CN212136410U - Conveyor for semiconductor processing - Google Patents
Conveyor for semiconductor processing Download PDFInfo
- Publication number
- CN212136410U CN212136410U CN202020647264.7U CN202020647264U CN212136410U CN 212136410 U CN212136410 U CN 212136410U CN 202020647264 U CN202020647264 U CN 202020647264U CN 212136410 U CN212136410 U CN 212136410U
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- Prior art keywords
- fixedly connected
- side wall
- pipeline
- bearing plate
- piston
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- Expired - Fee Related
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 42
- 230000006835 compression Effects 0.000 claims abstract description 8
- 238000007906 compression Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 7
- 238000005192 partition Methods 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims description 2
- 230000000903 blocking effect Effects 0.000 claims 2
- 238000007791 dehumidification Methods 0.000 abstract description 15
- 230000008569 process Effects 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 20
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000010720 hydraulic oil Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000012720 thermal barrier coating Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of semiconductors, and a conveyor is used in semiconductor processing is disclosed, include the device body and place the box, the symmetry is provided with the mounting hole on placing the lateral wall of box, and the setting of mounting hole linear array is on placing the lateral wall of box, fixedly connected with baffle on the one end inside wall of mounting hole, the symmetry is provided with compression spring on the one end lateral wall of baffle, and compression spring's one end fixedly connected with baffle, the middle part fixedly connected with gasbag of baffle, and the one end of gasbag offsets with the baffle and sets up, sliding connection has the bearing plate on placing the inside wall of box, and the one end fixedly connected with telescoping device of bearing plate, one side fixedly connected with pipeline of telescoping device, and pipeline and telescoping device are linked together, fixedly connected with annular fender shoulder on the inside wall of pipeline. The conveying device for semiconductor processing can accelerate the dehumidification process and increase the dehumidification uniformity.
Description
Technical Field
The utility model relates to the field of semiconductor technology, specifically be a conveyor for semiconductor processing.
Background
Semiconductor devices are electronic devices that utilize the special electrical properties of semiconductor materials to perform specific functions. At present, the drying mode in the prior art mostly uses room temperature for dehumidification, but the mode needs a long time, so that the production efficiency is reduced, Chinese patent No. CN209337455U is retrieved, the conveying device for semiconductor processing can realize the conveying of semiconductor materials and can also carry out high-temperature dehumidification on the semiconductor materials, but the device puts the semiconductor materials in a placing box for carrying out dehumidification on the conveying box, and no ventilation device is arranged at the upper end and the lower end of the placing box in the dehumidification process. The non-uniform dehumidification of the upper and lower parts of the semiconductor material may be caused, and the lack of the liftout device in the placing box makes the work personnel to find the semiconductor material troublesome
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a to prior art not enough, the utility model provides a conveyor for semiconductor processing possesses the dehumidification and is even and be convenient for get advantages such as put, has solved the problem that the background art provided.
(II) technical scheme
For the purpose that realizes above-mentioned dehumidification is even and be convenient for get put, the utility model provides a following technical scheme: a conveying device for semiconductor processing comprises a device body and a placing box, wherein mounting holes are symmetrically formed in the side wall of the placing box, a linear array of the mounting holes is formed in the side wall of the placing box, a baffle is fixedly connected to the inner side wall of one end of each mounting hole, compression springs are symmetrically arranged on the side wall of one end of each baffle, a partition is fixedly connected to one end of each compression spring, an air bag is fixedly connected to the middle of each baffle, one end of each air bag is abutted against the corresponding partition, a bearing plate is slidably connected to the inner side wall of the placing box, a telescopic device is fixedly connected to one end of each bearing plate, a pipeline is fixedly connected to one side of each telescopic device and communicated with the telescopic device, an annular retaining shoulder is fixedly connected to the inner side wall of the pipeline, a connecting rod is inserted into the annular retaining shoulder, and a first piston is fixedly connected to one, and the other end fixedly connected with magnet of connecting rod is located magnet one side fixedly connected with electro-magnet in the pipeline, and the one end opening part of pipeline is provided with the wiring port.
Preferably, the telescoping device includes the sleeve pipe, sheathed tube one end fixed connection is on placing the bottom lateral wall of box, and the intraductal sliding connection that overlaps has the second piston, the one end fixedly connected with ejector pin of second piston, and the one end of ejector pin and one side lateral wall fixed connection of bearing plate.
Preferably, the lateral wall of one side of bearing plate is gone up fixedly connected with blotter, and has seted up the bar line on the lateral wall of one side of blotter.
Preferably, an external thread is formed on the side wall of one end of the ejector rod, a connecting hole is formed in the side wall of one side of the bearing plate, an internal thread is formed in the connecting hole, and the ejector rod is connected with the bearing plate through a thread.
Preferably, the side wall of the pipeline is provided with a heat insulation coating, and the port of the pipeline, which is positioned at one end of the wiring port, is sealed by a sealing ring.
Preferably, a mounting groove is formed in the side wall of one side of the first piston, an internal thread is formed in the inner side wall of the mounting groove, an external thread is formed in the side wall of one end of the connecting rod, and the connecting rod is connected with the first piston through the thread.
(III) advantageous effects
Compared with the prior art, the utility model discloses possess following beneficial effect:
1. this kind of conveyor for semiconductor processing, through parts such as mounting hole, gasbag and the baffle that sets up, at the in-process of heating the dehumidification to the semiconductor, the gasbag is because the rising of temperature can take place the inflation, and the gasbag after the inflation can push up the baffle to the lower extreme lateral wall that makes to place the box is linked together through mounting hole and external, is convenient for place the moisture discharge of the semiconductor material of box lower extreme, has also increased the degree of consistency of dehumidification when having accelerated the process of dehumidification.
2. This kind of conveyor for semiconductor processing, through the telescoping device that sets up, parts such as pipeline and electro-magnet, when putting into semiconductor material, semiconductor material's gravity can extrude the telescoping device, thereby make the second piston of pipeline extruded to electro-magnet one side motion, the staff is when wanting to take out semiconductor material, only need to energize to the electro-magnet through the wiring port, make the electro-magnet produce magnetic force and then extrude magnet reverse motion, jack-up the ejector pin upwards through first piston, thereby make semiconductor material by ejecting place the box, the staff of being convenient for takes.
Drawings
FIG. 1 is a schematic view of the overall connection structure of the present invention;
FIG. 2 is a schematic view of the overall structure of the placing box of the present invention;
fig. 3 is a schematic front sectional view of the storage box of the present invention.
In the figure: 1. a device body; 2. placing the box; 3. a wiring port; 4. a partition plate; 5. an electromagnet; 6. a magnet; 7. a connecting rod; 8. an annular shoulder; 9. a first piston; 10. a pipeline; 11. a second piston; 12. a top rod; 13. a sleeve; 14. a bearing plate; 15. a baffle plate; 16. an air bag; 17. compressing the spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1
Referring to fig. 1-3, a conveying device for semiconductor processing comprises a device body 1 and a placing box 2, wherein the side wall of the placing box 2 is symmetrically provided with mounting holes, the mounting holes are linearly arranged on the side wall of the placing box 2 in an array manner, a baffle 15 is fixedly connected to the inner side wall of one end of each mounting hole, a compression spring 17 is symmetrically arranged on the side wall of one end of each baffle 15, one end of each compression spring 17 is fixedly connected with a partition plate 4, the middle part of each baffle 15 is fixedly connected with an air bag 16, one end of each air bag 16 is abutted to each partition plate 4, a bearing plate 14 is slidably connected to the inner side wall of the placing box 2, a cushion pad is fixedly connected to the side wall of one side of the bearing plate 14, strip-shaped grains are arranged on the side wall of one side of the cushion pad, the arranged cushion pad can reduce the abrasion between a semiconductor material, reduce the relative slip at both in transportation process, the one end fixedly connected with telescoping device of bearing plate 14, the external screw thread has been seted up on the one end lateral wall of ejector pin 12, the connecting hole has been seted up on one side lateral wall of bearing plate 14, and seted up the internal thread in the connecting hole, through threaded connection between ejector pin 12 and the bearing plate 14, the threaded connection of setting can be convenient for installation and dismantlement between ejector pin 12 and the bearing plate 14, improve the work efficiency of equipment in earlier stage and later maintenance.
One side fixedly connected with pipeline 10 of telescoping device, and pipeline 10 is linked together with the telescoping device, be provided with thermal barrier coating on the lateral wall of pipeline 10, and the port that is located pipeline 10 of 3 one ends of wiring port adopts the sealed setting of sealing washer, the thermal barrier coating and the sealing washer that set up all can reduce the inside heat of pipeline 10, make the inside part ageing speed of pipeline 10 slow down, the life of part has been increased, fixedly connected with annular fender shoulder 8 on the inside wall of pipeline 10, and the connecting rod 7 has been inserted in annular fender shoulder 8, the first piston 9 of one end fixedly connected with of connecting rod 7, the mounting groove has been seted up on one side lateral wall of first piston 9, and the internal thread has been seted up on the inside wall of mounting groove, the external screw thread has been seted up on the one end lateral wall of connecting rod 7, pass through threaded connection between connecting rod 7 and the first piston 9, the threaded connection that sets up can be convenient for the installation between Iron 6, fixedly connected with electro-magnet 5 in the pipeline 10 that is located magnet 6 one side, the magnetic pole repulsion setting between electro-magnet 5 and the magnet 6 after the circular telegram, and the one end opening part of pipeline 10 is provided with wiring port 3.
Example 2
Based on embodiment 1, as shown in fig. 1-3, the telescopic device includes a sleeve 13, one end of the sleeve 13 is fixedly connected to the bottom side wall of the placing box 2, and a second piston 11 is slidably connected in the sleeve 13, one end of the second piston 11 is fixedly connected to a top rod 12, and one end of the top rod 12 is fixedly connected to one side wall of the bearing plate 14. The telescopic device can be used for facilitating ejection and placement of semiconductor materials, and the efficiency of taking and placing the semiconductor materials by workers is improved.
The working principle is as follows: when the staff put into placing box 2 with semiconductor material, semiconductor material can extrude bearing plate 14, and bearing plate 14 is because the weight of semiconductor begins to move down, and the bearing plate 14 of downstream can extrude second piston 11 through ejector pin 12 for second piston 11 downstream drives first piston 9 motion through extrusion hydraulic oil, and first piston 9 passes through connecting rod 7 and drives magnet 6 and lean on the warp to electro-magnet 5 one side.
Further, when the semiconductor material is dehumidified by high temperature, the air bag 16 can also feel the thermal expansion, and further push the partition plate 4 to move to open the mounting hole, so that the bottom of the box 2 is communicated with the outside, the moisture of the semiconductor material at the lower end of the box 2 can be conveniently discharged, the dehumidification process is accelerated, and the dehumidification uniformity is increased.
Further, after carrying and the dehumidification is accomplished, when the staff wants to take out semiconductor material from placing box 2, only need to let electro-magnet 5 be linked together with external power through wiring port 3, electro-magnet 5 can produce magnetic force, make magnet 6 remove towards the party of keeping away from magnet, magnet 6 can pass through connecting rod 7 extrusion first piston 9, then first piston 9 can make second piston 11 rise through hydraulic oil, thereby drive bearing plate 14 and move up, the staff of being convenient for takes out semiconductor material.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A conveying device for semiconductor processing comprises a device body (1) and a placing box (2);
the method is characterized in that:
the side wall of the placing box (2) is symmetrically provided with mounting holes, the linear array of the mounting holes is arranged on the side wall of the placing box (2), the inner side wall at one end of each mounting hole is fixedly connected with a baffle (15), the side wall at one end of each baffle (15) is symmetrically provided with a compression spring (17), one end of each compression spring (17) is fixedly connected with a partition plate (4), the middle part of each baffle (15) is fixedly connected with an air bag (16), one end of each air bag (16) is abutted against the partition plate (4), the inner side wall of the placing box (2) is slidably connected with a bearing plate (14), one end of each bearing plate (14) is fixedly connected with a telescopic device, one side of each telescopic device is fixedly connected with a pipeline (10), the pipeline (10) is communicated with the telescopic devices, and the inner side wall of the pipeline (10) is fixedly connected with an annular blocking shoulder (, and the annular blocking shoulder (8) is inserted with a connecting rod (7), one end of the connecting rod (7) is fixedly connected with a first piston (9), the other end of the connecting rod (7) is fixedly connected with a magnet (6), the connecting rod is positioned on one side of the magnet (6), an electromagnet (5) is fixedly connected in the pipeline (10), and an opening at one end of the pipeline (10) is provided with a wiring port (3).
2. The conveying apparatus for semiconductor processing according to claim 1, wherein: the telescoping device includes sleeve pipe (13), the one end fixed connection of sleeve pipe (13) is on placing the bottom lateral wall of box (2), and sliding connection has second piston (11) in sleeve pipe (13), the one end fixedly connected with ejector pin (12) of second piston (11), and one side lateral wall fixed connection of the one end of ejector pin (12) and bearing plate (14).
3. The conveying apparatus for semiconductor processing according to claim 2, wherein: fixedly connected with blotter on one side lateral wall of bearing plate (14), and seted up the bar line on one side lateral wall of blotter.
4. The conveying apparatus for semiconductor processing according to claim 3, wherein: the bearing plate is characterized in that an external thread is formed in the side wall of one end of the ejector rod (12), a connecting hole is formed in the side wall of one side of the bearing plate (14), an internal thread is formed in the connecting hole, and the ejector rod (12) is connected with the bearing plate (14) through the thread.
5. The conveying apparatus for semiconductor processing according to claim 1, wherein: the side wall of the pipeline (10) is provided with a heat insulation coating, and the port of the pipeline (10) which is positioned at one end of the wiring port (3) is sealed by a sealing ring.
6. The conveying apparatus for semiconductor processing according to claim 1, wherein: the piston is characterized in that a mounting groove is formed in the side wall of one side of the first piston (9), an internal thread is formed in the inner side wall of the mounting groove, an external thread is formed in the side wall of one end of the connecting rod (7), and the connecting rod (7) is connected with the first piston (9) through the thread.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020647264.7U CN212136410U (en) | 2020-04-26 | 2020-04-26 | Conveyor for semiconductor processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020647264.7U CN212136410U (en) | 2020-04-26 | 2020-04-26 | Conveyor for semiconductor processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212136410U true CN212136410U (en) | 2020-12-11 |
Family
ID=73691756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020647264.7U Expired - Fee Related CN212136410U (en) | 2020-04-26 | 2020-04-26 | Conveyor for semiconductor processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212136410U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113739549A (en) * | 2021-09-14 | 2021-12-03 | 深圳市哥士顿电子科技有限公司 | Electronic components quick drying device |
| CN115479459A (en) * | 2022-08-23 | 2022-12-16 | 马鞍山马商食品有限公司 | Air dryer for producing hand-torn duck necks and working method of air dryer |
| CN116275226A (en) * | 2023-05-16 | 2023-06-23 | 南通中南智能科技有限公司 | Disc milling cutter and quick blade-changing milling machine with same |
-
2020
- 2020-04-26 CN CN202020647264.7U patent/CN212136410U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113739549A (en) * | 2021-09-14 | 2021-12-03 | 深圳市哥士顿电子科技有限公司 | Electronic components quick drying device |
| CN115479459A (en) * | 2022-08-23 | 2022-12-16 | 马鞍山马商食品有限公司 | Air dryer for producing hand-torn duck necks and working method of air dryer |
| CN115479459B (en) * | 2022-08-23 | 2023-11-03 | 马鞍山马商食品有限公司 | Air dryer for producing hand-torn duck neck and working method thereof |
| CN116275226A (en) * | 2023-05-16 | 2023-06-23 | 南通中南智能科技有限公司 | Disc milling cutter and quick blade-changing milling machine with same |
| CN116275226B (en) * | 2023-05-16 | 2023-08-15 | 南通中南智能科技有限公司 | Disc milling cutter and quick blade-changing milling machine with same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210120 Address after: 215000 24 Yaonan Road, Hengjing street, Wuzhong District, Suzhou City, Jiangsu Province Patentee after: Suzhou Benji Automation Machinery Co.,Ltd. Address before: 230000 Longgang Jing'an Xincheng North District, Yaohai District, Hefei City, Anhui Province Patentee before: Gu Jun |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201211 Termination date: 20210426 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |