence a plurality of heating systems of unmanned aerial vehicle, and a plurality of systems arrange on a plurality of different planes in space, the unable better radiating effect that reaches of present heat radiation structure.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a heat dissipation device, a heat dissipation assembly and a mobile platform.

The heat dissipation device of the embodiment of the application is used for dissipating heat of a first circuit board and comprises a first support, a second support and a heat dissipation piece. The first bracket is used for mounting the first circuit board; the second support is connected with the first support, and the plane where the second support is located is intersected with the plane where the first support is located; the heat dissipation member is connected with the second support, so that heat generated by the first circuit board can be dissipated through the heat dissipation member after passing through the first support and the second support in sequence.

The heat dissipation device comprises a first support and a second support which are connected with each other, a heat dissipation piece is connected with the second support, heat generated by a circuit board installed on the first support can be dissipated through the heat dissipation piece after passing through the first support and the second support in sequence, the first support and the second support are not in the same plane, the heat dissipation device can dissipate heat for elements installed on at least two different planes, the heat dissipation device is suitable for being more in elements, and a plurality of elements are distributed on at least two different planes.

In some embodiments, the heat dissipation device is further configured to dissipate heat for a second circuit board; wherein the second bracket is used for mounting the second circuit board; or, the heat sink is used for mounting the second circuit board; or, the second bracket and the heat dissipation member are used together for mounting the second circuit board.

In some embodiments, the heat sink is removably mounted to the second bracket; or the heat dissipation piece and the second support are of an integrally formed structure.

In some embodiments, the second bracket includes a first end and a second end, the first bracket is attached to the first end, and the heat sink is attached to the second end.

In some embodiments, the first bracket is made of a metal material, and the first bracket is used for being attached to the first circuit board; and/or the second support is made of a metal material, and the second support is used for being attached to the second circuit board.

In some embodiments, the heat sink is attached to the second circuit board; or the heat dissipation member and the second circuit board are arranged at intervals.

In some embodiments, the first bracket is further configured to mount a third circuit board, and two opposite sides of the first bracket are respectively configured to mount the first circuit board and the third circuit board.

In some embodiments, the heat dissipation device further includes a blower mounted on the second bracket, the blower and the heat dissipation member being substantially aligned so that an air flow generated by the blower is directed to the heat dissipation member.

In some embodiments, the heat dissipation device further includes a heat conduction member for transferring heat of the first circuit board and/or the second circuit board to the heat dissipation member, the heat conduction member includes a first section and a second section, the first section and the second section are not on the same plane, the first section is fixed on the first bracket, and the second section is fixed on the second bracket.

In some embodiments, the first bracket and the second bracket together form a housing space; the first section is arranged on the side, opposite to or the same as the accommodating space, of the first support; and/or the second section is arranged on the side of the second support, which is opposite to or the same as the accommodating space.

In some embodiments, the first bracket and the second bracket together form a housing space; the second support is provided with a via hole, the heat conducting piece penetrates through the via hole, one section of the first section and the second section is located in the accommodating space, and the other section of the first section and the second section is located outside the accommodating space.

In some embodiments, the first bracket includes a first board body and a plurality of first limiting ribs, and the first board body is used for mounting the first circuit board; the first limiting ribs are connected to the first plate body, a plurality of first limiting ribs and the first plate body jointly form a first limiting space, and at least part of the first section is accommodated in the first limiting space.

In some embodiments, a first glue overflow groove is formed on the first board body, the first glue overflow groove is located between the first limiting ribs, and the first glue overflow groove is communicated with the first limiting space.

In some embodiments, the second bracket includes a second board body and a plurality of second limiting ribs, and the second board body is used for mounting the second circuit board; the plurality of second limiting ribs are connected to the second plate body, a plurality of second limiting spaces are formed by the second limiting ribs and the second plate body together, and at least part of the second section is accommodated in the second limiting spaces.

In some embodiments, a second glue overflow groove is formed in the second board body, the second glue overflow groove is located between the second limiting ribs, and the second glue overflow groove is communicated with the second limiting space.

In some embodiments, the heat sink includes a main body and a plurality of heat dissipation fins, the plurality of heat dissipation fins are connected to the main body, a heat conduction channel is formed between the main body and at least two of the heat dissipation fins, and the second section extends into the heat conduction channel and is attached to the main body.

In some embodiments, a heat-conducting glue overflow groove is formed on the main body, the heat-conducting glue overflow groove is located between at least two of the heat dissipation fins, and the heat-conducting glue overflow groove is communicated with the heat-conducting channel.

The heat dissipation device of the embodiment of the application is used for dissipating heat of at least a first circuit board and a second circuit board, and comprises a heat conduction piece and a heat dissipation piece, wherein the heat conduction piece comprises a first section and a second section which are connected with each other, the first section and the second section are of an integrated structure, and the first section and the second section are not on the same plane; the heat dissipation member is connected with the second section of the heat conduction member; the first section is used for mounting the first circuit board, and the second section is used for mounting the second circuit board, so that heat generated by the first circuit board and the second circuit board is conducted to the heat dissipation member for heat dissipation; or the first section is used for mounting the first circuit board, and heat generated by the first circuit board can be conducted to the heat dissipation member for heat dissipation; the heat dissipation piece is also used for being attached to the second circuit board, so that heat generated by the second circuit board can be dissipated through the heat dissipation piece.

In the heat dissipation device in the embodiment of the application, the first section and the second section of the heat conducting part are not on the same plane, the heat dissipation part is connected with the second section of the heat conducting part, the heat absorbed by the first section and the second section of the heat conducting part can be transferred to the heat dissipation part, and the first section and the second section of the heat conducting part are not on the same plane, so that the heat dissipation device can dissipate heat for circuit boards at least positioned on two different planes, so that the heat dissipation device can be applicable to more elements, and a plurality of elements are distributed on equipment on at least two different planes.

In some embodiments, the heat dissipation device further comprises a first bracket and a second bracket, the first section being disposed on the first bracket; the second section is arranged on the second support, the second support is connected with the first support, and the second support and the first support are not in the same plane.

In some embodiments, the first bracket is further configured to mount a third circuit board, two opposite sides of the first bracket are respectively configured to mount the first circuit board and the third circuit board, and the first section is located between the first circuit board and the third circuit board.

In some embodiments, the heat conducting element further includes a third section, the third section and the second section are respectively connected to two ends of the first section, the third section is not on the same plane as the first section, and the third section is used for mounting a third circuit board to transfer heat generated by the third circuit board to the heat dissipating element.

The heat dissipation assembly of the embodiment of the application comprises a first circuit board, a second circuit board and the heat dissipation device of any one of the embodiments, wherein the heat dissipation device is used for dissipating heat of the first circuit board and the second circuit board.

In some embodiments, the first circuit board generates more heat than the second circuit board.

In some embodiments, one or more of an image transmission emitting chip, an image transmission amplifying chip and an image transmission processing chip are mounted on the first circuit board; and/or one or more of a vision processing chip and a memory chip are mounted on the second circuit board.

The mobile platform of this application embodiment includes fuselage and radiator unit, radiator unit installs on the fuselage, radiator unit includes first circuit board, second circuit board and this application arbitrary embodiment heat abstractor, heat abstractor is used for dispelling the heat for first circuit board and second circuit board.

The heat dissipation assembly and the mobile platform in the embodiment of the application can dissipate heat for a plurality of internal elements distributed on at least two different planes through the heat dissipation device.

Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a perspective assembly view of a mobile platform according to an embodiment of the present application;

FIG. 2 is an exploded perspective view of one perspective of a heat dissipation assembly according to an embodiment of the present application;

FIG. 3 is an exploded isometric view of another perspective of a heat dissipation assembly of an embodiment of the present application;

FIG. 4 is a perspective assembly view of a heat sink in accordance with an embodiment of the present application;

fig. 5 is an exploded perspective view of a heat sink according to an embodiment of the present application;

FIG. 6 is a perspective assembled view of a heat sink assembly according to an embodiment of the present application;

FIG. 7 is a perspective assembled view of a heat sink assembly according to an embodiment of the present application;

FIG. 8 is an exploded perspective view of a heat sink assembly according to an embodiment of the present application;

FIG. 9 is a perspective assembly view of a heat sink in accordance with an embodiment of the present application;

FIG. 10 is a perspective assembly view of a heat sink in accordance with an embodiment of the present application;

fig. 11 is a perspective assembly view of the heat sink according to the embodiment of the present application.

Description of the main element symbols:

the heat dissipation device comprises a mobile platform 2000, a heat dissipation assembly 1000, a heat dissipation device 100, a first support 10, a first board body 11, a first glue overflow groove 111, a first limit rib 12, a first limit space 13, a second support 20, a first end 21, a second end 22, an accommodating space 23, a via hole 24, a second board body 25, a second glue overflow groove 251, a second limit rib 26, a second limit space 27, a heat dissipation member 30, a main body 31, a heat conduction glue overflow groove 311, a heat dissipation fin 32, a heat conduction channel 33, an air supply member 40, a buffer member 41, a heat conduction member 50, a first end 51, a second section 52, a third section 53, a third support 60, a first circuit board 200, a second circuit board 300, a body 400 and a third circuit board 500.

Detailed Description

Embodiments of the present application will be further described below with reference to the accompanying drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.

In addition, the embodiments of the present application described below in conjunction with the accompanying drawings are exemplary and are only for the purpose of explaining the embodiments of the present application, and are not to be construed as limiting the present application.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "above," and "over" a second feature may mean that the first feature is directly above or obliquely above the second feature, or that only the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1 and 2, a mobile platform 2000 according to an embodiment of the present disclosure includes a body 400 and a heat dissipation assembly 1000, wherein the heat dissipation assembly 1000 is mounted on the body 400. The mobile platform 2000 may be embodied as any device capable of moving or rotating. Mobile platform 2000 may include, but is not limited to, land mobile, water mobile, air mobile, and other types of motorized vehicles, among others. For illustrative purposes, mobile platform 2000 may include a passenger vehicle, an unmanned aerial vehicle, an unmanned ship, etc., and operation of mobile platform 2000 may include modes of flight, cruise, crawl, etc. In the embodiment of the present application, the mobile platform 2000 is exemplified as an unmanned aerial vehicle, and it is to be understood that the mobile platform 2000 is not limited to an unmanned aerial vehicle, and may be other.

The unmanned aerial vehicle can be a multi-rotor unmanned aerial vehicle, such as a four-rotor unmanned aerial vehicle, a six-rotor unmanned aerial vehicle, an eight-rotor unmanned aerial vehicle, a twelve-rotor unmanned aerial vehicle, and the like. Unmanned aerial vehicles may be used to carry loads to accomplish predetermined tasks, such as carrying imaging devices to take photographs, carrying pesticides, nutrient solutions, and sprinklers to perform plant protection tasks, and the like. Unmanned vehicles can also be used in the fields of miniature self-timer, express delivery, disaster relief, wildlife observation, infectious disease monitoring, surveying and mapping, news reporting, power inspection, disaster relief, movie and television photography, and the like.

The body 400 may be used as a mounting carrier for functional components of the mobile platform 2000, for example, a pan/tilt, a load, a heat dissipation assembly 1000, and the like may be mounted outside the body 400, and a power module, a flight control system, an image transmission device, and the like may be mounted inside the body 400. The body 400 may provide protection against water, dust, etc. for functional components installed in the body 400, and the body 400 may provide an installation space for the heat dissipation assembly 1000, the pan/tilt head, etc.

Referring to fig. 2 and fig. 3, a heat dissipation assembly 1000 according to an embodiment of the present disclosure includes a first circuit board 200, a second circuit board 300, and a heat dissipation device 100, wherein the heat dissipation device 100 is used for dissipating heat of the first circuit board 200 and the second circuit board 300. The heat dissipation assembly 1000 may be mounted to the body 400 by means of bonding, welding, fastener connection, etc.

Specifically, the first circuit board 200 may have a processor, various chips, and other components mounted thereon, and the first circuit board 200 and the components mounted on the first circuit board 200 may generate a large amount of heat during operation, and the first circuit board 200 and the components mounted on the first circuit board 200 may be damaged or have a shortened service life when the amount of heat is too high, which may further cause the mobile platform 2000 to fail to operate normally.

The second circuit board 300 may have a processor, various chips, and other components mounted thereon, and the second circuit board 300 and the components mounted on the second circuit board 300 may generate a large amount of heat during operation, and the second circuit board 300 and the components mounted on the second circuit board 300 may be damaged or have a shortened service life when the amount of heat is too high, which may further cause the mobile platform 2000 not to operate normally.

Here, the components mounted on the second circuit board 300 may be the same as those mounted on the first circuit board 200, and the components mounted on the second circuit board 300 may be different from those mounted on the first circuit board 200.

Further, the heat generated by the first circuit board 200 may be the same as the heat generated by the second circuit board 300, or the heat generated by the first circuit board 200 may be different from the heat generated by the second circuit board 300, for example, the heat generated by the first circuit board 200 is smaller than the heat generated by the second circuit board 300, or the heat generated by the first circuit board 200 is larger than the heat generated by the second circuit board 300.

More specifically, in some embodiments, one or more of the image transmission emission chip, the image transmission amplification chip, and the image transmission processing chip are mounted on the first circuit board 200, for example, the image transmission emission chip is mounted on the first circuit board 200, the image transmission amplification chip is mounted on the first circuit board 200, the image transmission processing chip is mounted on the first circuit board 200, the image transmission emission chip and the image transmission amplification chip are mounted on the first circuit board 200, the image transmission emission chip and the image transmission processing chip are mounted on the first circuit board 200, the image transmission amplification chip and the image transmission processing chip are mounted on the first circuit board 200, and the image transmission emission chip, the image transmission amplification chip, and the image transmission processing chip are mounted on the first circuit board 200. It should be noted that the components mounted on the first circuit board 200 are not limited to the image transmission transmitting chip, the image transmission amplifying chip, and the image transmission processing chip, and may be other components.

In this embodiment, one or more of the image transmission emission chip, the image transmission amplification chip, and the image transmission processing chip are mounted on the first circuit board 200, so that the heat dissipation device 100 can better dissipate heat of one or more of the image transmission emission chip, the image transmission amplification chip, and the image transmission processing chip, so that one or more of the image transmission emission chip, the image transmission amplification chip, and the image transmission processing chip is not prone to malfunction due to over-high temperature during operation, and stable and reliable image processing and transmission processes are ensured.

Further, in some embodiments, one or more of a vision processing chip and a memory chip are mounted on the second circuit board 300, for example, the vision processing chip is mounted on the second circuit board 300, or the memory chip is mounted on the second circuit board 300, or the vision processing chip and the memory chip are mounted on the second circuit board 300. In this way, the heat dissipation device 100 can dissipate heat of one or more of the vision processing chip and the memory chip mounted on the second circuit board 300, so that the one or more of the vision processing chip and the memory chip is not prone to failure caused by over-high temperature during operation, and the process of vision positioning or information storage is stable and reliable. It should be noted that the components mounted on the second circuit board 300 are not limited to the above-described vision processing chip and memory chip, and may be other components.

Referring to fig. 2 to 4, the heat dissipation device 100 according to the embodiment of the present disclosure is used for dissipating heat of a first circuit board 200, and the heat dissipation device 100 includes a first bracket 10, a second bracket 20 and a heat dissipation member 30. The first bracket 10 is used for mounting the first circuit board 200, the second bracket 20 is connected with the first bracket 10, the second bracket 20 is not in the same plane with the first bracket 10, or the plane of the second bracket 20 is intersected with the plane of the first bracket 10. The heat sink 30 is connected to the second bracket 20 so that heat generated from the first circuit board 200 can be dissipated through the heat sink 30 after passing through the first and

second brackets

10 and 20 in sequence.

In the heat dissipation apparatus 100, the heat dissipation assembly 1000, and the mobile platform 2000 of the embodiment of the present application, by providing the first support 10 and the second support 20 that are connected to each other, the heat dissipation member 30 is connected to the second support 20, and heat generated by a circuit board installed on the first support 10 can be dissipated through the heat dissipation member 30 after passing through the first support 10 and the second support 20 in sequence, and the first support 10 and the second support 20 are not in the same plane, so that the heat dissipation apparatus 100 can dissipate heat for devices installed on at least two different planes, the heat dissipation apparatus 100 is suitable for dissipating heat for devices with more components, and a plurality of components are distributed on at least two different planes.

For example, when the mobile platform 2000 is an unmanned aerial vehicle, elements distributed on at least two surfaces of a fuselage of the unmanned aerial vehicle generate a large amount of heat during operation, and the heat dissipation assembly 1000 according to the embodiment of the present disclosure is installed on the fuselage of the unmanned aerial vehicle, and the heat dissipation assembly 1000 can dissipate heat for the elements distributed on at least two different surfaces, so that temperatures of the fuselage of the unmanned aerial vehicle and the elements installed on the fuselage are reduced, and the unmanned aerial vehicle is not prone to abnormal operation. Meanwhile, compared with a heat dissipation assembly using a plurality of heat dissipation devices arranged in a single plane, the structure of the heat dissipation assembly 1000 according to the embodiment of the present disclosure is more compact, and the size and weight of the unmanned aerial vehicle can be reduced.

Specifically, the mounting position of the first circuit board 200 on the first bracket 10 is not limited herein, for example, the first circuit board 200 may be mounted on a side of the first bracket 10 close to the second bracket 20, and the first circuit board 200 may also be mounted on a side of the first bracket 10 far from the second bracket 20. The second bracket 20 may be fixedly connected to the first bracket 10, or may be detachably connected to the first bracket 10, for example, the second bracket 20 is fixedly connected to the first bracket 10 by welding, bonding, or the like, or the second bracket 20 is detachably connected to the first bracket 10 by screws, pins, or fasteners.

Further, the first bracket 10 and the second bracket 20 are not on the same plane, and it is understood that the first bracket 10 and the second bracket 20 are arranged in a different plane, so that the first bracket 10 and the second bracket 20 can be installed on at least two different planes. That is, the first rack 10 is mounted on one face of the apparatus, and the second rack 20 may be mounted on the other face of the apparatus.

The heat dissipation member 30 may specifically be a heat dissipation tooth, a heat dissipation fin, a fan, a copper pipe, or the like, and the connection between the heat dissipation member 30 and the second bracket 20 may specifically be that the heat dissipation member 30 is attached to the second bracket 20, or that the heat dissipation member 30 is connected to one end of the second bracket 20. The heat sink 30 and the second bracket 20 may be fixedly coupled or detachably coupled. The heat generated by the first circuit board 200 can be dissipated through the heat dissipating member 30 after passing through the first bracket 10 and the second bracket 20 in sequence, so that the heat dissipating member 30 can dissipate the heat of the first circuit board 200 mounted on the first bracket 10, and the heat dissipating device 100 can also dissipate the heat of the components not mounted on the plane where the heat dissipating member 30 is located, so that the heat dissipating device 100 can dissipate the heat of the components on a plurality of different planes at the same time.

Referring to fig. 2 and 3, in some embodiments, the heat dissipation device 100 is further used for dissipating heat of the second circuit board 300.

In one embodiment, the second bracket 20 is used to mount the second circuit board 300. The second circuit board 300 may be mounted at any position on the second bracket 20, for example, the second circuit board 300 may be mounted on a side of the second bracket 20 close to the first bracket 10, and the second circuit board 300 may also be mounted on a side of the second bracket 20 away from the first bracket 10. The second circuit board 300 may be partially mounted on the second bracket 20, or the second circuit board 300 may be entirely mounted on the second bracket 20. The second circuit board 300 is mounted on the second bracket 20, and since the heat sink 30 is connected to the second bracket 20, the heat sink 30 can also dissipate heat of the second circuit board 300, which reduces the temperature of the second circuit board 300 so that the second circuit board 300 is not damaged due to over-high temperature.

In yet another embodiment, the heat sink 30 is used to mount the second circuit board 300. Wherein the second circuit board 300 may be mounted on any position of the heat sink 30, so that the heat sink 30 may dissipate heat of the second circuit board 300. For example, the second circuit board 300 may be attached to the heat sink 30, and the second circuit board 300 may be mounted on an end of the heat sink 30 that is not connected to the second bracket 20. The second circuit board 300 is mounted on the heat sink 30, so that the heat sink 30 can dissipate heat of the second circuit board 300, and the second circuit board 300 and the components mounted on the second circuit board 300 are not easily damaged by over-high temperature.

In another embodiment, the second bracket 20 and the heat sink 30 are used together to mount the second circuit board 300. Wherein a portion of the second circuit board 300 may be mounted on the heat sink 30, and a portion of the second circuit board 300 may be mounted on the second bracket 20; it is also possible that the second circuit board 300 is mounted between the second bracket 20 and the heat sink 30; the positional relationship between the second circuit board 300 and the second bracket 20 and the heat sink 30 is not limited herein. By mounting the second circuit board 300 on the second bracket 20 and the heat sink 30, the second circuit board 300 can be heat-dissipated, and the second circuit board 300 and the components mounted on the second circuit board 300 are not easily damaged by excessive temperature.

Referring to fig. 4 and 5, the first bracket 10 may be made of a metal material, a plastic material, an elastic material, or the like, and the first bracket 10 may be attached to the first circuit board 200, or the first bracket 10 may be connected to the first circuit board 200 at intervals, or a heat conducting element such as a heat conducting sheet may be installed between the first bracket 10 and the first circuit board 200, and then heat conducting liquid such as heat conducting silicone grease, heat conducting glue, or the like is filled between the first bracket 10 and the first circuit board 200.

In one embodiment, the first bracket 10 is made of a metal material, for example, the first bracket 10 is made of a metal material such as iron, copper, aluminum, alloy, etc., so that the first bracket 10 may have a high hardness, the first bracket 10 is not easily deformed, and the first bracket 10 has a good thermal conductivity. In addition, the first bracket 10 is attached to the first circuit board 200, so that heat generated on the first circuit board 200 can be better transferred to the first bracket 10, and the first bracket 10 can transfer the heat to the second bracket 20 and then be dissipated by the heat dissipation member 30.

In another embodiment, the first bracket 10 is made of a plastic material, for example, the first bracket 10 is made of a plastic material such as plastic, etc., so that the mass of the first bracket 10 is relatively small compared to a metal material, and a larger design space can be provided when the first bracket is spatially arranged, thereby reducing the mass of the heat dissipation device 100, the heat dissipation assembly 1000, and the mobile platform 2000.

Referring to fig. 6, in some embodiments, the first support 10 is further configured to mount a third circuit board 500, and two opposite sides of the first support 10 are respectively configured to mount the first circuit board 200 and the third circuit board 500, so that the heat dissipation device 100 can further dissipate heat of the third circuit board 500, and reduce the temperature of the third circuit board 500, so that the temperature of the third circuit board 500 and the temperature of the components mounted on the third circuit board 500 are not too high to cause a failure, and the heat dissipation assembly 1000 and the mobile platform 2000 can work normally.

Specifically, the components mounted on the third circuit board 500 may be the same as the components mounted on the first circuit board 200, and the components mounted on the third circuit board 500 may also be different from the components mounted on the first circuit board 200. The third circuit board 500 is not on the same side of the first support 10 as the first circuit board 200, and the third circuit board 500 is mounted on the opposite side of the first support 10 to the first circuit board 200, so that the third circuit board 500 can transfer the generated heat to the first support 10, and the heat sink 30 can dissipate more of the generated heat of the third circuit board 500, and the temperature of the third circuit board 500 is lower.

Referring to fig. 2 and 3, the second bracket 20 may be made of a plastic material, a metal material, an elastic material, or the like, the second bracket 20 may be attached to the second circuit board 300, the second bracket 20 may also be disposed at an interval from the second circuit board 300, a heat conducting element such as a heat conducting fin may be disposed between the second bracket 20 and the second circuit board 300, and a heat conducting liquid such as a heat conducting silicone grease, a heat conducting adhesive, or the like may be filled between the second bracket 20 and the second circuit board 300.

In one embodiment, the second bracket 20 is made of a metal material, for example, the second bracket 20 may be made of a metal material such as iron, copper, aluminum, alloy, etc., so that the second bracket 20 may have high hardness and strength, the second bracket 20 is not easily deformed, and the second bracket 20 can better transfer heat. In addition, the second bracket 20 is adapted to be attached to the second circuit board 300, so that heat generated by the second circuit board 300 can be transferred to the second bracket 20 and then further transferred from the second bracket 20 to the heat sink 30 to be dissipated by the heat sink 30.

In another embodiment, the second bracket 20 is made of a plastic material, for example, the second bracket 20 is made of a plastic material such as plastic, etc., so that the mass of the second bracket 20 is relatively small compared to a metal material, and a larger design space can be provided when the second bracket is spatially arranged, thereby reducing the mass of the heat dissipation device 100, the heat dissipation assembly 1000, and the mobile platform 2000.

Referring to fig. 2 and 5, in an embodiment, the heat dissipation member 30 is detachably mounted on the second bracket 20, as shown in fig. 2 and 5, for example, the heat dissipation member 30 is detachably mounted on the second bracket 20 by screws, buckles, or the like, so that when one of the heat dissipation member 30 and the second bracket 20 is damaged, the damaged one of the heat dissipation member 30 and the second bracket 20 is detached for maintenance or replacement, thereby reducing the number of discarded components and reducing the maintenance cost of the heat dissipation device 100. For example, a fixing column is disposed on the second bracket 20, a stud is disposed on the heat sink 30, and the second bracket 20 and the heat sink 30 are fixedly connected by a screw.

Referring to fig. 7 and 8, in another embodiment, the heat dissipation element 30 and the second bracket 20 are integrally formed, as shown in fig. 7 and 8, for example, the heat dissipation element 30 and the second bracket 20 are integrally formed by casting or forging, which can reduce the manufacturing cost of the heat dissipation element 30 and the second bracket 20, and the relative position between the heat dissipation element 30 and the second bracket 20 is more stable.

Referring to fig. 2 and 5, in some embodiments, the second bracket 20 includes a first end 21 and a second end 22, the first bracket 10 is connected to the first end 21 of the second bracket 20, and the heat dissipation member 30 is connected to the second end 22 of the second bracket 20, so that heat on the first bracket 10 can be transferred from the first end 21 of the second bracket 20 to the second end 22 of the second bracket 20, and the heat dissipation member 30 disposed on the second end 22 can dissipate the received heat to reduce heat of the first circuit board 200 mounted on the first bracket 10.

Specifically, referring to fig. 2, fig. 5 and fig. 9, the first end 21 and the second end 22 of the second bracket 20 may be respectively located at different sides of the second bracket 20, for example, the first end 21 and the second end 22 may be two adjacent ends of the second bracket 20, as shown in fig. 9, and the first end 21 and the second end 22 may also be two opposite ends of the second bracket 20, as shown in fig. 2 and fig. 5. The first bracket 10 is connected to the first end 21 of the second bracket 20 and is not in the same plane with the second bracket 20, for example, the first bracket 10 may be connected to the second bracket 20 vertically or obliquely. Wherein the heat sink 30 may be attached to the second end 22 of the second bracket 20 by means of screws, pins, welding, etc. to dissipate heat of the second bracket 20.

In one embodiment, the first end 21 and the second end 22 are opposite ends of the second bracket 20, the first bracket 10 is vertically connected to the first end 21 of the second bracket 20, and an included angle formed between the first bracket 10 and the second bracket 20 is a right angle.

Referring to fig. 2 and 3, in an example, a counterbore is formed in the first bracket 10, a stud is disposed on the second bracket 20, the stud of the second bracket 20 is inserted into the counterbore of the first bracket 10, and then a screw is inserted into the stud to fixedly connect the first bracket 10 and the second bracket 20.

Referring to fig. 2, in an embodiment, the heat dissipation member 30 is attached to the second circuit board 300, so that heat generated by the second circuit board 300 can be directly transmitted to the heat dissipation member 30 and then dissipated by the heat dissipation member 30, thereby reducing the temperature of the second circuit board 300 and components mounted on the second circuit board 300, and preventing the second circuit board 300 and the components mounted on the second circuit board 300 from being easily broken down.

In another embodiment, the heat dissipation member 30 is spaced apart from the second circuit board 300, specifically, the heat dissipation member 30 is not directly attached to the second circuit board 300, for example, a heat conduction sheet, a heat conduction block, a gasket, or the like is disposed between the heat dissipation member 30 and the second circuit board 300, or a gap exists between the heat dissipation member 30 and the second circuit board 300, or the second circuit board 300 is attached to the second bracket 20, and the heat dissipation member 30 is connected to the second bracket 20 without directly contacting the second circuit board 300.

Referring to fig. 2, 5 and 7, in some embodiments, the heat sink 30 includes a main body 31 and a plurality of heat dissipation fins 32, the plurality of heat dissipation fins 32 are connected to the main body 31, and a heat conduction channel 33 is formed between the main body 31 and at least two of the heat dissipation fins 32. Specifically, the heat dissipation fins 32 may be a metal sheet, and the plurality of heat dissipation fins 32 may be arranged in a tooth shape on the body 31. The heat dissipation fins 32 on both sides of the heat conduction channel 33 may be connected to the main body 31 at equal intervals or at unequal intervals.

Further, a heat-conducting glue overflow groove 311 is formed on the main body 31, the heat-conducting glue overflow groove 311 is located between the at least two heat dissipation fins 32, and the heat-conducting glue overflow groove 311 is communicated with the heat-conducting channel 33, so that heat-conducting liquid such as heat-conducting silicone grease or heat-conducting glue can be filled in the heat-conducting glue overflow groove 311, and thus, the component installed in the heat-conducting channel 33 can be fully contacted with the heat dissipation member 30, and the heat of the component in the heat-conducting channel 33 can be better dissipated by the heat dissipation member 30.

Referring to fig. 2 and 4, in some embodiments, the heat dissipation device 100 further includes an air blowing element 40, the air blowing element 40 is mounted on the second bracket 20, and the air blowing element 40 and the heat dissipation element 30 are substantially aligned, so that the air flow generated by the air blowing element 40 is guided to the heat dissipation element 30. Therefore, the air blowing element 40 can better guide the air flow to the heat dissipation element 30 to accelerate the heat dissipation on the heat dissipation element 30, and can transmit the heat generated by the first circuit board 200 and the second circuit board 300 more quickly, so that the temperatures of the first circuit board 200 and the second circuit board 300 are not too high easily.

In some embodiments, referring to fig. 1, when the heat dissipation assembly 1000 is mounted on the body 400, the airflow direction of the air supply element 40 flows from the front side of the body 400 to the rear side of the body 400, so that the airflow generated by the air supply element 40 does not reverse the airflow generated when the body 400 moves and affect the airflow amount of the air supply element 40 blowing toward the heat dissipation element 30.

Specifically, the air supply member 40 may be a centrifugal fan, an axial flow fan, a fan, or the like, which is capable of driving the air flow, and the air supply member 40 may be detachably mounted or fixedly mounted on the second bracket 20. Further, the air blowing element 40 and the heat sink 30 may be substantially aligned, the center of the air blowing element 40 and the center of the heat sink 30 may be substantially aligned, or the center of the air outlet of the air blowing element 40 and the center of the heat sink 30 may be substantially aligned. In one embodiment, the center of the air supply element 40 is aligned with the center of the heat sink element 30, so that the air flow generated by the air supply element 40 can directly blow to the heat sink element 30 to better carry away the temperature on the heat sink element 30.

In one embodiment, the air supply member 40 is a centrifugal fan, which generates more concentrated air flow than an axial flow fan with the same size and rotation speed, and more air flow can be blown to the heat sink 30. Meanwhile, the axial flow fan needs to be vertically installed on the second bracket 20, which increases the volume of the heat dissipation device 100; the centrifugal fan can change the direction of the air flow, and the centrifugal fan can reduce the volumes of the heat dissipation device 100, the heat dissipation assembly 1000 and the mobile platform 2000, so that the heat dissipation device 100, the heat dissipation assembly 1000 and the mobile platform 2000 are more compact.

More specifically, the air supply part 40 can be provided with a positioning hole, one side of the air supply part 40 close to the second support 20 can be provided with a back adhesive, the second support 20 is provided with a positioning column, the positioning hole is sleeved on the positioning column, and then the back adhesive is adhered on the second support 20, so that the position of the air supply part 40 in operation is stable.

Further, referring to fig. 2, a buffer 41 is further installed between the air blowing element 40 and the second bracket 20, the buffer 41 can buffer the vibration generated by the air blowing element 40 during operation, and the first bracket 10 and the second bracket 20 are not easily driven by the air blowing element 40 to vibrate together. The buffer 41 includes, but is not limited to, a buffer foam, a sponge, a spring, a silicone element, and other elements having a buffering property.

Referring to fig. 2 and 5, in some embodiments, the heat dissipation device 100 further includes a heat conduction member 50, the heat conduction member 50 is used for transferring heat of the first circuit board 200 and/or the second circuit board 300 to the heat dissipation member 30, the heat conduction member 50 includes a first section 51 and a second section 52, and the first section 51 and the second section 52 may be an integrated structure. The first section 51 and the second section 52 are not on the same plane, the first section 51 is fixed on the first bracket 10, and the second section 52 is fixed on the second bracket 20. On one hand, the heat of the first circuit board 200 and/or the second circuit board 300 may be transferred to the heat dissipation member 30 through the thermal conduction member 50, so that the heat dissipation member 30 can better dissipate the heat of the first circuit board 200 and/or the second circuit board 300; on the other hand, the first and

second segments

51 and 52 are not on the same plane, but are fixed to the first and

second supports

10 and 20, respectively, whereby the heat-conducting material 50 can radiate heat to at least two different planes of the device requiring heat radiation.

Specifically, the heat conductive member 50 may be a copper pipe, a heat conductive sheet, or the like, which can conduct heat. The first section 51 and the second section 52 are not in the same plane, and it is understood that the heat conducting member 50 is not straight and may be bent, so that the first section 51 and the second section 52 can be fixed on the first bracket 10 and the second bracket 20, respectively. Meanwhile, the first section 51 is fixed on the first support 10, and the second section 52 is fixed on the second support 20, so that the heat conducting member 50 is not easy to damage, and the heat conducting member 50 can be made into a more complex structure so as to be used for radiating heat for equipment with multiple surfaces needing heat radiation.

The heat dissipation device 100 includes a first bracket 10, a second bracket 20, a heat dissipation member 30, an air supply member 40, and a heat conduction member 50, wherein the heat conduction member 50 transfers heat of the first circuit board 200 and the second circuit board 300 to the heat dissipation member 30, and then the air supply member 40 generates air flow to blow the heat dissipation member 30 for heat dissipation. In one experiment, limit scenarios were set: the environmental temperature is 40 ℃, the simulation test is carried out under the condition of no wind after standing, the temperature of core heating devices (such as an image transmission emitting chip, an image transmission amplifying chip, an image transmission processing chip and the like) arranged on the first circuit board 200 is respectively reduced from 104 ℃ to 84.2 ℃, the temperature of 92.1 ℃ to 79.3 ℃, the temperature of core heating devices (such as a vision processing chip, a storage chip and the like) arranged on the second circuit board 300 is respectively reduced from 105 ℃ to 89.6 ℃, and the temperature of 99 ℃ to 86.2 ℃.

In one embodiment, the thermal conduction member 50 is connected to the first circuit board 200. For example, the heat conducting element 50 is attached to the first circuit board 200, or objects such as heat conducting silicone grease and heat conducting glue are filled between the heat conducting element 50 and the first circuit board 200, or the heat conducting element 50 is connected to the first circuit board 200 through the first bracket 10, so that the heat of the first circuit board 200 can be transferred to the heat conducting element 50, and the heat conducting element 50 can transfer the received heat to the heat dissipating element 30, so that the heat dissipating element 30 can dissipate the heat generated by the first circuit board 200.

In still another embodiment, the heat-conductive member 50 is connected to the second circuit board 300. For example, the heat conducting member 50 is attached to the second circuit board 300, or heat conducting liquid such as heat conducting silicone grease, heat conducting glue, etc. is filled between the heat conducting member 50 and the second circuit board 300, or the heat conducting member 50 is connected to the second circuit board 300 through the second bracket 20; thereby, the heat of the second circuit board 300 may be transferred to the heat conduction member 50, and the heat conduction member 50 may transfer the received heat to the heat dissipation member 30, so that the heat dissipation member 30 can more dissipate the heat of the second circuit board 300.

In another embodiment, the thermal conduction member 50 is connected to the first circuit board 200 and the second circuit board 300. For example, the first section 51 is attached to the first circuit board 200, and the second section 52 is attached to the second circuit board 300; or objects such as heat-conducting silicone grease, heat-conducting glue and the like are filled between the first section 51 and the first circuit board 200, and objects such as heat-conducting silicone grease, heat-conducting glue and the like are filled between the second section 52 and the second circuit board 300; or the first section 51 and the first circuit board 200 are respectively attached to two opposite sides of the first support 10, and the second section 52 and the second circuit board 300 are respectively attached to two opposite sides of the second support 20. In this way, the heat generated by the first circuit board 200 and the second circuit board 300 can be transferred to the heat conduction member 50, and the heat conduction member 50 can transfer the received heat to the heat dissipation member 30, so that the heat dissipation member 30 can dissipate the heat generated by the first circuit board 200 and the second circuit board 300.

Further, the second segment 52 may extend into the heat conducting channel 33 of the heat dissipation member 30 according to the above embodiment, so that the heat on the heat conducting element 50 can be transferred to the heat dissipation member 30 and then dissipated by the heat dissipation member 30, thereby improving the heat dissipation efficiency of the heat dissipation device 100 for the first circuit board 200 and the second circuit board 300.

Meanwhile, the second section 52 can cover the heat-conducting glue overflow groove 311 formed on the main body 31, so that heat-conducting liquid such as heat-conducting silicone grease or heat-conducting glue is filled in the heat-conducting glue overflow groove 311, the heat-dissipating member 30 can be fully contacted with the heat-conducting member 50, heat on the heat-conducting member 50 can be fully transferred to the heat-dissipating member 30, and then the heat-dissipating member 30 dissipates heat, and the heat-dissipating efficiency of the heat-dissipating device 100 on the first circuit board 200 and the second circuit board 300 is effectively improved.

Referring to fig. 9, the first end 21 and the second end 22 are two adjacent ends of the second bracket 20, and at this time, the extending direction of the second section 52 is not consistent with the flowing direction of the airflow formed by the blowing element 40, even if the first bracket 20 is installed on the left side wall of the body 400, the flowing direction of the airflow formed by the blowing element 40 can still be consistent with the moving direction of the moving platform 2000, which can accelerate the dissipation of heat on the heat dissipation member 30, so that the heat dissipation assembly 1000 can be used for dissipating heat for any plane on the body 400.

Further, referring to fig. 10, in some embodiments, the heat conducting member 50 further includes a third section 53, the third section 53 and the second section 52 are respectively connected to two ends of the first section 51, the third section 53 and the first section 51 are not on the same plane, and the third section 53 is used for mounting a third circuit board to transfer heat generated by the third circuit board to the heat dissipating member 30, so that the heat dissipating device 100 can perform multi-dimensional heat dissipation for more complex equipment with a plurality of heating systems, thereby achieving a better heat dissipating effect.

Specifically, the heat conducting member 50 may be bent several times and divided into a first segment 51, a second segment 52 and a third segment 53, the third segment 53 and the second segment 52 are respectively connected to two ends of the first segment 51, the third segment 53 and the first segment 51 are not on the same plane, and the second segment 52 and the first segment 51 are not on the same plane. The second end 22 and the third segment 53 may be in the same plane or in two different planes. The third circuit board is mounted on the third section 53 of the heat conductive member 50 so that heat generated from the third circuit board can be transferred to the third section 53 of the heat conductive member 50, and then sequentially pass through the first section 51 and the second section 52 to reach the heat sink 30.

More specifically, the heat dissipation device 100 further includes a third bracket 60, the third bracket 60 is connected to the first bracket 10, the third bracket 60 is not coplanar with the first bracket 10, the third section 53 is mounted on the third bracket 60, the third circuit board is mounted on the third bracket 60, or the third circuit board is mounted on the third section 53, so that heat of the third circuit board can be transferred to the third section 53 and further transferred to the first section 51 and the second section 52.

Referring to fig. 11, a connection structure among the first bracket 10, the second bracket 20, and the third bracket 60 may also be as shown in fig. 11. Specifically, when the heat dissipation assembly 1000 is installed on the body 400, the first bracket 10 may be installed on the right side wall of the body 400, the extending direction of the heat conducting member 50 is not consistent with the airflow direction of the air supply member 40, and the airflow direction of the air supply member 40 is still the same as the moving direction of the mobile platform 2000, so that the heat dissipation of the heat dissipation member 30 may be accelerated, and the heat dissipation assembly 1000 may dissipate heat from components on the left side wall and the left side wall of the body 400. Of course, the first bracket 10 may be mounted on the right, rear, and bottom walls of the body 400. The connection structure of the third bracket 60 to the first bracket 10 is not limited to the structure shown in fig. 11, and for example, the third bracket 60 may be mounted on the bottom wall of the body 400.

Referring to fig. 4, 6 and 7, in some embodiments, the first bracket 10 and the second bracket 20 together form a receiving space 23, and the receiving space 23 may be used to receive a part of the functional device (e.g., the first circuit board 200, the second circuit board 300, etc.) or other device (e.g., a battery) for avoiding the mobile platform 2000.

Further, in one embodiment, the first section 51 is disposed on the opposite side or the same side of the first support 10 as the receiving space 23. The first circuit board 200 may be disposed on a side of the first support 10 opposite to or the same as the accommodating space 23, the first section 51 and the first circuit board 200 may be disposed on the same side of the first support 10, and the first section 51 and the first circuit board 200 may also be disposed on two sides of the first support 10 opposite to each other.

Further, in still another embodiment, the second section 52 is disposed on the same side of the second bracket 20 as or opposite to the receiving space 23. It is understood that the second section 52 and the accommodating space 23 may be on the same side of the second support 20, and the second section 52 and the accommodating space 23 may also be on opposite sides of the second support 20. The second circuit board 300 may be disposed on the same side or opposite side of the second support 20 as or opposite to the accommodating space 23, the second section 52 and the second circuit board 300 may be disposed on the same side of the second support 20, and the second section 52 and the second circuit board 300 may also be disposed on opposite sides of the second support 20, respectively.

Further, in another embodiment, the first section 51 is disposed on the side opposite or the same side of the first bracket 10 with the receiving space 23, and the second section 52 is disposed on the side of the second bracket 20 with the receiving space 23. For example, the first section 51 is disposed on the side opposite to the accommodating space 23 of the first bracket 10, and the second section 52 is disposed on the side opposite to the accommodating space 23 of the second bracket 20; alternatively, the first section 51 is disposed on the same side as the receiving space 23 of the first rack 10, and the second section 52 is disposed on the same side as the receiving space 23 of the second rack 20; alternatively, the first section 51 is disposed on the opposite side of the first support 10 from the receiving space 23, and the second section 52 is disposed on the same side of the second support 20 as the receiving space 23; still alternatively, the first section 51 is disposed on the same side of the first rack 10 as the accommodating space 23, and the second section 52 is disposed on the opposite side of the second rack 20 from the accommodating space 23.

Referring to fig. 2 and 5, in some embodiments, the second frame 20 has a through hole 24, and the heat conducting element 50 penetrates through the through hole 24. One of the first section 51 and the second section 52 is located in the accommodating space 23, and the other section is located outside the accommodating space 23. For example, the first section 51 is located in the accommodating space 23, and the second section 52 is located outside the accommodating space 23, that is, the first section 51 is disposed on the same side of the first rack 10 as the accommodating space 23, and the second section 52 is disposed on the opposite side of the second rack 20 from the accommodating space 23. Or the second section 52 is located in the accommodating space 23, and the first section 51 is located outside the accommodating space 23, that is, the first section 51 is disposed on the opposite side of the first support 10 from the accommodating space 23, and the second section 52 is disposed on the same side of the second support 20 as the accommodating space 23.

Referring to fig. 2 and 5, in some embodiments, the first bracket 10 includes a first plate 11 and a plurality of first limiting ribs 12. The first board body 11 is used for mounting the first circuit board 200, and the plurality of first limiting ribs 12 are connected to the first board body 11. The first limiting ribs 12 and the first board body 11 jointly form a first limiting space 13, and the first section 51 is at least partially accommodated in the first limiting space 13, so that the first limiting space 13 can limit the position of the first section 51, the first section 51 is not easy to move on the first bracket 10, the first section 51 is not easy to be damaged, and the first section 51 can better conduct heat on the first circuit board 200.

Specifically, the first circuit board 200 is mounted on the first board body 11, the first limiting rib 12 and the first board body 11 together form a first limiting space 13, and the first limiting space 13 can limit the lateral movement of at least a portion of the first section 51 on the first bracket 10, so as to prevent the first end 51 of the heat conducting member 50 from being damaged during movement. The number of the first limiting ribs 12 may be two, three, four, five, or more.

In one embodiment, the first section 51 is entirely accommodated in the first limiting space 13, so that the first limiting space 13 can better limit the movement of the heat-conducting member 50, and the heat-conducting member 50 can be prevented from being damaged due to the movement of the heat-conducting member 50.

Further, referring to fig. 2 and 5, in some embodiments, a first glue overflow groove 111 is formed on the first plate 11, the first glue overflow groove 111 is located between the first limiting ribs 12, and the first glue overflow groove 111 is communicated with the first limiting space 13. On one hand, the first glue overflow groove 111 can be used for accommodating heat conduction liquid such as heat conduction silicone grease or heat conduction glue filled among the heat conduction member 50, the first bracket 10 and the first circuit board 200; on the other hand, a liquid such as a heat conductive silicone grease or a heat conductive adhesive filled between the heat conductive member 50, the first circuit board 200, and the first bracket 10 may overflow through the first adhesive overflow groove 111; on the other hand, the first glue overflow groove 111 may be used to fix glue, so that the first section 51 may be tightly connected to the first bracket 10 without loosening.

Further, in one embodiment, the first board 11 is further provided with lightening holes, which can reduce the weight of the first bracket 10 and can also serve to apply heat conducting glue to the first circuit board 200.

Referring to fig. 2 and 5, in some embodiments, the second bracket 20 further includes a second board 25 and a plurality of second limiting ribs 26, and the second board 25 is used for mounting the second circuit board 300. The plurality of second limiting ribs 26 are connected to the second plate body 25, the plurality of second limiting ribs 26 and the second plate body 25 form a second limiting space 27 together, and the second section 52 is at least partially accommodated in the second limiting space 27. In this way, the second limiting space 27 can be limited to the second section 52, so that the second section 52 is not easy to move on the second bracket 20, and the heat-conducting member 50 can better conduct the heat of the second circuit board 300.

Specifically, the second circuit board 300 is mounted on the second body 25, the second limiting rib 26 and the second plate 25 together form a second limiting space 27, and the second limiting space 27 can limit the lateral movement of at least a portion of the second section 52 on the second bracket 20, so as to prevent the second end 52 of the heat conducting member 50 from being damaged during movement. The number of the second limiting ribs 26 may be two, three, four, five, or more.

In one embodiment, the second section 52 is entirely accommodated in the second limiting space 27, so that the second limiting space 27 can better limit the movement of the heat conducting member 50, and the second section 52 can be prevented from being damaged due to the movement of the second section 52.

Further, referring to fig. 2 and 5, in some embodiments, a second glue overflow groove 251 is formed on the second board 25, the second glue overflow groove 251 is located between the plurality of second limiting ribs 26, and the second glue overflow groove 251 is communicated with the second limiting space 27, so that the heat conductive silicone grease or the heat conductive glue filled between the heat conductive member 50, the first circuit board 200 and the first bracket 10 can overflow through the second glue overflow groove 251.

Of course, the heat sink 100 according to the embodiment of the present invention may not include the first bracket 10 and the second bracket 20 described above. The heat sink 100 includes the heat conducting element 50 and the heat dissipating element 30 according to the above embodiments, the first section 51 and the second section 52 are not on the same plane, and the second section 52 is connected to the heat dissipating element 30. The first section 51 is used for mounting the first circuit board 200, and the second section 52 is used for mounting the second circuit board 300, so that heat generated by the first circuit board 200 and the second circuit board 300 is conducted to the heat sink 30 for heat dissipation; or the first section 51 is used for mounting the first circuit board 200, the heat generated by the first circuit board 200 can be conducted to the heat dissipation member 30 for heat dissipation, and the heat dissipation member 30 is also used for being attached to the second circuit board 300, so that the heat generated by the second circuit board 300 can be dissipated through the heat dissipation member 30.

In the heat dissipating device 100 according to the embodiment of the present invention, the first section 51 and the second section 52 are not on the same plane, and the second section 52 is connected to the heat dissipating member 30, so that the heat absorbed by the first section 51 and the second section 52 on the heat conducting member 50 can be transferred to the heat dissipating member 30. Because the first section and the second section of the heat conducting piece are not on the same plane, the heat dissipation device can dissipate heat for the circuit board which is at least positioned on two different planes, and the heat dissipation device can be suitable for dissipating heat for devices with more elements and a plurality of elements distributed on at least two different planes.

Specifically, in an embodiment, the first section 51 and the second section 52 are used for mounting the first circuit board 200 and the second circuit board 300, respectively, and heat of the first circuit board 200 and the second circuit board 300 can be transferred to the first section 51 and the second section 52, respectively, so that the heat sink 30 can dissipate heat of the first circuit board 200 and the second circuit board 300, and since the first section 51 and the second section 52 are on two different planes, the heat dissipation device 100 can dissipate heat of circuit boards on at least two different planes at the same time.

Further, the heat generated from the first circuit board 200 is greater than the heat generated from the second circuit board 300. The heat of the high temperature portion on the heat conducting element 50 is transferred to the low temperature portion, and the heat generated by the first circuit board 200 is greater than the heat generated by the second circuit board 300, so that the heat of the first circuit board 200 can be better transferred from the first section 51 to the second section 52, thereby effectively preventing the heat on the heat conducting element 50 from being transferred from the second section 52 to the first section 51, which results in the heat of the heat conducting element 50 not being transferred to the heat dissipating element 30. Meanwhile, since the first bracket 10 is installed at the front side of the body 400, when the mobile platform 2000 moves, external air flow will impact the front side of the body 400, the external air flow can better carry away heat of the circuit board located at the front side of the body 400, the first circuit board 200 is arranged at the front side of the body 400, and the heat of the first circuit board 200 is set to be larger than that of the second circuit board 300, so that the characteristic of faster heat dissipation at the front side of the body 400 is effectively utilized, and the over-high temperature of the first circuit board 200 or the second circuit board 300 is avoided.

In another embodiment, the first section 51 is used for mounting the first circuit board 200, so that the heat of the first circuit board 200 can be transferred to the first section 51 and then can be dissipated by the heat dissipation member 30, and the heat dissipation member 30 is mounted to the second circuit board 300, so that the heat generated by the second circuit board 300 can also be dissipated through the heat dissipation member 30. Since the heat sink 30 is connected to the second section 52, that is, the second circuit board 300 and the first circuit board 200 on the heat sink 30 can be on two different planes, the heat dissipation device 100 can dissipate heat of circuit boards on at least two different planes at the same time.

In the description herein, reference to the description of the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present application, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations of the above embodiments may be made by those of ordinary skill in the art within the scope of the present application, which is defined by the claims and their equivalents.

Claims

1. A heat dissipation device, wherein the heat dissipation device is configured to dissipate heat from a first circuit board, the heat dissipation device comprising:

a first bracket for mounting the first circuit board;

the second support is connected with the first support, and the plane where the second support is located is intersected with the plane where the first support is located; and

the heat dissipation piece is connected with the second support, so that heat generated by the first circuit board can be dissipated through the heat dissipation piece after passing through the first support and the second support in sequence.

2. The heat dissipation device of claim 1, wherein the heat dissipation device is further configured to dissipate heat for a second circuit board;

wherein the second bracket is used for mounting the second circuit board; or, the heat sink is used for mounting the second circuit board; or, the second bracket and the heat dissipation member are used together for mounting the second circuit board.

3. The heat dissipating device of claim 2, wherein said heat dissipating member is removably mounted to said second bracket; or the heat dissipation piece and the second support are of an integrally formed structure.

4. The heat dissipating device of claim 2, wherein said second bracket includes a first end and a second end, said first bracket being attached to said first end and said heat dissipating member being attached to said second end.

5. The heat dissipation device of claim 2, wherein the first bracket is made of a metal material, and the first bracket is used for being attached to the first circuit board; and/or

The second support is made of metal materials and used for being attached to the second circuit board.

6. The heat dissipation device of claim 2, wherein the heat dissipation member is attached to the second circuit board; or

The heat dissipation member and the second circuit board are arranged at an interval.

7. A heat dissipation device, wherein the heat dissipation device is configured to dissipate heat for at least a first circuit board and a second circuit board, the heat dissipation device comprising:

the heat conducting piece comprises a first section and a second section which are connected with each other, the first section and the second section are of an integral structure, and the first section and the second section are not on the same plane; and

a heat sink connected to the second section of the heat conducting member;

the first section is used for mounting the first circuit board, and the second section is used for mounting the second circuit board, so that heat generated by the first circuit board and the second circuit board is conducted to the heat dissipation member for heat dissipation; alternatively, the first and second electrodes may be,

the first section is used for mounting the first circuit board, and heat generated by the first circuit board can be conducted to the heat dissipation member for heat dissipation; the heat dissipation piece is also used for being attached to the second circuit board, so that heat generated by the second circuit board can be dissipated through the heat dissipation piece.

8. The heat dissipating device of claim 7, wherein said heat dissipating member comprises:

a main body; and

the radiating fins are connected to the main body, a heat conduction channel is formed between the main body and at least two radiating fins, and the second section extends into the heat conduction channel and is attached to the main body.

9. The heat dissipating device of claim 8, wherein the main body has a heat-conducting glue-overflowing groove formed thereon, the heat-conducting glue-overflowing groove being located between at least two of the heat dissipating fins, the heat-conducting glue-overflowing groove being communicated with the heat-conducting channel.

10. The heat dissipating device of any one of claims 7 to 9, further comprising:

a first bracket, the first section disposed on the first bracket; and

the second section is arranged on the second support, the second support is connected with the first support, and the second support and the first support are not in the same plane.

11. The heat dissipating device of claim 10, wherein said heat dissipating member is removably mounted to said second bracket; or the heat dissipation piece and the second support are of an integrally formed structure.

12. A heat sink assembly, comprising:

a first circuit board;

a second circuit board; and

the heat dissipating device of any of claims 1 to 11, configured to dissipate heat from the first circuit board and the second circuit board.

13. The heat dissipation assembly of claim 12, wherein the first circuit board generates more heat than the second circuit board.

14. The heat dissipation assembly of claim 12, wherein one or more of a map-transmitting emission chip, a map-transmitting amplification chip, and a map-transmitting processing chip are mounted on the first circuit board; and/or

One or more of a vision processing chip and a memory chip are mounted on the second circuit board.

15. A mobile platform, comprising:

a body; and

the heat dissipating assembly of any of claims 12 to 14, mounted on the fuselage.