CN212152488U - Electroplating solution cooling device for electroplating production line - Google Patents
Electroplating solution cooling device for electroplating production line Download PDFInfo
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- CN212152488U CN212152488U CN201921945677.7U CN201921945677U CN212152488U CN 212152488 U CN212152488 U CN 212152488U CN 201921945677 U CN201921945677 U CN 201921945677U CN 212152488 U CN212152488 U CN 212152488U
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Abstract
The utility model provides an electroplating solution cooling device for an electroplating production line, which comprises an electroplating box, wherein the inner side of the electroplating box is fixedly connected with a heat conducting pipe, the upper end of the left side of the heat conducting pipe is fixedly connected with a water inlet pipe, the water inlet pipe extends to the outer side of the electroplating box, the upper end of the right side of the heat conducting pipe is fixedly connected with a water outlet pipe, the upper end and the lower end of the left side of the electroplating box are respectively fixedly connected with a one-way water inlet guide pipe and a water outlet guide pipe, the one-way water inlet guide pipe and the water outlet guide pipe extend to the inner part of the electroplating box, one ends of the outer sides of the one-way water inlet guide pipe and the water outlet guide pipe are all clamped with a connecting piece, a guide pipe is clamped between the connecting pieces, the upper end of the guide pipe, the rapid cooling is achieved, and the production is stably carried out.
Description
Technical Field
The utility model relates to an electroplate production technical field, especially relate to an electroplating solution cooling device for electroplating production line.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis, thereby having the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like.
In the electroplating production at present, because the plating solution passes through the reason of electric current for a long time, the temperature of plating solution will rise, and the temperature rise of plating solution just can lead to the unstable phenomenon to appear in the plating solution to influence whole electroplating's quality, and then need reduce the temperature of plating solution to certain temperature range just can carry out next round of electroplating work, just can guarantee the normal clear of electroplating.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides an electroplating solution cooling device for electroplating production line to electroplating solution temperature easily rises and leads to unstable problem when solving electroplating production.
The utility model relates to an electroplating solution cooling device's for electroplating production line purpose and efficiency is reached by following specific technological means: the utility model provides an electroplating solution cooling device for electroplating production line, including electroplating box, the inboard fixedly connected with heat pipe of electroplating box, heat pipe left side upper end fixedly connected with inlet tube, the inlet tube extends to the electroplating box outside, heat pipe right side upper end fixedly connected with outlet pipe, the upper and lower extreme difference fixedly connected with one-way water inlet pipe of electroplating box left side, go out the water pipe, one-way water inlet pipe, it is inside that it all extends to electroplating box to go out the water pipe, one-way water inlet pipe, the equal joint in water pipe outside one end has the connecting piece, the joint has the pipe between the connecting piece, cooling device has been cup jointed to the pipe upper end, one-way water inlet pipe upper end joint has the.
Preferably, the cooling device further comprises a plurality of cooling pipes, connecting rods, slit grooves, water inlets, water outlets and coiled pipes, the cooling pipes are cylindrical, the connecting rods are fixedly connected among the cooling pipes, the slit grooves are formed among the cooling pipes, the water inlets are formed in the upper ends of the coiled pipes, and the water outlets are formed in the lower ends of the coiled pipes.
Preferably, the water inlet and the water outlet of the coiled pipe extend to the outer side of the cooling pipe, and the coiled pipe is sleeved at the upper end of the conduit.
Preferably, the fan corresponds to the cooling device, and the fan is connected with an external power supply.
Preferably, one-way pipe of intaking still includes the stopper, the movable plate, the through-hole, the recess, the spout, the slide bar, the backup pad, one-way pipe inboard of intaking is located the equal fixedly connected with stopper in electroplating box junction top and bottom, stopper central point puts and is equipped with the recess, the joint has the movable plate between top and the bottom stopper, movable plate right side one end is equipped with the spout inboard and is located the equal fixedly connected with backup pad in stopper right side top and bottom, the backup pad is close to stopper one side fixedly connected with slide bar, the slide bar corresponds the joint with the spout, the spring has been cup jointed to.
Preferably, the movable plate is T-shaped, through holes are formed in the upper side and the lower side of the movable plate, and the outer sides of the through holes extend to correspond to the grooves in a clamping mode.
Preferably, the upper ends of the water outlet conduit, the water inlet pipe and the water inlet are all provided with switch valves.
Preferably, the upper end of the water outlet pipe is provided with a water pump, the model of the water pump is PO3500, and the water pump is connected with an external power supply.
Has the advantages that:
(1) the utility model discloses cooling device is equipped with a plurality of cooling tubes, forms a plurality of slot grooves between the cooling tube, and the slot groove corresponds with the fan, and the plating solution is when the pipe, at first the cooling tube inside normal atmospheric temperature water for the plating solution cooling, and the fan cools off the cooling tube by blowing simultaneously to the slot groove forms the convection current, and the cooling effect is better, and cooling rate is faster, then mixes the effect that reaches the cooling with the plating solution of refrigerated plating solution and electroplating tank.
(2) The utility model discloses be equipped with the heat pipe, inside temperature is fixed time, lets in normal atmospheric temperature water through the inlet tube, and normal atmospheric temperature water absorbs and discharges through the outlet pipe after the heat, can supply the hot-water local use of needs, and the heat recovery energy is energy-conserving and reduce economic cost, and the practicality is high.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic structural view of the cooling device of the present invention.
Fig. 3 is an enlarged schematic view of a portion a in fig. 1 according to the present invention.
Fig. 4 is a schematic view of the internal structure of the cooling tube of the present invention.
In fig. 1 to 4, the correspondence between the component names and the reference numbers is:
electroplating box 1, outlet pipe 2, heat pipe 3, outlet conduit 4, switch valve 5, conduit 6, fan 7, cooling device 8, cooling pipe 801, connecting rod 802, slot 803, water inlet 804, water outlet 805, coiled pipe 806, connecting piece 9, water pump 10, inlet tube 11, one-way inlet conduit 12, stopper 1201, movable plate 1202, through hole 1203, recess 1204, spout 1205, slide bar 1206, backup pad 1207.
Detailed Description
The technical solution in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the protection scope of the present invention based on the embodiments of the present invention.
Example (b):
as shown in figures 1 to 4: the utility model provides an electroplating solution cooling device for electroplating production line, including electroplating box 1, 1 inboard fixedly connected with heat pipe 3 of electroplating box, 3 left side upper end fixedly connected with inlet tube 11 of heat pipe, inlet tube 11 extends to the electroplating box 1 outside, 3 right sides upper end fixedly connected with outlet pipe 2 of heat pipe, the upper and lower extreme difference fixedly connected with one-way pipe 12 of intaking in electroplating box 1 left side, go out water pipe 4, one-way pipe 12 of intaking, it all extends to electroplating box 1 inside to go out water pipe 4, one-way pipe 12 of intaking, the equal joint in 4 outside one ends of play water pipe has connecting piece 9, the joint has pipe 6 between connecting piece 9, cooling device 8 has been cup jointed to the pipe 6 upper end, one-way pipe 12 upper end joint has water pump 10, 1 left side wall fixedly connected with.
Wherein: the cooling device 8 further comprises a plurality of cooling pipes 801, a plurality of connecting rods 802, a slit groove 803, a water inlet 804, a water outlet 805 and a coiled pipe 806, wherein the cooling pipes 801 are cylindrical, the connecting rods 802 are fixedly connected between the cooling pipes 801, the slit groove 803 is formed between the cooling pipes 801, the water inlet 804 is formed in the upper end of the coiled pipe 806, the water outlet 805 is formed in the lower end of the coiled pipe 806, and when the temperature of the electroplating solution in the electroplating box 1 rises, water is added into the cooling pipes 801 through the water inlet 804, so that the normal-temperature water in the cooling pipes 801 absorbs the thermal electroplating solution passing through the coiled pipe 806, and the electroplating solution achieves the effect of cooling.
Wherein: the water inlet 804 and the water outlet 805 of the coiled pipe 806 are extended outside the cooling pipe 801, the coiled pipe 806 is sleeved at the upper end of the guide pipe 6, the coiled pipe 806 is long enough after being bent, and when the electroplating solution passes through the coiled pipe 806, the normal-temperature water in the cooling pipe 801 has enough time to absorb heat and cool the electroplating solution, so that the cooling effect is better.
Wherein: the fan 7 corresponds to the cooling device 8, the fan 7 is connected with an external power supply, the gap grooves 803 are formed between the cooling pipes 801, and the fan 7 blows air to form convection on two sides of the gap grooves 803, so that the cooling speed is higher.
Wherein: the unidirectional water inlet pipe 12 further comprises a limiting block 1201, a moving plate 1202, a through hole 1203, a groove 1204, a sliding groove 1205, a sliding rod 1206 and a supporting plate 1207, the limiting blocks 1201 are fixedly connected to the top and the bottom of the joint of the electroplating box 1 on the inner side of the unidirectional water inlet pipe 12, the groove 1204 is arranged at the central position of the limiting block 1201, the moving plate 1202 is clamped between the top and the bottom limiting blocks 1201, the sliding groove 1205 is arranged at one end of the right side of the moving plate 1202, the supporting plate 1207 is fixedly connected to the top and the bottom of the right side of the limiting block 1201 on the inner side of the unidirectional water inlet pipe 12, the sliding rod 1206 is fixedly connected to the supporting plate 1207 close to the side of the limiting block 1201, the sliding rod 1206 is correspondingly clamped with the sliding groove 1205, a spring is sleeved at the upper end of the sliding rod 1206, electroplating solution is pumped up by, meanwhile, the plating liquid in the plating tank does not flow backward when entering the plating tank 1 because the pressure of the plating liquid in the plating tank is not higher than the pressure of the plating liquid outside.
Wherein: the movable plate 1202 is "T" shaped, and the upper and lower sides of the movable plate 1202 are provided with through holes 1203, the outer sides of the through holes 1203 extend to correspond to the grooves 1204 in a clamping manner, and under normal conditions, the outer sides of the through holes are connected with the inner wall of the left side of the grooves, so that the movable plate 1202 seals the one-way water inlet conduit 12 to prevent the electroplating solution from flowing into the cooling pipe 801 at normal temperature.
Wherein: the upper ends of the water outlet pipe 4, the water inlet pipe 11 and the water inlet 804 are respectively provided with the switch valve 5, so that the electroplating solution can be conveniently controlled to be cooled, the switch valve 5 is opened when cooling is needed, and the switch valve is closed when the electroplating solution is not needed.
Wherein: 2 upper ends of outlet pipe are equipped with water pump 10, and the water pump 10 model is PO3500, and external power supply is connected to water pump 10, and 2 upper end water pumps 10 of outlet pipe can be taken out the inside hot water of heat pipe 3 to the place that needs to use, can save economic cost and energy resource consumption.
The working principle is as follows: when the temperature of the electroplating solution rises, the water inlet pipe 11, the water inlet 804 and the switch valve 5 are opened, so that the heat conduction pipe 3 and the cooling pipe 801 store water, then the switch valve of the water outlet pipe 4 is opened, then the fan 7 and the power switch of the water pump 10 at the upper end of the unidirectional water inlet pipe 12 are opened, the electroplating solution is pumped into the inlet pipe 6 through the water pump 10 at the upper end of the unidirectional water inlet pipe 12, when passing through the inlet pipe 6, the normal temperature water in the cooling pipe 801 firstly cools and absorbs heat to the electroplating solution, simultaneously the fan 7 blows air to the cooling pipe 801 to accelerate the cooling of the electroplating solution, then the electroplating solution enters the unidirectional water inlet pipe 12, the moving plate 1202 moves towards the right side by extruding, so that the electroplating solution enters the groove 1204, then enters the through hole 1203 to the electroplating tank 1 through the through hole 1203, so that the cooled electroplating, meanwhile, the heat conduction pipe 3 continuously absorbs heat of the electroplating solution in the electroplating box 1, and when hot water is at a certain temperature, the water pump 10 at the upper end of the water outlet 2 pumps water to an external place needing to be used, such as a living area and machinery.
Claims (8)
1. The utility model provides an electroplating solution cooling device for electroplating production line, includes electroplating box (1), its characterized in that: the inner side of the electroplating box (1) is fixedly connected with a heat conduction pipe (3), the upper end of the left side of the heat conduction pipe (3) is fixedly connected with a water inlet pipe (11), the water inlet pipe (11) extends to the outer side of the electroplating box (1), the upper end of the right side of the heat conduction pipe (3) is fixedly connected with a water outlet pipe (2), the upper end and the lower end of the left side of the electroplating box (1) are respectively and fixedly connected with a one-way water inlet guide pipe (12) and a one-way water outlet guide pipe (4), the one-way water inlet conduit (12) and the water outlet conduit (4) both extend to the interior of the electroplating box (1), one ends of the outer sides of the unidirectional water inlet guide pipe (12) and the water outlet guide pipe (4) are respectively clamped with a connecting piece (9), a guide pipe (6) is clamped between the connecting pieces (9), the upper end of the guide pipe (6) is sleeved with a cooling device (8), one-way water inlet pipe (12) upper end joint has water pump (10), electroplating box (1) left side wall fixedly connected with fan (7).
2. The plating solution cooling device for the electroplating production line according to claim 1, characterized in that: the cooling device (8) further comprises a cooling pipe (801), a connecting rod (802), a plurality of slit grooves (803), a water inlet (804), a water outlet (805) and a coiled pipe (806), wherein the cooling pipe (801) is cylindrical, the cooling pipe (801) is provided with a plurality of connecting rods (802), the connecting rods (802) are fixedly connected between the cooling pipe (801), the slit grooves (803) are formed between the cooling pipe (801), the water inlet (804) is arranged at the upper end of the coiled pipe (806), and the water outlet (805) is arranged at the lower end of the coiled pipe.
3. The plating solution cooling device for an electroplating production line according to claim 2, characterized in that: the coiled pipe (806) is provided with a water inlet (804) and a water outlet (805) which extend to the outer side of the cooling pipe (801), and the coiled pipe (806) is sleeved at the upper end of the guide pipe (6).
4. The plating solution cooling device for the electroplating production line according to claim 1, characterized in that: the fan (7) corresponds to the cooling device (8), and the fan (7) is connected with an external power supply.
5. The plating solution cooling device for the electroplating production line according to claim 1, characterized in that: the unidirectional water inlet guide pipe (12) further comprises a limiting block (1201), a moving plate (1202), a through hole (1203), a groove (1204), a sliding groove (1205), a sliding rod (1206) and a supporting plate (1207), wherein the limiting block (1201) is fixedly connected to the top and the bottom of the joint of the electroplating box (1) on the inner side of the unidirectional water inlet guide pipe (12), the groove (1204) is formed in the central position of the limiting block (1201), the moving plate (1202) is clamped between the top and the bottom limiting block (1201), the sliding groove (1205) is formed in one end of the right side of the moving plate (1202), the supporting plate (1207) is fixedly connected to the top and the bottom of the right side of the limiting block (1201), the sliding rod (1206) is fixedly connected to one side, and the sliding rod (1206) is correspondingly clamped with the sliding groove (1205), the upper end of the sliding rod (1206) is sleeved with a spring.
6. The plating solution cooling device for the electroplating production line according to claim 5, characterized in that: the movable plate (1202) is T-shaped, through holes (1203) are formed in the upper side and the lower side of the movable plate (1202), and the outer sides of the through holes (1203) extend to be corresponding to the grooves (1204) in a clamping mode.
7. The plating solution cooling device for the electroplating production line according to claim 1, characterized in that: the upper ends of the water outlet conduit (4), the water inlet pipe (11) and the water inlet (804) are all provided with switch valves (5).
8. The plating solution cooling device for the electroplating production line according to claim 1, characterized in that: the water outlet pipe (2) upper end is equipped with water pump (10), water pump (10) model is PO3500, external power source is connected in water pump (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921945677.7U CN212152488U (en) | 2019-11-12 | 2019-11-12 | Electroplating solution cooling device for electroplating production line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921945677.7U CN212152488U (en) | 2019-11-12 | 2019-11-12 | Electroplating solution cooling device for electroplating production line |
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| Publication Number | Publication Date |
|---|---|
| CN212152488U true CN212152488U (en) | 2020-12-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921945677.7U Active CN212152488U (en) | 2019-11-12 | 2019-11-12 | Electroplating solution cooling device for electroplating production line |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113445114A (en) * | 2021-06-28 | 2021-09-28 | 江苏澳光电子有限公司 | Plating bath plating solution cooling structure |
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2019
- 2019-11-12 CN CN201921945677.7U patent/CN212152488U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113445114A (en) * | 2021-06-28 | 2021-09-28 | 江苏澳光电子有限公司 | Plating bath plating solution cooling structure |
| CN113445114B (en) * | 2021-06-28 | 2023-04-25 | 江苏澳光电子有限公司 | Electroplating bath electroplating solution cooling structure |
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