CN212160162U - Optical module packaging structure - Google Patents
Optical module packaging structure Download PDFInfo
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- CN212160162U CN212160162U CN202020798057.1U CN202020798057U CN212160162U CN 212160162 U CN212160162 U CN 212160162U CN 202020798057 U CN202020798057 U CN 202020798057U CN 212160162 U CN212160162 U CN 212160162U
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Abstract
The application discloses an optical module packaging structure which comprises a shell, and a circuit board and an optical assembly which are arranged in the shell; the shell is provided with an electric port and an optical port, and an optical fiber adapter is arranged at the optical port; one end of the circuit board extends out of the electric port, and the other end of the circuit board is connected with the optical assembly; the optical assembly comprises a tail end connected with the circuit board and a front end close to the optical port, at least one optical socket is arranged on the end face of the front end, and the optical socket is inserted into the optical fiber adapter; and a structural adhesive is arranged between the optical assembly and the shell and is used for bonding the optical assembly and the shell. Structural adhesive is added in a gap between the optical assembly and the shell to prevent the optical assembly from generating displacement in later use to cause optical mismatch, so that the stability and reliability of the optical module are greatly improved; the light module is additionally provided with the light-shielding film, so that the structure is easy to disassemble, assemble and repair, and the cost of the light module can be effectively reduced.
Description
Technical Field
The application relates to the technical field of optical communication, in particular to an optical module packaging structure.
Background
With the rapid development of communication and the increasing exuberance of the demand of cloud computing, the market demand for high-speed optical modules is increasing day by day. The optical module can be normally used only by ensuring the stable light emitting function, and the internal optical assembly of the optical module is very sensitive to the position, and the position of the optical assembly is easy to shift slightly under stress, so that the light emitting function can be influenced. Therefore, when the shell of the external package of the optical module is designed, a certain assembly clearance is reserved between the shell and the internal optical assembly, and the shell is prevented from interfering with the optical assembly to cause the failure of the optical assembly.
As shown in fig. 1 and 2, a conventional optical module includes a housing 10 ', an optical module 30' and a circuit board 20 'enclosed in the housing 10', and a fiber adapter 40 'provided at one end of the housing 10'. Wherein one end of the optical assembly 30 ' is connected to the circuit board 20 ', the other end is provided with an optical receptacle 31 ', and the front end of the optical receptacle 31 ' is installed in the optical fiber adapter 40 ' for connecting an external optical fiber patch cord. A gap a is left between the optical assembly 30 'and the housing 10' to avoid interference between the optical assembly 30 'and the housing 10'. In addition, heat conduction blocks 50 'are arranged between the circuit board 20' and the housing 10 'and between the optical assembly 30' and the housing 10 'to quickly transfer heat generated during operation of the components on the circuit board 20' and the optical assembly 30 'to the outside of the housing 10', so that heat dissipation performance of the optical module is improved. An electromagnetic shielding structure 60 ' is disposed at the end of the optical receptacle 31 ' of the optical module 30 ' to improve the anti-interference performance of the optical module. However, in the actual use process, due to the thermal stress of the housing 10 ', the optical module 20', and the like, the processing residual stress of the material, and the release of the compression holding force of the heat conduction block 50 ', the electromagnetic shielding structure 60', and the like, the optical module 30 'is displaced in the housing 10', the degree of fitting between the optical receptacle 31 'of the optical module 30' and the optical fiber adapter 40 'is changed, and thus, an abnormality such as an abnormal insertion/removal of the optical module optical port optical fiber adapter 40' or an interference between the optical module 30 'and the housing 10' and a performance failure occurs.
Disclosure of Invention
An object of the application is to provide an optical module packaging structure, has solved because of the optical subassembly displacement leads to the problem of optical mismatch, has higher stability and reliability.
In order to achieve one of the above objects, the present application provides an optical module package structure, including a housing, and a circuit board and an optical module disposed in the housing; the shell is provided with an electric port and an optical port, and an optical fiber adapter is arranged at the optical port; one end of the circuit board extends out of the electric port, and the other end of the circuit board is electrically connected with the optical component; the optical assembly comprises a tail end electrically connected with the circuit board and a front end close to the optical port, at least one optical socket is arranged on the end face of the front end, and the front end of the optical socket is arranged in the optical fiber adapter; and a structural adhesive is arranged between the optical assembly and the shell and is used for bonding the optical assembly and the shell.
As a further improvement of the embodiment, a film spacer is arranged between the structural adhesive and the optical assembly, and the film spacer is arranged on the outer surface of the optical assembly.
As a further improvement of the embodiment, the separator is fixed to the surface of the optical member by an adhesive.
As a further improvement of the embodiment, the film has two opposite surfaces, one or two surfaces of the film are provided with double-sided adhesive tape, and the film is adhered to the surface of the optical component through the double-sided adhesive tape.
As a further improvement of the embodiment, the film separator is wound around the outer surface of the optical assembly in a "U" shape or a "square" shape, or the film separator includes two flat sheets disposed oppositely, and the two flat sheets are respectively disposed on two outer surfaces of the optical assembly, which are opposite to each other.
As a further improvement of the embodiment, the rubber diaphragm is made of an insulating high-temperature-resistant material.
As a further improvement of the embodiment, the insulating and high temperature resistant material comprises polycarbonate, polyimide or fiberglass cloth.
As a further improvement of the embodiment, the optical component has an upper surface and a lower surface and two side faces connecting the upper surface and the lower surface; the structural adhesive is arranged on the upper surface and the lower surface or two side surfaces of the optical component; or the structural adhesive is arranged on the upper surface, the lower surface and two side surfaces of the optical component.
As a further improvement of the implementation, the optical module package structure further includes an electromagnetic shielding structure, and the electromagnetic shielding structure is sleeved on the front end face of the optical receptacle, which is close to the optical assembly.
As a further improvement of the embodiment, a heat conducting block is arranged between the circuit board and/or the optical assembly and the housing, and the structural adhesive is arranged in a staggered manner with respect to the heat conducting block
The beneficial effect of this application: structural adhesive is added in a gap between the optical assembly and the shell to prevent the optical assembly from generating displacement in later use to cause optical mismatch, so that the stability and reliability of the optical module are greatly improved; the light module is additionally provided with the light-shielding film, so that the structure is easy to disassemble, assemble and repair, and the cost of the light module can be effectively reduced.
Drawings
FIG. 1 is an exploded view of a conventional optical module package structure;
FIG. 2 is a cross-sectional view of the optical module of FIG. 1;
fig. 3 is an exploded schematic view of an optical module package structure in embodiment 1 of the present application;
fig. 4 is an exploded schematic view of an optical module package structure in embodiment 2 of the present application;
fig. 5 is a schematic diagram of a partially assembled structure of the optical module package structure in fig. 4.
Detailed Description
The present application will now be described in detail with reference to specific embodiments thereof as illustrated in the accompanying drawings. These embodiments are not intended to limit the present application, and structural, methodological, or functional changes made by those skilled in the art according to these embodiments are included in the scope of the present application.
In the various illustrations of the present application, certain dimensions of structures or portions may be exaggerated relative to other structures or portions for ease of illustration and, thus, are provided to illustrate only the basic structure of the subject matter of the present application.
Also, terms used herein such as "upper," "above," "lower," "below," and the like, denote relative spatial positions of one element or feature with respect to another element or feature as illustrated in the figures for ease of description. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. When an element or layer is referred to as being "on," or "connected" to another element or layer, it can be directly on, connected to, or intervening elements or layers may be present.
Example 1
As shown in fig. 3, the optical module package of this embodiment includes a housing 10, and a circuit board 20 and an optical assembly 30 disposed in the housing 10. The housing 10 is provided with an electric port 14 and an optical port 13, the optical fiber adapter 40 is arranged at the optical port 13, the housing 10 comprises an upper housing 11 and a lower housing 12, and the upper housing 11 and the lower housing 12 are locked and fixed together through screws 80. The circuit board 20 has one end extending out of the electrical port 14 of the housing 10 and the other end electrically connected to the optical component 30, where the circuit board 20 is fixedly connected to the optical component 30, that is, one end of the circuit board is fixed to one end of the optical component, and the optical component can be electrically connected to the circuit board by wire bonding (e.g., gold wire bonding). In other embodiments, the circuit board 20 may also be electrically connected to the optical assembly 30 through a flexible circuit board, and the optical assembly is connected to the circuit board through the flexible circuit board, so that the relative position between the optical assembly and the circuit board can be flexibly adjusted. The optical module 30 comprises a terminal end 33 electrically connected to the circuit board 20 and a front end 32 adjacent to the optical port 13 of the housing 10, wherein the front end 32 of the optical module 30 is provided with at least one optical receptacle 31, and the front end of the optical receptacle 31 is arranged in the fiber adapter 40 for connecting an external optical fiber patch cord, where the front end of the optical receptacle 31 refers to the end of the optical receptacle 31 away from the optical module 30. The optical module 30 of this embodiment includes a light receiving end and a light emitting end, and has two light sockets 31, which are the light receiving end and the light emitting end, respectively. In order to avoid interference between the optical assembly 30 and the housing 10, a gap is left between the optical assembly 30 and the housing 10, and a structural adhesive 70 is disposed in the gap between the optical assembly 30 and the housing 10, and the structural adhesive 70 bonds the optical assembly 30 and the housing 10.
In this embodiment, the heat conducting blocks 50 are disposed between the circuit board 20 and the housing 10 and between the optical assembly 30 and the housing 10, and the structural adhesive 70 is disposed by staggering the heat conducting blocks 50, that is, the heat conducting blocks 50 are directly connected to the optical assembly 30 and the housing 10 in a heat conducting manner, so as to quickly transfer heat generated during operation of the components on the circuit board 20 and the optical assembly 30 to the outside of the housing 10, thereby improving heat dissipation performance of the optical module. An electromagnetic shielding structure 60 is sleeved on the end face of the optical receptacle 31 of the optical module 30, which is close to the front end 32 of the optical module 30, so as to improve the anti-interference performance of the optical module. When assembled, the optical assembly 30 is assembled with the circuit board 20, and the heat conduction block 50 is assembled in the housing 10. The electromagnetic shielding structure 60 includes an upper shielding part and a lower shielding part, which are assembled to the upper housing 11 and the lower housing 12 adjacent to the optical port 13, respectively, when assembled. Structural adhesive 70 is adhered to the positions of the upper housing 11 and the lower housing 12 corresponding to the optical assemblies 30, respectively, the assembled optical assemblies 30 and the circuit board 20 are installed in the lower housing 12, and then the optical fiber adapter 40 is assembled to the corresponding optical port of the lower housing 12, so that the optical receptacle 31 of the optical assembly 30 is inserted into the optical fiber adapter 40 for connecting an external optical fiber patch cord. Then, the upper case 11 is covered, and the upper case 11 and the lower case 12 are fastened by screws 80. Here, the optical fiber adapter 40 is assembled to the optical port 13 by post-assembly, and the optical fiber adapter 40 can be adjusted to a proper position and then fixed to the optical port 13 of the housing 10 by screw locking or adhesive, so as to absorb the tolerance of the optical assembly 30 and the optical receptacle 31 thereof. In other embodiments, the fiber optic adapters may be integrally designed with the housing. In this embodiment, the optical member 30 has an upper surface and a lower surface and two side surfaces connecting the upper surface and the lower surface. The structural adhesive 70 is filled in the gaps between the upper surface and the lower surface of the optical assembly 30 and the upper shell 11 and the lower shell 12 respectively, the optical assembly 30 can be firmly fixed after the structural adhesive 70 is cured, the problem that the optical assembly 30 is displaced due to thermal stress, processing residual stress of materials, and release of compression holding force of the heat conducting block 50, the electromagnetic shielding structure 60 and the like in the later use process is solved, the problem that the optical assembly 30 is mismatched with the optical fiber adapter 40 to cause abnormal plugging and unplugging of an external optical fiber jumper is solved, and the stability and the reliability of the optical module are greatly improved. In other embodiments, the structural adhesive may be filled in the gap between the two side surfaces of the optical component and the housing, or the structural adhesive may be disposed on the upper surface, the lower surface, and the two side surfaces of the optical component, or the structural adhesive may be disposed on only one outer surface of the optical component, such as the upper surface or the lower surface. Here, the structural adhesive 70 is an epoxy adhesive, and in other embodiments, a common adhesive such as an acrylate adhesive, an anaerobic adhesive, or an organic silicon adhesive may be used.
Example 2
As shown in fig. 4 and 5, unlike embodiment 1, the optical module package of this embodiment is further provided with a release sheet 90, the release sheet 90 is disposed between the structural adhesive 70 and the optical module 30 and fixed to the surface of the optical module 30, and the structural adhesive 70 is bonded to the optical module 30 through the release sheet 90. The adhesive sheet 90 is additionally arranged between the structural adhesive 70 and the optical assembly 30 to isolate the optical assembly 30 from the structural adhesive 70, so that the optical assembly 30 and the shell 10 can be conveniently detached during repair, and the problem that the structural adhesive 70 is not easy to detach during repair due to over-adhesion is avoided. Here, the separator 90 is made of an insulating and high-temperature resistant material, and in this embodiment, a Polycarbonate (PC) material is used, and in other embodiments, an insulating and high-temperature resistant material such as Polyimide (PI) or fiberglass cloth may be used.
In this embodiment, the release sheet 90 is secured to the surface of the optical assembly 30 by adhesive. Here, the pellicle 90 has two opposite surfaces, one or both of which is provided with a double-sided adhesive tape, and the pellicle 90 is adhered to the surface of the optical assembly 30 by the double-sided adhesive tape. In other embodiments, other attachment means such as glue may be used to attach the release sheet 90 to the surface of the optical assembly 30. When assembled, the optical assembly 30 is assembled with the circuit board 20, and the heat conduction block 50 is assembled in the housing 10. The electromagnetic shielding structure 60 includes an upper shielding part and a lower shielding part, which are assembled to the upper housing 11 and the lower housing 12 adjacent to the optical port 13, respectively, when assembled. The upper housing 11 and the lower housing 12 are respectively adhered with the structure adhesive 70 at the positions corresponding to the optical assemblies 30, the adhesive separating sheet 90 is adhered at the position corresponding to the structure adhesive 70 on the surface of the optical assembly 30, then the assembled optical assembly 30 and the circuit board 20 are installed in the lower housing 12, the structure adhesive 70 is adhered to the adhesive separating sheet 90, and the optical fiber adapter 40 is assembled at the optical port 13 corresponding to the lower housing 12, so that the optical receptacle 31 of the optical assembly 30 is inserted into the optical fiber adapter 40 for connecting an external optical fiber patch cord. Finally, the upper housing 11 is covered, and the upper housing 11 and the lower housing 12 are locked by screws 80. Here, the adhesive separating sheet 90 is a long strip, and is in a U shape or a "square" shape around the periphery of the optical assembly 30 to separate the optical assembly 30 from the structural adhesive 70, so as to prevent the structural adhesive 70 from adhering to the surface of the optical assembly 30. In other embodiments, the film-separating sheet may also be a plurality of separate segments, which are respectively adhered to the surfaces of the optical assembly corresponding to the structural adhesive, for example, the film-separating sheet includes two opposite flat sheets, which are respectively disposed on two opposite outer surfaces (e.g., upper and lower surfaces) of the optical assembly to separate the optical assembly from the structural adhesive.
The above list of details is only for the concrete description of the feasible embodiments of the present application, they are not intended to limit the scope of the present application, and all equivalent embodiments or modifications that do not depart from the technical spirit of the present application are intended to be included within the scope of the present application.
Claims (10)
1. An optical module packaging structure comprises a shell, a circuit board and an optical assembly, wherein the circuit board and the optical assembly are arranged in the shell; the shell is provided with an electric port and an optical port, and an optical fiber adapter is arranged at the optical port; one end of the circuit board extends out of the electric port, and the other end of the circuit board is electrically connected with the optical component; the method is characterized in that: the optical assembly comprises a tail end electrically connected with the circuit board and a front end close to the optical port, at least one optical socket is arranged on the end face of the front end, and the front end of the optical socket is arranged in the optical fiber adapter; and a structural adhesive is arranged between the optical assembly and the shell and is used for bonding the optical assembly and the shell.
2. The optical module package of claim 1, wherein: and a film isolating piece is arranged between the structural adhesive and the optical assembly and is arranged on the outer surface of the optical assembly.
3. The optical module package of claim 2, wherein: the film is fixed on the surface of the optical component through glue.
4. The optical module package of claim 2, wherein: the film is provided with two opposite surfaces, one surface or two surfaces of the film are provided with double-sided adhesive tapes, and the film is adhered to the surface of the optical component through the double-sided adhesive tapes.
5. The optical module package of claim 2, wherein: the film separating piece is U-shaped or U-shaped and winds the outer surface of the optical assembly, or the film separating piece comprises two flat pieces which are oppositely arranged, and the two flat pieces are respectively arranged on the two outer surfaces which are opposite to each other on the optical assembly.
6. The light module package according to any one of claims 2-5, wherein: the rubber isolating piece is made of an insulating high-temperature-resistant material.
7. The optical module package of claim 6, wherein: the insulating high-temperature-resistant material comprises polycarbonate, polyimide or glass fiber cloth.
8. The light module package according to any one of claims 1-5, wherein: the optical assembly has an upper surface and a lower surface and two side faces connecting the upper surface and the lower surface; the structural adhesive is arranged on the upper surface and the lower surface or two side surfaces of the optical component; or the structural adhesive is arranged on the upper surface, the lower surface and two side surfaces of the optical component.
9. The light module package according to any one of claims 1-5, wherein: the optical module packaging structure further comprises an electromagnetic shielding structure, and the electromagnetic shielding structure is sleeved at the position, close to the front end face of the optical component, of the optical socket.
10. The light module package according to any one of claims 1-5, wherein: and a heat conduction block is arranged between the circuit board and/or the optical assembly and the shell, and the structural adhesive is staggered with the heat conduction block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020798057.1U CN212160162U (en) | 2020-05-14 | 2020-05-14 | Optical module packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020798057.1U CN212160162U (en) | 2020-05-14 | 2020-05-14 | Optical module packaging structure |
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| Publication Number | Publication Date |
|---|---|
| CN212160162U true CN212160162U (en) | 2020-12-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020798057.1U Active CN212160162U (en) | 2020-05-14 | 2020-05-14 | Optical module packaging structure |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113419315A (en) * | 2021-07-16 | 2021-09-21 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2022237347A1 (en) * | 2021-05-13 | 2022-11-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2024055753A1 (en) * | 2022-09-14 | 2024-03-21 | 苏州旭创科技有限公司 | Optical module |
-
2020
- 2020-05-14 CN CN202020798057.1U patent/CN212160162U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022237347A1 (en) * | 2021-05-13 | 2022-11-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113419315A (en) * | 2021-07-16 | 2021-09-21 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2024055753A1 (en) * | 2022-09-14 | 2024-03-21 | 苏州旭创科技有限公司 | Optical module |
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