CN212179120U - Unit and air conditioner based on semiconductor heat exchanger - Google Patents
Unit and air conditioner based on semiconductor heat exchanger Download PDFInfo
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- CN212179120U CN212179120U CN202020600831.3U CN202020600831U CN212179120U CN 212179120 U CN212179120 U CN 212179120U CN 202020600831 U CN202020600831 U CN 202020600831U CN 212179120 U CN212179120 U CN 212179120U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 133
- 238000010438 heat treatment Methods 0.000 claims abstract description 40
- 238000005057 refrigeration Methods 0.000 claims abstract description 27
- 239000003507 refrigerant Substances 0.000 claims description 101
- 239000007788 liquid Substances 0.000 claims description 43
- 238000010257 thawing Methods 0.000 claims description 24
- 238000001816 cooling Methods 0.000 claims description 21
- 230000029058 respiratory gaseous exchange Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 6
- 238000010977 unit operation Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 12
- 238000001704 evaporation Methods 0.000 description 9
- 230000008020 evaporation Effects 0.000 description 9
- 239000007789 gas Substances 0.000 description 6
- 238000009833 condensation Methods 0.000 description 5
- 230000005494 condensation Effects 0.000 description 5
- 238000004781 supercooling Methods 0.000 description 4
- 239000000567 combustion gas Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 239000010687 lubricating oil Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000009491 slugging Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
The utility model discloses a unit and air conditioner based on semiconductor heat exchanger. Wherein, this system includes: compressor, outdoor heat exchanger, indoor heat exchanger and cross valve still include: first semiconductor heat exchanger, its first end sets up outdoor heat exchanger's second end with between indoor heat exchanger's the second end, the second end sets up indoor heat exchanger's first end department with between the second interface of cross valve during unit operation refrigeration mode, first semiconductor heat exchanger's first end is the refrigeration end, and the second end is for heating the end, when unit operation heating mode, first semiconductor heat exchanger's first end switches to heating the end, and the second end switches to heating the end, through the utility model discloses, can utilize semiconductor heat exchanger to realize improving two kinds of functions of super-cooled rate and superheat degree simultaneously, practice thrift the cost, promote refrigeration effect simultaneously.
Description
Technical Field
The utility model relates to an air conditioning technology field particularly, relates to a unit and air conditioner based on semiconductor heat exchanger.
Background
Most of the existing multi-split systems adopt a subcooler to control the supercooling degree of a high-pressure liquid refrigerant and a gas-liquid separator to control the superheat degree of a low-pressure gas refrigerant, the subcooler and the gas-liquid separator have high cost, and the subcooler needs to lose part of the refrigerant to subcool the rest of the refrigerant, so that the refrigerating capacity can be reduced during the refrigerating cycle; the gas-liquid separator has poor control effect on the low-pressure superheat degree, and the liquid return of the compressor cannot be reduced or avoided well.
Aiming at the problem that the supercooling degree and the superheat degree of a refrigerant can not be controlled with low cost and high efficiency in the prior art, an effective solution is not provided at present.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides an in provide a unit and air conditioner based on semiconductor heat exchanger to can not the low cost among the solution prior art, the problem of the super-cooled rate and the superheat degree of high efficiency control refrigerant.
In order to solve the technical problem, the utility model provides a unit based on semiconductor heat exchanger, wherein, this system includes: compressor, outdoor heat exchanger, indoor heat exchanger and cross valve, the first interface of cross valve with the exhaust end intercommunication of compressor, the second interface with the first end intercommunication of indoor heat exchanger, the third interface with the end intercommunication of breathing in of compressor, the fourth interface with the first end intercommunication of outdoor heat exchanger, its characterized in that, the unit still includes:
a first end of the first semiconductor heat exchanger is arranged between the second end of the outdoor heat exchanger and the second end of the indoor heat exchanger, and a second end of the first semiconductor heat exchanger is arranged between the first end of the indoor heat exchanger and a second interface of the four-way valve;
when the unit operates in a heating mode, the first semiconductor heat exchanger is used for reducing the temperature of a refrigerant discharged by the outdoor heat exchanger and improving the temperature of the refrigerant discharged by the indoor heat exchanger, and the first end of the first semiconductor heat exchanger is a heating end while the second end of the first semiconductor heat exchanger is a cooling end;
when the unit operates in a refrigeration mode, the first semiconductor heat exchanger is used for increasing the temperature of the refrigerant discharged by the indoor heat exchanger and reducing the temperature of the refrigerant discharged by the compressor, and the first end of the first semiconductor heat exchanger is a heating end while the second end of the first semiconductor heat exchanger is a cooling end.
Further, when the unit operates in the defrosting mode, the first end of the first semiconductor heat exchanger is a refrigerating end, and the first end of the first semiconductor heat exchanger is a heating end.
Further, the unit further includes:
the first control valve is arranged between the first end of the first semiconductor heat exchanger and the second end of the indoor heat exchanger;
the second control valve is arranged between the second end of the first semiconductor heat exchanger and the first end of the indoor heat exchanger;
a defrosting bypass pipeline, wherein the first end of the defrosting bypass pipeline is connected to a pipeline between the first control valve and the first end of the first semiconductor heat exchanger, and the second end of the defrosting bypass pipeline is connected to a pipeline between the second control valve and the second end of the first semiconductor heat exchanger;
the third control valve is arranged on the defrosting bypass pipeline;
when the unit operates in the defrosting mode, the first control valve and the second control valve are closed, the third control valve is opened, and the refrigerant discharged by the outdoor heat exchanger sequentially passes through the first end of the first semiconductor heat exchanger, the third control valve and the second end of the first semiconductor heat exchanger and returns to the compressor; alternatively, the first and second electrodes may be,
the first control valve and the second control valve are opened, the third control valve is closed, and the refrigerant discharged by the outdoor heat exchanger sequentially passes through the first end of the first semiconductor heat exchanger, the first control valve, the indoor heat exchanger, the second control valve and the second end of the first semiconductor heat exchanger and returns to the compressor.
Further, the unit further includes:
the first temperature sensor is arranged between the first end of the first semiconductor heat exchanger and the second end of the indoor heat exchanger and used for detecting the first temperature of a refrigerant after heat exchange with the first end of the first semiconductor heat exchanger when the unit operates in a refrigeration mode, so that the heat exchange quantity of the first semiconductor heat exchanger is adjusted according to the first temperature.
Further, the unit further includes:
and the second temperature sensor is arranged between the second end of the first semiconductor heat exchanger and the third interface of the four-way valve and used for detecting the second temperature of the refrigerant after heat exchange with the second end of the first semiconductor heat exchanger when the unit operates in a refrigeration mode, so that the heat exchange quantity of the first semiconductor heat exchanger is adjusted according to the second temperature.
Further, the unit further includes:
and the third temperature sensor is arranged between the first end of the outdoor heat exchanger and a fourth interface of the four-way valve and used for detecting the third temperature of the refrigerant discharged from the first end of the outdoor heat exchanger when the unit operates in the heating mode, so that the heat exchange quantity of the first semiconductor heat exchanger is adjusted according to the third temperature.
Further, the unit further includes:
and the gas-liquid separator is arranged between the first end of the indoor heat exchanger and the air suction end of the compressor and is used for separating and collecting liquid refrigerants in the refrigerants.
Further, the unit further includes:
and the heating end of the second semiconductor heat exchanger is arranged at the gas-liquid separator and is used for exchanging heat with the gas-liquid separator so as to increase the temperature in the gas-liquid separator.
Further, the unit further includes:
and the expansion valve is arranged on a pipeline between the second end of the outdoor heat exchanger and the second end of the indoor heat exchanger.
The utility model also provides an air conditioner, including above-mentioned unit.
Use the technical scheme of the utility model, through the refrigeration end of semiconductor heat exchanger and the heat transfer of outdoor heat exchanger exhaust liquid refrigerant, reduce the temperature of this liquid refrigerant, and then improve the super-cooled rate of liquid refrigerant, heat production end and the gaseous refrigerant heat transfer of indoor heat exchanger combustion gas through semiconductor heat exchanger promote the temperature of this gaseous refrigerant, and then improve gaseous refrigerant's superheat degree, utilize semiconductor heat exchanger to realize improving two kinds of functions of super-cooled rate and superheat degree simultaneously, the cost is saved, the refrigeration effect has been promoted simultaneously.
Drawings
Fig. 1 is a block diagram of an assembly according to an embodiment of the invention;
fig. 2 is a refrigerant flow diagram of the unit in the refrigeration mode according to the embodiment of the present invention;
fig. 3 is a refrigerant flow diagram of the unit according to the embodiment of the present invention in the heating mode;
fig. 4 is a block diagram of an assembly according to another embodiment of the present invention;
fig. 5 is a refrigerant flow diagram of the unit according to the embodiment of the present invention in the first defrosting mode;
fig. 6 is a refrigerant flow diagram of the unit according to the embodiment of the present invention in the second defrosting mode;
fig. 7 is an internal structural view of a semiconductor heat exchanger according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the embodiments of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, and "a plurality" typically includes at least two.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
It should be understood that although the terms first, second, third, etc. may be used to describe the temperature sensors in embodiments of the present invention, the temperature sensors should not be limited to these terms. These terms are only used to distinguish between temperature sensors. For example, the first temperature sensor may also be referred to as a second temperature sensor, and similarly, the second temperature sensor may also be referred to as a first temperature sensor without departing from the scope of embodiments of the present invention.
The words "if", as used herein, may be interpreted as "at … …" or "at … …" or "in response to a determination" or "in response to a detection", depending on the context. Similarly, the phrases "if determined" or "if detected (a stated condition or event)" may be interpreted as "when determined" or "in response to a determination" or "when detected (a stated condition or event)" or "in response to a detection (a stated condition or event)", depending on the context.
It is also noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in the article or device in which the element is included.
The following describes in detail alternative embodiments of the present invention with reference to the accompanying drawings.
Example 1
This embodiment provides a unit based on semiconductor heat exchanger, and fig. 1 is according to the utility model discloses the block diagram of unit, and the arrow in the figure represents the refrigerant flow direction, and as shown in fig. 1, this unit includes: the air conditioner comprises a compressor 11, an outdoor heat exchanger 12, an indoor heat exchanger 13 and a four-way valve YV1, wherein a first interface a of the four-way valve YV1 is communicated with a discharge end of the compressor 11, a second interface b is communicated with a first end of the indoor heat exchanger 13, a third interface c is communicated with a suction end of the compressor 11, a fourth interface d is communicated with the first end of the outdoor heat exchanger 12, in a cooling mode, the air conditioner is conducted along the first interface a to the fourth interface d and the second interface b to the third interface c, in a heating mode, the air conditioner is conducted along the first interface a to the second interface b and the fourth interface d to the third interface c.
In the existing unit, the pipeline communicated with the first end of the indoor heat exchanger 13 and the pipeline communicated with the second end of the outdoor heat exchanger 12 are parallel and compactly distributed. Therefore, in the cooling mode, it is considered that the same semiconductor heat exchanger is used to cool the liquid pipe communicated with the outdoor heat exchanger 12, so that the refrigerant in the pipeline communicated with the second end of the outdoor heat exchanger 12 exchanges heat with the cooling end of the semiconductor heat exchanger to obtain the supercooling degree, and the gas pipe communicated with the first end of the indoor heat exchanger 13 is heated, so that the gaseous refrigerant in the pipeline communicated with the first end of the indoor heat exchanger 13 exchanges heat with the heating end of the semiconductor heat exchanger to obtain the superheat degree. For the semiconductor heat exchanger, in the heating mode, the refrigerant in the pipeline communicated with the second end of the outdoor heat exchanger 12 exchanges heat with the heating end of the semiconductor heat exchanger to obtain superheat degree, and the cooling end of the refrigerant semiconductor heat exchanger in the pipeline communicated with the first end of the indoor heat exchanger 13 exchanges heat. The refrigerant in the pipeline communicated with the first end of the indoor heat exchanger 13 absorbs the heat of the heating end, and the refrigerant in the pipeline communicated with the second end of the outdoor heat exchanger 12 transfers the heat to the cooling end, so that the normal operation of the semiconductor can be ensured just.
Based on the above concept, as shown in fig. 1, the unit of this embodiment further includes: the first semiconductor heat exchanger 14 comprises a semiconductor unit 141, a first end 142 and a second end 143, the first end 142 is arranged at an outlet of the outdoor heat exchanger 12, the second end 143 is arranged at an outlet of the indoor heat exchanger 13, and when the unit operates in a refrigeration mode, the first end 142 is controlled to exchange heat with a refrigerant discharged by the outdoor heat exchanger 12 so as to reduce the temperature of the refrigerant and further improve the supercooling degree; and controlling the second end 143 to exchange heat with the refrigerant discharged from the indoor heat exchanger 13 to increase the temperature of the refrigerant, so as to increase the superheat degree, and operating the unit.
A first semiconductor heat exchanger 14 including a semiconductor unit 141, a first end 142, a second end 143, the first end 142 being disposed between the second end of the outdoor heat exchanger 12 and the second end of the indoor heat exchanger 13, and the second end thereof being disposed between the first end of the indoor heat exchanger 13 and the second port of the four-way valve;
when the unit operates in the cooling mode, the first semiconductor heat exchanger is configured to reduce the temperature of the refrigerant discharged from the outdoor heat exchanger 12 and increase the temperature of the refrigerant discharged from the indoor heat exchanger 13, so that when the unit operates in the cooling mode, the first semiconductor heat exchanger 14 is energized with a forward current, such that the first end 142 is a cooling end and the second end 143 is a heating end.
Fig. 2 is according to the utility model discloses the refrigerant flow diagram of unit under refrigeration mode, as shown in fig. 2, compressor 11 exhaust high temperature high pressure refrigerant passes through the first interface a of cross valve YV1 in proper order, fourth interface d gets into the condensation of outdoor heat exchanger 12 and releases heat, liquid refrigerant discharge outdoor heat exchanger 12 after releasing heat, first end 142 through first semiconductor heat exchanger 14, further reduce the temperature, it is gaseous discharge to get into the heat absorption evaporation of indoor heat exchanger 13 after the super-cooled rate to improve, the gaseous refrigerant of indoor heat exchanger 13 combustion gas passes through the second end 143 of first semiconductor heat exchanger 14, the temperature further risees, after improving the superheat degree, pass through cross valve YV 1's second interface b again in proper order, third interface c returns the induction end of compressor 11, accomplish a refrigeration cycle.
Under the refrigeration mode, through the refrigeration end of first semiconductor heat exchanger and the heat transfer of the discharged liquid refrigerant of outdoor heat exchanger, reduce the temperature of this liquid refrigerant, and then improve the super-cooled rate of this liquid refrigerant, heat production end through semiconductor heat exchanger and the gaseous refrigerant heat transfer of indoor heat exchanger exhaust, promote the temperature of this gaseous refrigerant, and then improve the superheat degree of this gaseous refrigerant, utilize semiconductor heat exchanger to realize improving two kinds of functions of super-cooled rate and superheat degree simultaneously, the cost is saved, the refrigeration effect has been promoted simultaneously.
When the unit operates in the heating mode, the first semiconductor heat exchanger 14 is configured to increase the temperature of the refrigerant discharged from the indoor heat exchanger 13 and decrease the temperature of the refrigerant discharged from the compressor 11, so that when the unit operates in the heating mode, the first semiconductor heat exchanger 14 is energized with a reverse current, such that the first end 142 is a heating end, and the second end 143 is a cooling end.
Fig. 3 is according to the utility model discloses refrigerant flow diagram under unit heating mode, as shown in fig. 3, compressor 11 exhaust high temperature high pressure refrigerant passes through four-way valve YV 1's first interface a, second interface b in proper order, second end 143 through first semiconductor heat exchanger 14, it is exothermic to further cool down after entering indoor heat exchanger 13 condensation, liquid refrigerant after exothermic discharges indoor heat exchanger 13, second end 142 through first semiconductor heat exchanger 14, the temperature risees, after improving the superheat degree, get into outdoor heat exchanger 12, after the endothermic evaporation is gaseous, fourth interface d through four-way valve YV1, third interface c returns the induction end to compressor 11, accomplish one time heating cycle.
In the heating mode, the liquid refrigerant discharged from the indoor heat exchanger 13 is heated by the heating end of the first semiconductor heat exchanger 14, so that the heat exchange pressure of the outdoor heat exchanger 12 is shared, the temperature of the refrigerant flowing into the outdoor heat exchanger 12 is increased, the frosting of the outdoor heat exchanger 12 can be delayed, the degree of superheat of air suction can be ensured, and the liquid return is avoided.
It should be noted that the first end 142 of the first semiconductor heat exchanger 14 and the second end of the outdoor heat exchanger 12 may be in contact with each other, and exchange heat by heat conduction; the first end 142 and the pipeline at the second end of the outdoor heat exchanger 12 may also be arranged at a preset distance, wherein the preset distance should be smaller than the farthest distance capable of realizing heat exchange, and the smaller the preset distance is, the higher the heat exchange efficiency is, so that the gap between the first end 142 and the pipeline at the second end of the outdoor heat exchanger 12 may be filled with air, and heat exchange is performed in a convection manner; the first end 142 may also be provided with a fan (not shown in the figure) to enhance the flow of air and improve the heat exchange effect.
Similarly, the second end 143 of the first semiconductor heat exchanger 14 and the air pipe at the first end of the indoor heat exchanger 13 can contact each other, and exchange heat in a heat conduction manner; the second end 143 and the air pipe of the first end of the indoor heat exchanger 13 can also be arranged at a preset distance, the second end 143 and the air pipe of the first end of the indoor heat exchanger 13 are filled with air at a front interval, heat is exchanged in a convection mode, the second end 143 can also be provided with a fan, the air flowing is enhanced, and the heat exchange effect is improved.
Example 2
This embodiment provides another kind based on semiconductor heat exchanger unit, fig. 4 is according to the utility model discloses the structure chart of unit of another embodiment, under the refrigeration mode, if after the super-cooled degree of outdoor heat exchanger 12 exhaust liquid refrigerant reaches a definite value, perhaps after the super-heated degree of indoor heat exchanger 13 exhaust gas state refrigerant reaches a definite value, the efficiency of air conditioner will not rise again, consequently, need control semiconductor heat exchanger's heat transfer volume, in order to avoid the extravagant energy, controllable for making semiconductor heat exchanger's heat transfer volume, as shown in fig. 4, this unit still includes: the first temperature sensor RT1 is arranged between the first end of the first semiconductor heat exchanger 14 and the second end of the indoor heat exchanger 13 and is used for detecting a first temperature of a refrigerant after heat exchange with the first end of the first semiconductor heat exchanger 14, so that the heat exchange quantity of the first semiconductor heat exchanger 14 is adjusted according to the first temperature, when the difference value between the condensation temperature of the refrigerant and the first temperature is greater than a first threshold value, the excessive cooling capacity is sufficient, the energy efficiency of the system cannot be improved by increasing the excessive cooling capacity, and at the moment, the heat exchange quantity of the first semiconductor heat exchanger 14 is controlled to be reduced so as to reduce energy waste; when the difference between the condensation temperature of the refrigerant and the first temperature is less than or equal to a first threshold value and is greater than or equal to a second threshold value, which indicates that the excessive cooling capacity has a certain increased space, the heat exchange quantity of the first semiconductor heat exchanger is controlled to be kept unchanged, the current heat exchange quantity is maintained, and the refrigerant discharged by the outdoor heat exchanger 12 maintains the current cooling speed; when the difference value between the condensation temperature of the refrigerant and the first temperature is smaller than a second threshold value, the excessive cooling capacity is too low, the heat exchange capacity of the first semiconductor heat exchanger needs to be controlled to be increased, and the excessive cooling capacity is accelerated to be improved; wherein the first threshold is greater than a second threshold.
Similarly, as shown in fig. 4, the unit further includes: the second temperature sensor RT2 is disposed between the first end of the indoor heat exchanger 13 and the suction end of the compressor 11, and is configured to detect a second temperature of the refrigerant after heat exchange with the second end 143 of the first semiconductor heat exchanger 14, so as to adjust the heat exchange amount of the first semiconductor heat exchanger 14 according to the second temperature, when a difference between the second temperature and an evaporation temperature of the refrigerant is greater than a third threshold, it indicates that the amount of superheat is sufficient, and then the amount of superheat is increased, which may not improve the energy efficiency of the system, and at this time, the amount of heat exchange of the first semiconductor heat exchanger 14 is controlled to be decreased; when the difference between the second temperature and the evaporation temperature of the refrigerant is less than or equal to a third threshold and greater than or equal to a fourth threshold, which indicates that the superheat has a certain increased space, controlling the heat exchange amount of the first semiconductor heat exchanger 14 to be kept unchanged, and maintaining the current heat exchange amount; when the difference value between the second temperature and the evaporation temperature of the refrigerant is smaller than a fourth threshold value, it is indicated that the superheat is too low, the heat exchange quantity of the first semiconductor heat exchanger 14 needs to be controlled to be increased, and the superheat is accelerated; wherein the third threshold is greater than a fourth threshold.
Similarly, in the heating mode, the superheat degree of the refrigerant entering the outdoor heat exchanger 12 in the room needs to be controlled according to the current superheat degree, and therefore, the unit further includes:
and a third temperature sensor RT3 disposed between the first end of the outdoor heat exchanger 12 and the fourth port d of the four-way valve YV1, and configured to detect a third temperature of the refrigerant discharged from the first end of the outdoor heat exchanger 12 in the unit operation heating mode, so as to adjust the heat exchange amount of the first semiconductor heat exchanger 14 according to the third temperature. Specifically, when the difference between the third temperature and the evaporation temperature of the refrigerant is greater than a fifth threshold, it indicates that the superheat is sufficient, and the superheat is increased again, so that the energy efficiency of the system cannot be improved, and at this time, the heat exchange amount of the first semiconductor heat exchanger 14 is controlled to be reduced; when the difference between the third temperature and the evaporation temperature of the refrigerant is less than or equal to a fifth threshold and is greater than or equal to a sixth threshold, which indicates that the superheat has a certain increased space, controlling the heat exchange amount of the first semiconductor heat exchanger 14 to be kept unchanged, and maintaining the current heat exchange amount; when the difference value between the third temperature and the evaporation temperature of the refrigerant is smaller than a sixth threshold value, it is indicated that the superheat is too low, the heat exchange amount of the first semiconductor heat exchanger 14 needs to be controlled to be increased, and the superheat is accelerated; wherein the fifth threshold is greater than a sixth threshold.
The liquid refrigerant discharged from the outdoor heat exchanger 12 enters the indoor heat exchanger 13 and is evaporated into a gaseous state, but there is a possibility that the evaporation is incomplete, and the refrigerant discharged from the indoor heat exchanger 13 further includes a part of liquid refrigerant, so as to avoid that the part of liquid refrigerant returns to the compressor 11 and causes liquid slugging of the compressor 11, as shown in fig. 4, the unit further includes: and a gas-liquid separator 18, the gas-liquid separator 18 being disposed between the first end of the indoor heat exchanger 13 and the suction end of the compressor 11, and configured to separate and collect liquid refrigerants in the refrigerants.
The gas-liquid separator 18 will store the collected liquid refrigerant in the bottom, and as the operation time continues, the liquid refrigerant in the bottom will accumulate more and more, resulting in fewer and less refrigerants participating in refrigeration in the unit, and reducing the refrigeration efficiency, in order to further evaporate the liquid refrigerant collected by the gas-liquid separator 18 into gas state, and return to the refrigeration cycle, the unit further includes: the heating end 192 of the second semiconductor heat exchanger 19 is disposed at the gas-liquid separator 18, and is configured to heat the gas-liquid separator 18, so as to raise the temperature inside the gas-liquid separator 18, and thereby evaporate the liquid refrigerant at the bottom into a gaseous state, and return the gaseous state to the compressor 11.
In this embodiment, the unit further includes: and an expansion valve EXV1, the expansion valve EXV1 being provided on a line between the second end of the outdoor heat exchanger 12 and the second end of the indoor heat exchanger 13.
In order to separate the lubricant oil mixed in the gaseous refrigerant discharged from the compressor 11, as shown in fig. 4, the unit further includes: the oil-gas separator 111 separates the lubricating oil from the gaseous refrigerant through the oil-gas separator, and prevents the lubricating oil from entering the outdoor heat exchanger 12 or the indoor heat exchanger 13 to affect the refrigeration efficiency.
The unit is configured to operate a cooling mode and a heating mode, and also needs to operate a defrosting mode if an outdoor heat exchanger is frosted, and when the unit operates the defrosting mode, a first end 142 of the first semiconductor heat exchanger is a cooling end, and a second end 143 of the first semiconductor heat exchanger is a heating end, as shown in fig. 4, the unit further includes: a first control valve 15 disposed between the first end 142 of the first semiconductor heat exchanger 14 and the second end of the indoor heat exchanger 13; a second control valve 16 disposed between the second end 143 of the first semiconductor heat exchanger 14 and the first end of the indoor heat exchanger 13; a defrosting bypass pipeline, wherein the first end of the defrosting bypass pipeline is connected to a pipeline between the first control valve and the first end of the first semiconductor heat exchanger, and the second end of the defrosting bypass pipeline is connected to a pipeline between the second control valve and the second end of the first semiconductor heat exchanger; a third control valve 17 disposed on the defrosting bypass line;
when the unit operates in the first defrosting mode, the first control valve 15 and the second control valve 16 are closed, the third control valve 17 is opened, fig. 5 is a flow diagram of the refrigerant of the unit in the first defrosting mode, as shown in fig. 5, the refrigerant discharged after defrosting of the outdoor heat exchanger 12 sequentially returns to the compressor 11 through the first end 142 of the first semiconductor heat exchanger 14, the third control valve 17 and the second end 143 of the first semiconductor heat exchanger 14.
When the unit operates the second defrosting mode, the first control valve 15 and the second control valve 16 are opened, the third control valve 17 is closed, fig. 6 is a flow diagram of the refrigerant of the unit in the second defrosting mode, as shown in fig. 6, the refrigerant discharged after the outdoor heat exchanger 12 defrosts sequentially passes through the first end 142 of the first semiconductor heat exchanger 14, the first control valve 15, the indoor heat exchanger 13, the second control valve 16 and the second end 143 of the first semiconductor heat exchanger 14 and returns to the compressor 11.
Fig. 7 is an internal structure diagram of a semiconductor heat exchanger according to an embodiment of the present invention, and as shown in fig. 7, the principle of semiconductor refrigeration is to utilize a P-N junction of a semiconductor material to perform refrigeration by applying direct current at two ends, so as to directly convert electric energy into heat energy. A P-type semiconductor element and an N-type semiconductor element are connected to form a thermocouple, and when a direct current power supply is connected, temperature difference and heat transfer are generated at the joint, and when the current flows from the N → P direction, the joint absorbs heat to form a first end 142; when the current P → N is in the direction, heat is released to form the second terminal 143.
The embodiment is based on the principle that semi-refrigeration and semi-heating are realized by electrifying a semiconductor material, fins are distributed on the refrigerating end and the heating end of the semiconductor to be in contact with the refrigerating end and the heating end of the semiconductor, and heat exchange is carried out through the fins. The plurality of semiconductor heat exchange fins are connected in series or in parallel between the refrigerating end and the heating end fins, namely the plurality of semiconductor heat exchange fins are arranged on the same fin surface and are clamped by two groups of heat exchanger fins to form a semiconductor heat exchanger, so that the refrigerating end and the heating end are respectively utilized.
Example 3
This embodiment provides one the utility model provides an air conditioner is still provided, including the above-mentioned unit based on semiconductor heat exchanger.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (10)
1. An assembly, comprising: compressor, outdoor heat exchanger, indoor heat exchanger and cross valve, the first interface of cross valve with the exhaust end intercommunication of compressor, the second interface with the first end intercommunication of indoor heat exchanger, the third interface with the end intercommunication of breathing in of compressor, the fourth interface with the first end intercommunication of outdoor heat exchanger, its characterized in that, the unit still includes:
a first end of the first semiconductor heat exchanger is arranged between the second end of the outdoor heat exchanger and the second end of the indoor heat exchanger, and a second end of the first semiconductor heat exchanger is arranged between the first end of the indoor heat exchanger and a second interface of the four-way valve;
when the unit operates in a refrigeration mode, the first semiconductor heat exchanger is used for reducing the temperature of a refrigerant discharged by the outdoor heat exchanger and improving the temperature of the refrigerant discharged by the indoor heat exchanger, and the first end of the first semiconductor heat exchanger is a refrigeration end and the second end of the first semiconductor heat exchanger is a heating end;
when the unit operates in the heating mode, the first semiconductor heat exchanger is used for increasing the temperature of the refrigerant discharged by the indoor heat exchanger and reducing the temperature of the refrigerant discharged by the compressor, and the first end of the first semiconductor heat exchanger is a heating end while the second end of the first semiconductor heat exchanger is a cooling end.
2. The unit according to claim 1, wherein when the unit is operating in the defrost mode, the first end of the first semiconductor heat exchanger is a cooling end and the first end of the first semiconductor heat exchanger is a heating end.
3. The aggregate according to claim 2, characterized in that it further comprises:
the first control valve is arranged between the first end of the first semiconductor heat exchanger and the second end of the indoor heat exchanger;
the second control valve is arranged between the second end of the first semiconductor heat exchanger and the first end of the indoor heat exchanger;
a defrosting bypass pipeline, wherein the first end of the defrosting bypass pipeline is connected to a pipeline between the first control valve and the first end of the first semiconductor heat exchanger, and the second end of the defrosting bypass pipeline is connected to a pipeline between the second control valve and the second end of the first semiconductor heat exchanger;
the third control valve is arranged on the defrosting bypass pipeline;
when the unit operates in the defrosting mode, the first control valve and the second control valve are closed, the third control valve is opened, and the refrigerant discharged by the outdoor heat exchanger sequentially passes through the first end of the first semiconductor heat exchanger, the third control valve and the second end of the first semiconductor heat exchanger and returns to the compressor; alternatively, the first and second electrodes may be,
the first control valve and the second control valve are opened, the third control valve is closed, and the refrigerant discharged by the outdoor heat exchanger sequentially passes through the first end of the first semiconductor heat exchanger, the first control valve, the indoor heat exchanger, the second control valve and the second end of the first semiconductor heat exchanger and returns to the compressor.
4. The aggregate according to claim 1, characterized in that it further comprises:
the first temperature sensor is arranged between the first end of the first semiconductor heat exchanger and the second end of the indoor heat exchanger and used for detecting the first temperature of a refrigerant after heat exchange with the first end of the first semiconductor heat exchanger when the unit operates in a refrigeration mode, so that the heat exchange quantity of the first semiconductor heat exchanger is adjusted according to the first temperature.
5. The aggregate according to claim 1, characterized in that it further comprises:
and the second temperature sensor is arranged between the second end of the first semiconductor heat exchanger and the third interface of the four-way valve and used for detecting the second temperature of the refrigerant after heat exchange with the second end of the first semiconductor heat exchanger when the unit operates in a refrigeration mode, so that the heat exchange quantity of the first semiconductor heat exchanger is adjusted according to the second temperature.
6. The aggregate according to claim 1, characterized in that it further comprises:
and the third temperature sensor is arranged between the first end of the outdoor heat exchanger and a fourth interface of the four-way valve and used for detecting the third temperature of the refrigerant discharged from the first end of the outdoor heat exchanger when the unit operates in the heating mode, so that the heat exchange quantity of the first semiconductor heat exchanger is adjusted according to the third temperature.
7. The aggregate according to claim 1, characterized in that it further comprises:
and the gas-liquid separator is arranged between the first end of the indoor heat exchanger and the air suction end of the compressor and is used for separating and collecting liquid refrigerants in the refrigerants.
8. The aggregate according to claim 7, characterized in that it further comprises:
and the heating end of the second semiconductor heat exchanger is arranged at the gas-liquid separator and is used for exchanging heat with the gas-liquid separator so as to increase the temperature in the gas-liquid separator.
9. The aggregate according to claim 1, characterized in that it further comprises:
and the expansion valve is arranged on a pipeline between the second end of the outdoor heat exchanger and the second end of the indoor heat exchanger.
10. An air conditioner characterized by comprising the unit of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020600831.3U CN212179120U (en) | 2020-04-20 | 2020-04-20 | Unit and air conditioner based on semiconductor heat exchanger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020600831.3U CN212179120U (en) | 2020-04-20 | 2020-04-20 | Unit and air conditioner based on semiconductor heat exchanger |
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| Publication Number | Publication Date |
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| CN212179120U true CN212179120U (en) | 2020-12-18 |
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| CN202020600831.3U Withdrawn - After Issue CN212179120U (en) | 2020-04-20 | 2020-04-20 | Unit and air conditioner based on semiconductor heat exchanger |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111397045A (en) * | 2020-04-20 | 2020-07-10 | 珠海格力电器股份有限公司 | Unit based on semiconductor heat exchanger, control method thereof and air conditioner |
| CN113418256A (en) * | 2021-07-15 | 2021-09-21 | 重庆金康赛力斯新能源汽车设计院有限公司 | Heat pump air conditioning system and working method thereof |
| WO2023279871A1 (en) * | 2021-07-09 | 2023-01-12 | 青岛海尔空调器有限总公司 | Air conditioner, and method and apparatus used for air conditioner control |
-
2020
- 2020-04-20 CN CN202020600831.3U patent/CN212179120U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111397045A (en) * | 2020-04-20 | 2020-07-10 | 珠海格力电器股份有限公司 | Unit based on semiconductor heat exchanger, control method thereof and air conditioner |
| CN111397045B (en) * | 2020-04-20 | 2024-04-05 | 珠海格力电器股份有限公司 | Unit based on semiconductor heat exchanger, control method thereof and air conditioner |
| WO2023279871A1 (en) * | 2021-07-09 | 2023-01-12 | 青岛海尔空调器有限总公司 | Air conditioner, and method and apparatus used for air conditioner control |
| CN113418256A (en) * | 2021-07-15 | 2021-09-21 | 重庆金康赛力斯新能源汽车设计院有限公司 | Heat pump air conditioning system and working method thereof |
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