CN212221617U

CN212221617U - Wafer loader-unloader

Info

Publication number: CN212221617U
Application number: CN202020729658.7U
Authority: CN
Inventors: 朱育民; 钟卓君; 黄嘉修
Original assignee: E&R ENGINEERING CORP
Current assignee: E&R ENGINEERING CORP
Priority date: 2020-05-07
Filing date: 2020-05-07
Publication date: 2020-12-25
Anticipated expiration: 2030-05-07

Abstract

The utility model discloses a wafer loader, it can provide the wafer storage state in the not unidimensional wafer box is placed and detectable wafer box, this wafer loader contains a machine platform that has the additional circuit board, and be used for the positioning mechanism who places the wafer box on this additional circuit board in this machine platform setting, this positioning mechanism has the positioning element, lock joint unit and spacing unit are in order to provide the not unidimensional wafer box location, so this wafer loader is applicable in many types of wafer box, so the suitability is good, set up a sensing mechanism on this additional circuit board, and set up a detection mechanism on this machine platform, this detection mechanism has a first detection group and a second detection group, according to the not unidimensional wafer and choose for use first detection group or second detection group to carry out the detection of wafer storage state, can improve detection convenience and efficiency.

Description

Wafer loader-unloader

Technical Field

The present invention relates to a wafer loader, and more particularly to a wafer loader for placing wafer cassettes of different types.

Background

Wafers with different sizes can be placed by adopting different wafer boxes, and the different wafer boxes need to be placed by adopting a special machine, so that the special machines which are suitable for the wafer boxes with different sizes are individually configured according to the wafer boxes with different sizes, namely, a single special machine cannot be suitable for the wafer boxes with different sizes, so that the applicability of the existing special machine is poor, and the industrial requirements cannot be met.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a wafer loader/unloader, which improves the problem that the present special-purpose machine cannot be applied to wafer boxes of different sizes.

To achieve the object of the disclosure, the wafer loader can provide wafer boxes of different sizes to place and detect the wafer storage state in the wafer boxes, and the wafer loader comprises:

a machine table, which is provided with an additional circuit board for placing the wafer box, and a chute is formed on the additional circuit board;

a positioning mechanism, which is arranged on the machine table and is used for positioning the wafer box placed on the additional circuit board, the positioning mechanism is provided with a positioning unit, a fastening unit and a limiting unit, the positioning unit is arranged on the additional circuit board and is provided with three positioning convex parts, the three positioning convex parts protrude out of the top surface of the additional circuit board, the fastening unit is arranged on the machine table and is provided with a fastening driving component and a fastening seat, the fastening driving component is arranged on the machine table, the fastening seat is arranged on the fastening driving component, wherein the fastening driving component can drive the fastening seat to extend out of the chute, and the limiting unit is arranged on the top surface of the additional circuit board;

a sensing mechanism, which is arranged on the additional circuit board of the machine platform; and

a detection mechanism disposed on one side of the machine platform and located on one side of the additional circuit board and used for detecting the storage state of the wafer in the wafer box, the detection mechanism having a first detection set and a second detection set, the first detection set being disposed on the machine platform and including a first driving member, a first L-shaped arm, a first transmission member and a first detection unit, the first driving member being disposed on the machine platform, the first L-shaped arm being rotatably disposed on the machine platform, the first transmission member being disposed on the machine platform and connected to the first driving member and the first L-shaped arm, the first detection unit being disposed on the first L-shaped arm and having two first detection portions disposed at intervals, the second detection set being disposed on the machine platform and opposite to the first detection set, the second detection set including a second driving member, a second L-shaped arm, a second transmission member and a second detection unit, the second driving member being disposed on the machine platform, the second L-shaped arm is rotatably arranged on the machine table, the second transmission part is arranged on the machine table and connected with the second driving part and the second L-shaped arm, the second detection unit is arranged on the second L-shaped arm and provided with two second detection parts arranged at intervals, and the distance between the two first detection parts is smaller than that between the two second detection parts.

Optionally, the sensing mechanism includes a first sensing element, a second sensing element, a third sensing element, a fourth sensing element, a fifth sensing element, a seventh sensing element and an eighth sensing element protruding out of the top surface of the additional circuit board, the first sensing element and the second sensing element form an 8-inch bare-chip wafer sensing set, the third sensing element, the fourth sensing element, the fifth sensing element and the sixth sensing element form a 12-inch iron frame wafer sensing set, and the third sensing element, the fourth sensing element, the fifth sensing element, the sixth sensing element, the seventh sensing element and the eighth sensing element form a 12-inch bare-chip wafer sensing set.

Optionally, the wafer loader comprises an adapter plate, the adapter plate is placed on the additional circuit board, the positioning convex portion of the positioning unit extends into the adapter plate, the adapter plate is buckled with the adapter plate by the buckling unit, the adapter plate is provided with two pressing plates arranged at intervals, the two pressing plates are pivoted on the adapter plate and respectively abut against the fifth sensing piece and the sixth sensing piece, and the fifth sensing piece and the sixth sensing piece form an 8-inch iron frame type wafer sensing set.

Optionally, the sensing mechanism includes a ninth sensing element and a tenth sensing element protruding out of the top surface of the additional circuit board, and the seventh sensing element, the eighth sensing element, the ninth sensing element and the tenth sensing element form a board sensing set.

Optionally, a plurality of stoppers are arranged on the top surface of the adapter plate at intervals.

Optionally, the fastening driving assembly includes a transverse driving member and a longitudinal driving member, the transverse driving member is disposed on the machine platform, the longitudinal driving member is disposed and controlled by the transverse driving member to move transversely, and the fastening seat is disposed and controlled by the longitudinal driving member to move longitudinally.

Optionally, a cover is disposed on the machine platform, and the cover covers the additional circuit board.

Optionally, an opening is formed in the machine table, an assembling seat is arranged on the machine table, and an opening and closing driving member is arranged in the machine table, connected with the assembling seat and driving the assembling seat to open and close the opening.

Optionally, the detection mechanism is disposed on the mounting seat.

Optionally, a displacement adjusting assembly is arranged on the machine table, and the displacement adjusting assembly is connected with and drives the additional circuit board to move.

Optionally, the displacement adjusting assembly includes a motor, a screw rod and a sliding block, the motor is disposed on the machine, the screw rod is disposed and controlled by the motor, and the sliding block is fixedly disposed on the bottom surface of the additional circuit board and is screwed to the screw rod.

Optionally, the first transmission member and the second transmission member are both belt transmission members, the first transmission member and the second transmission member both include a pneumatic cylinder and a clamping arm, the pneumatic cylinder is disposed on the machine, the clamping arm is disposed and controlled by the pneumatic cylinder, and the clamping arm clamps the corresponding belt transmission member

In the above, the wafer loader can position the wafer cassettes of different sizes by the positioning mechanism, and the positioning unit is adopted to position, the positioning unit is matched with the buckling unit to position, or the limiting unit to position, so that the wafer loader has good applicability, in addition, the detection mechanism provides the first detection group and the second detection group, the first detection group or the second detection group is selected to detect the wafer storage state according to the size of the wafer in the wafer cassette placed on the additional circuit board, if the first detection group can be selected for detecting 8-inch wafers, the first driving piece drives the first L-shaped arm to rotate through the first driving piece, and the two first detection parts on the first L-shaped arm pass through two sides of the wafer and detect; if the second detection set can be selected for detecting the 12-inch wafer, the second driving part drives the second L-shaped arm to rotate through the second transmission part, so that the detection mechanism can improve the detection convenience.

Drawings

FIG. 1: for the wafer loader of the present invention, a three-dimensional appearance diagram of the first wafer box is placed.

FIG. 2: is another perspective appearance schematic diagram of fig. 1.

FIG. 3: is a partial schematic view of the exploded perspective view of fig. 2.

FIG. 4: is a partial perspective view of the flip cover of fig. 1.

FIG. 5: is a partially schematic view of the uncapped three-dimensional appearance of the first wafer cassette of fig. 2.

FIG. 6: is the partial schematic view of the three-dimensional appearance of the cover of the wafer loader and unloader of the present invention.

FIG. 7: is a top plan view of fig. 6.

FIG. 8: a schematic perspective view of the additional circuit board of fig. 6 with the interposer disposed thereon.

FIG. 9: is an exploded perspective view of fig. 8.

FIG. 10: is a top plan view of fig. 8.

FIG. 11: is a cross-sectional view of the A-A section line of FIG. 10.

FIG. 12: is a schematic three-dimensional appearance diagram of the fastening unit of the wafer loader of the present invention.

FIG. 13: is the three-dimensional appearance schematic diagram of the displacement adjusting component of the wafer loader and unloader of the utility model.

FIG. 14: a schematic perspective view of the first type of wafer cassette is provided in fig. 6.

FIG. 15: is an exploded perspective view of fig. 14.

FIG. 16: do the utility model discloses the wafer loader has placed the three-dimensional outward appearance sketch map of second style wafer box.

FIG. 17: is a partial schematic perspective view of the wafer handler of FIG. 16 with the lid removed.

FIG. 18: is an exploded perspective view of fig. 17.

FIG. 19: do the utility model discloses the lid of wafer loader takes off and has placed the local sketch map of the three-dimensional outward appearance of third style wafer box.

FIG. 20: is an exploded perspective view of fig. 19.

FIG. 21: do the utility model discloses the lid of wafer loader takes off and has placed the local sketch map of the three-dimensional outward appearance of fourth style wafer box.

FIG. 22: is an exploded perspective view of fig. 21.

FIG. 23: do the utility model discloses the lid of wafer loader takes off and has placed the local sketch map of the three-dimensional outward appearance of fifth wafer box.

FIG. 24: is an exploded perspective view of fig. 23.

FIG. 25: is the partial schematic view of the three-dimensional appearance of the sixth wafer cassette placed on the lid of the wafer loader of the present invention.

FIG. 26: is an exploded perspective view of fig. 25

FIG. 27 is a schematic view showing: do the utility model discloses the lid of wafer loader takes off and has placed the local sketch map of the three-dimensional outward appearance of seventh style wafer box.

FIG. 28: is an exploded perspective view of fig. 27.

Detailed Description

The following description of the preferred embodiments of the present invention will be made in conjunction with the drawings and the accompanying drawings to further illustrate the technical means adopted to achieve the objects of the present invention.

As shown in fig. 1, 2, and 14 to 28, the wafer handler of the present invention can provide wafer cassettes of different sizes to be placed and can detect the wafer storage state in the wafer cassettes, as shown in fig. 5 to 7, the wafer handler includes a machine 10, a positioning mechanism 20, a sensing mechanism 30, and a detecting mechanism 40.

The machine 10 has an additional circuit board 11 for placing the wafer box, and a sliding slot 12 is formed on the additional circuit board 11.

The positioning mechanism 20 is disposed on the machine 10 and is used for positioning the wafer cassette placed on the additional circuit board 11, the positioning mechanism 20 has a positioning unit 21, a fastening unit 22 and a limiting unit 23, the positioning unit 21 is disposed on the additional circuit board 11 and has three positioning protrusions 24, the three positioning protrusions 24 protrude out of the top surface of the additional circuit board 11, the fastening unit 22 is disposed on the machine 10 and has a fastening driving component 25 and a fastening seat 26, the fastening driving component 25 is disposed on the machine 10, the fastening seat 26 is disposed on the fastening driving component 25, wherein the fastening driving component 25 can drive the fastening seat 26 to extend out of the sliding slot 12, and the limiting unit 23 is disposed on the top surface of the additional circuit board 11.

The sensing mechanism 30 is disposed on the additional circuit board 11 of the machine 10, wherein the sensing mechanism 30 includes a first sensing element 31, a second sensing element 32, a third sensing element 33, a fourth sensing element 34, a fifth sensing element 35, a seventh sensing element 37 and an eighth sensing element 38 protruding out of the top surface of the additional circuit board 11, the first sensing element 31 and the second sensing element 32 form an 8-inch die-type wafer sensing set, the third sensing element 33, the fourth sensing element 34, the fifth sensing element 35 and the sixth sensing element 36 form a 12-inch iron frame-type wafer sensing set, and the third sensing element 33, the fourth sensing element 34, the fifth sensing element 35, the sixth sensing element 36, the seventh sensing element 37 and the eighth sensing element 38 form a 12-inch die-type wafer sensing set.

The detecting mechanism 40 is disposed on the machine 10 and located on one side of the additional circuit board 11, and is used for detecting the storage status of the wafer in the wafer cassette, the detecting mechanism 40 has a first detecting set 41 and a second detecting set 42, the first detecting set 41 is disposed on the machine 10 and includes a first driving member 411, a first L-shaped arm 412, a first transmission member 413 and a first detecting unit 414, the first driving member 411 is disposed on the machine 10, the first L-shaped arm 412 is rotatably disposed on the machine 10, the first transmission member 413 is disposed on the machine 10 and connects the first driving member 411 and the first L-shaped arm 412, the first detecting unit 414 is disposed on the first L-shaped arm 412 and has two first detecting portions 415 disposed at intervals, the second detecting set 42 is disposed on the machine 10 and is opposite to the first detecting set 41, the second detecting set 42 includes a second driving member 421, a second L-shaped arm 422, a third L-shaped arm 422, and a third detecting unit 414, A second transmission member 423 and a second detection unit 424, the second driving member 421 is disposed on the machine platform 10, the second L-shaped arm 422 is rotatably disposed on the machine platform 10, the second transmission member 423 is disposed on the machine platform 10 and is connected to the second driving member 421 and the second L-shaped arm 422, the second detection unit 424 is disposed on the second L-shaped arm 422 and has two second detection portions 425 disposed at intervals, the interval between the two first detection portions 415 is smaller than the interval between the two second detection portions 425, the first detection set 41 and the second detection set 42 of the detection mechanism 40 can be used to detect the wafer storage state placed in the wafer cassette, and the storage state includes wafer missing, stacking, oblique insertion, deformation, and position.

In the above, the first transmission member 413 and the second transmission member 423 are both belt transmission members, the first driving member 411 and the second driving member 421 both include a pneumatic cylinder 43 and a clamping arm 44, the pneumatic cylinder 43 is disposed on the machine table 10, the clamping arm 44 is disposed and controlled by the pneumatic cylinder 43, and the clamping arm 44 clamps the corresponding belt transmission member.

Wherein, the wafer handler comprises an adapter plate 50, the adapter plate 50 is placed on the additional circuit board 11, three first fixing slots 52 and a second fixing slot 53 are formed on the bottom surface of the adapter plate 50, the positioning protrusion 24 of the positioning unit 21 extends into the first fixing slot 52 of the adapter plate 50, the fastening seat 26 of the fastening unit 22 extends into the second fixing slot 53 of the adapter plate 50 to fasten the adapter plate 50, the adapter plate 50 has two pressing plates 51 arranged at intervals, the two pressing plates 51 are pivoted on the adapter plate 50 and respectively abut against the fifth sensing element 35 and the sixth sensing element 36, the fifth sensing element 35 and the sixth sensing element 36 form an 8-inch iron frame type wafer sensing set, the sensing mechanism 30 comprises a ninth sensing element 39 and a tenth sensing element 391 protruding out of the top surface of the additional circuit board 11, the seventh sensing element 37, the eighth sensing element 38, The ninth sensing member 39 and the tenth sensing member 391 form a sensing group of an adapter plate 50, and a plurality of stoppers 54 are disposed on the top surface of the adapter plate 50.

As shown in fig. 12, the fastening driving assembly 25 includes a transverse driving member 27 and a longitudinal driving member 28, the transverse driving member 27 is disposed on the machine 10, the longitudinal driving member 28 is disposed and controlled by the transverse driving member 27 to move transversely, the fastening seat 26 is disposed and controlled by the longitudinal driving member 28 to move longitudinally, wherein the longitudinal driving member 28 can be a pneumatic cylinder.

As shown in fig. 1 and 4, a cover 60 is disposed on the machine 10, and the cover 60 covers the additional circuit board 11.

As shown in fig. 2, 3 and 5, an opening 13 is formed on the machine 10, and a mounting seat 14 is disposed on the machine 10, an opening/closing driving member 15 is disposed in the machine 10, the opening/closing driving member 15 is connected to a linking arm 16, and the end of the linking arm 16 is connected to the mounting seat 14, so that the opening/closing driving member 15 can drive the mounting seat 14 through the linking arm 16 to control the opening/closing of the opening 13, in addition, the detecting mechanism 40 is disposed on the mounting seat 14, the first L-shaped arm 412 and the second L-shaped arm 422 of the detecting mechanism 40 are respectively disposed on two sides of the mounting seat 14, and the positions of the first L-shaped arm 412 and the second L-shaped arm 422 are adjusted through the corresponding pneumatic cylinder 43, and the detecting mechanism retreats if waiting; if the wafer loader is required to be scanned, the wafer loader is advanced, and the wafer loader comprises a door opener 70, the door opener 70 is disposed on the assembly base 14, the door opener 70 comprises two suction nozzle units 71 and a knob unit 72, the two suction nozzle units 71 are disposed on the assembly base 14, the knob unit 72 is disposed on the assembly base 14 and comprises a linkage driving member 73, a connecting rod 74 and two knobs 75, the linkage driving member 73 is disposed on the assembly base 14, the connecting rod 74 is connected with the linkage driving member 73, the two knobs 75 are disposed on the assembly base 14 and connected with the connecting rod 74, wherein the linkage driving member 73 can be a pneumatic cylinder.

As shown in fig. 13, a displacement adjusting assembly 80 is disposed on the machine table 10, the displacement adjusting assembly 80 is connected to and drives the additional circuit board 11 to move, the displacement adjusting assembly 80 includes a motor 81, a screw 82 and a sliding block 83, the motor 81 is disposed on the machine table 10, the screw 82 is disposed and controlled by the motor 81, the sliding block 83 is fixedly disposed on the bottom surface of the additional circuit board 11 and screwed to the screw 82, wherein the motor 81 drives the screw 82 to rotate, the sliding block 83 moves along the axis of the screw 82, the additional circuit board 11 moves together with the sliding block 83, and thus the position of the additional circuit board 11 can be adjusted according to the size of the wafer cassette.

As shown in fig. 1 to 3, 14 and 15, the wafer handler provides a first type of wafer cassette 90A for placement, the bottom surface of the first type of wafer cassette 90A forms three positioning slots 91 and a fastening slot 92, and the rear side surface of the first type of wafer cassette 90A is provided with a door 93, the first type of wafer cassette 90A is placed on the additional circuit board 11 of the machine 10, the three positioning protrusions 24 of the positioning unit 21 respectively extend into the three positioning slots 91 of the first type of wafer cassette 90A to primarily position the first type of wafer cassette 90A on the additional circuit board 11, the fastening driving assembly 25 drives the fastening base 26 to move laterally and longitudinally through the lateral driving member 27 and the longitudinal driving member 28, so that the fastening base 26 can extend out of the sliding slot 12 of the additional circuit board 11 and extend into the fastening slot 92 of the first type of wafer cassette 90A to further position the first type of wafer cassette 90A on the additional circuit board 11, the positioning stability of the first wafer cassette 90A on the additional circuit board 11 is improved, and then the door 93 of the first wafer cassette 90A is removed by the door opener 70 so as to facilitate the subsequent detection operation of the detection mechanism 40, during the door opening process, the door opener 70 drives the assembly seat 14 through the opening/closing driving member 15, so that the two suction nozzle units 71 move towards the door 93 to adsorb the door 93, and the knob 75 of the knob unit 72 extends into the knob hole 94 of the door 93, the linkage driving member 73 drives the two knobs 75 through the connecting rod 74, thereby achieving the purpose of opening the door 93.

As shown in fig. 5, after the door 93 is opened, the detecting mechanism 40 can select the first detecting set 41 or the second detecting set 42 to detect the wafer storage state in the first wafer cassette 90A, if the size of the wafer placed in the first wafer cassette 90A is 8 inches, the first detecting set 41 can be selected, if the size of the wafer placed in the first wafer cassette 90A is 12 inches, the second detecting set 42 can be selected, taking the first detecting set 41 as an example, the pneumatic cylinder 43 of the first driving member 411 can drive the clamping arm 44 to move up and down, the clamping arm 44 clamps the first transmission member 413 to move up and down, the first transmission member 413 drives the first L-shaped arm 412 to rotate, and the first detecting unit 414 on the first L-shaped arm 412 further detects the wafer storage state through the two first detecting portions 415; on the contrary, if the second detecting set 42 is selected, the detecting operation principle of the second detecting set 42 is the same as the detecting operation principle of the first detecting set 41, wherein when the first type of wafer cassette 90A is placed on the additional circuit board 11, the first type of wafer cassette 90A triggers the third sensing element 33, the fourth sensing element 34, the fifth sensing element 35, the sixth sensing element 36, the seventh sensing element 37 and the eighth sensing element 38 of the sensing mechanism 30, so as to know whether the first type of wafer cassette 90A is placed or not.

As shown in fig. 16 to 18, the wafer handler provides a second type of wafer cassette 90B for placement, three positioning slots 91 are formed on the bottom surface of the second type of wafer cassette 90B, the second type of wafer cassette 90B is placed on the additional circuit board 11 of the machine 10, the three positioning protrusions 24 of the positioning unit 21 respectively extend into the three positioning slots 91 of the second type of wafer cassette 90B, the positioning mechanism 20 positions the second type of wafer cassette 90B on the additional circuit board 11 through the positioning unit 21, further covers the cover 60 to prevent the second type of wafer cassette 90B from being collided, so as to achieve the purpose of protecting the second type of wafer cassette 90B, wherein when the second type of wafer cassette 90B is placed on the additional circuit board 11, the second type of wafer cassette 90B will trigger the third sensing element 33, the fourth sensing element 34, the fifth sensing element 35 and the sixth sensing element 36 of the sensing mechanism 30, thereby knowing whether the second type of cassette 90B is placed or not.

Referring to fig. 19 to 24, the wafer handler can provide a third type wafer cassette 90C, a fourth type wafer cassette 90D, and a fifth type wafer cassette 90E for placement, and can achieve the positioning purpose through the position-limiting blocks 29 of the position-limiting units 23 of the positioning mechanism 20, taking the placement of the third type wafer cassette 90C as an example, the third type wafer cassette 90C is placed on the additional circuit board 11 of the wafer handler, and the bottom edges and the front edges of the two outer sides of the third type wafer cassette 90C respectively abut against the corresponding position-limiting blocks 29, so that the third type wafer cassette 90C can be stably positioned on the additional circuit board 11, the fourth type wafer cassette 90D and the fifth type wafer cassette 90E are both positioned on the additional circuit board 11 through the position-limiting blocks 29, wherein the third type wafer cassette 90C, the fourth type wafer cassette 90D, and the fifth type wafer cassette 90E are used for storing 8 inches of wafers, in addition, when the third type of wafer cassette 90C, the fourth type of wafer cassette 90D, and the fifth type of wafer cassette 90E are placed on the additional circuit board 11, the first sensing element 31 and the second sensing element 32 of the sensing mechanism 30 are triggered, and the placement of the third type of wafer cassette 90C, the fourth type of wafer cassette 90D, and the fifth type of wafer cassette 90E is known through the triggering of the first sensing element 31 and the second sensing element 32.

Referring to fig. 25 to 28, the wafer handler can provide a sixth wafer cassette 90F and a seventh wafer cassette 90G through the adapter plate 50, and referring to fig. 8 to 11, the adapter plate 50 is first placed and positioned on the additional circuit board 11, the positioning protrusion 24 of the positioning unit 21 extends into the first fixing groove 52 of the adapter plate 50, the fastening driving component 25 of the fastening unit 22 drives the fastening seat 26, so that the fastening seat 26 extends out of the chute 12 and extends into the second fixing groove 53 of the adapter plate 50, the adapter plate 50 is stably positioned on the additional circuit board 11 through the positioning unit 21 and the fastening unit 22 of the positioning mechanism 20, referring to fig. 25 and 26, for example, to provide the placement of the sixth wafer cassette 90F, the sixth wafer cassette 90F is directly placed on the adapter plate 50, and the outer bottom edge of the sixth wafer cassette 90F abuts against the stopper 54 on the adapter plate 50, the sixth wafer cassette 90F is positioned on the adapter plate 50 by the stop of the stop block 54, so that the sixth wafer cassette 90F is indirectly positioned on the additional circuit board 11 by the adapter plate 50, similarly, referring to fig. 27 and 28, the seventh wafer cassette 90G is positioned on the adapter plate 50 by the stop of the stop block 54 and is indirectly positioned on the additional circuit board 11 by the adapter plate 50, referring to fig. 9 to 11, 25 and 26, if the sixth wafer cassette 90F is placed on the adapter plate 50, the sixth wafer cassette 90F presses the two pressing plates 51 on the adapter plate 50 downward to displace the two pressing plates 51 downward, so that the fifth sensing member 35 and the sixth sensing member 36 under the two pressing plates 51 are used to sense whether a wafer cassette is placed on the adapter plate 50 or not, in addition, when the interposer 50 is placed on the additional circuit board 11, the interposer 50 will press against and touch the seventh sensing element 37, the eighth sensing element 38, the ninth sensing element 39 and the tenth sensing element 391 of the sensing mechanism 30, and the placement of the interposer 50 is known through the touch of the seventh sensing element 37, the eighth sensing element 38, the ninth sensing element 39 and the tenth sensing element 391.

In summary, the positioning mechanism 20 of the wafer handler provides the positioning unit 21, the fastening unit 22 and the limiting unit 23 to provide wafer cassettes of different sizes and types to be positioned on the additional circuit board 11, and further provides the adapter plate 50 to allow the adapter plate 50 to be positioned on the additional circuit board 11 through the positioning unit 21 and the fastening unit 22, and provide wafer cassettes of other types to be placed, and the stopper 54 on the adapter plate 50 provides positioning to allow the wafer cassettes to be indirectly positioned on the additional circuit board 11, so that the wafer handler can provide a plurality of wafer cassettes to be placed respectively, thereby effectively improving applicability, in addition, the detecting mechanism 40 of the wafer handler provides the first detecting set 41 and the second detecting set 42, and the distance between the two first detecting portions 415 is smaller than the distance between the two second detecting portions 425, so that the first detecting set 41 or the second detecting set 42 can be selected according to the size of the wafer to be detected, the detection convenience is improved.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and although the present invention has been disclosed with the preferred embodiment, but not limited to the present invention, any skilled person in the art can make some modifications or equivalent changes to the technical content disclosed above without departing from the technical scope of the present invention, but all the technical matters of the present invention are within the scope of the technical solution of the present invention.

Claims

1. A wafer handler for accommodating wafer cassettes of different sizes and for detecting a wafer storage state in the wafer cassettes, the wafer handler comprising:

2. The wafer handler of claim 1, wherein the sensing mechanism comprises a first sensing element, a second sensing element, a third sensing element, a fourth sensing element, a fifth sensing element, a seventh sensing element and an eighth sensing element protruding from the top surface of the additional circuit board, the first sensing element and the second sensing element form an 8-inch die-type wafer sensing set, the third sensing element, the fourth sensing element, the fifth sensing element and the sixth sensing element form a 12-inch chase-type wafer sensing set, and the third sensing element, the fourth sensing element, the fifth sensing element, the sixth sensing element, the seventh sensing element and the eighth sensing element form a 12-inch die-type wafer sensing set.

3. The wafer handler of claim 2, wherein the wafer handler comprises an adapter plate disposed on the additional circuit board and having positioning protrusions of the positioning units extending into the adapter plate, and the fastening unit fastens the adapter plate, the adapter plate having two pressing plates spaced apart from each other, the two pressing plates being pivotally mounted on the adapter plate and abutting against the fifth sensing element and the sixth sensing element, respectively, and the fifth sensing element and the sixth sensing element forming an 8-inch chase type wafer sensing group.

4. The wafer handler of claim 3, wherein the sensing mechanism includes a ninth sensing element and a tenth sensing element protruding from the top surface of the additional circuit board, the seventh sensing element, the eighth sensing element, the ninth sensing element and the tenth sensing element forming a joint plate sensing set.

5. The wafer handler of claim 3, wherein the top surface of the interposer is provided with a plurality of spaced apart stops.

6. The wafer handler of any one of claims 1 to 5, wherein the latch driver assembly comprises a transverse driver disposed on the platform and a longitudinal driver disposed and controlled to move transversely by the transverse driver, and the latch seat is disposed and controlled to move longitudinally by the longitudinal driver.

7. The wafer handler of any one of claims 1 to 5, wherein a lid is disposed on the platform, the lid covering the additional circuit board.

8. The wafer handler of any one of claims 1 to 5, wherein the platform has an opening formed therein, and the platform has a mounting seat disposed thereon, and the platform has an opening/closing driving member disposed therein, the opening/closing driving member being connected to the mounting seat and driving the mounting seat to open/close the opening.

9. The wafer handler of claim 8, wherein the detection mechanism is disposed on the mount.

10. The wafer handler of any one of claims 1 to 5, wherein a displacement adjustment assembly is disposed on the platform, the displacement adjustment assembly being coupled to and configured to move the additional circuit board.

11. The wafer handler of claim 10, wherein the displacement adjustment assembly comprises a motor disposed on the platform, a screw disposed and controlled by the motor, and a slider fixedly disposed on the bottom surface of the additional pcb and threadedly coupled to the screw.

12. The wafer handler of any one of claims 1 to 5, wherein the first and second actuators are belt actuators, each of the first and second actuators comprises a pneumatic cylinder and a clamping arm, the pneumatic cylinder is disposed on the platform, the clamping arm is disposed and controlled by the pneumatic cylinder, and the clamping arm clamps the corresponding belt actuator.