CN212071567U - Chemical mechanical polishing pad with fish-scale protrusions - Google Patents

Chemical mechanical polishing pad with fish-scale protrusions Download PDF

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Publication number
CN212071567U
CN212071567U CN202020792996.5U CN202020792996U CN212071567U CN 212071567 U CN212071567 U CN 212071567U CN 202020792996 U CN202020792996 U CN 202020792996U CN 212071567 U CN212071567 U CN 212071567U
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polishing pad
fish
scale
base member
chemical mechanical
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CN202020792996.5U
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Chinese (zh)
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朱文献
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Onstar Technology Shenzhen Co ltd
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Onstar Technology Shenzhen Co ltd
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The utility model discloses a chemical mechanical polishing pad with fish scale is bellied, including the polishing pad base member, the polishing pad base member is circular, the surface of polishing pad base member evenly is provided with the arch of a plurality of rows of fish scale distribution, each bellied cross section sets up and is circularly, just the thick border in bellied center is thin, every row the arch is close to the position at polishing pad base member border is provided with being used for of looks adaptation and fills the scale. The utility model discloses technical scheme is simple and practical, aims at improving the anti-junk and stabs thorn destruction ability, improves its life, sparingly changes the polishing pad cost.

Description

Chemical mechanical polishing pad with fish-scale protrusions
Technical Field
The utility model relates to a chemical mechanical polishing technical field, in particular to chemical mechanical polishing pad with fish scale is bellied.
Background
Chemical mechanical planarization/polishing techniques and processes are increasingly being used in electronic chip production. It can remove topography from the surface of silicon oxide, polysilicon, diffusion barrier and metal, etc. and achieve extremely high-requirement planarization, and provides for its subsequent photolithography step, and avoids the problem of depth focusing during the illumination of photosensitive layer, and it is the most effective planarization surface treatment step in the manufacture of integrated circuit. In addition, this technique is widely used in other fields such as polishing of third-generation semiconductor substrates SiC, optical sapphire, glass and the like, metal alloys for sealing and decoration, ceramics and the like. In summary, CMP is a very widely used surface treatment process technology. With the ever-increasing demand for increased performance and reduced cost of CMP processes, the development of new devices, new materials, and new processes is constantly ongoing, and the polishing pad, one of the consumables of CMP, has a significant impact on process performance. In addition to the material, the surface structure and shape of the polishing pad can significantly affect the service life of the polishing pad and the performance of the CMP process.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a chemical mechanical polishing pad with fish scale is bellied aims at improving the anti-fragmentation and stabs the destruction ability of thorn, improves its life, sparingly changes the polishing pad cost, reduces the polishing pad and changes the number of times and improve CMP work efficiency.
In order to realize the above-mentioned purpose, the utility model provides a chemical mechanical polishing pad with fish scale shape is bellied, including the polishing pad base member, the polishing pad base member is circular, the surface of polishing pad base member evenly is provided with the arch of a plurality of rows of fish scale shape distribution, each bellied cross section setting is circular, just the thick border in bellied center is thin, every row the arch is close to the position at polishing pad base member border is provided with being used for filling the scale of looks adaptation.
Preferably, a groove is formed between two adjacent rows of the protrusions.
Preferably, two adjacent rows of the protrusions are arranged in a staggered and covering mode in sequence.
Preferably, the ratio of the diameter of the cross-section of the protrusions to the diameter of the polishing pad base ranges from 10% to 30%.
Compared with the prior art, the beneficial effects of the utility model are that: the CMP polishing pad with the imitated scale structure has the effects of resisting stabbing and damaging of broken objects and fine particles, so that the service life of the CMP polishing pad is prolonged, the consumption cost of raw materials is saved, the replacement frequency of the polishing pad is reduced, and the working efficiency of CMP is improved; the alternation of the scaly bumps and the grooves on the structure is beneficial to the dispersion of the polishing solution, thereby achieving the uniform polishing effect. For different CMP requirements and processes, the size of a single scale can be designed from micrometer to centimeter; the resistance is the largest in the inverse fish scale direction and the smallest in the forward direction, and the resistance is alternated during the CMP process, and the friction resistance and the cutting force caused by the scaly bulges are gradually increased and reduced. The periodic variation can maintain good polishing efficiency and reduce surface defects.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural view of the present invention;
the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The chemical mechanical polishing pad with the fish-scale-shaped protrusions provided by the embodiment comprises a polishing pad base body 100, wherein the polishing pad base body 100 is circular, a plurality of rows of fish-scale-shaped protrusions 200 are uniformly arranged on the surface of the polishing pad base body 100, each protrusion 200 is circular in cross section, the center thick edge of each protrusion 200 is thin, and the position, close to the edge of the polishing pad base body 100, of each row of protrusions 200 is provided with a filling scale 300 which is matched with the position, wherein the filling scale 300 is arranged on the position.
In an embodiment of the present invention, a groove is formed between two adjacent rows of protrusions 200.
In an embodiment of the present invention, two adjacent rows of protrusions 200 are sequentially overlapped in a staggered manner.
In one embodiment of the present invention, the ratio of the diameter of the cross-section of the protrusions 200 to the diameter of the polishing pad substrate 100 ranges from 10% to 30%. The range of ratios is equivalent to the distribution density and the interval, and when the density is small, the number of protrusions 200 distributed on the polishing pad base 100 is small, but the area of the protrusions 200 is large, so that the surface is relatively smooth without much resistance, and the cutting rate is low. On the contrary, when the density is high, a certain number of protrusions 200 are arranged on the polishing pad substrate 100 in a fish scale-like distribution, the frequency of surface undulation is high, the resistance is increased, and the cutting rate is increased.
The scales of the fish show unique functional gradient mechanical properties, and the scales are mutually overlapped to effectively disperse the tooth biting force effect. The utility model discloses technical scheme for imitative scale structure CMP polishing pad will have anti garrulous thing and tiny granule and prick the destruction effect, improves its life, saves raw and other materials consumption cost, reduces the polishing pad and changes the number of times and improve CMP work efficiency.
The staggered and arranged fish scale-shaped alternate bulges 200 are beneficial to dispersing the polishing solution, so that the uniform polishing effect is achieved. Single scale size designs can range from microns to centimeters for different CMP requirements and processes. The resistance is the largest in the inverse fish scale direction and the smallest in the forward direction, which alternate during CMP, and the frictional resistance and cutting force caused by the scaly protrusions 200 gradually increase and decrease. The periodic variation can maintain good polishing efficiency and reduce surface defects. The gentle alternating action described above is repeated for a number of times for each revolution of the base plate, ensuring uniformity of the CMP process.
The above is only the preferred embodiment of the present invention, and not the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings or the direct or indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims (4)

1. The utility model provides a chemical mechanical polishing pad with fish scale is bellied, a serial communication port, including the polishing pad base member, the polishing pad base member is circular, the surface of polishing pad base member evenly is provided with the arch of a plurality of rows fish scale distribution, each bellied cross section sets up and is circularly, just bellied thick border in center is thin, every row the arch is close to the position at polishing pad base member border is provided with being used for of looks adaptation and fills the scale.
2. The chemical mechanical polishing pad having fish-scale shaped protrusions according to claim 1, wherein grooves are formed between two adjacent rows of said protrusions.
3. The chemical mechanical polishing pad with fish-scale shaped protrusions of claim 1, wherein two adjacent rows of said protrusions are sequentially staggered to cover each other.
4. The chemical mechanical polishing pad having fish-scale shaped protrusions according to any one of claims 1 to 3, wherein the ratio of the diameter of the cross section of the protrusions to the diameter of the base of the polishing pad is in the range of 10% to 30%.
CN202020792996.5U 2020-05-13 2020-05-13 Chemical mechanical polishing pad with fish-scale protrusions Active CN212071567U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020792996.5U CN212071567U (en) 2020-05-13 2020-05-13 Chemical mechanical polishing pad with fish-scale protrusions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020792996.5U CN212071567U (en) 2020-05-13 2020-05-13 Chemical mechanical polishing pad with fish-scale protrusions

Publications (1)

Publication Number Publication Date
CN212071567U true CN212071567U (en) 2020-12-04

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020792996.5U Active CN212071567U (en) 2020-05-13 2020-05-13 Chemical mechanical polishing pad with fish-scale protrusions

Country Status (1)

Country Link
CN (1) CN212071567U (en)

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