CN212216626U

CN212216626U - Contact pressing die for circuit board

Info

Publication number: CN212216626U
Application number: CN201922484652.8U
Authority: CN
Inventors: 刘清; 雷鹏; 屈瑛; 李娟�; 杨一煌; 白燕芳; 李英芬; 王飞
Original assignee: Inner Mongolia North Heavy Industries Group Co Ltd
Current assignee: Inner Mongolia North Heavy Industries Group Co Ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-12-25
Anticipated expiration: 2029-12-31

Abstract

The application relates to the field of electronic instrument manufacturing, discloses a contact embossing mold utensil for circuit board, includes: the pressing template comprises a first template and a second template which are arranged adjacently; the first pressing groove is arranged on the lower pressing template, is configured to accommodate a part to be pressed and comprises a first section, a second section and an expanding section, the first section and the expanding section are arranged on the first template, the second section is arranged on the second template, and the expanding section is arranged between the first section and the second section and has a radius larger than that of the first section and the second section; wherein, the first template and the second template can be separated or attached to each other under the action of external force. Further comprising: and the upper pressing template is arranged above the lower pressing template in a covering manner, and a second pressing groove is arranged corresponding to the first pressing groove. The contact pressing die for the circuit board can press and form the contact part for the circuit board by the blank part at one time, and saves processing time and cost.

Description

Contact pressing die for circuit board

Technical Field

The application relates to the field of electronic instrument manufacturing, for example to a contact pressing die for a circuit board.

Background

Among the product parts produced in the market at present, there is a wiring contact on the mounting circuit board, and machining is adopted, for example, a copper alloy wire with the diameter of 2 mm and the length of 14 mm is machined into a finished part product with the diameter of 1 mm and the length of one end of 9 mm.

In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art: in the actual machining process, workers are required to clamp the workpiece through a lathe, and the workpiece is small in size and high in machining difficulty.

Disclosure of Invention

The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview nor is intended to identify key/critical elements or to delineate the scope of such embodiments but rather as a prelude to the more detailed description that is presented later.

The embodiment of the disclosure provides a contact pressing die for a circuit board, which is used for solving the technical problems of high processing difficulty and long processing time of wiring contacts on the circuit board.

In some embodiments, a contact pressing mold for a circuit board includes: the pressing template comprises a first template and a second template which are arranged adjacently; the first pressing groove is arranged on the lower pressing template, is configured to accommodate a part to be pressed and comprises a first section, a second section and an expanding section, the first section and the expanding section are arranged on the first template, the second section is arranged on the second template, and the expanding section is arranged between the first section and the second section and has a radius larger than that of the first section and the second section; wherein, the first template and the second template can be separated or attached to each other under the action of external force.

In some embodiments, a contact pressing mold for a circuit board, further comprising: and the upper pressing template is arranged above the lower pressing template in a covering manner, and a second pressing groove is arranged corresponding to the first pressing groove.

The contact pressing die for the circuit board provided by the embodiment of the disclosure can realize the following technical effects: the contact pressing die for the circuit board can press and form the contact part for the circuit board by the blank part at one time, and saves processing time and cost.

The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.

Drawings

One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the accompanying drawings and not in limitation thereof, in which elements having the same reference numeral designations are shown as like elements and not in limitation thereof, and wherein:

fig. 1 is a schematic structural view of a contact pressing mold for a circuit board according to an embodiment of the disclosure;

fig. 2 is a schematic view of a finished part provided by an embodiment of the present disclosure.

Reference numerals:

1. pressing the template downwards; 10. a first press groove; 101. a first stage; 102. a second stage; 103. a diameter expanding section; 11. a first template; 12. a second template; 2. pressing the template upwards; 20. a second press groove; 21. a third template; 22. a fourth template; 3. positioning pins; 4. positioning holes; 5. a connecting member; 6. a fastener.

Detailed Description

So that the manner in which the features and elements of the disclosed embodiments can be understood in detail, a more particular description of the disclosed embodiments, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.

Fig. 1 is a contact pressing mold for a circuit board according to an embodiment of the present disclosure. As shown in fig. 1, an embodiment of the present disclosure provides a contact pressing mold for a circuit board, including: the lower pressing template 1, the first pressing groove 10, the first template 11 and the second template 12. The lower pressing template 1 comprises a first template 11 and a second template 12 which are adjacently arranged; the first pressing groove 10 is arranged on the lower pressing template 1, is configured to accommodate a part to be pressed and comprises a first section 101, a second section 102 and an expanding section 103, the first section 101 and the expanding section 103 are arranged on the first template 11, the second section 102 is arranged on the second template 12, and the expanding section 103 is arranged between the first section 101 and the second section 102 and has a radius larger than that of the first section 101 and the second section 102; wherein, the first template 11 and the second template 12 can be separated or attached to each other under the action of external force. When the first template 11 and the second template 12 are separated, a part to be pressed is placed into the first pressure groove 10; when the first template 11 and the second template 12 are tightly attached, the part to be pressed forms a joint part through the neck expanding part due to the constant volume.

In some embodiments, the first template 11 and the second template 12 are connected by an elastic member. When no external force is applied to the first template 11 and the second template 12, the elastic connecting piece separates the first template 11 from the second template 12, and at the moment, the first template 11 and the second template 12 are connected together through the elastic connecting piece, but have a gap; the first template 11 and the second template 12 may be brought into close proximity after the application of an external force.

In some embodiments, the first indent 10 is semi-cylindrical. Optionally, the first indent is semi-rectangular. The first pressure type groove 10 is consistent with the shape of the part to be pressed, and the length of the first pressure type groove is the same as that of the part to be pressed when the first template 11 is separated from the second template 12. This allows the lower part of the press part to be placed exactly in the first press groove. Optionally, the first indent 10 is a semi-rectangular groove. Optionally, the first indent is a semi-polygonal groove. Therefore, parts to be pressed in different shapes can be placed in the first pressing groove, and contact parts in different shapes can be manufactured.

In some embodiments, the length of the second segment 102 is greater than the length of the first segment 101. In this way, the joint of the part to be pressed can be formed at a desired position. Optionally, the length of the second segment 102 is equal to the length of the first segment 101. This allows the joint to be formed at the middle portion of the part to be pressed, and joint parts to be used in various applications can be produced.

In some embodiments, the contact pressing mold for a circuit board further comprises: and (4) pressing the template 2. The upper die plate 2 is covered and arranged above the lower die plate 1, and a second press groove 20 is arranged corresponding to the first press groove 10. The upper pressing template 2 is matched with the lower pressing template 1 for use and covers the upper part of the lower pressing template 1. The upper die plate 2 can be placed against the lower die plate 1 without a gap therebetween. Therefore, when the part to be pressed is placed into the first pressure groove 10, the second pressure groove 20 arranged on the upper pressure template 2 covers the part to be pressed, and the part to be pressed is completely wrapped by the first pressure groove 10 and the second pressure groove.

In some embodiments, the upper die plate 2 includes: a third template 21 and a fourth template 22. The third template 21 is arranged above the first template 11; a fourth die plate 22 disposed above the second die plate 12; when the first template 11 is placed against the side of the second template 12, the third template 21 is placed against the fourth template 22. The upper die plate is pressed tightly on the lower die plate, so that the third die plate 21 is tightly attached to the fourth die plate 22 when the first die plate 11 is tightly attached to the side edge of the second die plate 12. Therefore, the templates are tightly pressed, and the part to be pressed is extruded into the shape of the pressing groove without changing the volume, so that the part can be formed at one time.

In some embodiments, the lower die plate 1 and the upper die plate 2 are limited by a positioning pin 3; the positioning pin 3 is arranged on the lower die plate 1, and the upper die plate 2 is provided with a positioning hole 4 for the positioning pin 3 to pass through. The positioning holes 4 are matched with the positioning pins 3 to limit the relative positions of the upper die plate 2 and the lower die plate 1. Alternatively, the positioning pin 3 is fixed on the lower die plate 1 by welding. The welding connection strength is good, the structure is simple, and the manufacture is convenient. Optionally, the positioning pin and the lower pressing template are integrally formed in the manufacturing process. Therefore, no gap exists between the positioning pin 3 and the lower pressing template 1, no fracture occurs, and the positioning pin has better integrity.

In some embodiments, the lower die plate 1 is provided with connecting members 5 connected to the upper die plate 2, and the distance between the connecting members 5 on the same die plate is greater than or equal to the distance between the positioning pins 3 on the same die plate. Therefore, the stress of the connecting piece can be uniform, and the upper die plate 2 and the lower die plate 1 are tightly matched.

In some embodiments, the contact pressing mold for a circuit board further comprises: and a fastener 6. The fastener 6 is engaged with the connecting member 5 and configured to fasten the connection of the lower die plate 1 and the upper die plate 2. The fastener 6 is mutually matched with the connecting piece 5, the upper die plate is placed on the lower die plate and connected with the connecting piece 5 through the positioning pin 3, the fastener 6 is installed on the connecting piece 5, and the lower die plate 1 and the upper die plate 2 are fastened together by using a tool.

In some embodiments, the lower die plate 1 is detachably connected with the upper die plate 2. The lower die plate 1 and the upper die plate 2 can be separated. The upper die plate 2 is removed from the lower die plate by loosening the connection between the fastening member 6 and the connecting member 5. Thus, the first press groove 10 on the lower die plate 1 is exposed, the component to be pressed can be smoothly placed into the first press groove 10, then the upper die plate 2 is installed back, the upper die plate 2 and the lower die plate 1 are fastened, and then the first die plate 11 and the second die plate 12, and the third die plate 21 and the fourth die plate 22 are clamped by using a tool to manufacture the contact part.

The contact pressing die for the circuit board does not need to be clamped by a lathe, and can be used for extruding a copper alloy wire blank into parts required by production at one time by a die pressing method, so that the problem of difficulty in processing due to small size of the parts can be effectively solved, raw materials can be saved, the processing efficiency can be improved, and the purposes of cost reduction and efficiency improvement can be achieved.

The above description and drawings sufficiently illustrate embodiments of the disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The scope of the disclosed embodiments includes the full ambit of the claims, as well as all available equivalents of the claims. As used in this application, although the terms "first," "second," etc. may be used in this application to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, unless the meaning of the description changes, so long as all occurrences of the "first element" are renamed consistently and all occurrences of the "second element" are renamed consistently. The first and second elements are both elements, but may not be the same element. Furthermore, the words used in the specification are words of description only and are not intended to limit the claims. As used in the description of the embodiments and the claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Similarly, the term "and/or" as used in this application is meant to encompass any and all possible combinations of one or more of the associated listed. In addition, the terms "comprises" and/or "comprising," when used in this application, specify the presence of stated features, integers, and/or components, but do not preclude the presence or addition of one or more other features, integers, components, and/or groups thereof. Without further limitation, an element defined by the phrase "comprising an …" does not exclude the presence of other like elements in a process, method or apparatus that comprises the element. In this document, each embodiment may be described with emphasis on differences from other embodiments, and the same and similar parts between the respective embodiments may be referred to each other. For methods, products, etc. of the embodiment disclosures, reference may be made to the description of the method section for relevance if it corresponds to the method section of the embodiment disclosure.

The terms "upper", "lower", "vertical", "horizontal", "inner", "outer", and the like herein indicate orientations or positional relationships based on those shown in the drawings, and are used for convenience in describing the present specification and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention. In the description herein, unless otherwise specified and limited, the term "connected" is to be understood broadly, and may be, for example, a mechanical or electrical connection, a communication between two elements, a direct connection, or an indirect connection via an intermediate medium, and the specific meaning of the term may be understood by those skilled in the art as appropriate. Herein, the term "plurality" means two or more, unless otherwise specified.

Claims

1. A contact pressing mold for a circuit board, comprising:

the pressing template comprises a first template and a second template which are arranged adjacently;

the first pressing groove is arranged on the lower pressing template, is configured to accommodate a part to be pressed and comprises a first section, a second section and an expanding section, the first section and the expanding section are arranged on the first template, the second section is arranged on the second template, the expanding section is arranged between the first section and the second section, and the radius of the expanding section is larger than that of the first section and that of the second section;

wherein the first template and the second template can be separated or attached to each other under the action of external force.

2. The contact pressing mold for circuit board according to claim 1, wherein said first mold plate and said second mold plate are connected by an elastic member.

3. The contact pressing mold for circuit board according to claim 2, wherein said first molding groove has a semi-cylindrical shape.

4. A contact pressing mold for a circuit board according to claim 3, wherein the length of said second section is greater than the length of said first section.

5. The contact pressing mold for circuit board according to claim 1, further comprising:

and the upper die plate is covered above the lower die plate, and a second pressing groove is arranged corresponding to the first pressing groove.

6. The contact pressing mold for circuit board according to claim 5, wherein said upper pressing plate comprises:

the third template is arranged above the first template;

the fourth template is arranged above the second template;

when the second template is tightly attached to the side edge of the first template, the third template is tightly attached to the fourth template.

7. The contact pressing mold for circuit board according to claim 6, wherein the upper pressing mold plate and the lower pressing mold plate are limited by a positioning pin;

the positioning pin is arranged on the lower die plate, and the upper die plate is provided with a positioning hole for the positioning pin to pass through.

8. The contact pressing mold for circuit board according to claim 7, wherein said lower die plate is provided with connecting members connected to said upper die plate, and a distance between said connecting members on the same die plate is greater than or equal to a distance between said positioning pins on the same die plate.

9. The contact pressing mold for circuit board according to claim 8, further comprising a fastener, cooperating with the connecting member, configured to fasten the connection of the lower die plate and the upper die plate.

10. A contact pressing mold for a circuit board according to any one of claims 5 to 9, wherein said upper die plate is detachably connected to said lower die plate.