CN212251992U - Semiconductor device holder - Google Patents
Semiconductor device holder Download PDFInfo
- Publication number
- CN212251992U CN212251992U CN202020643653.2U CN202020643653U CN212251992U CN 212251992 U CN212251992 U CN 212251992U CN 202020643653 U CN202020643653 U CN 202020643653U CN 212251992 U CN212251992 U CN 212251992U
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- sheet metal
- metal part
- groove
- semiconductor device
- stamping
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Abstract
The utility model discloses a bracket for semiconductor equipment, which comprises a first sheet metal part, wherein a first groove is formed in the middle part of the bracket by stamping; the second sheet metal part is tightly attached to the first sheet metal part, a second groove opposite to the first groove is formed in the middle of the second sheet metal part through stamping, and the second groove and the first groove are encircled to form a through groove; and one end of the third sheet metal part is connected to the first sheet metal part, and the other end of the third sheet metal part is bent and perpendicular to the first sheet metal part. The utility model provides a support for semiconductor device, low in production cost, processing cycle is short, and simple to operate is swift.
Description
Technical Field
The utility model relates to a semiconductor equipment technical field, specifically speaking relates to a support for semiconductor equipment.
Background
Referring to fig. 1, a conventional semiconductor device stand includes four blocks 10, wherein two blocks 10 disposed opposite to each other are formed with semicircular grooves, which cooperate to form a circular through-groove 11 for holding a cylinder. Four block 10 parts all need adopt CNC processing, and CNC working costs is high, and the cycle length of processing is long, and processing equipment is expensive, and processing needs more professional operating personnel, leads to support manufacturing cost very high, does not have any advantage in the trade competition and says, and current supporting structure is complicated loaded down with trivial details simultaneously.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a support for semiconductor device, low in production cost, processing cycle is short, and simple to operate is swift.
The utility model discloses a technical scheme that support for semiconductor device adopted is:
a support for semiconductor equipment comprises a first sheet metal part, wherein a first groove is formed in the middle of the first sheet metal part through stamping; the second sheet metal part is attached to the first sheet metal part, a second groove opposite to the first groove is formed in the middle of the second sheet metal part through stamping, and the second groove and the first groove are encircled to form a through groove; and one end of the third sheet metal part is connected to the first sheet metal part, and the other end of the third sheet metal part is bent and perpendicular to the first sheet metal part.
According to the preferable scheme, in the region where the first sheet metal part and the third sheet metal part are combined, one of the first sheet metal part and the third sheet metal part is provided with a first waist-shaped hole, and the other one is provided with a corresponding round hole.
Preferably, the other end of the third sheet metal part is provided with a second waist-shaped hole.
According to a preferable scheme, the first sheet metal part and the second sheet metal part are connected through stainless iron press riveting screws.
Preferably, the cross section of the through groove is quadrilateral.
Preferably, the cross section of the through groove is square.
The utility model discloses a support for semiconductor device's beneficial effect is: form first recess on making first sheet metal component through the punching press, form the second recess on the second sheet metal component, the second recess encloses into logical groove with the centre gripping cylinder with first recess, and this structure does benefit to through the panel beating mode of bending shaping, reduces processing cost by a wide margin, shortens processing cycle. Third sheet metal component one end is connected in first sheet metal component, and the other end is buckled and is perpendicular with first sheet metal component to this has reduced prior art's spare part quantity, has simplified the installation operation, has reduced the processing cost simultaneously.
Drawings
Fig. 1 is a schematic structural view of a related art stand for a semiconductor device.
Fig. 2 is a schematic structural view of the bracket for semiconductor device of the present invention.
Detailed Description
The invention will be further elucidated and described with reference to the following embodiments and drawings in which:
referring to fig. 2, a bracket for a semiconductor device includes a first sheet metal part 20, a second sheet metal part 30, and a third sheet metal part 40.
The first sheet metal part 20 is formed with a first recess 21 in the middle by stamping. The second sheet metal part 30 is tightly attached to the first sheet metal part 20, and a second groove 31 opposite to the first groove 21 is formed in the middle of the second sheet metal part 30 through stamping. Second recess 31 encloses into logical groove with first recess 21, leads to the groove and is used for the centre gripping cylinder, and this structure does benefit to through panel beating bending mode shaping, reduces substantially the processing cost, shortens processing cycle. Preferably, the cross section of the through groove is quadrilateral, and four sides of the quadrilateral are respectively abutted against the cylinder, so that the through groove is effectively clamped. In this embodiment, the cross section of the through groove is square. The first sheet metal part 20 and the second sheet metal part 30 are connected by a stainless iron clinch bolt 22.
One end of the third sheet metal part 40 is connected to the first sheet metal part 20, and the other end is bent and perpendicular to the first sheet metal part 20. In the region where the first sheet metal part 20 and the third sheet metal part 40 are combined, one of the first sheet metal part 20 and the third sheet metal part 40 is provided with a first waist-shaped hole 41, and the other is provided with a corresponding round hole. The first sheet metal part 20 is connected with the third sheet metal part 40 through a fastener, when the length of the third sheet metal part 40 extending out of the first sheet metal part 20 needs to be adjusted, the fastener can be unscrewed, the position of the circular hole in the length direction of the first waist-shaped hole 41 is adjusted, and screwing is achieved. In this embodiment, two first kidney-shaped holes 41 are provided in parallel.
In the above scheme, the other end of the third sheet metal part 40 is provided with a second waist-shaped hole 42.
The utility model discloses a support for semiconductor device makes first sheet metal component 20 go up to form first recess 21 through the punching press, forms second recess 31 on the second sheet metal component 30, and second recess 31 encloses into logical groove with first recess 21 with the centre gripping cylinder, and this structure does benefit to through the panel beating shaping of bending the processing method, reduces the processing cost by a wide margin, shortens processing cycle. One end of the third sheet metal part 40 is connected to the first sheet metal part 20, and the other end is bent and perpendicular to the first sheet metal part 20, so that the number of parts in the prior art is reduced, the installation operation is simplified, and the processing cost is reduced.
It should be finally noted that the above embodiments are only intended to illustrate the technical solutions of the present invention, and not to limit the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.
Claims (6)
1. A stand for a semiconductor device, comprising
The middle part of the first sheet metal part forms a first groove through stamping;
the second sheet metal part is attached to the first sheet metal part, a second groove opposite to the first groove is formed in the middle of the second sheet metal part through stamping, and the second groove and the first groove form a through groove in a surrounding mode; and
and one end of the third sheet metal part is attached to the first sheet metal part, and the other end of the third sheet metal part is bent and perpendicular to the first sheet metal part.
2. The bracket for semiconductor equipment according to claim 1, wherein in a region where the first sheet metal part and the third sheet metal part meet, one of the first sheet metal part and the third sheet metal part is provided with a first kidney-shaped hole, and the other is provided with a corresponding circular hole.
3. The bracket for semiconductor equipment according to claim 1, wherein the other end of the third sheet metal part is provided with a second kidney-shaped hole.
4. A rack for semiconductor devices according to any of claims 1-3, wherein the first sheet metal part and the second sheet metal part are connected by means of stainless iron clinch bolts.
5. A rack for semiconductor devices according to any of claims 1 to 3, wherein the through-groove has a quadrangular cross section.
6. The stand for semiconductor devices according to claim 5, wherein the through-groove has a square cross section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020643653.2U CN212251992U (en) | 2020-04-26 | 2020-04-26 | Semiconductor device holder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020643653.2U CN212251992U (en) | 2020-04-26 | 2020-04-26 | Semiconductor device holder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212251992U true CN212251992U (en) | 2020-12-29 |
Family
ID=73996925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020643653.2U Active CN212251992U (en) | 2020-04-26 | 2020-04-26 | Semiconductor device holder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212251992U (en) |
-
2020
- 2020-04-26 CN CN202020643653.2U patent/CN212251992U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |