CN212241906U - Traceless injection mold core of electronic product - Google Patents
Traceless injection mold core of electronic product Download PDFInfo
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- CN212241906U CN212241906U CN202020138386.3U CN202020138386U CN212241906U CN 212241906 U CN212241906 U CN 212241906U CN 202020138386 U CN202020138386 U CN 202020138386U CN 212241906 U CN212241906 U CN 212241906U
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- mould benevolence
- die core
- core body
- benevolence body
- mold
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Abstract
The utility model discloses an electron product does not have trace mould benevolence of moulding plastics, including mould benevolence body, the inside round hole of having seted up of mould benevolence body, the round hole link up the inside of mould benevolence body, round hole quantity is established to two, the fixed slot has been seted up on mould benevolence body top surface, mould benevolence body top fixedly connected with boss. The utility model discloses a set up the round hole, the compound die operation of mould benevolence body has been made things convenient for, the compound die efficiency of mould benevolence body has been improved, through setting up fixed slot and boss, prevent that mould benevolence body from producing the lateral deviation and avoid mould benevolence body to produce the vibration when moulding plastics, the stability of mould benevolence body when moulding plastics has been improved, through setting up positioning channel section, can carry out firm locking with the position of mould benevolence body in injection mold, make mould benevolence body can not produce the offset, the effectual plastic product of having avoided after moulding plastics produces the compound die line, the product quality of electronic product plastic shell has been improved.
Description
Technical Field
The utility model relates to a mould plastics mould benevolence technical field, concretely relates to electron product does not have trace mould benevolence of moulding plastics.
Background
The shell of the electronic product is usually made of plastic materials, and is injection-molded through a corresponding injection mold, wherein the injection mold usually comprises a plurality of mold cores, the mold is closed through the mold cores to form an injection mold cavity, and then the plastic is injected into the injection mold cavity for injection molding.
However, when the mold core of the injection mold for electronic products is closed, the mold core cannot be stably fixed in the mold, so that the mold core is impacted to generate position deviation during injection, and then the injection molded plastic product generates a closing line, thereby reducing the quality of the plastic product.
Therefore, it is necessary to provide a traceless injection mold insert for electronic products to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an electron product does not have trace mould benevolence of moulding plastics, through setting up the round hole, the compound die operation of mould benevolence body has been made things convenient for, the compound die efficiency of mould benevolence body has been improved, through setting up fixed slot and boss, prevent that mould benevolence body from producing the lateral shifting and avoid mould benevolence body to produce the vibration when moulding plastics, the stability of mould benevolence body when moulding plastics has been improved, through setting up positioning channel section, can carry out firm locking with the position of mould benevolence body in injection mold, make mould benevolence body can not produce the offset, with the above-mentioned weak point in the.
In order to achieve the above object, the present invention provides the following technical solutions: the utility model provides an electron product does not have trace mould benevolence of moulding plastics, includes mould benevolence body, the inside round hole that has seted up of mould benevolence body, the round hole link up the inside of mould benevolence body, the round hole quantity is established to two, the fixed slot has been seted up on mould benevolence body top surface, the fixed slot is established in one side position on the top of mould benevolence body, mould benevolence body top fixedly connected with boss, the boss is established in one side position of fixed slot, mould benevolence body side surface has seted up the square groove, the square groove is established in one side that the boss was kept away from to mould benevolence body, a side surface that mould ben.
Preferably, the two circular holes are respectively arranged at two sides of the die core body, and the two circular holes are symmetrically distributed about the central axis of the die core body.
Preferably, the fixing grooves are vertically distributed with the bosses.
Preferably, the cross section of the positioning clamping groove is L-shaped.
Preferably, the number of the positioning clamping grooves is two, and the two positioning clamping grooves are symmetrically distributed about the central axis of the mold core body.
In the technical scheme, the utility model provides a technological effect and advantage:
through setting up the round hole, the compound die operation of mould benevolence body has been made things convenient for, the compound die efficiency of mould benevolence body has been improved, through setting up fixed slot and boss, prevent that mould benevolence body from producing the lateral shifting and avoid mould benevolence body to produce the vibration when moulding plastics, the stability of mould benevolence body when moulding plastics has been improved, through setting up positioning channel section, can carry out firm locking with the position of mould benevolence body in injection mold, make mould benevolence body can not produce the offset, the effectual plastic product of having avoided after moulding plastics produces the joint line, the product quality of electronic product plastic shell has been improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings can be obtained by those skilled in the art according to these drawings.
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic view of another overall structure of the present invention;
FIG. 3 is a schematic view of the overall structure of the back side of the present invention;
fig. 4 is a top cross-sectional view of the present invention;
fig. 5 is an enlarged view of the structure of the portion a of fig. 2 according to the present invention.
Description of reference numerals:
1 mould benevolence body, 2 round holes, 3 fixed slots, 4 bosss, 5 square grooves, 6 positioning slot.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings.
The utility model provides a no trace injection mould benevolence of electronic product as shown in fig. 1-5, including mould benevolence body 1, round hole 2 has been seted up to mould benevolence body 1 inside, round hole 2 link up the inside of mould benevolence body 1, the quantity of round hole 2 is set to two, mould benevolence body 1 top surface is seted up fixed slot 3, fixed slot 3 is established in the top one side position of mould benevolence body 1, mould benevolence body 1 top fixedly connected with boss 4, boss 4 is established in one side position of fixed slot 3, mould benevolence body 1 one side surface is seted up square groove 5, square groove 5 is established in mould benevolence body 1 one side of keeping away from boss 4, mould benevolence body 1 is close to one side surface of square groove 5 and is seted up positioning slot 6, positioning slot 6 is established in;
further, in the above technical scheme, the two circular holes 2 are respectively arranged at two sides of the die core body 1, the two circular holes 2 are symmetrically distributed about the central axis of the die core body 1, and the die core body 1 is movably mounted in the die through the circular holes 2, so that the die closing operation of the die core body 1 is greatly facilitated, and the die closing efficiency of the die core body 1 is improved;
further, in the above technical solution, the fixing grooves 3 and the bosses 4 are vertically distributed, and by arranging the fixing grooves 3 and the bosses 4, the die core body 1 is prevented from generating lateral deviation and the die core body 1 is prevented from generating vibration during injection molding;
further, in the above technical solution, the cross section of the positioning card slot 6 is L-shaped;
furthermore, in the above technical scheme, the number of the positioning clamping grooves 6 is two, the two positioning clamping grooves 6 are symmetrically distributed about the central axis of the mold core body 1, the injection mold can clamp and position the mold core body 1 through the positioning clamping grooves 6, so as to prevent the mold core body 1 from longitudinally shifting, and effectively and firmly lock the position of the mold core body 1 in the injection mold;
the implementation mode is specifically as follows: when an injection mold is used for closing a mold, the circular holes 2 are arranged in the mold core body 1, and the two circular holes 2 are symmetrically distributed about the central axis of the mold core body 1, so that the mold core body 1 can be conveniently moved and installed in the mold through the circular holes 2, the mold closing operation of the mold core body 1 is greatly facilitated, the mold closing efficiency of the mold core body 1 is improved, the fixing grooves 3 are arranged on the mold core body 1, when the mold core body 1 is moved to a mold closing position in the injection mold, the injection mold can stably position and fix the mold core body 1 through the fixing grooves 3, the transverse offset of the mold core body 1 is effectively prevented, the bosses 4 are arranged on one side of the fixing grooves 3, the bosses 4 are fixed when the injection mold fixes the mold core body 1 through the fixing grooves 3, and the bosses 4 on the mold core body 1 are effectively prevented from vibrating during injection molding after being fixed in the injection mold, the stability of the die core body 1 during injection molding is improved, the square groove 5 is arranged to facilitate the position butt joint and positioning of the die core body 1 in an injection mold, the position accuracy of the die core body 1 in the injection mold is improved, the die closing accuracy is improved, the accuracy of a die cavity is ensured, the injection molding accuracy of an injection molding product is improved, the positioning clamping groove 6 is arranged, the injection mold can clamp and position the die core body 1 through the positioning clamping groove 6 to prevent the die core body 1 from longitudinally shifting, the position of the die core body 1 in the injection mold is effectively and firmly locked, when in injection molding, the die core body 1 cannot shift under the locking of the positioning clamping groove 6, the die closing line of a plastic product after injection molding can be effectively avoided, the product quality of a plastic shell of an electronic product is improved, and the embodiment particularly solves the problem that the die core cannot be stably fixed in the mold in the prior art, the plastic product after injection molding has a mold clamping line.
This practical theory of operation:
referring to the attached drawings 1-5 of the specification, when an injection mold is used for mold closing, the circular holes 2 are arranged in the mold core body 1, and the two circular holes 2 are symmetrically distributed about the central axis of the mold core body 1, so that the mold core body 1 can be conveniently moved and installed in the mold through the circular holes 2, the mold closing operation of the mold core body 1 is greatly facilitated, the mold closing efficiency of the mold core body 1 is improved, the fixing grooves 3 are arranged on the mold core body 1, when the mold core body 1 is moved to a mold closing position in the injection mold, the injection mold can stably fix the mold core body 1 through the fixing grooves 3, the bosses 4 are arranged on one side of the fixing grooves 3, the bosses 4 are fixed when the injection mold fixes the mold core body 1 through the fixing grooves 3, and after the bosses 4 on the mold core body 1 are fixed in the injection mold, the vibration of the mold core body 1 during, through setting up square groove 5, make things convenient for mould benevolence body 1 to carry out the position butt joint location in injection mold, the accuracy nature of mould benevolence body 1 position in injection mold has been improved, through setting up positioning groove 6, injection mold accessible positioning groove 6 is with the location of mould benevolence body 1 joint, prevent that mould benevolence body 1 from producing vertical skew, effectual carry out firm locking with the position of mould benevolence body 1 in injection mold, when moulding plastics, mould benevolence body 1 is under the locking through positioning groove 6, can not produce the offset.
While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that the described embodiments may be modified in various different ways without departing from the spirit and scope of the present invention. Accordingly, the drawings and description are illustrative in nature and should not be construed as limiting the scope of the invention.
Claims (5)
1. The utility model provides an electron product does not have trace mould benevolence of moulding plastics, includes mould benevolence body (1), its characterized in that: the die core comprises a die core body (1), wherein a round hole (2) is formed in the die core body (1), the round hole (2) penetrates through the die core body (1), the number of the round holes (2) is two, a fixing groove (3) is formed in the top end surface of the die core body (1), the fixing groove (3) is formed in one side of the top end of the die core body (1), a boss (4) is fixedly connected to the top end of the die core body (1), the boss (4) is arranged in one side of the fixing groove (3), a square groove (5) is formed in one side surface of the die core body (1), the square groove (5) is formed in one side of the die core body (1) away from the boss (4), a positioning clamping groove (6) is formed in one side surface of the die core body (1) close to the square groove (5), and the positioning clamping.
2. The traceless injection molding die core of the electronic product according to claim 1, wherein: the two circular holes (2) are respectively arranged at two sides of the die core body (1), and the two circular holes (2) are symmetrically distributed about the central axis of the die core body (1).
3. The traceless injection molding die core of the electronic product according to claim 1, wherein: the fixing grooves (3) and the bosses (4) are vertically distributed.
4. The traceless injection molding die core of the electronic product according to claim 1, wherein: the cross section of the positioning clamping groove (6) is L-shaped.
5. The traceless injection molding die core of the electronic product according to claim 1, wherein: the number of the positioning clamping grooves (6) is two, and the two positioning clamping grooves (6) are symmetrically distributed about the central axis of the die core body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020138386.3U CN212241906U (en) | 2020-01-21 | 2020-01-21 | Traceless injection mold core of electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020138386.3U CN212241906U (en) | 2020-01-21 | 2020-01-21 | Traceless injection mold core of electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212241906U true CN212241906U (en) | 2020-12-29 |
Family
ID=73989894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020138386.3U Active CN212241906U (en) | 2020-01-21 | 2020-01-21 | Traceless injection mold core of electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212241906U (en) |
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2020
- 2020-01-21 CN CN202020138386.3U patent/CN212241906U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220303 Address after: 215000 Building 5, No.3 Qianzhu Road, Yuexi street, Wuzhong Economic Development Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou Shishang Intelligent Electronics Co.,Ltd. Address before: Room 4, No.4, industrial zone, original enterprise base, no.2588 Huanqing Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province 215000 Patentee before: Kunshan shundanuo Precision Electronic Technology Co.,Ltd. |
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| TR01 | Transfer of patent right |