CN212122010U - Floating pressing device for reflow soldering - Google Patents
Floating pressing device for reflow soldering Download PDFInfo
- Publication number
- CN212122010U CN212122010U CN202020878809.5U CN202020878809U CN212122010U CN 212122010 U CN212122010 U CN 212122010U CN 202020878809 U CN202020878809 U CN 202020878809U CN 212122010 U CN212122010 U CN 212122010U
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- fixedly connected
- buffer
- reflow soldering
- probe
- dustcoat
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- 238000005476 soldering Methods 0.000 title claims abstract description 25
- 238000003825 pressing Methods 0.000 title abstract description 19
- 239000000523 sample Substances 0.000 claims abstract description 19
- 238000009434 installation Methods 0.000 claims description 14
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 6
- 230000003139 buffering effect Effects 0.000 description 5
- 238000005299 abrasion Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a reflow soldering is with floating high press device, including dustcoat, backing plate and support, the horizontal fixedly connected with backing plate in top of support, and the top fixedly connected with dustcoat of backing plate, the intermediate position department fixedly connected with pneumatic telescopic link on the inside top of dustcoat, and the horizontal fixedly connected with fly leaf of pneumatic telescopic link's output, the bottom of fly leaf evenly runs through there is buffer structure, and the horizontal fixedly connected with push pedal in buffer structure's bottom, the even vertical fixedly connected with probe in bottom of push pedal, and the equal fixedly connected with mounting structure in bottom of probe, mounting structure's inside all is provided with the pressure head. The utility model discloses a set up buffer structure on the push pedal top, utilize buffer spring can be fine slow down too big pressing force, avoid the pressing force to cause press wear to PCB board, pressure head and probe to extension fixture's life.
Description
Technical Field
The utility model relates to a reflow soldering equipment technical field specifically is reflow soldering is with floating high press device.
Background
Along with the development of society, the electronic manufacturing field of China has obtained rapid development, and in the electronic chip manufacturing process, can use reflow soldering to assist production usually, and width height is pressed and is an important index of deciding reflow soldering performance, but current floating height pressing device for reflow soldering still has many problems or defects:
firstly, the conventional floating pressing device for reflow soldering is not provided with a buffer structure when in use, and the service life of equipment is influenced when the pressing force is too large;
second, traditional reflow soldering is with floating high press device, does not have the pressure head structure of being convenient for to change during the use, and the pressure head of inconvenient quick replacement local damage reduces work efficiency.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a reflow soldering is with floating high press device to the problem of not having the buffering and being not convenient for change the pressure head that proposes in solving above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a reflow soldering is with floating high press device, includes dustcoat, backing plate and support, the horizontal fixedly connected with backing plate in top of support, and the top fixedly connected with dustcoat of backing plate, the intermediate position department fixedly connected with pneumatic telescopic link on the inside top of dustcoat, and pneumatic telescopic link's the horizontal fixedly connected with fly leaf of output, the bottom of fly leaf evenly runs through there is buffer structure, and the horizontal fixedly connected with push pedal in buffer structure's bottom, the even vertical fixedly connected with probe in bottom of push pedal, and the equal fixedly connected with mounting structure in bottom of probe, mounting structure's inside all is provided with the pressure head.
Preferably, the lower extreme of the inside both sides of dustcoat has all been seted up the spout, and the equal sliding connection in inside of spout has the slider, one side of slider all with fly leaf one end fixed connection.
Preferably, the both sides of dustcoat are even vertical to be seted up the radiating groove, and the inside of radiating groove all blocks and is equipped with the filter screen.
Preferably, the shape of the support is L-shaped, and the bottom end of the support is welded with the mounting feet.
Preferably, mounting structure's inside has set gradually fixed case, installation pole, spacing groove, installation spring, stopper and mounting groove, the equal fixed connection of mounting groove is in the bottom of probe, and the fixed case of the equal fixedly connected with in both sides of mounting groove, the installation pole has all been run through to one side of fixed case, and the inside of the fixed case on installation pole surface all twines there is the installation spring, the equal fixedly connected with stopper of one end of installation pole, and the inside both sides upper end of pressure head all seted up with stopper matched with spacing groove.
Preferably, buffer box, buffer spring, buffer board and buffer pole have set gradually in buffer structure's inside, the even fixed connection of buffer box is on the top of push pedal, and the even fixedly connected with buffer spring in bottom of buffer box inside, the equal sliding connection in buffer box on buffer spring top has the buffer board, and the equal vertical fixedly connected with buffer pole of intermediate position department on buffer board top, the top of buffer pole all with fly leaf bottom welding.
Compared with the prior art, the beneficial effects of the utility model are that: this reflow soldering is with floating high press device is rational in infrastructure, has following advantage:
(1) the buffer box, the buffer spring and the buffer rod are arranged at the top end of the push plate, when the pressing force is too large, the buffer rod can descend to drive the buffer plate to move and compress the buffer spring, the too large pressing force can be well slowed down by utilizing the elasticity of the buffer spring, and the pressing abrasion of the pressing force on the PCB, the pressure head and the probe is avoided, so that the quality of the PCB is improved, meanwhile, the service lives of the pressure head and the probe can be prolonged, and the production economy is reduced;
(2) through set up fixed case and mounting groove in the probe bottom, through pulling installation pole for the stopper removes compression installation spring to breaking away from the spacing groove completely, later can take off the pressure head that has damaged and more renew the pressure head, loaded down with trivial details when avoiding traditional bolt fastening, reduces the time of changing, and then accelerates production efficiency, and can avoid damaging because of local pressure head and need changing whole device, and then reduce cost of maintenance, improvement production economy.
Drawings
FIG. 1 is a schematic front view of the present invention;
FIG. 2 is a schematic side sectional view of the present invention;
FIG. 3 is an enlarged schematic view of the mounting structure of the present invention;
fig. 4 is a schematic view of the structure of the buffer structure of the present invention.
In the figure: 1. a pneumatic telescopic rod; 2. a housing; 3. a chute; 4. a slider; 5. a base plate; 6. pushing the plate; 7. a support; 8. mounting a foot; 9. a pressure head; 10. a mounting structure; 1001. a fixed box; 1002. mounting a rod; 1003. a limiting groove; 1004. installing a spring; 1005. a limiting block; 1006. mounting grooves; 11. a probe; 12. a buffer structure; 1201. a buffer tank; 1202. a buffer spring; 1203. a buffer plate; 1204. a buffer rod; 13. a movable plate; 14. a heat sink; 15. and (5) filtering by using a filter screen.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a floating and high-pressure device for reflow soldering comprises an outer cover 2, a base plate 5 and a support 7, wherein the support 7 is L-shaped, and mounting feet 8 are welded at the bottom end of the support 7;
specifically, as shown in fig. 1 and 2, when the mechanism is used, firstly, the mechanical strength of the mechanism is higher through the welded mounting feet 8, the device is easier to fix on a reflow soldering machine, and the fixation is more firm, so that the subsequent operation is convenient;
the top end of the bracket 7 is transversely and fixedly connected with a backing plate 5, and the top end of the backing plate 5 is fixedly connected with an outer cover 2;
radiating grooves 14 are uniformly and vertically formed in the two sides of the outer cover 2, and filter screens 15 are clamped inside the radiating grooves 14;
specifically, as shown in fig. 2, when the mechanism is used, firstly, the heat dissipation groove 14 is arranged, so that heat inside the outer cover 2 can be dissipated conveniently, and the filter screen 15 can prevent impurities such as external dust and the like from entering the inner part of the outer cover 2 to influence the normal operation of the equipment;
the middle position of the top end inside the outer cover 2 is fixedly connected with a pneumatic telescopic rod 1, the type of the pneumatic telescopic rod 1 can be HL-A-8, the pneumatic telescopic rod 1 is electrically connected with a starting switch through a wire, and the output end of the pneumatic telescopic rod 1 is transversely and fixedly connected with a movable plate 13;
the lower ends of two sides in the outer cover 2 are both provided with sliding grooves 3, the sliding blocks 4 are slidably connected in the sliding grooves 3, and one side of each sliding block 4 is fixedly connected with one end of the movable plate 13;
specifically, as shown in fig. 1, when the mechanism is used, firstly, the movable plate 13 is stably descended by utilizing the sliding of the sliding block 4 in the sliding chute 3, so as to facilitate the subsequent operation of the reflow soldering process on the PCB;
the bottom end of the movable plate 13 is uniformly penetrated with a buffer structure 12;
the buffer structure 12 is internally and sequentially provided with a buffer box 1201, a buffer spring 1202, a buffer plate 1203 and a buffer rod 1204, the buffer box 1201 is uniformly and fixedly connected to the top end of the push plate 6, the bottom end of the interior of the buffer box 1201 is uniformly and fixedly connected with the buffer spring 1202, the buffer plate 1203 is slidably connected to the interior of the buffer box 1201 at the top end of the buffer spring 1202, the buffer rod 1204 is vertically and fixedly connected to the middle position of the top end of the buffer plate 1203, and the top end of the buffer rod 1204 is welded to the bottom end of the movable plate 13;
specifically, as shown in fig. 1, 2 and 4, when the mechanism is used, firstly, when the pressing force is too large, the buffer rod 1204 is lowered to drive the buffer plate 1203 to move to compress the buffer spring 1202, and the excessive pressing force can be well relieved by using the elastic force of the buffer spring 1202, so that the pressing abrasion of the pressing force on the PCB, the pressure head 9 and the probe 11 is avoided;
the bottom end of the buffer structure 12 is transversely and fixedly connected with a push plate 6, the bottom end of the push plate 6 is uniformly and vertically and fixedly connected with probes 11, and the bottom ends of the probes 11 are fixedly connected with mounting structures 10;
a fixing box 1001, a mounting rod 1002, a limiting groove 1003, a mounting spring 1004, a limiting block 1005 and a mounting groove 1006 are sequentially arranged in the mounting structure 10, the mounting grooves 1006 are all fixedly connected to the bottom end of the probe 11, the fixing boxes 1001 are fixedly connected to the two sides of the mounting groove 1006, the mounting rod 1002 penetrates through one side of each fixing box 1001, the mounting spring 1004 is wound in each fixing box 1001 on the surface of the mounting rod 1002, the limiting block 1005 is fixedly connected to one end of each mounting rod 1002, and the limiting grooves 1003 matched with the limiting block 1005 are formed in the upper ends of the two sides in the pressure head 9;
specifically, as shown in fig. 1, 2 and 3, when the mechanism is used, firstly, the mounting rod 1002 is pulled, so that the limiting block 1005 moves to compress the mounting spring 1004 until the limiting block is completely separated from the limiting groove 1003, and then the damaged pressure head 9 can be taken down and replaced by a new pressure head 9, so that the replacement time is shortened, and the production efficiency is further improved;
the mounting structures 10 are each provided with a ram 9 on the inside.
The working principle is as follows: when the device is used, the device is firstly fixed on a reflow soldering machine through the mounting foot 8, then a power supply is connected externally, when a PCB moves to a position right below the push plate 6, the pneumatic telescopic rod 1 is controlled to work through a starting switch, the movable plate 13 stably descends by utilizing the sliding of the sliding block 4 in the sliding groove 3, the push plate 6 is driven to descend, the pressure head 9 is enabled to compress the PCB and the reflow soldering process is carried out, and after the operation is finished, the pneumatic telescopic rod 1 works to drive the push plate 6 to ascend, and then the PCB continues to move;
meanwhile, when the reflow soldering process is carried out, when the pressing force is too large, the buffering rod 1204 can be lowered to drive the buffering plate 1203 to move to compress the buffering spring 1202, the excessive pressing force can be well relieved by the aid of the elastic force of the buffering spring 1202, and pressing abrasion of the PCB, the pressure head 9 and the probe 11 caused by the pressing force is avoided;
when a certain pressure head 9 is damaged due to unexpected factors, the mounting rod 1002 can be pulled, the limiting block 1005 moves to compress the mounting spring 1004 until the limiting block 1003 is completely separated, then the damaged pressure head 9 can be taken down and replaced by a new pressure head 9, the replacement time is shortened, and the production efficiency is further accelerated.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a reflow soldering is with floating high press device, includes dustcoat (2), backing plate (5) and support (7), its characterized in that: the utility model discloses a safety protection device for a vehicle, including support (7), the horizontal fixedly connected with backing plate in top (5) of support (7), and the top fixedly connected with dustcoat (2) of backing plate (5), the intermediate position department fixedly connected with pneumatic telescopic link (1) on the inside top of dustcoat (2), and the horizontal fixedly connected with fly leaf (13) of output of pneumatic telescopic link (1), buffer structure (12) have evenly been run through to the bottom of fly leaf (13), and the horizontal fixedly connected with push pedal (6) in bottom of buffer structure (12), the even vertical fixedly connected with probe (11) in bottom of push pedal (6), and the equal fixedly connected with mounting structure (10) in bottom of probe (11), the inside of mounting structure (10) all is provided with pressure head (9).
2. The floating press device for reflow soldering according to claim 1, characterized in that: the lower extreme of the inside both sides of dustcoat (2) has all been seted up spout (3), and the equal sliding connection in inside of spout (3) has slider (4), one side of slider (4) all with fly leaf (13) one end fixed connection.
3. The floating press device for reflow soldering according to claim 1, characterized in that: the heat dissipation device is characterized in that heat dissipation grooves (14) are uniformly and vertically formed in two sides of the outer cover (2), and filter screens (15) are clamped inside the heat dissipation grooves (14).
4. The floating press device for reflow soldering according to claim 1, characterized in that: the support (7) is L-shaped, and the bottom end of the support (7) is welded with mounting feet (8).
5. The floating press device for reflow soldering according to claim 1, characterized in that: the utility model discloses a probe mounting structure, including mounting structure (10), the inside of mounting structure (10) has set gradually fixed case (1001), installation pole (1002), spacing groove (1003), installation spring (1004), stopper (1005) and mounting groove (1006), the equal fixed connection in the bottom of probe (11) of mounting groove (1006), and the equal fixed case (1001) of fixedly connected with in both sides of mounting groove (1006), installation pole (1002) have all been run through to one side of fixed case (1001), and the inside of the fixed case (1001) on installation pole (1002) surface all twines installation spring (1004), the equal fixedly connected with stopper (1005) of one end of installation pole (1002), and pressure head (9) inside both sides upper end all seted up with stopper (1005) matched with spacing groove (1003).
6. The floating press device for reflow soldering according to claim 1, characterized in that: buffer structure (12) inside has set gradually surge-box (1201), buffer spring (1202), buffer board (1203) and buffer beam (1204), the even fixed connection of surge-box (1201) is on the top of push pedal (6), and the even fixedly connected with buffer spring (1202) in the inside bottom of surge-box (1201), the inside equal sliding connection of buffer board (1203) of buffer box (1201) on buffer spring (1202) top, and the equal vertical fixedly connected with buffer beam (1204) of intermediate position department on buffer board (1203) top, the top of buffer beam (1204) all with fly leaf (13) bottom welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020878809.5U CN212122010U (en) | 2020-05-22 | 2020-05-22 | Floating pressing device for reflow soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020878809.5U CN212122010U (en) | 2020-05-22 | 2020-05-22 | Floating pressing device for reflow soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212122010U true CN212122010U (en) | 2020-12-11 |
Family
ID=73669054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020878809.5U Active CN212122010U (en) | 2020-05-22 | 2020-05-22 | Floating pressing device for reflow soldering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212122010U (en) |
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2020
- 2020-05-22 CN CN202020878809.5U patent/CN212122010U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Floating height pressing device for reflow soldering Effective date of registration: 20231213 Granted publication date: 20201211 Pledgee: Hengqin Guangdong Macao Deep Cooperation Zone Branch of Guangdong Shunde Rural Commercial Bank Co.,Ltd. Pledgor: ZHUHAI YUNTAILI ELECTRONIC CO.,LTD. Registration number: Y2023980071142 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |