CN212113644U - Processing device for semiconductor device packaging - Google Patents
Processing device for semiconductor device packaging Download PDFInfo
- Publication number
- CN212113644U CN212113644U CN202021012785.1U CN202021012785U CN212113644U CN 212113644 U CN212113644 U CN 212113644U CN 202021012785 U CN202021012785 U CN 202021012785U CN 212113644 U CN212113644 U CN 212113644U
- Authority
- CN
- China
- Prior art keywords
- substrate
- cover
- cover plate
- plate frame
- placing area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
The utility model discloses a processing device for packaging a semiconductor device, which comprises a body and a cover body, wherein the upper surface of the body is provided with a placing area, a substrate component is placed in the placing area, the substrate component comprises a support plate, a cover plate frame and a substrate, the cover plate frame is arranged above the substrate, and the lower surface of the cover plate frame is in contact connection with the upper surface at the edge of the substrate; the lower surface of the cover body is provided with a plurality of magnets, and when the cover body is placed on the body with the substrate assembly, the magnets can be connected with the cover plate frame in an adsorption manner; the placing area is a groove which is arranged on the upper surface of the body and is used for embedding the substrate assembly, one end of the groove is provided with a barrier strip, the other end of the groove is provided with a feed inlet, and the substrate assembly can slide into or leave the placing area from the feed inlet. The utility model discloses can relax, shift the base plate from the support plate fast, improve machining efficiency and product stability, still avoid leading to the apron to crush the condition of the chip on the base plate because of the skew of base plate subassembly.
Description
Technical Field
The utility model relates to a processingequipment is used in semiconductor device encapsulation belongs to semiconductor packaging technology field.
Background
At present, electronic products are made smaller and thinner, the packaging thickness of electronic components is required to be thinner and thinner, and the thinning of the products can be mainly realized by reducing the height of a wire arc, reducing the thickness of a chip, reducing the thickness of a substrate, replacing the packaging mode and the like.
The thickness of the substrate has a large variation space, the thickness of the substrate commonly used by people is larger than 0.15mm, the substrate can directly run in the rails of die bond and wire bond equipment, but the substrate is warped in the process and has the risk of material blocking and the like. The substrate becomes thinner and then warps, and particularly the warped substrate after heating becomes more severe, and the warped substrate is likely to cause problems such as material jamming and incomplete vacuum adsorption when traveling in the equipment track.
The thin substrate generally adopts the support plate to support the substrate to run in the track, and simultaneously presses the pressing strip to press the edge of the substrate, but during molding, the support plate cannot directly enter the molding equipment, and when the pressing strip is manually taken, the pressing strip shakes and touches the substrate, so that a gold thread collapses.
Disclosure of Invention
The utility model aims at providing a processingequipment is used in semiconductor device encapsulation, this processingequipment is used in semiconductor device encapsulation can relax, shift the base plate from the support plate fast, have improved machining efficiency and product stability, have still avoided leading to the apron to crush the condition of the chip on the base plate because of the skew of base plate subassembly.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a processing device for packaging a semiconductor device comprises a body and a cover body arranged above the body, wherein the upper surface of the body is provided with a placing area arranged opposite to the lower surface of the cover body, a substrate assembly is placed in the placing area, the substrate assembly comprises a support plate, a cover plate frame and a substrate positioned on the upper surface of the support plate, the cover plate frame is arranged above the substrate, and the lower surface of the cover plate frame is in contact connection with the upper surface at the edge of the substrate;
the lower surface of the cover body is provided with a plurality of magnets corresponding to the cover plate frame, and when the cover body is placed on the body with the substrate assembly, the magnets can be connected with the cover plate frame in an adsorption manner; the placing area is a groove which is arranged on the upper surface of the body and is used for embedding the substrate assembly, one end of the groove is provided with a barrier strip, the other end of the groove is provided with a feed inlet, and the substrate assembly can slide into or leave the placing area from the feed inlet.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the support plate has magnetism all around, the material of apron frame is iron, the support plate passes through magnetic attraction and adsorbs the apron frame.
2. In the above scheme, the magnet is a magnet.
3. In the above scheme, one side edge of the cover body is connected with one side of the body, so that the cover body can be connected to the body in an openable manner.
4. In the scheme, two sides of the placing area are respectively provided with a pressing strip, one side of each pressing strip is embedded into the groove in the upper surface of the body, and the other side of each pressing strip extends into the upper part of the placing area.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
the utility model discloses semiconductor device encapsulates and uses processingequipment, it makes the apron frame separate with base plate and support plate through the mode of magnetic adsorption through setting up the magnet at the lid lower surface, both can easily, fast shift the base plate from the support plate, and effectively reduced and touched the base plate and caused the risk that the large tracts of land gold thread collapses down when getting the apron frame manually again, improved machining efficiency and product stability; in addition, the groove is arranged to form a track, the position of the substrate in the placement area is limited, the position precision of the substrate in the placement area is improved, the problem that the substrate frame cannot be effectively adsorbed due to the fact that the substrate assembly is shifted is solved, the working efficiency is improved, and the situation that the cover plate crushes chips on the substrate due to the fact that the substrate assembly is shifted is also avoided.
Drawings
FIG. 1 is a schematic structural view of a semiconductor device packaging processing apparatus according to the present invention;
FIG. 2 is a schematic structural view of the cover of the present invention;
fig. 3 is a schematic structural diagram of the substrate assembly of the present invention.
In the above drawings: 1. a body; 11. a groove; 112. blocking strips; 113. a feed inlet; 101. a placement area; 102. layering; 2. a cover body; 3. a magnet; 5. a substrate assembly; 51. a carrier plate; 52. a cover plate frame; 53. a substrate.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
Example 1: a processing device for packaging a semiconductor device comprises a body 1 and a cover body 2 arranged above the body 1, wherein the upper surface of the body 1 is provided with a placing area 101 which is arranged opposite to the lower surface of the cover body 2, a substrate assembly 5 is placed in the placing area 101, the substrate assembly 5 comprises a carrier plate 51, a cover plate frame 52 and a substrate 53 which is positioned on the upper surface of the carrier plate 51, the cover plate frame 52 is arranged above the substrate 53, and the lower surface of the cover plate frame 52 is in contact connection with the upper surface at the edge of the substrate 53;
the lower surface of the cover body 2 is provided with a plurality of magnets 3 corresponding to the cover plate frame 52, and when the cover body 2 is placed on the body 1 with the substrate assembly, the magnets 3 can be connected with the cover plate frame 52 in an adsorption manner; the placing area 101 is a groove 11 which is arranged on the upper surface of the body 1 and is used for embedding the substrate assembly, one end of the groove 11 is provided with a barrier strip 112, the other end of the groove is provided with a feeding hole 113, and the substrate assembly can slide into or leave the placing area 101 from the feeding hole 113.
The periphery of the carrier plate 51 is magnetic, the cover plate frame 52 is made of iron, and the carrier plate 51 adsorbs the cover plate frame 52 through magnetic attraction; the magnet 3 is a magnet; one side edge of the cover 2 is connected to one side of the main body 1, so that the cover 2 can be connected to the main body 1 in an openable manner.
Example 2: a processing device for packaging a semiconductor device comprises a body 1 and a cover body 2 arranged above the body 1, wherein the upper surface of the body 1 is provided with a placing area 101 which is arranged opposite to the lower surface of the cover body 2, a substrate assembly 5 is placed in the placing area 101, the substrate assembly 5 comprises a carrier plate 51, a cover plate frame 52 and a substrate 53 which is positioned on the upper surface of the carrier plate 51, the cover plate frame 52 is arranged above the substrate 53, and the lower surface of the cover plate frame 52 is in contact connection with the upper surface at the edge of the substrate 53;
the lower surface of the cover body 2 is provided with a plurality of magnets 3 corresponding to the cover plate frame 52, and when the cover body 2 is placed on the body 1 with the substrate assembly, the magnets 3 can be connected with the cover plate frame 52 in an adsorption manner; the placing area 101 is a groove 11 which is arranged on the upper surface of the body 1 and is used for embedding the substrate assembly, one end of the groove 11 is provided with a barrier strip 112, the other end of the groove is provided with a feeding hole 113, and the substrate assembly can slide into or leave the placing area 101 from the feeding hole 113.
Chamfers are arranged on two sides of the feed port 113, so that the thin substrate can conveniently enter the track; the barrier strip 112 and the groove 11 are integrally formed; two sides of the placing area 101 are respectively provided with a pressing strip 102, one side of the pressing strip 102 is embedded into the groove 11 on the upper surface of the body 1, and the other side of the pressing strip 102 extends into the upper part of the placing area 101.
When the processing device for packaging the semiconductor device is adopted, the magnet is arranged on the lower surface of the cover body, so that the cover plate frame is separated from the substrate and the support plate in a magnetic adsorption mode, the substrate can be easily and quickly transferred from the support plate, the risk of large-area gold wire collapse caused by the fact that the cover plate frame is touched by the substrate when being manually taken is effectively reduced, and the processing efficiency and the product stability are improved; in addition, the groove is arranged to form a track, the position of the substrate in the placement area is limited, the position precision of the substrate in the placement area is improved, the problem that the substrate frame cannot be effectively adsorbed due to the fact that the substrate assembly is shifted is solved, the working efficiency is improved, and the situation that the cover plate crushes chips on the substrate due to the fact that the substrate assembly is shifted is also avoided.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (5)
1. A processing device for semiconductor device packaging is characterized in that: the packaging box comprises a body (1) and a cover body (2) arranged above the body (1), wherein the upper surface of the body (1) is provided with a placing area (101) which is arranged opposite to the lower surface of the cover body (2), a substrate assembly (5) is placed in the placing area (101), the substrate assembly (5) comprises a support plate (51), a cover plate frame (52) and a substrate (53) positioned on the upper surface of the support plate (51), the cover plate frame (52) is arranged above the substrate (53), and the lower surface of the cover plate frame (52) is in contact connection with the upper surface at the edge of the substrate (53);
the lower surface of the cover body (2) is provided with a plurality of magnets (3) corresponding to the cover plate frame (52), and when the cover body (2) is placed on the body (1) with the base plate assembly, the magnets (3) can be connected with the cover plate frame (52) in an adsorption manner; place district (101) for offering in body (1) upper surface, supplying recess (11) of base plate subassembly embedding, the one end of this recess (11) is provided with blend stop (112), and the other end is feed inlet (113), base plate subassembly can slide from feed inlet (113) and get into or leave and place district (101).
2. The processing apparatus for packaging a semiconductor device according to claim 1, wherein: the periphery of the carrier plate (51) is provided with magnetism, the cover plate frame (52) is made of iron, and the carrier plate (51) adsorbs the cover plate frame (52) through magnetic attraction.
3. The processing apparatus for packaging a semiconductor device according to claim 1, wherein: the magnet (3) is a magnet.
4. The processing apparatus for packaging a semiconductor device according to claim 1, wherein: one side edge of the cover body (2) is connected with one side of the body (1), so that the cover body (2) can be connected to the body (1) in an opening and closing manner.
5. The processing apparatus for packaging a semiconductor device according to claim 1, wherein: two sides of the placing area (101) are respectively provided with a pressing strip (102), one side of the pressing strip (102) is embedded into the groove (11) on the upper surface of the body (1), and the other side of the pressing strip (102) extends into the upper part of the placing area (101).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021012785.1U CN212113644U (en) | 2020-06-05 | 2020-06-05 | Processing device for semiconductor device packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021012785.1U CN212113644U (en) | 2020-06-05 | 2020-06-05 | Processing device for semiconductor device packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212113644U true CN212113644U (en) | 2020-12-08 |
Family
ID=73615374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021012785.1U Active CN212113644U (en) | 2020-06-05 | 2020-06-05 | Processing device for semiconductor device packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212113644U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115106671A (en) * | 2022-08-22 | 2022-09-27 | 度亘激光技术（苏州）有限公司 | Packaging method and packaging clamp |
-
2020
- 2020-06-05 CN CN202021012785.1U patent/CN212113644U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115106671A (en) * | 2022-08-22 | 2022-09-27 | 度亘激光技术（苏州）有限公司 | Packaging method and packaging clamp |
| CN115106671B (en) * | 2022-08-22 | 2022-11-25 | 度亘激光技术（苏州）有限公司 | Packaging method and packaging clamp |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN212113644U (en) | Processing device for semiconductor device packaging | |
| CN109904096A (en) | A kind of semiconductor load all-in-one machine | |
| CN209266371U (en) | A kind of semiconductor load all-in-one machine | |
| WO2007108228A1 (en) | Resin sealing/molding apparatus | |
| KR20180028905A (en) | Electronic circuit device and method of manufacturing electronic circuit device | |
| CN213054432U (en) | Processing device for micro diode packaging | |
| CN212113645U (en) | Auxiliary device for taking materials for thin substrate packaging | |
| CN212084959U (en) | Processing device for electronic device | |
| CN110718492B (en) | Tray body collection module and method thereof | |
| CN210575949U (en) | Vertical stacking structure of large chip | |
| CN212978020U (en) | High-precision processing device for semiconductor integrated device | |
| US20030038363A1 (en) | Semiconductor device and apparatus for manufacturing same | |
| CN212113648U (en) | High-efficiency processing jig for integrated circuit chip | |
| CN208157362U (en) | A kind of full-automatic load press welder | |
| CN208336207U (en) | A kind of biradical island lead frame frame and its SOT33-5L packaging part | |
| CN212113646U (en) | Processing device for integrated circuit chip | |
| CN102651360A (en) | Packaging body structure capable of realizing copper wire keyed joint and manufacturing method thereof | |
| CN113764303A (en) | High-precision processing device for semiconductor integrated device | |
| KR20110042973A (en) | Device for providing bag automatically and method for providing bag bag using the same | |
| CN212113647U (en) | Packaging device for semiconductor device | |
| CN213140544U (en) | Self-adsorption glue box suction nozzle material taking device | |
| CN107505564B (en) | Chip testing-pin-tilting prevention bag filling device and operation method thereof | |
| CN111627890A (en) | IC electromagnetic shielding layer grounding structure and processing technique thereof | |
| CN107611052B (en) | Chip testing and braid adjusting device and operation method thereof | |
| JP2008194904A (en) | Resin sealing apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |