CN212180884U

CN212180884U - Current sensor

Info

Publication number: CN212180884U
Application number: CN202020576478.XU
Authority: CN
Inventors: 何必胥; 常辉; 林华定
Original assignee: Shanghai Prevision Automotive Sensor Co ltd
Current assignee: Shanghai Prevision Automotive Sensor Co ltd
Priority date: 2020-04-17
Filing date: 2020-04-17
Publication date: 2020-12-18
Anticipated expiration: 2030-04-17

Abstract

The utility model discloses a current sensor, which comprises a rectangular mounting frame, wherein an electrical socket is arranged on the mounting frame; the upper and lower parts of the mounting frame are respectively connected with an upper cover plate and a lower cover plate, at least three groups of C-shaped silicon steel sheets are mounted in the mounting frame, fixed claws limiting movement are arranged on the periphery of each group of silicon steel sheets, and the fixed claws are fixedly arranged on the inner wall of the mounting frame; the bottom of the inner cavity of the mounting frame is provided with a chip; install the PCBA board on the apron down, the silicon steel sheet passes through the chip and connects the PCBA board, the PCBA board is connected with electric socket. The utility model discloses an adopt stationary dog and ultrasonic bonding line to fix the silicon steel sheet, make the silicon steel sheet difficult for removing, more stable, and through set up recess installation chip in the installing frame, make the three routes test integration of silicon steel sheet at a plug, make the installation of whole silicon steel sheet and chip more stable.

Description

Current sensor

Technical Field

The utility model relates to a current sensor's technical field especially relates to a current sensor.

Background

The current sensor is a detection device which can sense the information of the current to be detected and convert the sensed information into an electric signal meeting certain standards or other information in required forms according to a certain rule for output so as to meet the requirements of information transmission, processing, storage, display, recording, control and the like.

The current sensor is one of magnetic sensors, and can be used for household appliances, smart grids, electric vehicles, wind power generation and the like.

The current sensor often has a working condition that information output cannot be transmitted due to instable installation of silicon steel sheets and chips.

SUMMERY OF THE UTILITY MODEL

The utility model provides an installation makes the more stable current sensor of installation of whole silicon steel sheet and chip.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a current sensor comprises a rectangular mounting frame, wherein an electric socket is arranged on the mounting frame; the upper cover plate and the lower cover plate are respectively connected to the upper part and the lower part of the mounting frame, and the mounting frame is internally provided with at least three groups of C-shaped silicon steel sheets, the periphery of each group of silicon steel sheets is provided with a fixed claw for limiting movement, and the fixed claws are fixedly arranged on the inner wall of the mounting frame; the bottom of the inner cavity of the mounting frame is provided with a chip; install the PCBA board on the apron down, the silicon steel sheet passes through the chip and connects the PCBA board, the PCBA board is connected with electric socket.

Preferably, the upper cover plate and the lower cover plate are respectively provided with an ultrasonic welding line for fixing the position of the silicon steel sheet.

Preferably, the PCBA board is embedded and mounted on the lower cover plate.

Preferably, a fixing column is arranged in the mounting frame and used for placing the C-shaped silicon steel sheet in a penetrating and sleeving manner.

Preferably, the bottom of installing frame inner chamber is equipped with the recess, the recess is located the opening part of the silicon steel sheet of C font, the recess is used for firmly placing the chip.

The utility model discloses an adopt stationary dog and ultrasonic bonding line to fix the silicon steel sheet, make the silicon steel sheet difficult for removing, more stable, and through set up recess installation chip in the installing frame, make the three routes test integration of silicon steel sheet at a plug, make the installation of whole silicon steel sheet and chip more stable.

Drawings

Fig. 1 is the utility model provides a current sensor's whole spatial structure sketch map.

Fig. 2 is a schematic top view of a current sensor according to the present invention;

FIG. 3 is a cross-sectional view C-C of FIG. 2;

fig. 4 is a schematic view of a three-dimensional structure inside a current sensor according to the present invention;

fig. 5 is a schematic perspective view of a groove in a current sensor according to the present invention;

fig. 6 is a diagram of the installation structure of the PCBA board in the current sensor provided by the present invention.

Reference numbers in the figures:

1. an upper cover plate; 2. a lower cover plate; 3. an electrical outlet; 4. a reinforcement ring; 5. silicon steel sheets; 6. a chip; 7. PCBA board; 8. a groove; 9. ultrasonic welding wires; 10. a fixed jaw; 11. and (5) fixing the column.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

As shown in fig. 1 to 6, for the current sensor provided by the present invention, the current sensor includes a rectangular mounting frame and a C-shaped silicon steel sheet 5, wherein an electrical socket 3 is disposed on the mounting frame; the upper and lower parts of the mounting frame are respectively connected with an upper cover plate 1 and a lower cover plate 2, three fixing columns 11 are fixed in the mounting frame, and the fixing columns 11 are used for being sleeved with C-shaped silicon steel sheets 5;

the periphery of each group of silicon steel sheets 5 is provided with a fixed claw 10 which can move in a limited manner, the fixed claws 10 are fixedly arranged on the inner wall of the mounting frame, and the fixed claws 10 fix the black silicon steel sheets 5 through ultrasonic hot riveting; a groove 8 is formed in the bottom of the inner cavity of the mounting frame, the groove 8 is located at the opening of the C-shaped silicon steel sheet 5, and the groove 8 is used for stably placing the chip 6; lower apron 2 goes up the embedded PCBA board 7 that installs, silicon steel sheet 5 passes through chip 6 and connects PCBA board 7, PCBA board 7 is connected with electric socket 3.

Further, the edges of the periphery of the upper cover plate 1 and the lower cover plate 2 are respectively provided with an ultrasonic welding line 9 for fixing the position of the silicon steel sheet 5, and the ultrasonic welding lines are installed through ultrasonic welding.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A current sensor comprises a rectangular mounting frame, wherein an electric socket (3) is arranged on the mounting frame; the mounting frame is characterized in that at least three groups of C-shaped silicon steel sheets (5) are mounted in the mounting frame, fixing claws (10) limiting movement are arranged on the periphery of each group of silicon steel sheets (5), and the fixing claws (10) are fixedly arranged on the inner wall of the mounting frame; the bottom of the inner cavity of the mounting frame is provided with a chip (6); install PCBA board (7) on lower apron (2), PCBA board (7) are connected through chip (6) in silicon steel sheet (5), PCBA board (7) are connected with electric socket (3).

2. A current sensor according to claim 1, characterized in that the upper cover plate (1) and the lower cover plate (2) are provided with ultrasonic welding lines (9) for fixing the position of the silicon steel sheet (5), respectively.

3. A current sensor according to claim 1, characterised in that the lower cover plate (2) has embedded therein a PCBA plate (7).

4. The current sensor according to claim 1, wherein a fixing column (11) is arranged in the mounting frame, and the fixing column (11) is used for placing a C-shaped silicon steel sheet (5) in a penetrating manner.

5. The current sensor according to claim 1, wherein a groove (8) is formed in the bottom of the inner cavity of the mounting frame, the groove (8) is located at an opening of the C-shaped silicon steel sheet (5), and the groove (8) is used for stably placing the chip (6).