CN212153728U - Building shock insulation support monitoring devices - Google Patents
Building shock insulation support monitoring devices Download PDFInfo
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- CN212153728U CN212153728U CN202020529897.8U CN202020529897U CN212153728U CN 212153728 U CN212153728 U CN 212153728U CN 202020529897 U CN202020529897 U CN 202020529897U CN 212153728 U CN212153728 U CN 212153728U
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Abstract
The utility model discloses a building isolation bearing monitoring devices, including X displacement detection module, Y displacement detection module, Z displacement detection module, rotation angle detection module and data processing module, X displacement detection module includes X to displacement sensor and X direction reflector panel, Y displacement detection module includes Y to displacement sensor and Y direction reflector panel, Z displacement detection module includes Z to displacement sensor and Z direction reflector panel, rotation angle detection module is including the installation pole, annular calibrated scale and horizontal stand to and laser emitter and camera. The utility model relates to a rationally realize real-time supervision to in time propose the forecast.
Description
Technical Field
The utility model belongs to the technical field of building isolation bearing monitoring, especially, relate to a building isolation bearing monitoring devices.
Background
The traditional building can resist earthquake action by improving the structural strength, and can be realized by means of increasing the section area of a member, the steel consumption and the like in a certain range. Because the traditional anti-seismic structure aims at preventing the structure from collapsing, the anti-seismic performance of the traditional anti-seismic structure depends on the plasticity of the structure (member) to a great extent, and the good structural plasticity can protect the personal and property safety in the building, but after earthquake, the building is repaired or dismantled to destroy the building, a large amount of building waste is generated, the environment is polluted, and a plurality of defects exist.
The existing seismic isolation building along with the technical development means that a seismic isolation technology is adopted, a seismic isolation support is arranged on a lower structure of the building to form a seismic isolation layer, an upper structure of the building is isolated from the lower structure of the building, and the upper and lower traditional rigid structures are in 'soft' connection through the seismic isolation support. Therefore, the earthquake energy is consumed, the transmission of the earthquake energy to the upper part is reduced, and the safety of the upper structure and the safety of internal personnel and equipment can be effectively guaranteed.
However, the existing displacement detection device for the shock insulation support is complex in operation, low in efficiency and single in detection content. In addition, the conventional monitoring device needs personnel to check regularly, so that the task is large, the labor intensity is high, and the real-time performance cannot be met.
Therefore, at present, a building isolation bearing monitoring device with simple structure and reasonable design is lacked, time and labor are saved, the cost is low, the three-dimensional displacement and the rotation angle of the isolation bearing can be conveniently acquired, real-time monitoring is realized, the forecast is timely provided, and prevention and treatment measures are convenient to take.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that not enough among the above-mentioned prior art is directed at, provide a building isolation bearing monitoring devices, its reasonable in design and with low costs, save time, laborsaving, the cost is little, is convenient for acquire the three-dimensional displacement and the rotation angle of isolation bearing, realizes real-time supervision to in time propose the forecast, be convenient for take prevention and cure measures.
In order to solve the technical problem, the utility model discloses a technical scheme is: the utility model provides a building isolation bearing monitoring devices, is provided with the isolation bearing between building substructure and the building superstructure, building substructure includes a plurality of frame posts, its characterized in that: the device comprises an X displacement detection module, a Y displacement detection module, a Z displacement detection module and a rotation angle detection module, wherein the X displacement detection module is arranged on a frame column and is used for detecting the X-direction displacement of a vibration isolation support, the Y displacement detection module is arranged on the frame column and is used for detecting the Y-direction displacement of the vibration isolation support, the rotation angle detection module is arranged on the frame column and is used for detecting the Z-direction displacement of the vibration isolation support, the rotation angle detection module is used for detecting the rotation angle of the vibration isolation support, and the data processing module is connected with the X displacement detection module, the Y displacement detection module, the Z displacement detection module and the rotation angle detection module, the X displacement detection module comprises an X-direction displacement sensor arranged on one side surface of the frame column and an X-direction reflecting plate arranged at the bottom of the upper structure of the building, the Y displacement detection module comprises a Y-direction displacement sensor arranged on the other side surface of the frame column, the Z displacement detection module comprises a Z displacement sensor arranged at the top of the frame column and a Z-direction reflecting plate arranged at the bottom of the upper structure of the building, the rotation angle detection module comprises a plurality of mounting rods for arranging the outer circumference of the upper connecting steel plate, an annular dial disc arranged on the mounting rods, a horizontal support arranged on one opposite side surface of the frame column, a laser transmitter and a camera arranged on the horizontal support, the data processing module comprises a microcontroller, and the X displacement sensor, the Y displacement sensor, the Z displacement sensor and the camera are all connected with the microcontroller.
Foretell building isolation bearing monitoring devices which characterized in that: the X is to the biggest surface of the X direction reflector panel towards the laser of displacement sensor transmission, and the X is to the laser of displacement sensor transmission and be parallel with X axle direction, the Y is to the biggest surface of the Y direction reflector panel towards the laser of displacement sensor transmission, and the Y is to the laser of displacement sensor transmission and be parallel with Y axle direction, the Z is to the biggest surface of the Z direction reflector panel towards the laser of displacement sensor transmission, and the Z is to the laser of displacement sensor transmission and be parallel with Z axle direction.
Foretell building isolation bearing monitoring devices which characterized in that: the center of the bottom surface of a lower connecting steel plate of the shock insulation support is used as an original point O, the center of the bottom surface of the lower connecting steel plate of the shock insulation support passes through the original point O and points to the east as an X axis, the center of the bottom surface of the lower connecting steel plate of the shock insulation support passes through the original point O and is perpendicular to the direction of the X axis and points to the north as a Y axis, and the center of the bottom surface of the lower connecting steel plate of the shock.
Foretell building isolation bearing monitoring devices which characterized in that: the data processing module further comprises a voice alarm module connected with the microcontroller, and the X-direction displacement sensor, the Y-direction displacement sensor and the Z-direction displacement sensor are connected with the microcontroller through the RS485 communication module.
Foretell building isolation bearing monitoring devices which characterized in that: the microcontroller is in data communication with the monitoring module through the first communication module and the second communication module, the monitoring module comprises a computer, a router and a switch which are sequentially connected with the computer, and the second communication module is connected with the switch;
a temperature and humidity sensor is arranged on the upper structure of the building and connected with a microcontroller.
Compared with the prior art, the utility model has the following advantage:
1. simple structure, reasonable design and simple and convenient installation and layout.
2. The X-direction displacement sensor and the X-direction reflector are arranged in the monitoring shock insulation support, the X-direction displacement variable quantity is detected, the Y-direction displacement sensor and the Y-direction reflector are arranged, the Y-direction displacement variable quantity is detected, the Z-direction displacement sensor and the Z-direction reflector are arranged, the Z-direction displacement variable quantity is detected, and therefore the three-dimensional displacement of the shock insulation support is monitored in real time, and long-term real-time detection is effectively adapted.
3. The monitoring and shock-isolating support is internally provided with a laser transmitter, an annular dial and a camera, laser emitted by the laser transmitter irradiates the annular dial to form a positioning irradiation point, the camera shoots an image of the positioning irradiation point on the annular dial at the monitoring and shock-isolating support, and the rotation angle of the monitoring and shock-isolating support is obtained by the position change quantity of the positioning irradiation point in the image of the positioning irradiation point on the annular dial twice.
4. The utility model discloses a X is to displacement sensor, Y to displacement sensor and Z to displacement sensor, and X direction displacement variation and Y direction displacement variation are measured to non-contact method, the installation of being convenient for.
5. The utility model discloses carry out time measuring to the damping support, not only considered X direction displacement variation, Y direction displacement variation, still considered Z direction displacement variation and rotation angle, improved parameter measurement scope.
To sum up, the utility model relates to a rationally and with low costs, save time, laborsaving, the cost is little, is convenient for acquire the three-dimensional displacement and the rotation angle of isolation bearing, realizes real-time supervision to in time propose the forecast, be convenient for take the prevention and cure measure.
The technical solution of the present invention is further described in detail by the accompanying drawings and examples.
Drawings
Fig. 1 is the utility model discloses building isolation bearing monitoring devices's schematic structure diagram.
Fig. 2 is the utility model discloses building isolation bearing monitoring devices's circuit schematic block diagram.
Fig. 3 is the utility model discloses building isolation bearing monitoring devices annular calibrated scale's position schematic diagram.
Fig. 4 is the utility model discloses building isolation bearing monitoring devices temperature and humidity sensor's circuit schematic diagram.
Fig. 5 is the utility model discloses building isolation bearing monitoring devices voice alarm module's circuit schematic diagram.
Fig. 6 is the utility model discloses building isolation bearing monitoring devices RS485 communication module's circuit schematic diagram.
Fig. 7 is the utility model discloses building isolation bearing monitoring devices RJ45 communication module's circuit schematic diagram.
Description of reference numerals:
1-a shock insulation support; 1-connecting a steel plate; 1-2-lower connecting steel plate;
1-3-shock insulation rubber pad; 3-frame columns;
4-building superstructure; 5-1-X direction reflector; 5-2-X direction displacement sensor;
6-1-Y direction reflecting plate; a 6-2-Y direction displacement sensor; 7-Z displacement sensor;
a 7-1-Z direction reflector; 8-annular dial scale; 8-1-mounting a rod;
9-a camera; 9-1 — horizontal stand; 9-2-laser emitter;
10-a microcontroller; 11-RS 485 communication module; 12 — a first communication module;
13-a second communication module; 14-a switch; 15-a router;
16-a computer; 17-a temperature and humidity sensor; 18-voice alarm module;
101-1 st monitoring isolation bearing; 102-2 nd monitoring isolation bearing;
103-3 rd monitoring isolation bearing; 104-4 th monitor isolation bearing.
Detailed Description
As shown in fig. 1 to 3, a building isolation bearing monitoring device comprises an isolation bearing 1 arranged between a building lower structure and a building upper structure 4, wherein the building lower structure comprises a plurality of frame columns 3, and is characterized in that: the device comprises an X displacement detection module, a Y displacement detection module, a Z displacement detection module and a rotation angle detection module, wherein the X displacement detection module is arranged on a frame column 3 and is used for detecting the X-direction displacement of a vibration isolation support 1, the Y displacement detection module is arranged on the frame column 3 and is used for detecting the Z-direction displacement of the vibration isolation support 1, the rotation angle detection module is used for detecting the rotation angle of the vibration isolation support, and a data processing module is connected with the X displacement detection module, the Y displacement detection module, the Z displacement detection module and the rotation angle detection module, the X displacement detection module comprises an X-direction displacement sensor 5-2 arranged on one side surface of the frame column 3 and an X-direction reflection plate 5-1 arranged at the bottom of an upper structure 4 of a building, and the Y displacement detection module comprises a Y-direction displacement sensor 6-2 arranged on the other side surface of the frame column 3 and a Y-direction displacement sensor 6-2 arranged on the other side surface A Y-direction reflector 6-1 arranged at the bottom of the upper structure 4 of the building, the Z displacement detection module comprises a Z-direction displacement sensor 7 arranged at the top of the frame column 3 and a Z-direction reflector 7-1 arranged at the bottom of the upper structure 4 of the building, the rotation angle detection module comprises a plurality of mounting rods 8-1 arranged on the outer circumference of the connecting steel plate 1-1, an annular dial 8 arranged on the plurality of mounting rods 8-1 and a horizontal bracket 9-1 arranged on one opposite side surface of the frame column 3, and a laser emitter 9-2 and a camera 9 which are arranged on the horizontal bracket 9-1, the data processing module comprises a microcontroller 10, and the X-direction displacement sensor 5-2, the Y-direction displacement sensor 6-2, the Z-direction displacement sensor 7 and the camera 9 are all connected with the microcontroller 10.
In this embodiment, the laser emitted by the X-displacement sensor 5-2 is directed to the maximum surface of the X-direction reflector 5-1, the laser emitted by the X-displacement sensor 5-2 is parallel to the X-axis direction, the laser emitted by the Y-displacement sensor 6-2 is directed to the maximum surface of the Y-direction reflector 6-1, the laser emitted by the Y-displacement sensor 6-2 is parallel to the Y-axis direction, the laser emitted by the Z-displacement sensor 7 is directed to the maximum surface of the Z-direction reflector 7-1, and the laser emitted by the Z-displacement sensor 7 is parallel to the Z-axis direction.
In this embodiment, the center of the bottom surface of the lower connecting steel plate (1-2) of the seismic isolation support 1 is taken as an origin O, the center of the bottom surface passing through the origin O and pointing to the east is taken as an X axis, the center of the bottom surface passing through the origin O and pointing to the east is taken as a Y axis, the center of the bottom surface passing through the origin O and perpendicular to the X axis and pointing to the north is taken as a Y axis, and the center of the bottom surface passing through the origin O and perpendicular to an XOY.
In this embodiment, the data processing module further includes a voice alarm module 18 connected to the microcontroller 10, and the X-direction displacement sensor 5-2, the Y-direction displacement sensor 6-2, and the Z-direction displacement sensor 7 are connected to the microcontroller 10 through an RS485 communication module 11.
In this embodiment, the microcontroller 10 performs data communication with a monitoring module through a first communication module 12 and a second communication module 13, the monitoring module includes a computer 16, and a router 15 and a switch 14 which are sequentially connected to the computer 16, and the second communication module 13 is connected to the switch 14;
a temperature and humidity sensor 17 is arranged on the building upper structure 4, and the temperature and humidity sensor 17 is connected with the microcontroller 10.
In this embodiment, the microcontroller 10 may be referred to as STM32F103ZET6 microcontroller.
In this embodiment, the temperature and humidity sensor 17 is an AM2301 temperature and humidity sensor, which is a temperature and humidity composite sensor including calibrated digital signal output, and has high reliability and excellent long-term stability, and is convenient to install in a high-order place.
As shown in fig. 4, in this embodiment, the temperature and humidity sensor 17 is an AM2301 temperature and humidity sensor, a VDD pin of the AM2301 temperature and humidity sensor is connected to a 5V power output terminal, an SDA pin of the AM2301 temperature and humidity sensor is divided into two paths, one path is connected to the 5V power output terminal through a resistor R1, the other path is connected to a PA14 pin of the microcontroller 10, a GND pin of the AM2301 temperature and humidity sensor is grounded, and an NC pin of the AM2301 temperature and humidity sensor is suspended.
In this embodiment, the temperature and humidity sensor 17 detects the temperature and humidity of the environment where the vibration isolation support 1 is located, and sends the detected temperature and humidity to the microcontroller 10, the microcontroller 10 compares the temperature and humidity value with the temperature and humidity required value, and when the temperature and humidity value is greater than the temperature and humidity required value, the microcontroller 10 controls the voice alarm module 18 to alarm and remind.
As shown in fig. 5, in this embodiment, the audio alarm module 18 includes a chip XFS4243CE, a chip TPA2005D1 and a speaker SPK1, the 1 st, 3 rd and 5 th pins of the chip XFS4243CE are all grounded, the 2 nd pin of the chip XFS4243CE is connected to a 3.3V power output terminal, the 10 th pin of the chip XFS4243CE is connected to a PC11 pin of the microcontroller 10, the 8 th pin of the chip XFS4243CE is connected to a PC10 pin of the microcontroller 10, the 4 th pin of the chip XFS4243CE is connected to one end of a resistor R28, the 6 th pin of the chip XFS4243CE is grounded, the 1 st pin and the 6 th pin of the chip TPA2005D1 are connected to a 3.3V power output terminal, the 3 rd pin of the chip TPA2005D1 is connected to the other end of the resistor R28 through a capacitor C22, the 4 th pin of the chip TPA2005D1 is connected to the other end of the capacitor TPA 2005C 23, the other end of the chip TPA2005 is connected to the resistor 29, the chip TPA2005 is connected to the ground, the chip TPA 465 th pin is connected to the chip TPA2005D 465, one path is connected with one end of a capacitor C26, the other path is connected with one end of a resistor R30, and the third path is connected with one end of a loudspeaker SPK 1; the 8 th pin of the chip TPA2005D1 is divided into two paths, one path is connected with the other end of the capacitor C26, the other path is connected with the other end of the resistor R30, and the third path is connected with the other end of the loudspeaker SPK 1.
As shown in fig. 6, in this embodiment, the RS485 communication module 11 includes a chip MAX1487, a pin 1 of the chip MAX1487 is connected to a pin PD1 of the microcontroller 10, a connection end of a pin 2 and a pin 3 of the chip MAX1487 is connected to a pin PD2 of the microcontroller 10, a pin 4 of the chip MAX1487 is connected to a pin PD3 of the microcontroller 10, a pin 5 of the chip MAX1487 is grounded, the pin 6 of the chip MAX1487 is divided into three paths, one path is connected to a 5V power output terminal through a resistor R5, the other path is connected to one end of a resistor R3, and the third path is connected to an anode of a regulator D1; the 7 th pin of the chip MAX1487 is divided into three paths, one path is grounded through a resistor R2, the other path is connected with one end of a resistor R4, and the third path is connected with the anode of a voltage regulator tube D2; the cathode of the voltage regulator tube D1 and the cathode of the voltage regulator tube D2 are both grounded, the other end of the resistor R3 is connected with a line A of the RS485 bus, and the other end of the resistor R4 is connected with a line B of the RS485 bus.
In the embodiment, the RS485 communication module 11 is arranged, so that the X-direction displacement sensor 5-2, the Y-direction displacement sensor 6-2 and the Z-direction displacement sensor 7 can conveniently carry out data communication with the microcontroller 10 through the RS485 bus, the parallel connection of a plurality of sensors is realized, the transmission distance is long, and the interference is small.
In this embodiment, the microcontroller 10 controls the chip MAX1487
The pin is a receiver low level enable and the DE pin of the chip MAX1487 is a driver output high level enable for receiving and transmitting, and two control signals for transmitting and receiving are reversed, that is, the microcontroller 10 outputs a high level control for transmitting, and the microcontroller 10 outputs a low level control for receiving.
In this embodiment, the X-displacement sensor 5-2, the Y-displacement sensor 6-2 and the Z-displacement sensor 7 may be referred to as the laser ranging sensors of FSDs 11-290-RS 485.
In this embodiment, in the actual connection process, the terminals a of the X-direction displacement sensor 5-2 and the terminals B of the Y-direction displacement sensor 6-2 are connected to the line a of the RS485 bus, and the terminals B of the X-direction displacement sensor 5-2 and the Y-direction displacement sensor 6-2 are connected to the line B of the RS485 bus.
In this embodiment, in the actual connection process, the terminal a of the Z-displacement sensor 7 is connected to the line a of the RS485 bus, the terminal B of the Z-displacement sensor 7 is connected to the line B of the RS485 bus,
in this embodiment, the OV7670 camera may be referred to as the camera 9.
In this embodiment, it should be noted that, the connection between the camera 9 and the microcontroller 10 can refer to the schematic connection diagram between the STM32F103ZET6 single chip microcomputer and the OV7670 camera module disclosed in the embedded portable multifunctional image capturing system based on ARM, which is the chinese utility model patent with application number CN 201620012886.6.
In this embodiment, the laser transmitter 9-2 may refer to a cross-shaped laser transmitter for receiving laser light.
In this embodiment, the first communication module 12 may refer to a TL-FC311A-3 optical fiber transceiver, and the second communication module 13 may refer to a TL-FC311B-3 optical fiber transceiver.
As shown in fig. 7, in this embodiment, in an actual connection process, the microcontroller 10 is connected with an RJ45 interface module for connecting the first communication module 12, the RJ45 interface module includes a chip RTL8015AS, a chip 20F001N and an RJ N interface, pins SA N-SA N of the RTL 8015N are respectively connected with pins PA N-PA N of the microcontroller 10, pins SA N-SA N of the RTL 8015N and pins SA N-SA N of the RTL 8015N are both grounded, pins SA N-SA N of the RTL 8015N are both connected with a 5V power output terminal, pins SD N-SD N of the RTL 8015N are respectively connected with pins PC N-PC N of the microcontroller 10, pins tdrsrv, IOWB and IOWB pins of the rtpc N of the RTL 8015N are respectively connected with pins empc N, pins emcs N of the microcontroller 10, pins emcs N of the rtpc N and pins emcs N of the rtpc N are both grounded via pins smpc N, the smpc N and the smpc N pins of the smpc N, the AEN pin of the RTL8015AS is grounded, the TPOUT + pin of the RTL8015AS is divided into two paths, one path is grounded through a capacitor C37, and the other path is connected with the TD + pin of the chip 20F001N through a resistor R34; the TPOUT-pin of the RTL8015AS is divided into two paths, one path is grounded through a capacitor C36, and the other path is connected with the TD-pin of the chip 20F001N through a resistor R33; the TPIN + pin of the RTL8015AS is divided into two paths, one path is connected with one end of a resistor R32, and the other path is connected with the RD + pin of the chip 20F 001N; the TPIN-pin of the RTL8015AS is divided into two paths, one path is connected with one end of a resistor R31, and the other path is connected with the RD-pin of the chip 20F 001N; the other end of the resistor R32 and the other end of the resistor R31 are grounded through a capacitor C35; the TX + pin of the chip 20F001N is connected with the TX + pin of an RJ45 interface, the TX-pin of the chip 20F001N is connected with the TX-pin of an RJ45 interface, the RX + pin of the chip 20F001N is connected with the RX + pin of an RJ45 interface, and the RX-pin of the chip 20F001N is connected with the RX-pin of an RJ45 interface.
In this embodiment, in the actual connection process, the RJ45 interface is connected to the ethernet interface of the first communication module 12 through a network cable.
In this embodiment, in an actual connection process, the optical interface of the first communication module 12 is connected to the optical interface of the second communication module 13 through an optical fiber.
In this embodiment, in the actual connection process, the ethernet interface of the second communication module 13 is connected to the ethernet interface of the switch 14 through a network cable.
In this embodiment, the switch 14 may refer to a TP-LINK switch.
In this embodiment, router 15 may refer to the TL-R473G router of the TP-LINK.
In this embodiment, during the actual connection process, the other ethernet interface of the switch 14 is connected to a LAN network of the router 15 through a network cable.
In this embodiment, the computer 16 may refer to a associative computer. In the actual connection process, the network interface of the computer 16 is connected to another LAN network interface of the router 35 through a network cable.
In this embodiment, the X-direction reflecting plate 5-1 and the Y-direction reflecting plate 6-1 are independent reflecting plates.
In this embodiment, the annular scale 8 is an angle scale.
In this embodiment, a horizontal support rod for mounting the Z-displacement sensor 7 is disposed on the top of the frame column 3.
In the embodiment, the vibration isolation support 1 comprises vibration isolation rubber pads 1-3, upper connecting steel plates 1-1 arranged on the upper portions of the vibration isolation rubber pads 1-3 and lower connecting steel plates 1-2 arranged at the bottoms of the vibration isolation rubber pads 1-3, the upper connecting steel plates 1-1 of the vibration isolation support are fixedly connected with a building upper structure 4, and the lower connecting steel plates 1-2 of the vibration isolation support are fixedly connected with a frame column 3.
When the utility model is used in detail, the X-direction initial distance between the X-direction displacement sensor 5-2 and the X-direction reflector 5-1, the Y-direction initial distance between the Y-direction displacement sensor 6-2 and the Y-direction reflector 6-1, and the Z-direction initial distance between the Z-direction displacement sensor 7 and the Z-direction reflector 7-1 are set; at the initial moment, laser emitted by a laser emitter 9-2 irradiates on an annular dial 8 to form a positioning irradiation point, a camera 9 shoots an image of the positioning irradiation point on the annular dial 8 and sends the image of the positioning irradiation point to a microcontroller 10, the microcontroller 10 sends the image of the positioning irradiation point to a computer 16 through a first communication module 12, a second communication module 13, a switch 14 and a router 15, the computer 16 displays the image of the positioning irradiation point on the annular dial at the initial moment, and further the angle scale value of the positioning irradiation point on the annular dial 8 at the initial moment is conveniently observed and obtained, so that the initial angle value of the vibration isolation support 1 is obtained;
in the process of detecting by the X-direction displacement sensor 5-2, the Y-direction displacement sensor 6-2 and the Z-direction displacement sensor 7, the X-direction displacement sensor 5-2 sends the detected X-direction displacement to the microcontroller 10, the Y-direction displacement sensor 6-2 sends the detected Y-direction displacement to the microcontroller 10, the Z-direction displacement sensor 7 sends the detected Z-direction displacement to the microcontroller 10, the microcontroller 10 respectively performs difference processing on the received X-direction displacement, Y-direction displacement and Z-direction displacement with the X-direction initial distance, Y-direction initial distance and Z-direction initial distance to obtain X-direction displacement variation, Y-direction displacement variation and Z-direction displacement variation, and when the X-direction displacement variation, Y-direction displacement variation and Z-direction displacement variation received by the microcontroller 10 are larger than a displacement variation set value, the microcontroller 10 controls the voice alarm module 18 to alarm;
in addition, the camera 9 shoots an image of a positioning irradiation point on the annular dial 8 at the next moment and sends the image to the microcontroller 10, the microcontroller 10 sends the image to the computer 16 through the first communication module 12, the second communication module 13, the switch 14 and the router 15, and the computer 16 displays the image of the positioning irradiation point on the annular dial at the next moment, so that the angle scale value of the positioning irradiation point on the annular dial 8 at the next moment can be observed and obtained conveniently, and the initial angle value of the vibration isolation support 1 is subtracted from the angle scale value of the positioning irradiation point on the annular dial 8 at the next moment to obtain the rotation angle of the vibration isolation support 1.
In this embodiment, in an actual use process, the temperature and humidity detected by the temperature and humidity sensor 17 is sent to the computer 16 through the first communication module 12, the second communication module 13, the switch 14 and the router 15, and the computer 16 displays the temperature and humidity, so as to facilitate remote monitoring.
To sum up, the utility model relates to a rationally and with low costs, save time, laborsaving, the cost is little, is convenient for acquire the three-dimensional displacement and the rotation angle of isolation bearing, realizes real-time supervision to in time propose the forecast, be convenient for take the prevention and cure measure.
The above, only be the utility model discloses a preferred embodiment, it is not right the utility model discloses do any restriction, all according to the utility model discloses the technical entity all still belongs to any simple modification, change and the equivalent structure change of doing above embodiment the utility model discloses technical scheme's within the scope of protection.
Claims (5)
1. The utility model provides a building isolation bearing monitoring devices, is provided with isolation bearing (1) between building substructure and building superstructure (4), building substructure includes a plurality of frame post (3), its characterized in that: comprises an X displacement detection module which is arranged on a frame column (3) and detects the X-direction displacement of a shock insulation support (1), a Y displacement detection module which is arranged on the frame column (3) and detects the Y-direction displacement of the shock insulation support (1), a Z displacement detection module which is arranged on the frame column (3) and detects the Z-direction displacement of the shock insulation support (1), a rotation angle detection module which detects the rotation angle of the shock insulation support (1), and a data processing module which is connected with the X displacement detection module, the Y displacement detection module, the Z displacement detection module and the rotation angle detection module, wherein the X displacement detection module comprises an X-direction displacement sensor (5-2) which is arranged on one side surface of the frame column (3) and an X-direction reflecting plate (5-1) which is arranged at the bottom of an upper structure (4) of a building, the Y displacement detection module comprises a Y displacement sensor (6-2) arranged on the other side surface of the frame column (3) and a Y-direction reflector (6-1) arranged at the bottom of the building superstructure (4), the Z displacement detection module comprises a Z displacement sensor (7) arranged at the top of the frame column (3) and a Z-direction reflector (7-1) arranged at the bottom of the building superstructure (4), the rotation angle detection module comprises a plurality of mounting rods (8-1) which are distributed on the outer circumference of the connecting steel plate (1-1), an annular dial (8) arranged on the mounting rods (8-1) and a horizontal support (9-1) arranged on one opposite side surface of the frame column (3), and a laser emitter (9-2) and a camera (9) arranged on the horizontal support (9-1), the data processing module comprises a microcontroller (10), and the X-direction displacement sensor (5-2), the Y-direction displacement sensor (6-2), the Z-direction displacement sensor (7) and the camera (9) are all connected with the microcontroller (10).
2. A building isolation bearing monitoring device according to claim 1, wherein: the laser emitted by the X-direction displacement sensor (5-2) points to the maximum surface of the X-direction reflector (5-1), the laser emitted by the X-direction displacement sensor (5-2) is parallel to the X-axis direction, the laser emitted by the Y-direction displacement sensor (6-2) points to the maximum surface of the Y-direction reflector (6-1), the laser emitted by the Y-direction displacement sensor (6-2) is parallel to the Y-axis direction, the laser emitted by the Z-direction displacement sensor (7) points to the maximum surface of the Z-direction reflector (7-1), and the laser emitted by the Z-direction displacement sensor (7) is parallel to the Z-axis direction.
3. A building isolation bearing monitoring device according to claim 1, wherein: the center of the bottom surface of a lower connecting steel plate of the shock insulation support is used as an original point O, the direction crossing the original point O and pointing to the east is used as an X axis, the direction crossing the original point O and the X axis is vertical and pointing to the north is used as a Y axis, and the direction crossing the original point O and an XOY plane formed by the X axis and the Y axis are vertical and pointing to the upper structure (4) of the building is used as a Z axis.
4. A building isolation bearing monitoring device according to claim 1, wherein: the data processing module further comprises a voice alarm module (18) connected with the microcontroller (10), and the X-direction displacement sensor (5-2), the Y-direction displacement sensor (6-2) and the Z-direction displacement sensor (7) are connected with the microcontroller (10) through the RS485 communication module (11).
5. A building isolation bearing monitoring device according to claim 4, wherein: the microcontroller (10) is in data communication with a monitoring module through a first communication module (12) and a second communication module (13), the monitoring module comprises a computer (16), and a router (15) and a switch (14) which are sequentially connected with the computer (16), and the second communication module (13) is connected with the switch (14);
a temperature and humidity sensor (17) is arranged on the upper structure (4) of the building, and the temperature and humidity sensor (17) is connected with the microcontroller (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020529897.8U CN212153728U (en) | 2020-04-13 | 2020-04-13 | Building shock insulation support monitoring devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020529897.8U CN212153728U (en) | 2020-04-13 | 2020-04-13 | Building shock insulation support monitoring devices |
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| CN117213364A (en) * | 2023-08-28 | 2023-12-12 | 深圳大学 | Three-way displacement and corner monitoring system and method for shock insulation support |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117213364A (en) * | 2023-08-28 | 2023-12-12 | 深圳大学 | Three-way displacement and corner monitoring system and method for shock insulation support |
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