CN212072603U

CN212072603U - Insert applied to semiconductor plastic package mold and plastic package mold

Info

Publication number: CN212072603U
Application number: CN202020706052.1U
Authority: CN
Inventors: 张党军
Original assignee: Shenzhen Hualong Exactitude Mould Co ltd
Current assignee: Shenzhen Hualong Exactitude Mould Co ltd
Priority date: 2020-04-30
Filing date: 2020-04-30
Publication date: 2020-12-04
Anticipated expiration: 2030-04-30

Abstract

The utility model discloses an insert block applied to a semiconductor plastic package mold, which comprises a working end, a connecting end and a fixed end; a groove is formed in the working end, one end of the connecting end is movably connected with the groove, and the other end of the connecting end is connected with the fixed end; the material of the working end is hard alloy, and the material of the connecting end and the fixing end is common steel; simultaneously the utility model discloses a be applied to semiconductor plastic envelope mould. The utility model relates to a be applied to insert of semiconductor plastic envelope mould and plastic envelope mould has solved the problem that reduces manufacturing cost of inserting.

Description

Insert applied to semiconductor plastic package mold and plastic package mold

Technical Field

The utility model relates to a plastic package mould technical field particularly, especially relates to a be applied to insert and plastic package mould of semiconductor plastic package mould.

Background

In the plastic package operation, most of the semiconductor packages in the prior art are made of high-thermal-conductivity epoxy resin, the particle shape of the epoxy resin is hexahedral sheet, and the hexahedral epoxy resin is quite serious for the scouring wear of a plastic package mold, so that after an insert block in the plastic package mold is worn, more epoxy resin plastic package materials are used, the cost is correspondingly increased, and if the using amount of the epoxy resin plastic package materials is not increased, the product has fatal defects; meanwhile, after the insert is worn, the runner waste of the plastic package material is easily adhered to the working surface of the insert end, so that the next production operation is affected, and unpredictable product risks are caused, so that the worn insert needs to be replaced in time. Therefore, in view of the defects of the above-mentioned solutions in actual manufacturing and implementation and use, the present invention provides an insert and a mold for a semiconductor mold assembly, which are modified and improved, and are created with the help of professional knowledge and experience, and after various ingenuity and experiments, based on the spirit and concept of the solution, so as to reduce the manufacturing cost of the insert.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a be applied to semiconductor plastic packaging mould insert and plastic packaging mould to reduce the wearing and tearing that insert and manufacturing cost's problem.

The utility model relates to a be applied to insert of semiconductor plastic envelope mould and plastic envelope mould can realize through following technical scheme:

the utility model relates to an insert block applied to a semiconductor plastic package mold, which comprises a working end, a connecting end and a fixed end; a groove is formed in the working end, one end of the connecting end is movably connected with the groove, and the other end of the connecting end is connected with the fixed end; the material of work end is carbide, the link with the material of stiff end is ordinary steel.

Preferably, the working surface of the working end is a matte surface.

Preferably, the groove is a circular arc angle.

Preferably, the connecting end is i-shaped.

Preferably, the connecting end and the fixing end are integrally formed.

Preferably, the connecting end and the fixing end are assembled.

The mold comprises an upper mold and a lower mold, wherein the upper mold comprises an upper mold main body, any insert, a runner plate and a splitter box; the runner plates are arranged in parallel at equal intervals in the middle of the upper die main body; the insert is movably arranged in each runner plate; a plurality of shunting grooves are formed in the side edge of each runner plate; the lower die comprises a lower die main body, a plurality of charging barrels and a cavity, the charging barrels are arranged in the middle of the lower die main body in parallel at equal intervals and are aligned with the corresponding insert positions respectively, and the charging barrels penetrate through the lower die main body; the die cavity is arranged on the side edge of the charging barrel.

The utility model relates to a be applied to semiconductor plastic envelope mould insert and plastic envelope mould's beneficial effect does:

compared with the prior art, the insert block applied to the semiconductor plastic package mold and the plastic package mold are designed to be inserted through a split structure, so that the cost of the hard alloy material of the insert block is reduced, and meanwhile, the hard alloy material is selected, so that the insert block achieves the effects of wear resistance and durability under the flushing of epoxy resin; the working end face of the insert is designed into a rough face, and the insert has the advantage of being not easy to adhere to a runner material under the wear-resistant condition.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic perspective view of a semiconductor plastic package mold according to the present invention, which includes an upper mold and a lower mold;

fig. 2 is a schematic structural view of an upper mold of the semiconductor plastic package mold shown in fig. 1;

fig. 3 is a schematic structural view of a lower mold of the semiconductor plastic package mold shown in fig. 1;

fig. 4 is a schematic view of a cross-sectional structure of an insert applied to a semiconductor plastic package mold according to the present invention;

fig. 5 is a schematic view of the working process of the semiconductor plastic package mold of the present invention.

The following are marked in the figure: 11, an upper die; 111, an upper die body; 112, an insert; 1121, working end; 11211, a groove; 1122, a connection end; 1123, fixed end; 113, a runner plate; 114, a shunt channel; 12, a lower die; 121, a lower die body; 122, a cartridge; 123, a cavity; 20, epoxy resin molding compound; 21, an injection head.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of the embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "upper" and "lower" are used for indicating the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of describing the present invention and simplifying the description, but not for indicating or implying that the indicated device or element must have a specific position, be constructed and operated in a specific position, and thus should not be construed as limiting the present invention.

Further, in the present disclosure, unless otherwise expressly stated or limited, the first feature may comprise both the first and second features directly contacting each other, and also may comprise the first and second features not being directly contacting each other but being in contact with each other by means of further features between them. Also, the first feature being above, on or above the second feature includes the first feature being directly above and obliquely above the second feature, or merely means that the first feature is at a higher level than the second feature. A first feature that underlies, and underlies a second feature includes a first feature that is directly under and obliquely under a second feature, or simply means that the first feature is at a lesser level than the second feature.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless explicitly stated or limited otherwise, the terms "disposed," "connected," and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-3, a mold for plastic packaging semiconductor of the present invention may include an upper mold 11 and a lower mold 12, wherein the upper mold 11 is disposed above the lower mold 12 and is used in cooperation with the lower mold; the upper die 11 comprises an upper die main body 111, an insert 112, a runner plate 113 and a diversion channel 114; the plurality of runner plates 113 are arranged in parallel at equal intervals at the center of the upper die main body 111; the insert 112 is movably arranged in each runner plate 113; a plurality of the diversion grooves 114 are arranged on the side edge of each flow passage plate 113; in this embodiment, 7 flow channel plates 113 are equidistantly and parallelly disposed at the center of the upper mold body 111, and one diversion channel 114 is disposed around each flow channel plate 113; in other embodiments, the number of the runner plates 113 may also be 2, 3, 8 or other numbers, the number of the diversion grooves 114 may also be 2, 3 or other numbers, and the number of the runner plates 113 and the diversion grooves 114 may be set according to the specific size of the upper die main body 111; the lower die 12 comprises a lower die body 121, a plurality of material cylinders 122 and a cavity 123, wherein the material cylinders 122 are arranged in parallel at equal intervals in the center of the lower die body 121 and are respectively aligned with the corresponding positions of the inserts 112, and the material cylinders 122 penetrate through the lower die body 121; the cavity 123 is disposed at a side of the barrel 122.

Referring to fig. 4, the insert 112 includes a working end 1121, a connecting end 1122, and a fixed end 1123; a groove 11211 is formed in the working end 1121, the surface of the working end 1121 is machined into a rough surface, the problem that the flow channel material is easily adhered to the working surface of the working end 1121 is solved by the rough surface, the groove 11211 is designed into an arc angle, strength of the working end 1121 is increased, and the groove 11211 is used for fixing the connecting end 1122; the connecting end 1122 is i-shaped, one end of the connecting end is connected with the groove 11211, and the other end of the connecting end is connected with the fixed end 1123; the fixed end 1123 is movably arranged in the runner plate 113; the working end 1121 is made of a hard alloy, the connecting end 1122 and the fixing end 1123 are made of a common steel material, and the connecting end 1122 and the fixing end 1123 are integrally formed or assembled, in this embodiment, the connecting end 1122 and the fixing end 1123 are integrally formed; the size of the recess 11211 is slightly larger than the end of the connecting end 1122 connected to the recess 11211, facilitating the mounting of the connecting end 1122 in the recess 11211; the contact surface of the groove 11211 connected to the connection end 1122 is tightly attached to the connection end 1122, so that the working pressure borne by the working end 1121 is distributed to the connection end 1122, the service life of the working end 1121 is ensured, and the working end 1121 is not prone to stress cracking.

Referring to fig. 5, the working process of the present invention applied to the semiconductor plastic package mold is as follows:

assembling the insert 112 by assembling the working end 1121, the connecting end 1122 and the fixed end 1123, fixing the assembled insert 112 in the runner plate 113 through the fixed end 1123, placing the lower die 12 on a power unit, filling the cylinder 122 with an epoxy molding compound 20, then placing the upper die 11 on the lower die 12 and fixing the upper die 11 and the lower die 12 together; an injection head 21 of the power device is arranged in the barrel 122, the injection head 21 presses and injects the epoxy resin molding compound 20 in the barrel 122 onto the insert 112, and the epoxy resin molding compound 20 flows into the molding cavity 123 from the diversion channel 114 under the mutual pressure of the injection head 21 and the insert 112.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. An insert applied to a semiconductor plastic package mold is characterized by comprising a working end, a connecting end and a fixing end; a groove is formed in the working end, one end of the connecting end is movably connected with the groove, and the other end of the connecting end is connected with the fixed end; the material of work end is carbide, the link with the material of stiff end is ordinary steel.

2. The insert applied to the semiconductor plastic package mold according to claim 1, wherein the working surface of the working end is a rough surface.

3. The insert applied to the semiconductor plastic package mold according to claim 1, wherein the groove is an arc angle.

4. The insert applied to the semiconductor plastic package mold according to claim 1, wherein the connecting end is i-shaped.

5. The insert applied to the semiconductor plastic package mold as recited in claim 4, wherein the connecting end and the fixing end are integrally formed.

6. The insert applied to the semiconductor plastic package mold according to claim 4, wherein the connecting end and the fixing end are assembled and molded.

7. The mold comprises an upper mold and a lower mold, and is characterized in that the upper mold comprises an upper mold main body, an insert block as claimed in any one of claims 1 to 6, a runner plate and a splitter box; the runner plates are arranged in parallel at equal intervals in the middle of the upper die main body; the insert is movably arranged in each runner plate; a plurality of shunting grooves are formed in the side edge of each runner plate; the lower die comprises a lower die main body, a plurality of charging barrels and a cavity, the charging barrels are arranged in the middle of the lower die main body in parallel at equal intervals and are aligned with the corresponding insert positions respectively, and the charging barrels penetrate through the lower die main body; the die cavity is arranged on the side edge of the charging barrel.