CN212183661U - Set-top box - Google Patents
Set-top box Download PDFInfo
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- CN212183661U CN212183661U CN202020726956.0U CN202020726956U CN212183661U CN 212183661 U CN212183661 U CN 212183661U CN 202020726956 U CN202020726956 U CN 202020726956U CN 212183661 U CN212183661 U CN 212183661U
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- card
- slot
- mounting
- top box
- pcb substrate
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Abstract
The utility model discloses a set-top box, which comprises a PCB substrate, a shell and a CA card, wherein the shell is provided with a containing cavity, and the outer wall of the shell is concavely provided with an installation clamping groove; the PCB substrate is arranged in the accommodating cavity; the CA card is detachably arranged in the mounting card slot and is electrically connected with the PCB substrate. The utility model discloses change traditional interpolation formula into external, expose CA card most in casing outside air, do benefit to and reduce CA card ambient temperature.
Description
Technical Field
The utility model relates to a communication device technical field, in particular to set top box.
Background
In a series of set-top boxes, a CA card, namely a China Mobile Multimedia Broadcasting (CMMB) Mobile television CA decryption card, is used for a CMMB Mobile television terminal device, and is directed to a terminal device of a city in which a part of the CMMB is encrypted. The thickness of the CA card is 0.8mm, the material except the chip is plastic, in addition, the CA card is generally inserted into the bottom of the PCB and placed in the bottom case of the chassis, and is easy to deform under the influence of heat, so the temperature rise requirement is strict and is generally lower than 18 ℃. Although not generating heat by itself, the peripheral devices affect the temperature rise of the CA card by conducting and radiating heat through the PCB.
One solution is to minimize the number of high heat flux devices in the area on the PCB covered by the CA card, thus reducing the direct impact of high temperature devices on the CA card; another solution is to open holes or slots between the area on the PCB covered by the CA card and the nearby high heat flux devices to block heat from directly conducting to the CA card area.
However, since the system is of a compact design, the layout on the PCB is very dense, and it is impossible to minimize the number of devices with high heat flux density in the area on the PCB covered by the CA card, and there is no space for opening a hole or a slot.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a STB aims at reaching the reduction CA card temperature rise through reducing CA snap ring ambient temperature.
In order to achieve the above object, the utility model provides a set-top box, include:
the shell is provided with an accommodating cavity, and the outer wall of the shell is concavely provided with an installation clamping groove;
the PCB substrate is arranged in the accommodating cavity; and
and the CA card is detachably arranged in the mounting card slot and is electrically connected with the PCB substrate.
In one embodiment, the bottom wall of the installation clamping groove is convexly provided with a plurality of partition ribs arranged at intervals, and the CA card is accommodated in the installation clamping groove and is abutted against the partition ribs.
In one embodiment, the groove wall of the mounting groove is provided with a through hole communicated with the accommodating cavity, and the CA card is electrically connected with the PCB substrate through the through hole.
In one embodiment, the through hole is formed in the bottom wall of the mounting clamping groove, a shielding plate extends out of one side wall of the mounting clamping groove corresponding to the through hole, the shielding plate and the bottom wall of the mounting clamping groove are arranged in parallel at intervals, and the CA card is detachably arranged between the shielding plate and the bottom wall of the mounting clamping groove.
In one embodiment, the PCB substrate is provided with a card mounting seat corresponding to the through hole, the card mounting seat is provided with a card slot, and the CA card is received in the mounting card slot and partially inserted into the card slot so as to electrically connect the CA card with the PCB substrate.
In one embodiment, an elastic part is arranged in the clamping groove, and the CA card is detachably inserted in a gap formed by the elastic part and the groove wall of the clamping groove;
and/or the groove wall of the clamping groove forming the gap is an inclined surface.
In one embodiment, two opposite side walls of the mounting clamping groove are respectively provided with a guide groove; the CA card is inserted into or separated from the mounting slot along the guide slot.
In one embodiment, the shell comprises a bottom shell and a top shell, and the bottom shell and the top shell enclose to form an accommodating cavity; one side of the bottom shell, which is far away from the containing cavity, is concavely provided with an installation clamping groove.
In one embodiment, a foot pad is convexly arranged on one side of the bottom shell, which is far away from the accommodating cavity.
In one embodiment, the bottom shell is provided with a first heat dissipation hole;
and/or the top shell is provided with a third heat dissipation hole;
and/or the side wall of the mounting clamping groove is provided with a second heat dissipation hole.
In one embodiment, the side wall of the mounting slot is provided with a second heat dissipation hole.
The set-top box of the technical proposal of the utility model changes the jack form of the traditional interpolation type CA card into the external form by arranging the installation clamping groove on the concave outer wall of the shell, the utility model detachably arranges the CA card in the installation clamping groove, exposes most of the CA card in the air outside the shell, and is beneficial to reducing the ambient temperature of the CA card; the CA card and the PCB substrate are separated by the groove wall of the mounting groove, so that the thermal radiation influence of the PCB substrate on the CA card is reduced to a certain extent; meanwhile, the detachable installation mode is convenient for plugging and unplugging the CA card.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is an exploded schematic view of an embodiment of a set-top box of the present invention;
fig. 2 is a schematic structural diagram of an embodiment of the set-top box of the present invention;
fig. 3 is a schematic view illustrating a connection between a card holder and a PCB substrate according to an embodiment of the set-top box of the present invention;
FIG. 4 is an enlarged view taken at A in FIG. 3;
fig. 5 is a schematic view of the set-top box according to an embodiment of the present invention without a bottom shell.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 1 | |
2112 | |
| 11 | |
2113 | |
| 111 | |
212 | |
| 1111 | |
213 | |
| 1112 | Elastic piece | 214 | A first |
| 2 | |
215 | Second heat dissipation hole |
| 21 | |
22 | |
| 211 | |
3 | |
| 2111 | Through hole |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a set top box.
Referring to fig. 1 to 2, fig. 1 is an exploded schematic view of an embodiment of a set-top box of the present invention; fig. 2 is a schematic structural diagram of an embodiment of the set-top box of the present invention; fig. 3 is a schematic view illustrating a connection between a card holder and a PCB substrate according to an embodiment of the set-top box of the present invention; FIG. 4 is an enlarged view taken at A in FIG. 3; fig. 5 is a schematic view of the set-top box according to an embodiment of the present invention without a bottom shell.
In the embodiment of the present invention, as shown in fig. 1 and fig. 2, the set-top box includes a PCB substrate 1, a housing 2 and a CA card 3, wherein the housing 2 has a receiving cavity, and an installation card slot 211 is concavely provided on an outer wall of the housing 2; the PCB substrate 1 is arranged in the accommodating cavity; the CA card 3 is detachably disposed in the mounting card slot 211 and electrically connected to the PCB substrate 1.
The set-top box of the technical proposal of the utility model changes the jack form of the traditional interpolation type CA card into the external form by arranging the installation clamping groove 211 on the outer wall of the shell 2 in a concave way, the utility model detachably arranges the CA card 3 in the installation clamping groove 211, exposes most of the CA card 3 in the air outside the shell 2, and is beneficial to reducing the environmental temperature of the CA card 3; the CA card 3 and the PCB substrate 1 are separated by the groove wall of the mounting groove 211, so that the thermal radiation influence of the PCB substrate 1 on the CA card 3 is reduced to a certain extent; meanwhile, the detachable installation mode is convenient for plugging and unplugging the CA card 3. And the PCB substrate 1 and the CA card 3 are electrically connected through wiring.
In one embodiment, as shown in fig. 1 and 2, the housing 2 is made of plastic, the housing 2 is square, one side of the housing 2 placed on the desktop is the lower side, a plurality of switch holes are formed on the periphery of the housing 2 for inserting the switching connectors and the like, the PCB substrate 1 is installed in the accommodating cavity of the housing 2, the PCB substrate 1 is arranged in parallel with the upper and lower sides of the housing 2, electrical components such as a CPU & image processing chip and a high-frequency switching head are installed on the PCB substrate, and the CPU & image processing chip and the high-frequency switching head are all heating components.
As shown in fig. 1 and 2, the mounting card slot 211 is provided with a lower side of the housing 2, the CA card 3 is arranged in parallel with the PCB substrate 1 at a spacing, and there is a projected overlapping area between the CA card 3 and the PCB substrate 1.
In one embodiment, the CA card 3 is inserted into the mounting slot 211, in another embodiment, the CA card 3 can be fastened to the mounting slot 211 by means of a snap, and in yet another embodiment, the CA card 3 can be fixed in the mounting slot 211 by screws.
In one embodiment, as shown in fig. 1, a plurality of partition ribs 212 are protruded from the bottom wall of the mounting slot 211, and the CA card 3 is accommodated in the mounting slot 211 and abuts against the plurality of partition ribs 212.
It can be understood that, by setting up the partition ribs 212, on the one hand, the strength of the side wall of the mounting card slot 211 close to the PCB substrate 1 is enhanced, and on the other hand, the thermal contact between the CA card 3 and the side wall of the mounting card slot 211 close to the PCB substrate 1 is changed from face-to-face to line-to-face, which reduces the temperature influence of the bottom case 21 on the CA card 3.
In one embodiment, as shown in fig. 1 and 2, the bottom wall of the mounting slot 211 extends to the peripheral side of the housing 2 to form an open end, and the partition rib 212 is elongated and extends toward the open end.
As shown in fig. 1, in an embodiment, the number of the partition ribs 212 is plural, and the partition ribs are arranged at intervals; the partition rib 212 may be arranged according to the size of the overlapping area between the CA card 3 and the bottom wall of the mounting card slot 211.
In one embodiment, as shown in fig. 1, a through hole 2111 communicating with the accommodating cavity is formed in a wall of the mounting slot 211, and the CA card 3 is electrically connected to the PCB substrate 1 through the through hole 2111.
The through hole 2111 is provided to facilitate connection of the CA card 3 with the PCB substrate 1.
In an embodiment, as shown in fig. 1, the through hole 2111 is formed in the bottom wall of the mounting slot 211, a shielding plate 2113 extends from a side wall of the mounting slot 211 corresponding to the through hole 2111, the shielding plate 2113 is parallel to the bottom wall of the mounting slot 211 at an interval, and the CA card 3 is detachably disposed between the shielding plate 2113 and the bottom wall of the mounting slot 211.
In this embodiment, the shielding plate 2113 protects the PCB substrate 1 and the card receptacle 11, and particularly prevents foreign objects from rubbing against the PCB substrate 1 and the card receptacle 11 during transportation and placement when the CA card 3 is not inserted. Meanwhile, in this embodiment, the shielding plate 2113 also plays a role in fixing the CA card 3 in a clamping manner, and assists in inserting the CA card 3 in the insertion process of the CA card 3, thereby avoiding the occurrence of deviation in insertion.
The shielding plate 2113 is provided with an inclined surface which is inclined toward the inside of the mounting card slot to facilitate the insertion of the auxiliary CA card 3.
In an embodiment, the through hole 2111 may also be opened in a side wall of the bottom wall of the mounting card slot 211, and the CA card 3 and the PCB substrate 1 are electrically connected by a wire.
And set up through-hole 2111 at the diapire of installation card groove 211, can make things convenient for CA card 3 to be connected with PCB base plate 1 electricity, realize the electricity through binding post and connect.
As shown in fig. 1, the through hole 2111 is opened at a position far from the opening end of the bottom wall of the mounting slot 211 and extends to the side wall opposite to the opening end, so as to facilitate manufacturing of the mold, a connection between the side wall opposite to the opening end and the bottom wall is disconnected to form a second through hole, the second through hole is communicated with the through hole 2111, and stress generated when the mold is opened can be released.
The mould is used for the casing integrated into one piece.
In one embodiment, as shown in fig. 1, the PCB substrate 1 is provided with a card mounting seat 11, the card mounting seat 11 is disposed corresponding to the through hole 2111, and the card mounting seat 11 is provided with a CA card 3 received in the mounting card slot 211 and partially inserted into the card slot 1111, so that the CA card 3 is electrically connected to the PCB substrate 1.
The PCB substrate 1 is connected with the card mounting seat 11 in an inserting or threaded manner, and the CA card 3 is connected with the card mounting seat 11 in an inserting manner.
In other embodiments, the PCB substrate 1 and the card mounting seat 11 are fixedly connected or integrally disposed.
One end of the card mounting seat 11 is provided with a card slot 1111 for inserting the CA card 3, and the other end is connected with the PCB substrate 1 through a wiring terminal.
In one embodiment, as shown in fig. 3, 4 and 5, the card mounting base 11 has a card slot portion 111 into which the CA card 3 is inserted, the card slot portion 111 passes through and extends out of the through hole 2111 to the mounting card slot 211, and a card slot 1111 into which the CA card 3 is inserted is provided on the card slot portion 111.
In one embodiment, as shown in fig. 4, the slot 211 is provided with a resilient member 1112, and the CA card 3 is detachably inserted into a gap formed by the resilient member 1112 and a slot wall of the slot 1111; and/or the groove wall of the clamping groove forming the gap is an inclined surface.
The elastic piece 1112 realizes soft contact in the inserting or extracting process of the CA card 3, so that the damage of hard contact to the CA card 3 is avoided, and meanwhile, after the CA card 3 is inserted, the elastic piece 1112 extrudes the CA card 3, so that the CA card 3 is stably clamped between the elastic piece 1112 and the groove wall of the clamping groove 1111. The reason why the distance between the notches of the clamping groove 1111 is gradually reduced along the card insertion direction is to facilitate card insertion and to realize quick and accurate positioning during card insertion.
In an embodiment, as shown in fig. 4, the elastic element 1112 is an elastic piece, the card mounting seat 11 is provided with a movable hole for the elastic element 1112 to move, one end of the elastic element 1112 is installed on one side of the card slot 1111 close to the PCB substrate 1, the other end of the elastic element 1112 penetrates through the movable hole, the middle part of the elastic element 1112 bends toward one side of the card slot 1111 away from the PCB substrate 1 to form a protrusion, one end to the middle part of the elastic element 1112 is an inclined plane, one side of the card slot 1111 away from the PCB substrate 1 is an inclined plane, and the two inclined planes form a V-shaped card slot for inserting and positioning a CA card 3. Meanwhile, the elastic sheet is made of metal, and the CA card 3 can be electrically connected with the PCB substrate 1 through the metal elastic sheet.
In another embodiment, the elastic member 1112 may be a spring top bead.
In one embodiment, as shown in fig. 1, two opposite sidewalls of the mounting slot 211 are respectively provided with a guide slot 2112; CA card 3 is inserted into or removed from mounting card slot 211 along guide slot 2112.
By providing the guide groove 2112, the insertion and extraction of the CA card 3 are facilitated.
In one embodiment, as shown in fig. 1 and 2, two side walls adjacent to the open end are respectively provided with a guide slot 2112, the guide slot 2112 extends from the open end to a side wall opposite to the open end, and a shielding plate 2113 extends from the side wall opposite to the open end.
As shown in fig. 1 and 2, two opposite side walls of the mounting slot 211 extend into the mounting slot 211 to form two guide walls, which are parallel to the bottom wall and spaced apart from each other to form a guide slot, and the guide slots form a guide slot 2112 on one hand and a support for the CA card 3 on the other hand.
In another embodiment, a clamping protrusion is arranged at the bottom of the mounting slot 211, the CA card 3 is provided with a clamping groove, and the clamping protrusion is in adaptive clamping connection with the clamping groove, so that the CA card 3 is detachably connected with the mounting slot 211.
In one embodiment, as shown in fig. 1 and 2, the housing 2 includes a bottom shell 21 and a top shell 22, and the bottom shell 21 and the top shell 22 enclose to form a receiving cavity; one side of the bottom shell 21 departing from the accommodating cavity is concavely provided with an installation clamping groove 211.
The top shell and the bottom shell are arranged, so that the devices in the accommodating cavity can be conveniently installed and maintained.
In one embodiment, bottom housing 21 and mounting slot 211 are integrally formed.
In one embodiment, as shown in fig. 1 and 2, a side of bottom case 21 facing away from the accommodating cavity is protruded with a foot pad 213. The setting of the stand-off 213 helps to reduce the heat reflection of the CA card 3 from the desktop on which the set-top box is placed, while enhancing the convective heat transfer of air.
In one embodiment, as shown in fig. 1 and 2, the bottom surface of bottom case 21 is rectangular, and the number of foot pads 213 is four, and the foot pads are respectively disposed at four corners of the rectangle.
In one embodiment, the height of the footpad 213 is greater than or equal to 4 mm.
In one embodiment, as shown in fig. 1 and 2, the bottom case 21 is formed with a first heat dissipation hole 214. The heat dissipation of the PCB substrate 1 in the accommodating cavity is realized. The air heat dissipation efficiency is improved, the influence of the heat conduction of the PCB substrate 1 on the CA card 3 is further reduced, and the temperature rise of the CA card 3 is reduced.
In one embodiment, as shown in fig. 1 and 2, the number of the first heat dissipation holes 214 is multiple, so as to improve the heat dissipation efficiency.
In one embodiment, as shown in fig. 1, the sidewall of the mounting slot 211 is opened with a second heat dissipation hole 215. Through setting up second louvre 215, can reduce the temperature rise of installation card slot 211 lateral wall, and then reduce the heat radiation influence to CA card 3.
As shown in fig. 1, the partition rib 212 and the second heat dissipation holes 215 are both in a strip shape, and the second heat dissipation holes are disposed on both sides of the partition rib 212.
In one embodiment, the top case is provided with a plurality of third heat dissipation holes.
The air circulation process of the above arrangement is as follows: when air enters the accommodating cavity through the first heat dissipation hole 214, the second heat dissipation hole 215 or the third heat dissipation hole, the air passes through the PCB substrate 1 and flows out from the first heat dissipation hole 214, the second heat dissipation hole 215, the third heat dissipation hole or the through hole 2111, heat dissipation is realized, meanwhile, especially, the air flowing out from the second heat dissipation hole 215 or the through hole 2111 flows out from the opening of the installation clamping groove 211, heat accumulation is avoided, the temperature rise of the side wall of the installation clamping groove 211 between the PCB substrate 1 and the CA card 3 is reduced, and the temperature rise of the CA card 3 is further reduced.
As shown in fig. 1 and 2, the second heat dissipation holes 215 are strip-shaped holes, and the first heat dissipation holes 214 are long strip-shaped holes or circular holes.
The arrangement of the first heat dissipation hole 214, the second heat dissipation hole 215, the third heat dissipation hole and the through hole 2111 can form an air circulation channel, so that the purpose of air convection heat dissipation is achieved.
Through the analogue test, the utility model discloses for current CA card interpolation formula STB, the temperature rise of CA card can reduce more than 4 ℃.
It should be noted that the PCB substrate refers to a Printed Circuit Board, which is named as a Printed Circuit Board in chinese, and the present application does not improve the Circuit connection of the PCB substrate of the set-top box, and those skilled in the art can implement the foregoing technology.
The above is only the optional embodiment of the present invention, and not the scope of the present invention is limited thereby, all the equivalent structure changes made by the contents of the specification and the drawings are utilized under the inventive concept of the present invention, or the direct/indirect application in other related technical fields is included in the patent protection scope of the present invention.
Claims (10)
1. A set top box, comprising:
the shell is provided with an accommodating cavity, and an installation clamping groove is concavely arranged on the outer wall of the shell;
the PCB substrate is arranged in the accommodating cavity; and
and the CA card is detachably arranged in the mounting card slot and is electrically connected with the PCB substrate.
2. The set-top box of claim 1, wherein a plurality of spaced-apart ribs are raised from a bottom wall of the mounting slot, and wherein the CA card is received in the mounting slot and abuts the plurality of ribs.
3. The set top box of claim 1, wherein a through hole is formed in a wall of the mounting slot to communicate with the receiving cavity, and the CA card is electrically connected to the PCB substrate through the through hole.
4. The set top box of claim 3, wherein the through hole is formed in a bottom wall of the mounting slot, a shielding plate extends from a side wall of the mounting slot corresponding to the through hole, the shielding plate is spaced from the bottom wall of the mounting slot in parallel, and the CA card is detachably disposed between the shielding plate and the bottom wall of the mounting slot.
5. The set-top box of claim 3, wherein the PCB substrate is provided with a card mount corresponding to the through-hole, the card mount being provided with a card slot, the CA card being received in the card mount slot and partially inserted into the card slot to electrically connect the CA card with the PCB substrate.
6. The set-top box of claim 5, wherein the card slot is provided with an elastic member therein, and the CA card is detachably inserted into a gap formed by the elastic member and a slot wall of the card slot;
and/or the groove wall of the clamping groove forming the gap is an inclined surface.
7. The set-top box of claim 1, wherein two opposite side walls of the mounting slot are respectively provided with a guide groove; the CA card is inserted into or separated from the mounting slot along the guide slot.
8. The set top box of any of claims 1 to 7, wherein the housing comprises a bottom shell and a top shell that enclose the receiving cavity; one side of the bottom shell, which deviates from the accommodating cavity, is concavely provided with the mounting clamping groove.
9. The set-top box of claim 8, wherein a side of the bottom shell facing away from the receiving cavity is convexly provided with a foot pad.
10. The set-top box of claim 8, wherein the bottom shell defines a first heat dissipation aperture;
and/or the top shell is provided with a third heat dissipation hole;
and/or, the side wall of the mounting clamping groove is provided with a second heat dissipation hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020726956.0U CN212183661U (en) | 2020-05-06 | 2020-05-06 | Set-top box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020726956.0U CN212183661U (en) | 2020-05-06 | 2020-05-06 | Set-top box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212183661U true CN212183661U (en) | 2020-12-18 |
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ID=73765379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020726956.0U Active CN212183661U (en) | 2020-05-06 | 2020-05-06 | Set-top box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212183661U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114397019A (en) * | 2021-12-06 | 2022-04-26 | 湖北鑫汇生物科技有限公司 | Detecting instrument |
-
2020
- 2020-05-06 CN CN202020726956.0U patent/CN212183661U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114397019A (en) * | 2021-12-06 | 2022-04-26 | 湖北鑫汇生物科技有限公司 | Detecting instrument |
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