CN212191632U - BGA restores and covers adjustable ball planting anchor clamps with mould - Google Patents
BGA restores and covers adjustable ball planting anchor clamps with mould Download PDFInfo
- Publication number
- CN212191632U CN212191632U CN201922197516.0U CN201922197516U CN212191632U CN 212191632 U CN212191632 U CN 212191632U CN 201922197516 U CN201922197516 U CN 201922197516U CN 212191632 U CN212191632 U CN 212191632U
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- Prior art keywords
- mould
- upper cover
- positioning seat
- bga
- planting
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- 229910000831 Steel Inorganic materials 0.000 claims abstract description 32
- 239000010959 steel Substances 0.000 claims abstract description 32
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Abstract
The utility model discloses a BGA restores and uses mould lid adjustable ball planting anchor clamps, including the mould seat, bolt fixedly connected with mould upper cover is passed through at mould seat top, table wall fixed mounting has the connection framework in the mould upper cover, table wall fixed mounting has the positioning seat in the connection framework, just table wall is provided with the steel mesh in the positioning seat, mould upper cover top fixed mounting has the attachment strap, the second screw rod is vertically worn to be equipped with by the attachment strap horizontal end. The utility model discloses in, pass through the grip block with the IC-plate and fix behind the mould seat with the third screw rod, pass through the bolt fastening with mould seat and mould upper cover, rotate the second screw rod, the second screw rod passes through the external screw thread and drives the promotion cover and down remove, promotes the cover and promotes the steel mesh through the positioning seat and contact the IC-plate down to make the mould upper cover can carry out the regulation of steel mesh position according to the thickness of IC-plate, thereby improved the BGA restoration with the practicality of planting the ball anchor clamps.
Description
Technical Field
The utility model relates to a plant ball anchor clamps technical field, especially relate to a BGA restores and uses mould lid adjustable anchor clamps of planting balls.
Background
The BGA ball-planting fixture is called BGA ball-planting table, IC ball-planting table, universal ball-planting table, etc. The BGA ball planting fixture can conveniently scrape tin and plant balls for chips, solves a difficult problem in a chip ball planting process, improves the ball planting efficiency, and improves the ball planting quality.
At present, the existing ball planting fixture for BGA repair still has some defects, firstly, most of the upper covers of the moulds in the existing ball planting fixture for BGA repair are composed of steel meshes and frame bodies, and the frame bodies and the steel meshes are mostly fixedly connected, so that the upper covers of the moulds can not adjust the positions of the steel meshes according to the thickness of an IC (integrated circuit) board, and the practicability of the ball planting fixture for BGA repair is reduced; secondly, steel mesh and framework fixed connection for when the mould carries out the planting ball of different IC boards again, need whole change mould upper cover, thereby increased the manufacturing cost of mould, reduced the use effect of BGA restoration with planting the ball anchor clamps.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a: in order to solve the problems, the invention provides a BGA repairing mold cover adjustable ball-planting fixture.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a BGA restores and uses mould lid adjustable ball planting anchor clamps, includes the mould seat, bolt fixedly connected with mould upper cover is passed through at mould seat top, table wall fixed mounting has the connection framework in the mould upper cover, table wall fixed mounting has the positioning seat in the connection framework, just table wall is provided with the steel mesh in the positioning seat, mould upper cover top fixed mounting has the attachment strap, the vertical second screw rod of wearing to be equipped with of attachment strap horizontal end, the outer table wall of second screw rod closes soon through the screw thread and is connected with the promotion cover, just promote cover bottom and positioning seat fixed connection.
As a further description of the above technical solution:
the die upper cover and one side of the horizontal end of the connecting frame body are provided with a through groove, and the positioning seat is fixedly connected with the steel mesh through a first screw rod.
As a further description of the above technical solution:
the die holder comprises a third screw and two groups of clamping blocks connected with the third screw in a screwing mode, and openings of the two groups of clamping blocks deviate from each other.
As a further description of the above technical solution:
the second screw is connected with the butt strap in a clamping mode.
As a further description of the above technical solution:
the outer surface wall fixed mounting of the vertical end of positioning seat has the slider, the slider passes through the spout of vertical setting and is connected framework sliding connection.
As a further description of the above technical solution:
the cross section of the positioning seat is of a C-shaped structure.
To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:
1. the utility model discloses in, pass through the grip block with the IC-plate and fix behind the mould seat with the third screw rod, pass through the bolt fastening with mould seat and mould upper cover, rotate the second screw rod, the second screw rod passes through the external screw thread and drives the promotion cover and down remove, promotes the cover and promotes the steel mesh through the positioning seat and contact the IC-plate down to make the mould upper cover can carry out the regulation of steel mesh position according to the thickness of IC-plate, thereby improved the BGA restoration with the practicality of planting the ball anchor clamps.
2. The utility model discloses in, when needing to carry out the planting ball of different IC boards, the first screw rod of up rotating pushes away the steel mesh from the positioning seat and breaks away from through the groove, combines new steel mesh through leading to groove and positioning seat, and fix the steel mesh through rotatory first screw rod, thereby only need to change different steel meshes when making to carry out different IC boards and plant the ball, need not whole change mould upper cover, thereby when having reduced equipment cost, improved BGA restoration with the result of use of planting the ball anchor clamps.
Drawings
Fig. 1 shows a schematic structural diagram provided according to an embodiment of the present invention;
fig. 2 shows a schematic structural diagram of a location a provided according to an embodiment of the present invention;
fig. 3 shows a schematic structural diagram of a mold cover according to an embodiment of the present invention;
fig. 4 shows a schematic structural diagram of a mold base according to an embodiment of the present invention.
Illustration of the drawings:
1. covering the die; 2. a mold base; 3. a through groove; 4. connecting the frame body; 5. positioning seats; 6. a first screw; 7. a steel mesh; 8. a chute; 9. a slider; 10. a second screw; 11. a push sleeve; 12. a butt strap; 13. a clamping block; 14. and a third screw.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a BGA restores and uses mould lid adjustable ball planting anchor clamps, including mould seat 2, bolt fixedly connected with mould upper cover 1 is passed through at 2 tops of mould seat, table wall fixed mounting has the connection framework 4 in the mould upper cover 1, table wall fixed mounting has positioning seat 5 in the connection framework 4, and the table wall is provided with steel mesh 7 in the positioning seat 5, 1 top fixed mounting of mould upper cover has attachment strap 12, attachment strap 12 horizontal end is vertical to be worn to be equipped with second screw rod 10, 10 exterior walls of second screw rod close soon through the screw thread and are connected with promotion cover 11, and promote 11 bottoms of cover and 5 fixed connection of positioning seat.
Specifically, as shown in fig. 1, logical groove 3 has been seted up with connecting 4 horizontal ends one sides of framework to mould upper cover 1, positioning seat 5 passes through first screw rod 6 fixed connection with steel mesh 7, up first screw rod 6 of rotating, push away steel mesh 7 from positioning seat 5 and break away from mould upper cover 1 through leading to groove 3, combine new steel mesh 7 with positioning seat 5 through leading to groove 3, and it is fixed with steel mesh 7 through rotatory first screw rod 6, thereby make and only need change different steel mesh 7 when carrying out different IC boards and plant the ball, need not whole change mould upper cover 1, thereby when having reduced equipment cost, the result of use of ball anchor clamps is restoreed with BGA has been improved.
Specifically, as shown in fig. 4, the mold base 2 includes a third screw 14 and two sets of clamping blocks 13 screwed with the third screw 14, and the openings of the two sets of clamping blocks 13 are deviated from each other to fix the IC board.
Specifically, as shown in fig. 2, the second screw 10 is engaged with the strap 12 to ensure the stability of the rotation of the second screw 10.
Specifically, as shown in fig. 1, the outer surface wall fixed mounting of the vertical end of the positioning seat 5 has a slider 9, and the slider 9 is connected with the connecting frame body 4 in a sliding manner through a vertically arranged sliding groove 8, so as to improve the stability of the movement of the positioning seat 5.
Specifically, as shown in fig. 1, the cross section of the positioning seat 5 is a C-shaped structure, so as to enhance the stability of the steel mesh 7 and facilitate the installation of the steel mesh 7.
The working principle is as follows: when in use, after the IC board is fixed on the die base 2 through the clamping block 13 and the third screw 14, the die base 2 and the die upper cover 1 are fixed through the bolt, the second screw 10 is rotated, the second screw 10 drives the pushing sleeve 11 to move downwards through the external thread, the pushing sleeve 11 pushes the steel mesh 7 to contact the IC board downwards through the positioning seat 5, so that the die upper cover 1 can adjust the position of the steel mesh 7 according to the thickness of the IC board, thereby improving the practicability of the BGA ball planting fixture, when the ball planting of different IC boards is needed, the first screw 6 is rotated upwards, the steel mesh 7 is pushed away from the positioning seat 5 and separated from the die upper cover 1 through the through groove 3, the new steel mesh 7 is combined with the positioning seat 5 through the through groove 3, and the steel mesh 7 is fixed through rotating the first screw 6, so that only different steel meshes 7 need to be replaced when the ball planting of different IC boards is carried out, the whole die upper cover 1 does not need to be replaced, therefore, the equipment cost is reduced, and the using effect of the ball planting clamp for BGA repair is improved.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. The utility model provides a BGA restores and uses mould lid adjustable ball planting anchor clamps, includes mould seat (2), its characterized in that, bolt fixedly connected with mould upper cover (1) is passed through at mould seat (2) top, table wall fixed mounting has connection framework (4) in mould upper cover (1), table wall fixed mounting has positioning seat (5) in connection framework (4), just table wall is provided with steel mesh (7) in positioning seat (5), mould upper cover (1) top fixed mounting has attachment strap (12), attachment strap (12) horizontal end is vertical wears to be equipped with second screw rod (10), second screw rod (10) outward appearance wall closes soon through the screw thread and is connected with promotion cover (11), just promote cover (11) bottom and positioning seat (5) fixed connection.
2. The BGA repair mold cover adjustable ball-planting fixture of claim 1, wherein the mold upper cover (1) and one side of the horizontal end of the connecting frame body (4) are provided with a through groove (3), and the positioning seat (5) and the steel mesh (7) are fixedly connected through a first screw (6).
3. The BGA repair mold lid adjustable ball-planting fixture of claim 1, wherein the mold base (2) comprises a third screw (14) and two sets of clamping blocks (13) screwed with the third screw (14), and the openings of the two sets of clamping blocks (13) are opposite.
4. The BGA repair mold lid adjustable ball-planting jig of claim 1, wherein the second screw (10) is connected with the butt strap (12) in a snap-fit manner.
5. The BGA repair mold cover adjustable ball-planting fixture according to claim 1, wherein a slide block (9) is fixedly mounted on the outer surface wall of the vertical end of the positioning seat (5), and the slide block (9) is slidably connected with the connecting frame body (4) through a vertically arranged slide groove (8).
6. The BGA repair mold cap-adjustable ball-planting jig as claimed in claim 2, wherein the positioning seat (5) has a C-shaped cross-section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922197516.0U CN212191632U (en) | 2019-12-10 | 2019-12-10 | BGA restores and covers adjustable ball planting anchor clamps with mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922197516.0U CN212191632U (en) | 2019-12-10 | 2019-12-10 | BGA restores and covers adjustable ball planting anchor clamps with mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212191632U true CN212191632U (en) | 2020-12-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922197516.0U Expired - Fee Related CN212191632U (en) | 2019-12-10 | 2019-12-10 | BGA restores and covers adjustable ball planting anchor clamps with mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212191632U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114378745A (en) * | 2022-02-08 | 2022-04-22 | 湖南越摩先进半导体有限公司 | Ball planting device |
-
2019
- 2019-12-10 CN CN201922197516.0U patent/CN212191632U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114378745A (en) * | 2022-02-08 | 2022-04-22 | 湖南越摩先进半导体有限公司 | Ball planting device |
| CN114378745B (en) * | 2022-02-08 | 2023-05-05 | 湖南越摩先进半导体有限公司 | Ball planting device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201222 |