CN212193925U

CN212193925U - Injection mold of earphone neck strap

Info

Publication number: CN212193925U
Application number: CN202020398880.3U
Authority: CN
Inventors: 汪有志; 汪兵; 汪智勇; 周传曾
Original assignee: Dongguan Zhihong Plastic Moulding Co ltd
Current assignee: Dongguan Zhihong Plastic Moulding Co ltd
Priority date: 2020-03-25
Filing date: 2020-03-25
Publication date: 2020-12-22
Anticipated expiration: 2030-03-25

Abstract

The utility model belongs to the technical field of the earphone production technique and specifically relates to an injection mold of earphone neck area is related to, its technical scheme main points are: the injection molding device comprises a first injection molding fixed die, a second injection molding fixed die and two groups of injection molding movable dies, wherein the first injection molding fixed die and the second injection molding fixed die respectively form two die groups with the two groups of injection molding movable dies; the first injection molding fixed die comprises a fixed die core, and the first fixed die core is provided with a positioning assembly for positioning the connector and a limiting groove for limiting the earphone wire; the injection molding movable die comprises a movable die core, and the movable die core is provided with a limiting assembly; the second injection molding fixed die comprises a second fixed die core; the first fixed die core and the movable die core form a first cavity for forming a first half neck band, the second fixed die core and the movable die core bearing the first half neck band form a second cavity for forming a second half neck band, and the second half neck band and the first half neck band form a neck band body. The neck strap body is connected with the earphone wire rod tightly and stably, the production yield of the neck strap is improved, and the good elastic recovery performance of the neck strap is kept.

Description

Injection mold of earphone neck strap

Technical Field

The utility model belongs to the technical field of the earphone production technique and specifically relates to an injection mold of earphone neck strap is related to.

Background

Along with the popularization of the Bluetooth headset, a user can avoid the trouble of wires, easily talk and listen to music, and the Bluetooth headset brings great convenience to the work, life, exercise and other aspects of people. When people run and do exercises such as, rocking that great amount of exercise brought often makes the earphone slippage from the ear hole easily with perspiring, consequently, can hang the hanging bluetooth headset of neck on the neck and receive the hobbyist's of running liking, the direct condition of falling to the ground of reducible earphone.

At present, hanging bluetooth headset of neck mainly includes neck area, two control box and two earphone heads, refer to fig. 1, and the neck area is including neck area body 7, connector 62 and earphone wire 63 usually, and wherein, neck area body 7 is the arc form, and neck area body 7 is used for hanging on user's neck. Two connectors 62 are provided, the two connectors 62 are respectively arranged at two ends of the neck strap body 7, and the connectors 62 are provided with slots 62 a; the earphone wire 63 is covered by the neck strap along the length direction of the neck strap, and two ends of the earphone wire 63 penetrate and are exposed out of the two connectors 62. In addition, the two control boxes are respectively connected with the connectors 62 at the two ends of the neck strap body 7, and the control circuit boards in the two control boxes are connected through earphone wires 63 in the neck strap body 7; meanwhile, the two earphone heads are respectively connected with the control circuit boards in the two control boxes through connecting wires.

The neck strap body 7 in the neck strap is usually soft rubber with elastic recovery capability, so that the neck strap can be worn comfortably by a user and can keep stable clamping on the neck part of the user; meanwhile, the earphone wire 63 is protected by the cladding effect of the neck strap body 7 on the earphone wire 63.

In the prior art, there are three main ways of wrapping the neckband body 7 of the neckband and the earphone wire 63. One of them is that the neck strap body 7 with the through hole 62b inside is molded, and then the earphone wire 63 passes through the through hole 62b in the neck strap body 7; however, in order to ensure that the earphone wire 63 smoothly passes through the neckband body 7, the diameter of the through hole 62b in the neckband body 7 needs to be larger than the outer diameter of the earphone wire 63, so that a gap exists between the neckband body 7 and the earphone wire 63, the neckband body 7 can sink when being pressed by a hand, and the earphone wire 63 inside the neckband body can move relative to the neckband body 7 when the neckband shakes, thereby affecting the use experience of a user.

Another way is to place the earphone wire 63 in a mold cavity for injection molding of the neck strap body 7 before injection molding of the neck strap body 7, and to make the neck strap body 7 completely wrap the earphone wire 63 by injection molding, and finally the injection molded neck strap body 7 can be tightly bonded and stably connected with the earphone wire 63. However, the earphone wire 63 is a flexible wire harness, and in the actual injection molding process, the earphone wire 63 is easily subjected to the impact of injection molding pressure to cause deviation, so that the earphone wire 63 is difficult to be positioned at the central position in the neck strap body 7 in the preset condition in the molded neck strap body 7, and the earphone wire 63 is possibly positioned on the outer wall of the neck strap body 7 under the serious deviation condition, which seriously affects the production yield of the product.

Another is to use a shaping strip to limit and shape the earphone wire 63, for example, a neck band of a sport neck band earphone disclosed in chinese patent with publication number CN106792418B and a production process thereof, the neck band disclosed in this patent document includes a support injection molding soft rubber, a sealing injection molding soft rubber, the earphone wire 63, a neck band inner mold and a shaping strip, and the specific process steps are as follows: (1) bonding the earphone wire 63 to the arc-shaped molding strip; (2) respectively injection-molding two ends of the shaping strip bonded with the earphone wire 63 to form a neck strap inner die; (3) injection molding a groove-shaped supporting injection molding soft rubber, and placing the molding strip obtained in the step (2) in the groove of the supporting injection molding soft rubber before the supporting injection molding soft rubber is completely molded; (4) injection moulding involution flexible glue of moulding plastics, the flexible glue of moulding plastics of will involution is moulded plastics the recess opening bonding of flexible glue with the bearing for the inner wall and earphone wire rod 63, neck strap centre form and the shaping strip of flexible glue are moulded plastics to the involution and the bearing are glued completely.

The neck strap disclosed by the patent document uses the bearing injection molding software and the sealing injection molding soft glue to form the neck strap body 7 used for wrapping the earphone wire 63 for protection, and meanwhile, the earphone wire 63 is bonded on the arc-shaped shaping strip, so that the specific wiring of the earphone wire 63 is convenient to keep, and in the neck strap obtained by final production, the earphone wire 63 can be located in the middle position of the neck strap body 7 to obtain good protection.

However, the use of the shaping strip increases the production cost, and the presence of the shaping strip in the neck band also reduces the elastic recovery performance of the neck band to some extent, so that the neck band is liable to be excessively bent and cannot be recovered. In addition, for laminating user's neck, injection moulding's bearing is moulded plastics the flexible glue and is usually not regular circular-arc, this probably makes the bearing mould plastics flexible glue everywhere cooling time have the difference, and in step (3) that this patent document discloses, need mould plastics the flexible glue at the bearing before finalizing the design completely, the design strip that will bond the earphone cord is placed in the recess of the flexible glue is moulded plastics to the bearing, put into the in-process that the flexible glue recess was moulded plastics to the bearing at the design strip, the condition that the flexible glue was too soft and the atress warp is moulded plastics to the bearing probably appears, or the bearing is moulded plastics the flexible glue hard and is influenced the condition that the flexible glue bonding effect was moulded plastics to design strip and bearing, all will influence the production yield in neck area.

Disclosure of Invention

An object of the utility model is to provide an injection mold of earphone neckband, this injection mold can realize the inseparable and stable connection between neckband body and the earphone wire rod, simultaneously, can promote the production yield of neckband to can keep the good elasticity recovery performance of neckband.

The utility model discloses an inventive purpose can be realized through following technical scheme: an injection mold for an earphone neck strap comprises a first injection fixed mold, two groups of injection movable molds and a second injection fixed mold, wherein the two groups of injection movable molds are arranged on a rotating table of an injection molding machine, and the first injection fixed mold and the second injection fixed mold respectively form two mold groups with the two groups of injection movable molds in a one-to-one correspondence manner;

the first injection molding fixed die comprises a first fixed die plate and a first fixed die core, the first fixed die core is arranged on the surface of the first fixed die plate facing the injection molding movable die, two groups of positioning assemblies for positioning the connecting head and a limiting groove for limiting the earphone wire rod are symmetrically arranged on the surface of the first fixed die core, which is far away from the first fixed die plate, and two ends of the limiting groove are respectively connected with the two groups of positioning assemblies;

the injection molding movable die comprises a movable die plate and a movable die core, the movable die core is arranged on the surface of the movable die plate facing the first injection molding fixed die, two groups of limiting assemblies matched with the positioning assemblies respectively are arranged on the surface of the movable die core departing from the movable die plate, and the limiting assemblies are used for limiting the connector;

the second injection molding fixed die comprises a second fixed die plate and a second fixed die core, and the second fixed die core is arranged on the surface, facing the injection molding movable die, of the second fixed die plate;

the first fixed die core and the movable die core form a first cavity, and the first cavity is used for forming a first half neck belt; the second cover half benevolence is used for forming the second die cavity with the movable mould benevolence that bears first half neck area, the second die cavity is used for forming the second half neck area, the second half neck area combines together with first half neck area and forms the neck area body.

By adopting the technical scheme, the connecting head is fixedly connected with the earphone wire, the positioning assembly on the first fixed die core is used for positioning the connecting head, and the movable die core limiting assembly is used for limiting the connecting head, so that the stable traction of the connecting head on the earphone wire in the injection molding process of the first semicircular neck band can be kept, and the limit groove on the first fixed die core is used for limiting the earphone wire, so that the situation that the earphone wire is subjected to position deviation in the injection molding process of the first semicircular neck band can be effectively reduced, and the effect of improving the production yield of the neck band is achieved; meanwhile, the connector and the earphone wire are arranged in a first cavity formed by a first fixed die core and a movable die core, so that in the process of injection molding of the first half neck band, the connector and the earphone wire can form a tight bonding effect with the first half neck band, then the movable die core bearing the first half neck band and a second fixed die core are matched to form a second cavity, the second half neck band is injection molded on the bonding surface of the connector, the earphone wire and the first half neck band, so that the first half neck band and the second half neck band are bonded to form a neck band body covering the earphone wire, in the two injection molding processes, the earphone wire is positioned in the cavity used for injection molding, the first half neck band and the second half neck band which are injection molded can be tightly attached and stably bonded with the earphone wire, and the tight and stable connection between the neck band body and the earphone wire is realized; in addition, need not to use the design strip to fix a position the earphone wire rod among the injection molding process, can reduce the neck area and excessively buckle and cause the damage and the unable circumstances of recovering to the design strip to keep the good elasticity recovery performance of neck area.

Preferably, the positioning assembly comprises a positioning block, the first positioning die core is provided with two positioning installation grooves, and the positioning installation grooves are respectively communicated with two ends of the limiting groove;

the positioning block is accommodated in the positioning installation groove, and the surface of the positioning block, which is far away from the bottom of the positioning installation groove, is flush with the surface of the first positioning die core; the surface of the positioning block is provided with a positioning groove matched with the connector, and the positioning groove is communicated with the limiting groove.

By adopting the technical scheme, the positioning block is accommodated in the positioning installation groove, the surface of the positioning block is flush with the surface of the first fixing mold core, and the smoothness of the surface of the first fixing mold core is kept; the positioning groove is used for accommodating and positioning the connector, so that the positioning of the connector can be realized.

Preferably, a positioning column is arranged in the positioning groove and is in inserting fit with the slot of the connector.

Through adopting above-mentioned technical scheme, the reference column cooperates with the slot grafting of connector, promotes the location effect of locating component to the connector.

Preferably, the limiting assembly comprises a limiting block, and the limiting block is provided with a limiting groove;

when the fixed mold core is attached to the first fixed mold core, the limiting block is abutted to the locating block, and the limiting groove is buckled with the locating groove and is matched with the connector.

Through adopting above-mentioned technical scheme, spacing groove and constant head tank cooperate and carry out the holding spacing to the connector, can keep the stable of the in-process connector of moulding plastics to drawing of earphone wire rod.

Preferably, the first injection molding fixed die further comprises a fixed die ejector pin mechanism, and the fixed die ejector pin mechanism comprises a fixed die ejector pin plate and a first ejector pin; the fixed die ejector plate is positioned on one side, far away from the first fixed die core, of the first fixed die plate, and the fixed die ejector plate is connected to the first fixed die plate in a sliding mode along the direction close to or far away from the first fixed die plate;

a plurality of first thimble holes are formed in the bottom of the limiting groove of the first fixing mold core, and the first thimble holes penetrate from the bottom of the limiting groove to the surface, close to the first fixing mold plate, of the first fixing mold core; the first fixing template is provided with a plurality of first through holes, the number of the first through holes is the same as that of the first thimble holes, the first through holes correspond to the first thimble holes one by one, and the first through holes are communicated with the first thimble holes;

the first ejector pins are arranged on the surface, close to the first fixed template, of the fixed die ejector plate, the number of the first ejector pins is the same as that of the first ejector pin holes, the first ejector pins correspond to the first ejector pin holes one by one, and the first ejector pins penetrate through the first through holes and are in inserted fit with the first ejector pin holes;

the injection molding device is characterized in that a linkage assembly is arranged between the fixed die ejector plate and the injection molding movable die, when the movable die plate is separated from the first fixed die plate, the linkage assembly is used for driving the fixed die ejector plate to move along the direction of the movable die plate away from the first fixed die plate, so that the first ejector pin slides from the first ejector pin hole and protrudes out of the bottom of the limiting groove.

Through adopting above-mentioned technical scheme, behind first half neck area injection moulding, the movable mould of moulding plastics separates with the first cover half of moulding plastics, utilize linkage assembly to drive the cover half thimble board and remove along the direction that is close to first cover half board, first thimble slides the tank bottom of salient spacing groove from first thimble hole, exert the power towards the movable mould board along first cover half board to the earphone wire rod of spacing inslot, the semi-manufactured goods application of force of neck area that obtains promptly to moulding plastics, reduce the first half neck area of fashioned and glue in first cover half benevolence and with the condition that the movable mould benevolence breaks away from, make the semi-manufactured goods of neck area can stably stay in the movable mould benevolence, make the movable mould benevolence that bears the semi-manufactured goods of neck area can form good cooperation with the second cover half benevolence, keep the.

Preferably, a second thimble hole is formed at the bottom of the positioning groove of the positioning block, second through holes are formed in the first positioning die core and the first positioning die plate, and the second through holes are communicated with the second thimble hole;

the cover half thimble mechanism still includes the second thimble, the second thimble is located on the cover half thimble board, the second thimble runs through the second through-hole to with the cooperation of pegging graft of second thimble hole, the one end that the cover half thimble board was kept away from to the second thimble is used for with the lateral wall looks butt of connector.

Through adopting above-mentioned technical scheme, behind first half neck area injection moulding, the movable mould of moulding plastics separates with the first cover half of moulding plastics, the second thimble moves along with cover half thimble board, the protrusion in the constant head tank bottom slides from the second thimble hole, exert the power along first fixed die plate towards the movable mould board to the lateral wall of connector, in order ejecting in the constant head tank with the connector, further reduce fashioned first half neck area and glue in first fixed mould benevolence and with the condition that the movable mould benevolence breaks away from, make the neck area semi-manufactured goods can stably stay on the movable mould benevolence, make the movable mould benevolence that bears the weight of the semi-manufactured goods of neck area can form good cooperation with the second cover half benevolence, keep the good effect of moulding plastics of.

Preferably, the linkage assembly comprises a linkage pull rod and a linkage rubber sleeve, the first fixed template is provided with a pull rod slide hole, and the pull rod slide hole penetrates from one side of the first fixed template, which is close to the fixed die ejector plate, to the other side;

the linkage pull rod penetrates through the pull rod sliding hole in a sliding mode, and one end of the linkage pull rod is connected to the fixed die ejector plate;

the surface of the movable template close to the movable mould core is provided with a rubber sleeve connecting hole, and the linkage rubber sleeve is arranged at one end of the linkage pull rod far away from the fixed mould ejector plate; the linkage rubber sleeve can be inserted into or separated from the rubber sleeve connecting hole closely and is in interference fit with the rubber sleeve connecting hole.

By adopting the technical scheme, the linkage rubber sleeve is in interference fit with the rubber sleeve connecting hole of the movable template to form relative fixation between the linkage pull rod and the movable template, and when the movable template is separated from the first fixed template, the linkage pull rod drives the fixed die ejector plate to move along the direction close to the first fixed template, so that the first ejector pin slides from the first ejector pin hole and protrudes out of the bottom of the limiting groove; meanwhile, when the fixed die ejector plate moves to the first fixed die plate to abut against the fixed die plate, the movable die plate continues to move in the direction away from the first fixed die plate, so that the linkage rubber sleeve is separated from the rubber sleeve connecting hole.

Preferably, a reset assembly is arranged between the fixed die ejector plate and the first fixed die plate and used for enabling a first ejector pin protruding out of the bottom of the limiting groove to slide and retract into the first ejector pin hole.

By adopting the technical scheme, after the linkage gum cover is separated from the gum cover connecting hole, the reset assembly enables the fixed die ejector plate to move along the direction far away from the first fixed die plate, the first ejector pin slides and retracts into the first ejector pin hole, and the earphone wire rod required by next injection molding is convenient to place in the limiting groove.

Preferably, the bottom of the rubber sleeve connecting hole is provided with a vent hole, and the vent hole penetrates through the rubber sleeve connecting hole to one side of the movable template far away from the rubber sleeve connecting hole.

By adopting the technical scheme, the air vent realizes the communication between the rubber sleeve connecting hole and the outside air, and the linkage pull rod can be conveniently inserted into or separated from the linkage rubber sleeve.

To sum up, the utility model discloses a following at least one useful technological effect:

1. the tight and stable connection between the neck strap body and the earphone wire rod is realized, meanwhile, the production yield of the neck strap can be improved, and the good elastic recovery performance of the neck strap can be kept;

2. the fixed die ejector plate drives the first ejector pin and the second ejector pin to apply force to the formed neck belt semi-finished product by utilizing a linkage assembly formed by interference fit of the linkage rubber sleeve and a rubber sleeve connecting hole, the condition that the formed first half neck belt is adhered to the first fixed die core and is separated from the movable die core is reduced, the neck belt semi-finished product can be stably remained on the movable die core, the movable die core bearing the neck belt semi-finished product can be well matched with the second fixed die core, and the good injection molding effect of the second half neck belt is kept;

3. after the linkage gum cover breaks away from with the gum cover connecting hole, the reset assembly makes the cover half thimble board along the direction motion of keeping away from first fixed die plate, makes first thimble slide and withdraw in first thimble hole, is convenient for will next mould plastics required earphone wire rod and place in the spacing inslot.

Drawings

Fig. 1 is a schematic structural view of a neck band as indicated in the background of the invention.

Fig. 2 is a schematic structural view of the middle injection mold of the present invention.

Fig. 3 is a schematic view of the connection structure of the first injection molding fixed mold, the earphone wire and the connector of the present invention.

Fig. 4 is an enlarged schematic view of a portion a of fig. 3.

Fig. 5 is a schematic structural diagram of the middle injection molding movable mold of the present invention.

Fig. 6 is an enlarged structural view of a portion B in fig. 5.

Fig. 7 is the structure schematic diagram of the neck belt semi-finished product formed by injection molding after the middle injection molding movable mold and the first injection molding fixed mold are combined with the film.

Fig. 8 is a schematic view of the connection structure of the middle cover half ejector plate, the first cover half plate and the movable plate of the present invention.

Fig. 9 is a partial cross-sectional view for showing the connection relationship between the first thimble and the first thimble hole and between the second thimble and the second thimble hole.

Fig. 10 is an enlarged schematic view of a portion C of fig. 9.

Fig. 11 is a schematic structural view of the second injection molding fixed mold in the present invention.

Reference numerals: 1. a first injection molding fixed die; 11. a first stationary mold base plate; 12. a first flow channel push plate; 13. a first fixed template; 131. an ejector plate movable groove; 131a, a movable slot cover plate; 132. a pull rod slide hole; 133. a first through hole; 134. a second through hole; 14. a first fixed die core; 141. a limiting groove; 141a, a first thimble hole; 142. positioning the mounting groove; 143. positioning blocks; 143a, a positioning groove; 143b, positioning posts; 143c, a second thimble hole; 144. a first bearing block; 144a, a first supporting groove; 15. a fixed die thimble mechanism; 151. fixing a mould ejector plate; 152. a first thimble; 153. a second thimble; 2. injection molding a movable mold; 21. a movable mould seat plate; 22. cushion blocks; 23. moving the template; 231. connecting holes of the rubber sleeve; 24. a movable mould core; 241. a limiting block; 241a, a limit abutting groove; 241b, a limiting column; 242. a second bearing block; 242a, a second supporting groove; 3. a second injection molding fixed die; 31. a second stationary mold base plate; 32. a second flow channel push plate; 33. a second fixed template; 34. a second fixed mold core; 4. a linkage assembly; 41. linkage rubber sleeves; 42. a linkage pull rod; 5. a reset assembly; 51. a reset lever; 52. a return spring; 6. a neck band semi-finished product; 61. a first napestrap; 62. a connector; 62a, a slot; 62b, a through hole; 63. an earphone wire; 7. a neck strap body.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

Referring to fig. 1, for the utility model discloses an injection mold of earphone neck area, including first cover half 1 of moulding plastics, the movable mould 2 and the second cover half 3 of moulding plastics, wherein, the quantity of the movable mould 2 of moulding plastics has two sets ofly, and two sets of movable moulds 2 of moulding plastics are all installed on the revolving stage of injection molding machine. Under the driving action of the injection molding machine, the two groups of injection molding movable dies 2 are respectively close to and abutted against or away from each other for loosening with the first injection molding fixed die 1 and the second injection molding fixed die 3 so as to realize the functions of die opening and die closing. Meanwhile, the first injection molding fixed die 1 and the second injection molding fixed die 3 respectively form two die sets with the two groups of injection molding movable dies 2 in a one-to-one correspondence manner, and the two die sets are both thin water gap die sets.

The first injection molding fixed die 1 comprises a first fixed die base plate 11, a first runner push plate 12, a first fixed die plate 13 and a first fixed die core 14, wherein the first fixed die base plate 11 is fixedly arranged on the injection molding machine and is connected with a glue injection head of the injection molding machine. The first flow channel push plate 12 and the first fixed mold plate 13 are rectangular plates which are parallel to each other, the first flow channel push plate 12 is located on one side, close to the injection molding movable mold 2, of the first fixed mold base plate 11, and the first fixed mold plate 13 is located on one side, away from the first fixed mold base plate 11, of the first flow channel push plate 12. The first flow channel push plate 12 and the first fixed die plate 13 are connected with the first fixed die holder plate 11 through guide pillars and guide sleeve structures, and in addition, the first fixed die holder plate 11, the first flow channel push plate 12 and the first fixed die plate 13 are also provided with distance pull rods; the guide pillar, the guide sleeve structure and the distance pull rod are all the prior art, and are not described again here.

Referring to fig. 3 and 4, the first fixing mold core 14 is installed on one side of the first fixing mold plate 13 away from the first runner push plate 12 in an insert type design, and the first fixing mold core 14 is provided with an annular limiting groove 141, and the limiting groove 141 is used for limiting the earphone wires 63. Meanwhile, the first positioning mold core 14 is further provided with two positioning installation grooves 142, and the two positioning installation grooves 142 are respectively located at two ends of the limiting groove 141 and are communicated with the limiting groove 141; the positioning mounting grooves 142 are internally and fixedly provided with positioning blocks 143 which are flush with the surface of the first positioning die core 14, the positioning blocks 143 are provided with positioning grooves 143a which are matched with the connectors 62, and the positioning grooves 143a of the two positioning blocks 143 are respectively used for accommodating and positioning the connectors 62 which are fixedly connected with the two ends of the earphone wire 63.

In this embodiment, the connecting head 62 fixedly connected to the two ends of the earphone wire 63 is further provided with a circular slot 62a (see fig. 1), and correspondingly, a positioning column 143b inserted into the circular slot 62a is fixedly installed at the bottom of the positioning slot 143 a. In addition, two first supporting blocks 144 are further installed on the first positioning die core 14, the first supporting block 144 is located at one end of the positioning block 143 away from the limiting groove 141, a first supporting groove 144a communicated with the positioning groove 143a is formed in the first supporting block 144, and the first supporting groove 144a is used for supporting the earphone wire 63 passing through a section protruding from the connecting head 62.

Referring to fig. 5, the two injection molding dies 2 each include a die base plate 21, a spacer 22, a movable mold plate 23 and a movable mold core 24, wherein the die base plates 21 of the two injection molding dies 2 are both fixedly mounted on a rotary table of the injection molding machine, and the die base plates 21 of the two injection molding dies 2 are symmetrically arranged about a rotation center line of the rotary table. In a set of injection molding movable mould 2, there are two cushion blocks 22, two cushion blocks 22 are parallel, and two cushion blocks 22 are installed at the movable mould bedplate 21 towards the surface of the first injection molding fixed mould 1 and/or the second injection molding fixed mould 3 at intervals, the movable mould plate 23 is fixedly installed on the surface of the cushion block 22 far away from the movable mould bedplate 21, and the fixed connection of the movable mould plate 23 and the movable mould bedplate 21 is realized through the cushion blocks 22. Meanwhile, the movable die core 24 is installed on one side of the movable die plate 23 far away from the movable die base plate 21 in an insert type design mode.

Referring to fig. 4 and 6, the movable die core 24 is provided with a stopper 241 engaged with the positioning block 143 of the first fixed die core 14, and a second bearing block 242 engaged with the first bearing block 144. Wherein, the limiting block 241 is provided with a limiting abutting groove 241a, and the limiting abutting groove 241a is used for matching with the positioning groove 143a on the positioning block 143 to limit the connector 62 (see fig. 3); meanwhile, a limiting post 241b is fixedly mounted on the limiting abutting groove 241a, and the limiting post 241b is inserted into the slot 62a of the connector 62 (see fig. 3). The second supporting block 242 is provided with a second supporting slot 242a, and the second supporting slot 242a is used for matching with the first supporting slot 144a of the first supporting block 144 to clamp and limit a section of the earphone wire 63 (see fig. 3) which penetrates through and protrudes out of the connecting head 62.

Referring to fig. 3 and 5, when the injection movable mold 2 is driven by the injection molding machine to form a mold set with the first injection fixed mold 1, the movable mold plate 23 abuts against the first fixed mold plate 13, and the movable mold core 24 and the first fixed mold core 14 form a first cavity. Referring to fig. 7, the first cavity is used for injection molding of the first half neck band 61, and the injection molded first half neck band 61 is bonded with the earphone wire 63 and the connector 62 to obtain the neck band semi-finished product 6.

Referring to fig. 8, the first injection molding fixed mold 1 may further include a fixed mold ejector mechanism 15, and specifically, the fixed mold ejector mechanism 15 includes a fixed mold ejector plate 151, a first ejector 152 and a second ejector 153. Wherein, the thimble board movable groove 131 has been seted up on the surface that first fixed die plate 13 deviates from first fixed die benevolence 14, and fixed die thimble board 151 slides along the direction of the first fixed die plate of perpendicular to and connects in thimble board movable groove 131, and simultaneously, the notch department of thimble board movable groove 131 still has movable groove cover plate 131a through bolt fixed mounting, utilizes movable groove cover plate 131a to seal the notch of thimble board movable groove 131.

Referring to fig. 8, a linkage assembly 4 is installed between the fixed die ejector plate 151 and the movable die plate 23, and specifically, the linkage assembly 4 comprises a linkage pull rod 42 and a linkage rubber sleeve 41; the first fixed die plate 13 is provided with a pull rod slide hole 132, the pull rod slide hole 132 penetrates from one side of the first fixed die plate 13 close to the fixed die ejector plate 151 to the other side, the linkage pull rod 42 slides to penetrate through the pull rod slide hole 132, and one end of the linkage pull rod 42 is fixedly connected with the fixed die ejector plate 151. The outer diameter of the linkage rubber sleeve 41 is smaller than the inner diameter of the pull rod slide hole 132, and the linkage rubber sleeve 41 is fixedly installed at one end of the linkage pull rod 42 far away from the fixed die ejector plate 151.

Meanwhile, the surface of the movable die plate 23 close to the movable die core 24 is provided with a rubber sleeve connecting hole 231, the linkage rubber sleeve 41 can be inserted into or separated from the rubber sleeve connecting hole 231, and the linkage rubber sleeve 41 is in interference fit with the rubber sleeve connecting hole 231. In order to facilitate the linkage of the rubber sleeve 41 to be inserted into or separated from the rubber sleeve connecting hole 231, a vent hole (not shown in the figure) is further formed in the hole bottom of the rubber sleeve connecting hole 231, and the vent hole penetrates from the rubber sleeve connecting hole 231 to the side, far away from the rubber sleeve connecting hole 231, of the movable mold plate 23, so that the rubber sleeve connecting hole 231 is communicated with the outside air.

In addition, a reset assembly 5 is further installed between the fixed die ejector plate 151 and the first fixed die plate 13, and after the linkage rubber sleeve 41 is separated from the rubber sleeve connecting hole 231, the reset assembly 5 is used for enabling the fixed die ejector plate 151 to move in the direction away from the first fixed die plate 13. In this embodiment, the reset assembly 5 uses a reset rod 51 and a reset spring 52 commonly used in a mold, which are not described herein again for the prior art.

Referring to fig. 9 and 10, a plurality of first pin holes 141a are formed at intervals at the bottom of the limiting groove 141 of the first fixing core 14 along the length direction of the limiting groove 141, and the first pin holes 141a penetrate from the bottom of the limiting groove 141 to the surface of the first fixing core 14 close to the first fixing template 13; correspondingly, the first fixed die plate 13 is provided with a plurality of first through holes 133 penetrating through two opposite side walls of the first fixed die plate 13, and the number of the first through holes 133 is the same as that of the first thimble holes 141a, and the first through holes are communicated one by one. The first thimble 152 is fixedly mounted on the surface of the fixed mold thimble plate 151 close to the first fixed mold plate 13, the number of the first thimbles 152 is the same as that of the first thimble holes 141a, and the first thimbles 152 are in one-to-one correspondence, and meanwhile, the first thimbles 152 penetrate through the first through holes 133 and are in splicing fit with the first thimble holes 141 a.

A second thimble hole 143c is formed at the bottom of the positioning groove 143a of the positioning block 143, and correspondingly, the first positioning core 14 and the first positioning plate 13 are both provided with a second through hole 134 communicated with the second thimble hole 143 c. The second thimble 153 penetrates through the second through hole 134 and is in insertion fit with the second thimble hole 143c, and meanwhile, one end of the second thimble 153 is fixedly connected to the surface of the fixed die ejector plate 151 close to the first fixed die plate 13, and the other end is used for abutting against the side wall of the connector 62 located in the positioning groove 143 a.

Referring to fig. 11, the second injection molding fixed mold 3 includes a second fixed mold base plate 31, a second runner push plate 32, a second fixed mold plate 33 and a second fixed mold core 34, wherein the second fixed mold base plate 31 is fixedly mounted on the injection molding machine and connected to a glue injection head of the injection molding machine. The second flow channel push plate 32 and the second fixed mold plate 33 are rectangular plates which are parallel to each other, the second flow channel push plate 32 is positioned on one side, close to the injection molding moving mold 2, of the second fixed mold plate 31, and the second fixed mold plate 33 is positioned on one side, away from the second fixed mold plate 31, of the second flow channel push plate 32. Moreover, the second runner pushing plate 32, the second fixed mold plate 33 and the second fixed mold base plate 31 are all connected through a guide pillar, a guide sleeve structure and a distance pull rod, and the guide pillar, the guide sleeve structure and the distance pull rod are all the prior art and are not described herein again.

Referring to fig. 11, the second fixed mold core 34 is fixedly mounted on a side of the second fixed mold plate 33 away from the second runner push plate 32 in an insert type design, referring to fig. 5 and 11, when the injection mold 2 bearing the neck strap semi-finished product 6 (see fig. 7) is driven by an injection molding machine to form a mold set with the second injection mold core 3, the movable mold plate 23 abuts against the second fixed mold plate 33, and the movable mold core 24 bearing the neck strap semi-finished product 6 and the second fixed mold core 34 form a second cavity for molding the second half neck strap.

The implementation principle of the embodiment is as follows: the earphone wire 63 and the connector 62 are respectively placed in the limiting groove 141 and the positioning component of the first fixed die core 14, and the injection movable die 2 is driven by the injection molding machine to be close to and abutted against the first injection fixed die 1 to form a die set; at this time, the movable mold plate 23 abuts against the first fixed mold plate 13, the movable mold core 24 and the first fixed mold core 14 are closed to form a first cavity, and the earphone wire 63 and the connector 62 are both located on one side of the first cavity close to the first fixed mold core 14. Injecting glue into the first cavity by an injection molding machine, forming the first half neck band 61 in the first cavity, and forming the earphone wire 63 and the connector 62 with the first half neck band 61 to form a tight bonding effect in the injection molding process of the first half neck band 61 to obtain the neck band semi-finished product 6.

After the first half neck strap 61 is injection molded, the injection movable mold 2 is separated from the first injection fixed mold 1 under the driving of the injection molding machine, the movable mold plate 23 drives the linkage pull rod 42 to move, so that the fixed mold ejector plate 151 moves in the direction close to the first fixed mold plate 13, and the first ejector 152 and the second ejector 153 both move along with the fixed mold ejector plate 151. The first thimble 152 slides from the first thimble hole 141a to protrude out of the bottom of the limiting groove 141, and applies a force towards the movable die plate 23 to the earphone wire 63 in the limiting groove 141; meanwhile, the second thimble 153 slides from the second thimble hole 143c to protrude at the bottom of the positioning groove 143a, and applies a force to the sidewall of the connector 62 toward the movable mold plate 23, so that the neck strap semi-finished product 6 is separated from the movable mold core 24 and stably remains on the movable mold core 24.

The injection molding machine drives the rotating table to rotate, so that the injection molding movable die 2 bearing the neck strap semi-finished product 6 is opposite, and then the injection molding movable die 2 bearing the neck strap semi-finished product 6 is driven to form a die set with the second injection molding fixed die 3; at this time, the movable die plate 23 abuts against the second fixed die plate 33, and the movable die core 24 carrying the neck strap semi-finished product 6 and the second fixed die core 34 form a second cavity. And injecting glue into the second cavity by an injection molding machine, forming the second cavity to obtain a second half neck band, and forming the neck band body 7 tightly wrapping the earphone wire 63 by the second half neck band and the first half neck band 61 in the injection molding process of the second half neck band, so as to obtain a finished neck band product.

The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.

Claims

1. The utility model provides an injection mold of earphone neck area which characterized in that: the injection molding device comprises a first injection molding fixed die (1), injection molding movable dies (2) and a second injection molding fixed die (3), wherein the injection molding movable dies (2) are provided with two groups, the two groups of injection molding movable dies (2) are arranged on a rotating table of an injection molding machine, and the first injection molding fixed die (1) and the second injection molding fixed die (3) respectively form two die sets with the two groups of injection molding movable dies (2) in a one-to-one correspondence manner;

the first injection molding fixed die (1) comprises a first fixed die plate (13) and a first fixed die core (14), the first fixed die core (14) is arranged on the surface, facing the injection molding movable die (2), of the first fixed die plate (13), two groups of positioning assemblies for positioning the connector (62) and limiting grooves (141) for limiting the earphone wires (63) are symmetrically arranged on the surface, away from the first fixed die plate (13), of the first fixed die core (14), and two ends of each limiting groove (141) are connected with the two groups of positioning assemblies respectively;

the injection molding movable die (2) comprises a movable die plate (23) and a movable die core (24), the movable die core (24) is arranged on the surface, facing the first injection molding fixed die (1), of the movable die plate (23), two groups of limiting assemblies matched with the positioning assemblies are arranged on the surface, facing away from the movable die plate (23), of the movable die core (24), and the limiting assemblies are used for limiting the connector (62);

the second injection molding fixed die (3) comprises a second fixed die plate (33) and a second fixed die core (34), and the second fixed die core (34) is arranged on the surface, facing the injection molding movable die (2), of the second fixed die plate (33);

the first fixing die core (14) is used for forming a first cavity with the moving die core (24), and the first cavity is used for forming a first half neck belt (61); the second fixed die core (34) is used for forming a second cavity with a movable die core (24) bearing a first half neck band (61), the second cavity is used for forming a second half neck band, and the second half neck band and the first half neck band (61) are combined to form a neck band body (7).

2. An injection mold for an earphone neck band according to claim 1, wherein: the positioning assembly comprises a positioning block (143), the first positioning die core (14) is provided with two positioning installation grooves (142), and the two positioning installation grooves (142) are respectively communicated with two ends of the limiting groove (141);

the positioning block (143) is accommodated in the positioning installation groove (142), and the surface of the positioning block (143), which is far away from the bottom of the positioning installation groove (142), is flush with the surface of the first positioning die core (14); the surface of the positioning block (143) is provided with a positioning groove (143a) matched with the connector (62), and the positioning groove (143a) is communicated with the limiting groove (141).

3. An injection mold for an earphone neck band according to claim 2, wherein: a positioning column (143b) is arranged in the positioning groove (143a), and the positioning column (143b) is in inserting fit with a slot (62a) of the connector (62).

4. An injection mold of an earphone neck band according to claim 2 or 3, wherein: the limiting assembly comprises a limiting block (241), and a limiting groove (141) is formed in the limiting block (241);

when the fixed mold core is attached to the first fixed mold core (14), the limiting block (241) is abutted to the positioning block (143), and the limiting groove (141) is buckled with the positioning groove (143a) and is matched with the connector (62).

5. An injection mold of an earphone neck band according to claim 2 or 3, wherein: the first injection molding fixed die (1) further comprises a fixed die thimble mechanism (15), and the fixed die thimble mechanism (15) comprises a fixed die thimble plate (151) and a first thimble (152); the fixed die ejector plate (151) is positioned on one side, away from the first fixed die core (14), of the first fixed die plate (13), and the fixed die ejector plate (151) is connected to the first fixed die plate (13) in a sliding mode along the direction close to or away from the first fixed die plate (13);

a plurality of first pin holes (141a) are formed in the bottom of the limiting groove (141) of the first fixing die core (14), and the first pin holes (141a) penetrate from the bottom of the limiting groove (141) to the surface, close to the first fixing die plate (13), of the first fixing die core (14); the first fixed template (13) is provided with a plurality of first through holes (133), the number of the first through holes (133) is the same as that of the first thimble holes (141a), the first through holes (133) correspond to the first thimble holes (141a) one by one, and the first through holes (133) are communicated with the first thimble holes (141 a);

the first thimbles (152) are arranged on the surface, close to the first fixed template (13), of the fixed die ejector plate (151), the number of the first thimbles (152) is the same as that of the first thimble holes (141a), the first thimbles (152) correspond to the first thimble holes (141a) one by one, and the first thimbles (152) penetrate through the first through holes (133) and are in splicing fit with the first thimble holes (141 a);

be equipped with linkage subassembly (4) between cover half thimble board (151) and the movable mould (2) of moulding plastics, when movable mould board (23) and first fixed mould board (13) phase separation, linkage subassembly (4) are used for driving cover half thimble board (151) and move along the direction that movable mould board (23) kept away from first fixed mould board (13), make first thimble (152) slide protrusion in the tank bottom of spacing groove (141) from first thimble hole (141 a).

6. An injection mold for an earphone neck band according to claim 5, wherein: a second thimble hole (143c) is formed in the bottom of the positioning groove (143a) of the positioning block (143), second through holes (134) are formed in the first positioning die core (14) and the first positioning die plate (13), and the second through holes (134) are communicated with the second thimble hole (143 c);

the fixed die thimble mechanism (15) still includes second thimble (153), on fixed die thimble board (151) was located in second thimble (153), second thimble (153) run through second through-hole (134) to with second thimble hole (143c) grafting cooperation, the one end that fixed die thimble board (151) was kept away from in second thimble (153) is used for with the lateral wall looks butt of connector (62).

7. An injection mold for an earphone neck band according to claim 5, wherein: the linkage assembly (4) comprises a linkage pull rod (42) and a linkage rubber sleeve (41), the first fixed template (13) is provided with a pull rod sliding hole (132), and the pull rod sliding hole (132) penetrates from one side, close to the fixed mold ejector plate (151), of the first fixed template (13) to the other side;

the linkage pull rod (42) penetrates through the pull rod sliding hole (132) in a sliding mode, and one end of the linkage pull rod (42) is connected to the fixed die ejector plate (151);

a rubber sleeve connecting hole (231) is formed in the surface, close to the movable mold core (24), of the movable mold plate (23), and the linkage rubber sleeve (41) is arranged at one end, far away from the fixed mold ejector plate (151), of the linkage pull rod (42); the linkage rubber sleeve (41) can be inserted into or separated from the rubber sleeve connecting hole (231) closely and is in interference fit with the rubber sleeve connecting hole (231).

8. An injection mold for an earphone neck band according to claim 5, wherein: be equipped with reset assembly (5) between cover half thimble board (151) and first fixed die plate (13), reset assembly (5) are used for making first thimble (152) of protrusion in spacing groove (141) tank bottom slide and retract in first thimble hole (141 a).

9. An injection mold for an earphone neck band according to claim 7, wherein: the bottom of the rubber sleeve connecting hole (231) is provided with a vent hole, and the vent hole penetrates through the side, away from the rubber sleeve connecting hole (231), of the movable template (23) from the rubber sleeve connecting hole (231).