CN212174860U - Photoinduced adhesive tape - Google Patents
Photoinduced adhesive tape Download PDFInfo
- Publication number
- CN212174860U CN212174860U CN201921967824.0U CN201921967824U CN212174860U CN 212174860 U CN212174860 U CN 212174860U CN 201921967824 U CN201921967824 U CN 201921967824U CN 212174860 U CN212174860 U CN 212174860U
- Authority
- CN
- China
- Prior art keywords
- photoinduced
- adhesive tape
- adhesive
- basic unit
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002390 adhesive tape Substances 0.000 title claims abstract description 17
- 239000003292 glue Substances 0.000 claims abstract description 14
- 239000011248 coating agent Substances 0.000 claims abstract description 10
- 238000000576 coating method Methods 0.000 claims abstract description 10
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 8
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 8
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 7
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 239000004065 semiconductor Substances 0.000 abstract description 5
- 238000005520 cutting process Methods 0.000 abstract description 4
- 238000005265 energy consumption Methods 0.000 abstract description 4
- 238000005286 illumination Methods 0.000 abstract description 3
- 238000002360 preparation method Methods 0.000 abstract description 3
- 230000009172 bursting Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 25
- 239000012790 adhesive layer Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000007385 chemical modification Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Images
Abstract
The utility model discloses a photoinduced adhesive tape, which comprises a base layer, one side coating of basic unit has the glue film, one side coating that the basic unit was kept away from to the glue film has from the type rete. The utility model discloses in when using photoinduced adhesive losing tape to carry out semiconductor preparation, like during wafer cutting, its higher bonding strength can prevent that the wafer from flying apart, bursting apart at the course of working effectively protection work piece, only relies on ultraviolet illumination can make the sticky tape lose viscidity at several seconds to tens of seconds's time range in the stage of coming unstuck, need not to get into the high temperature workshop section and comes unstuck, has effectively reduced the energy consumption of production process for production cycle.
Description
Technical Field
The utility model relates to an sticky tape technical field especially relates to a photoinduced adhesive tape that loses.
Background
The adhesive tape is a special adhesive tape product, is mainly used for temporary bonding and protection, prevents workpieces from being scratched, abraded, polluted, corroded and the like, can be removed from the workpieces after use, has no residue on a bonding surface, and does not influence the material performance of the workpieces. After years of development and application exploration, the material is widely applied to various fields, and especially plays an important role in semiconductor wafer cutting, precision electronic device manufacturing and optical device manufacturing.
In the existing published sticky tape patents, such as chinese patents CN201621375728, CN201711155761, CN201811550094, CN201910053828, etc., all use the technical scheme of pyrolytic sticky tape to prepare sticky tape for semiconductor manufacturing, but the photo-induced sticky tape is more convenient to implement compared with the pyrolytic sticky tape, and has the advantages of lower energy consumption cost and faster degumming time.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the problem that the technical scheme of pyrolysis adhesive losing is used in the prior art, and providing a photoinduced adhesive losing tape.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a photoinduced adhesive losing tape, includes the basic unit, one side coating of basic unit has the glue film, one side coating that the basic unit was kept away from to the glue film has from the type rete.
Preferably, the base layer is a transparent flexible film with the thickness of 10-500 um.
Preferably, the base layer is made of a PO film and has a thickness of 50-150 um.
Preferably, the adhesive layer is a photosensitive rosin acrylic pressure-sensitive adhesive with the thickness of 2-100 um.
Preferably, the thickness of the glue layer is 5-30 um.
Preferably, the release film layer is made of PET, and the surface of the release film layer is coated with an organic silicon coating.
Has the advantages that:
1. when the photoinduced adhesive losing tape is used for semiconductor preparation, such as wafer cutting, the higher bonding strength can effectively protect workpieces in the processing process, prevent chips from flying and bursting apart, and in the degumming stage, the adhesive tape can lose the viscosity in the time range from several seconds to tens of seconds only by depending on ultraviolet illumination without entering a high-temperature working section for degumming, thereby effectively reducing the energy consumption in the production process and accelerating the production period;
2. the utility model discloses in photosensitive rosin acrylic acid pressure-sensitive adhesive who uses is through the method of chemical modification, will regard as the rosin that tackifying resin extensively is used for the gluing agent to introduce the molecular structure of acrylic acid gluing agent, has effectively strengthened the bonding strength of sticky tape, helps the work piece to fix better, prevents sliding in the course of working.
Drawings
Fig. 1 is a schematic structural view of a light-induced adhesive tape.
In the figure: 1 base layer, 2 glue layers and 3 release film layers.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Example 1
Referring to fig. 1, the light-induced adhesive tape comprises a base layer 1, wherein a glue layer 2 is coated on one side of the base layer 1, and a release film layer 3 is coated on one side of the glue layer 2 away from the base layer 1.
In the embodiment, the base layer 1 is a transparent flexible film with the thickness of 10-500um, the adhesive layer 2 is a photosensitive rosin acrylic pressure-sensitive adhesive with the thickness of 2-100um, the adhesive layer 2 is 5-30um, the release film layer 3 is made of PET, and the surface of the release film layer is coated with an organic silicon coating;
embodiment 2 referring to fig. 1, a light-induced adhesive tape comprises a base layer 1, wherein a side of the base layer 1 is coated with a glue layer 2, and a side of the glue layer 2 away from the base layer 1 is coated with a release film layer 3.
In this embodiment, the base layer 1 is a PO film and has a thickness of 50-150um, the adhesive layer 2 is a photosensitive rosin acrylic pressure-sensitive adhesive and has a thickness of 2-100um, the adhesive layer 2 has a thickness of 5-30um, the release film layer 3 is a PET, and the surface is coated with an organic silicon coating.
In the embodiment, when the photoinduced adhesive tape is used for semiconductor preparation, such as wafer cutting, the workpiece can be effectively protected by higher bonding strength in the processing process, the wafer is prevented from flying and cracking, the adhesive tape can lose the viscosity in the time range of several seconds to tens of seconds only by ultraviolet illumination in the degumming stage, the adhesive tape does not need to enter a high-temperature working section for degumming, the energy consumption in the production process is effectively reduced, and the production period is accelerated;
in the embodiment, the used photosensitive rosin acrylic pressure-sensitive adhesive introduces rosin which is widely used as an adhesive in a molecular structure of an acrylic adhesive through a chemical modification method, so that the adhesive strength of the adhesive tape is effectively enhanced, a workpiece is favorably fixed, and slippage in the processing process is prevented.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (3)
1. A light-induced adhesive tape comprising a base layer (1), characterized in that: one side coating of basic unit (1) has glue film (2), one side coating that basic unit (1) was kept away from in glue film (2) has from type rete (3), basic unit (1) is transparent flexible film, and thickness is 10-500um, glue film (2) are photosensitive rosin acrylic acid pressure-sensitive adhesive, and thickness is 2-100 um.
2. A light-induced release adhesive tape according to claim 1, wherein: the thickness of the glue layer (2) is 5-30 um.
3. A light-induced release adhesive tape according to claim 1, wherein: the release film layer (3) is made of PET, and the surface of the release film layer is coated with an organic silicon coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921967824.0U CN212174860U (en) | 2019-11-14 | 2019-11-14 | Photoinduced adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921967824.0U CN212174860U (en) | 2019-11-14 | 2019-11-14 | Photoinduced adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212174860U true CN212174860U (en) | 2020-12-18 |
Family
ID=73763001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921967824.0U Active CN212174860U (en) | 2019-11-14 | 2019-11-14 | Photoinduced adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212174860U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114806488A (en) * | 2022-04-14 | 2022-07-29 | 江苏国胶新材料有限公司 | Adhesive capable of being photoinduced to lose adhesion and preparation method thereof |
-
2019
- 2019-11-14 CN CN201921967824.0U patent/CN212174860U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114806488A (en) * | 2022-04-14 | 2022-07-29 | 江苏国胶新材料有限公司 | Adhesive capable of being photoinduced to lose adhesion and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221114 Address after: 518000 room 701, building C, comlong Science Park, Guansheng 5th Road, Luhu community, Guanhu street, Longhua District, Shenzhen City, Guangdong Province Patentee after: Dysprosium PU materials (Shenzhen) Co.,Ltd. Address before: 100000 No. 198, Room 201, North of Second Floor, No. 36, Haidian West Street, Haidian District, Beijing Patentee before: Beijing Qinghong Guangke Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240116 Address after: Unit 907, Building 1, Unit 1, Xinchen New Materials Pilot Industrialization Base, No. 300 Shutianpu Road, Shutianpu Community, Matian Street, Guangming District, Shenzhen City, Guangdong Province, 518000 Patentee after: Shenzhen Dipu Material Technology Co.,Ltd. Address before: 518000 room 701, building C, comlong Science Park, Guansheng 5th Road, Luhu community, Guanhu street, Longhua District, Shenzhen City, Guangdong Province Patentee before: Dysprosium PU materials (Shenzhen) Co.,Ltd. |
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| TR01 | Transfer of patent right |