CN212080886U

CN212080886U - SMD power type ultrathin LED device convenient to package

Info

Publication number: CN212080886U
Application number: CN202020591239.1U
Authority: CN
Inventors: 董哲康; 董学文; 陈江明; 董月圆
Original assignee: Changxing Kedi Led Co ltd
Current assignee: Changxing Kedi Led Co ltd
Priority date: 2020-04-20
Filing date: 2020-04-20
Publication date: 2020-12-04
Anticipated expiration: 2030-04-20

Abstract

The utility model discloses a SMD power type ultra-thin LED device convenient to encapsulation, including the silicon substrate, the upper end surface of silicon substrate is provided with LED bulb, cardboard, fixed orifices and portable positioning mechanism, portable positioning mechanism is located the outside of LED bulb, the fixed orifices is located portable positioning mechanism's inboard, the cardboard is located portable positioning mechanism's front end, the front end surface of silicon substrate is provided with flexible semicircle board, rotary fixing mechanism and fixed fixture block No. one, rotary fixing mechanism is located the outside of flexible semicircle board No. one, fixed fixture block is located rotary fixing mechanism's lower extreme. A SMD power type ultra-thin LED device convenient to encapsulation, be equipped with rotatory fixed establishment and portable positioning mechanism, can improve the convenience of removing the LED device, can also improve the fixity ability of LED device, the simple operation, convenient to use, the practicality is strong, brings better use prospect.

Description

SMD power type ultrathin LED device convenient to package

Technical Field

The utility model relates to a LED field, in particular to SMD power type ultra-thin LED device convenient to encapsulation.

Background

The LED device is a support equipment that carries out subassembly LED, and in order to satisfy the demand that people worked, people operated the LED device and used, improved people's work efficiency, along with the continuous development of science and technology, people also are higher and higher to the manufacturing process requirement of LED device.

The existing LED device has certain disadvantages in use, firstly, when the LED device is moved, the operation is inconvenient, the use of people is not facilitated, and in addition, when the LED device is fixed, the operation is inconvenient, the fixing performance is poor, certain adverse effects are brought to the use process of people, so that the paster type power ultrathin LED device convenient to package is provided.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a to prior art not enough, the utility model provides a SMD power type ultra-thin LED device convenient to encapsulation possesses the simple operation, and convenient to use and practicality advantage such as strong can effectively solve the problem in the background art.

(II) technical scheme

In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a SMD power type ultra-thin LED device convenient to encapsulation, includes the silicon substrate, the upper end surface of silicon substrate is provided with LED bulb, cardboard, fixed orifices and portable positioning mechanism, portable positioning mechanism is located the outside of LED bulb, the fixed orifices is located portable positioning mechanism's inboard, the cardboard is located portable positioning mechanism's front end, the front end surface of silicon substrate is provided with flexible semicircle board, rotary fixing mechanism and fixed fixture block No. one, rotary fixing mechanism is located the outside of flexible semicircle board No. one, fixed fixture block is located rotary fixing mechanism's lower extreme, the internal surface of flexible semicircle board is provided with flexible post No. two, the inner wall of flexible post No. two is provided with the spring No. two, the lower extreme surface of flexible post No. two is provided with fixed semicircle board.

Preferably, rotatory fixed establishment includes hollow holding rod, telescopic link, No. two flexible semicircle boards, a fixed column, a rotatory hole, a spring and a flexible post, the telescopic link is located the internal surface of hollow holding rod, No. two flexible semicircle boards all are located one side surface of hollow holding rod with a rotatory hole, and a rotatory hole is located the lower extreme of No. two flexible semicircle boards, a fixed column is located the surface of a rotatory hole, a spring all is located the internal surface of No. two flexible semicircle boards with a flexible post, and a spring is located the inner wall of a flexible post.

Preferably, a welding block is arranged between the second telescopic semicircular plate and the first spring, the inner surface of the second telescopic semicircular plate is fixedly connected with the outer surface of the upper end of the first spring through the welding block, and the telescopic rod is movably connected with the first fixing column.

Preferably, the movable positioning mechanism comprises a second fixing column, a connecting plate, a fixing cylinder, magnetic powder, a third fixing column, a baffle and a second rotating hole, the connecting plate is located on the outer wall of the second fixing column, the second rotating hole is located on the outer surface of the upper end of the connecting plate, the fixing cylinder is located on the outer surface of one end of the connecting plate, the magnetic powder is located on the inner wall of the fixing cylinder, the third fixing column is located on the outer wall of the fixing cylinder, and the baffle is located on the outer wall of the third fixing column.

Preferably, be equipped with the viscose between fixed drum and the magnetic, the inner wall of fixed drum passes through the fixed surface connection of viscose and magnetic, be equipped with No. two welding blocks between fixed drum and No. three fixed columns, the outer wall of fixed drum passes through the one end fixed surface connection of No. two welding blocks and No. three fixed columns.

Preferably, be equipped with No. three welding blocks between silicon substrate and the rotatory fixed establishment, the front end surface of silicon substrate is connected through No. three welding blocks and the one end external surface fixed connection of rotatory fixed establishment, be equipped with No. four welding blocks between silicon substrate and the portable positioning mechanism, the upper end surface of silicon substrate is connected through No. four welding blocks and portable positioning mechanism's lower extreme external surface fixed.

(III) advantageous effects

Compared with the prior art, the utility model provides a SMD power type ultra-thin LED device convenient to encapsulation possesses following beneficial effect:

1. this ultra-thin LED device of SMD power type convenient to encapsulation, rotatory fixed establishment through the setting, the convenience that the LED device removed has been improved, carry out fixed connection with a fixed column and silicon substrate, when using this mechanism, hold the hollow holding rod that sets up, upwards rotate the hollow holding rod, the telescopic link that sets up can be blocked with the telescopic link of setting to the flexible semicircle board of a setting, then upwards extract the telescopic link, make the telescopic link extension complete, people just can hold the hollow holding rod and come the LED device to remove or simply fix, prevent to take place the static phenomenon with the hand touching, influence the normal use of LED device, when not using the LED device, the shrink telescopic link, make the hollow holding rod fix the upper end at fixed fixture block, improve people's availability factor, high durability and convenient operation, high durability and convenient use.

2. This ultra-thin LED device of SMD power type convenient to encapsulation, but through the mobile positioning mechanism who sets up, the fixed performance of LED device has been improved, No. two fixed columns that will set up carry out fixed connection with the silicon substrate, then the connecting plate that rotates the setting, the baffle that makes the setting blocks with the cardboard, the stability can of this mechanism has been improved, then put into the fixed drum of setting with the fixed screw, because fixed drum inner wall has set up the magnetic that sets up, can prevent that the fixed screw from droing, thereby influence people's use, people's fixed performance has been improved, whole LED device simple structure, high durability and convenient operation, the effect of use is better for traditional mode.

Drawings

Fig. 1 is the utility model relates to a SMD power type ultra-thin LED device's overall structure schematic diagram convenient to encapsulation.

Fig. 2 is the utility model relates to a local part's schematic structure view among SMD power type ultra-thin LED device convenient to encapsulation.

Fig. 3 is the utility model relates to a rotatory fixed establishment's among SMD power type ultra-thin LED device structural schematic convenient to encapsulation.

Fig. 4 is the utility model relates to a rotatory fixed establishment's local part structural schematic in SMD power type ultra-thin LED device convenient to encapsulation.

Fig. 5 is the utility model relates to a portable positioning mechanism's among SMD power type ultra-thin LED device structural schematic convenient to encapsulation.

In the figure: 1. a silicon substrate; 2. an LED bulb; 3. a first telescopic semicircular plate; 4. a rotation fixing mechanism; 401. a hollow holding rod; 402. a telescopic rod; 403. a second telescopic semicircular plate; 404. a first fixing column; 405. a first rotary hole; 406. a first spring; 407. a first telescopic column; 5. fixing the fixture block; 6. clamping a plate; 7. a fixing hole; 8. a movable positioning mechanism; 801. a second fixing column; 802. a connecting plate; 803. a fixed cylinder; 804. magnetic powder; 805. a third fixing column; 806. a baffle plate; 807. a second rotary hole; 9. fixing the semicircular plate; 10. a second spring; 11. a second telescopic column.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

As shown in fig. 1-5, a chip type power ultra-thin LED device convenient for packaging comprises a silicon substrate 1, an LED bulb 2, a clamping plate 6, a fixing hole 7 and a movable positioning mechanism 8 are arranged on the outer surface of the upper end of the silicon substrate 1, but mobile positioning mechanism 8 is located the outside of LED bulb 2, fixed orifices 7 is located the inboard of mobile positioning mechanism 8, cardboard 6 is located the front end of mobile positioning mechanism 8, silicon substrate 1's front end surface is provided with flexible semicircle board 3 No. one, rotary fixing mechanism 4 and fixed fixture block 5, rotary fixing mechanism 4 is located the outside of flexible semicircle board 3 No. one, fixed fixture block 5 is located rotary fixing mechanism 4's lower extreme, the internal surface of flexible semicircle board 3 is provided with flexible post 11 No. two, the inner wall of flexible post 11 No. two is provided with spring 10 No. two, the lower extreme surface of flexible post 11 No. two is provided with fixed semicircle board 9.

Further, the rotary fixing mechanism 4 comprises a hollow holding rod 401, an expansion rod 402, two telescopic semicircular plates 403, one fixed column 404, one rotary hole 405, one spring 406 and one telescopic column 407, the expansion rod 402 is located on the inner surface of the hollow holding rod 401, two telescopic semicircular plates 403 and one rotary hole 405 are located on the outer surface of one side of the hollow holding rod 401, the one rotary hole 405 is located at the lower end of the two telescopic semicircular plates 403, the one fixed column 404 is located on the outer surface of the one rotary hole 405, the one spring 406 and the one telescopic column 407 are located on the inner surface of the two telescopic semicircular plates 403, the one spring 406 is located on the inner wall of the one telescopic column 407, and convenience in moving the LED device is improved.

Furthermore, a first welding block is arranged between the second telescopic semicircular plate 403 and the first spring 406, the inner surface of the second telescopic semicircular plate 403 is fixedly connected with the outer surface of the upper end of the first spring 406 through the first welding block, and the telescopic rod 402 is movably connected with the first fixing column 404, so that the fixing performance is improved.

Further, the movable positioning mechanism 8 comprises a second fixing column 801, a connecting plate 802, a fixing cylinder 803, magnetic powder 804, a third fixing column 805, a baffle 806 and a second rotating hole 807, the connecting plate 802 is located on the outer wall of the second fixing column 801, the second rotating hole 807 is located on the outer surface of the upper end of the connecting plate 802, the fixing cylinder 803 is located on the outer surface of one end of the connecting plate 802, the magnetic powder 804 is located on the inner wall of the fixing cylinder 803, the third fixing column 805 is located on the outer wall of the fixing cylinder 803, and the baffle 806 is located on the outer wall of the third fixing column 805, so that the work efficiency of.

Furthermore, an adhesive is arranged between the fixed cylinder 803 and the magnetic powder 804, the inner wall of the fixed cylinder 803 is fixedly connected with the outer surface of the magnetic powder 804 through the adhesive, a second welding block is arranged between the fixed cylinder 803 and the third fixing column 805, and the outer wall of the fixed cylinder 803 is fixedly connected with the outer surface of one end of the third fixing column 805 through the second welding block, so that the magnetic powder fixing device is convenient for people to operate and use.

Further, be equipped with No. three welding blocks between silicon substrate 1 and the rotatory fixed establishment 4, the front end surface of silicon substrate 1 is connected through No. three welding blocks and the one end external surface fixed connection of rotatory fixed establishment 4, is equipped with No. four welding blocks between silicon substrate 1 and the portable positioning mechanism 8, and the upper end surface of silicon substrate 1 is connected through No. four welding blocks and the lower extreme external surface fixed connection of portable positioning mechanism 8, and the practicality is strong.

The working principle is as follows: the utility model discloses a by silicon substrate 1, LED bulb 2, a flexible semicircle board 3, rotatory fixed establishment 4, hollow holding rod 401, telescopic link 402, No. two flexible semicircle boards 403, No. one fixed column 404, No. one rotatory hole 405, No. one spring 406, No. one flexible post 407, fixed fixture block 5, cardboard 6, fixed hole 7, movable positioning mechanism 8, No. two fixed columns 801, connecting plate 802, fixed cylinder 803, magnetic powder 804, No. three fixed columns 805, baffle 806, No. two rotatory holes 807, fixed semicircle board 9, No. two spring 10 and No. two flexible posts 11 constitute, firstly, through the rotatory fixed establishment 4 that sets up, the convenience that the LED device moved has been improved, go on fixed connection with silicon substrate 1 for No. one fixed column 404, when using this mechanism, hold hollow holding rod 401 that sets up, rotate hollow holding rod 401 upwards, telescopic link 402 that a flexible semicircle board 3 that sets up can block the setting up telescopic link, then the telescopic rod 402 is extracted upwards to enable the telescopic rod 402 to extend completely, people can hold the hollow holding rod 401 to move or simply fix the LED device, the phenomenon of static electricity caused by touching with hands is prevented, the normal use of the LED device is influenced, when the LED device is not used, the telescopic rod 402 is contracted, the hollow holding rod 401 is fixed at the upper end of the fixed clamping block 5, the use efficiency of people is improved, the operation is convenient, the use is convenient, the practicability is strong, secondly, the fixing performance of the LED device is improved through the arranged movable positioning mechanism 8, the arranged second fixing column 801 is fixedly connected with the silicon substrate 1, then the arranged connecting plate 802 is rotated, the arranged baffle 806 is clamped with the clamping plate 6, the stability of the mechanism is improved, then the fixing screw is placed into the arranged fixed cylinder 803, and due to the arranged magnetic powder 804 on the inner wall of the fixed cylinder 803, the LED fixing device has the advantages that the fixing screws can be prevented from falling off, so that the use of people is influenced, the fixing performance of people is improved, the whole LED device is simple in structure and convenient to operate, and the using effect is better than that of the traditional mode.

It is noted that, herein, relational terms such as first and second (a, b, etc.) and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a SMD power type ultra-thin LED device convenient to encapsulation, includes silicon substrate (1), its characterized in that: the LED lamp bulb fixing structure is characterized in that an LED bulb (2), a clamping plate (6), a fixing hole (7) and a movable positioning mechanism (8) are arranged on the outer surface of the upper end of the silicon substrate (1), the movable positioning mechanism (8) is located on the outer side of the LED bulb (2), the fixing hole (7) is located on the inner side of the movable positioning mechanism (8), the clamping plate (6) is located at the front end of the movable positioning mechanism (8), a first telescopic semicircular plate (3), a rotary fixing mechanism (4) and a fixing clamping block (5) are arranged on the outer surface of the front end of the silicon substrate (1), the rotary fixing mechanism (4) is located on the outer side of the first telescopic semicircular plate (3), the fixing clamping block (5) is located at the lower end of the rotary fixing mechanism (4), a second telescopic column (11) is arranged on the inner surface of the first telescopic semicircular plate (3), and a second spring (10) is arranged on the inner, and a fixed semicircular plate (9) is arranged on the outer surface of the lower end of the second telescopic column (11).

2. The chip type power ultra-thin LED device convenient for packaging according to claim 1, wherein: rotatory fixed establishment (4) include hollow holding rod (401), telescopic link (402), No. two flexible semicircle boards (403), fixed column (404), rotatory hole (405), spring (406) and flexible post (407), telescopic link (402) are located the internal surface of hollow holding rod (401), No. two flexible semicircle boards (403) and a rotatory hole (405) all are located one side surface of hollow holding rod (401), and a rotatory hole (405) is located the lower extreme of No. two flexible semicircle boards (403), fixed column (404) are located the surface of a rotatory hole (405), spring (406) and flexible post (407) all are located the internal surface of No. two flexible semicircle boards (403), and spring (406) are located the inner wall of flexible post (407).

3. The chip type power ultra-thin LED device convenient for packaging according to claim 2, wherein: a welding block is arranged between the second telescopic semicircular plate (403) and the first spring (406), the inner surface of the second telescopic semicircular plate (403) is fixedly connected with the outer surface of the upper end of the first spring (406) through the welding block, and the telescopic rod (402) is movably connected with the first fixing column (404).

4. The chip type power ultra-thin LED device convenient for packaging according to claim 1, wherein: the movable positioning mechanism (8) comprises a second fixing column (801), a connecting plate (802), a fixing cylinder (803), magnetic powder (804), a third fixing column (805), a baffle plate (806) and a second rotating hole (807), wherein the connecting plate (802) is located on the outer wall of the second fixing column (801), the second rotating hole (807) is located on the outer surface of the upper end of the connecting plate (802), the fixing cylinder (803) is located on the outer surface of one end of the connecting plate (802), the magnetic powder (804) is located on the inner wall of the fixing cylinder (803), the third fixing column (805) is located on the outer wall of the fixing cylinder (803), and the baffle plate (806) is located on the outer wall of the third fixing column (805).

5. The SMD power type ultrathin LED device convenient for packaging according to claim 4, characterized in that: the magnetic powder fixing device is characterized in that an adhesive is arranged between the fixed cylinder (803) and the magnetic powder (804), the inner wall of the fixed cylinder (803) is fixedly connected with the outer surface of the magnetic powder (804) through the adhesive, a second welding block is arranged between the fixed cylinder (803) and the third fixed column (805), and the outer wall of the fixed cylinder (803) is fixedly connected with the outer surface of one end of the third fixed column (805) through the second welding block.

6. The chip type power ultra-thin LED device convenient for packaging according to claim 1, wherein: be equipped with No. three welding blocks between silicon substrate (1) and rotary fixing mechanism (4), the front end surface of silicon substrate (1) is through the one end external fixed surface of No. three welding blocks and rotary fixing mechanism (4) and is connected, be equipped with No. four welding blocks between silicon substrate (1) and movable positioning mechanism (8), the upper end surface of silicon substrate (1) is through the lower extreme external fixed surface of No. four welding blocks and movable positioning mechanism (8) and is connected.