CN212066740U - Ultrasonic bone mineral density detection circuit - Google Patents
Ultrasonic bone mineral density detection circuit Download PDFInfo
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- CN212066740U CN212066740U CN202020141587.9U CN202020141587U CN212066740U CN 212066740 U CN212066740 U CN 212066740U CN 202020141587 U CN202020141587 U CN 202020141587U CN 212066740 U CN212066740 U CN 212066740U
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Abstract
An ultrasonic bone density detection circuit, comprising: the device comprises a power input component, a power detection component, a detection component and a result output component; when the power supply equipment is connected, the power supply input component receives a power supply signal output by the power supply equipment; the power supply detection assembly detects the voltage variation of the power supply signal and outputs the power supply signal when the voltage of the power supply signal is within a preset voltage range; the detection component outputs ultrasonic pulse waves with preset frequency according to the power supply signal; the result output assembly detects the actual propagation speed of the ultrasonic pulse waves in the skeleton and obtains the bone density of the skeleton based on the difference between the actual propagation speed and the preset propagation speed; the ultrasonic bone density detection circuit in the embodiment is connected with a stable power supply, so that the detection error of the bone density of a human body is reduced.
Description
Technical Field
The application belongs to the technical field of electronic circuits, and particularly relates to an ultrasonic bone mineral density detection circuit.
Background
Ultrasound is widely used in various technical fields such as medicine as a safe, economical and effective form, for example, ultrasound can be used for obtaining an in-vivo image of a heart or a fetus, technicians can obtain various physiological parameters of a human body through ultrasound, for example, bone density of the human body can be obtained through ultrasound, and scientific judgment basis is provided for health level of the human body based on the bone density; however, in the process of detecting the bone density of a human body by the conventional technology, the bone density is very easily influenced by power supply fluctuation, which causes physical damage to the detection circuit on one hand, and reduces the detection precision of the bone density of the human body and the application range of the ultrasonic bone density detection circuit on the other hand.
SUMMERY OF THE UTILITY MODEL
An object of the application is to provide an supersound bone density detection circuitry, aims at solving traditional supersound bone density detection circuitry and receives the undulant interference of power, has increaseed the problem of bone density detection error.
A first aspect of an embodiment of the present application provides an ultrasonic bone density detection circuit, including:
a power input component configured to receive a power signal output by a power device upon access by the power device;
the power supply detection component is connected with the power supply input component and is configured to detect the voltage variation of the power supply signal and output the power supply signal when the voltage of the power supply signal is within a preset voltage range;
the detection component is connected with the power supply detection component, arranged in a preset area of human skin and configured to output ultrasonic pulse waves with preset frequency according to the power supply signal; and
and the result output component is connected with the detection component and is used for detecting the actual propagation speed of the ultrasonic pulse wave in the bone and deriving the bone density of the bone based on the difference between the actual propagation speed and the preset propagation speed.
In one embodiment, the power detection assembly comprises:
a voltage detection part connected with the power input component and configured to detect a voltage variation of the power signal and output a turn-on signal when the voltage of the power signal is within a preset voltage range; and
and the switch component is connected with the voltage detection component, the power input component and the detection component, is configured to be conducted according to the conducting signal and outputs the power signal.
In one embodiment, the method further comprises:
the power supply alarm component is connected with the power supply input component and is configured to send out a first alarm signal when the power supply input component is detected to be in an abnormal power supply input state.
In one embodiment, the probe assembly includes two probes.
In one embodiment, the method further comprises:
a probe alarm assembly coupled to the probe and configured to emit a second alarm signal upon detection of a physical failure of the probe.
In one embodiment, the method further comprises:
and the voltage stabilizing component is connected between the power supply detection component and the detection component and is configured to stabilize the power supply signal.
In one embodiment thereof, the voltage stabilizing assembly comprises:
the first capacitor is connected with the first voltage stabilizing chip, and the second capacitor is connected with the first capacitor;
the power supply input pin of the first voltage stabilizing chip and the enabling pin of the first voltage stabilizing chip are connected to the power supply detection assembly in a sharing mode, and the grounding pin of the first voltage stabilizing chip is connected with a digital ground;
the first end of the first resistor and the first end of the second resistor are connected to a voltage feedback pin of the first voltage stabilizing chip in a sharing mode, and the second end of the second resistor is connected to digital ground;
the first end of the first capacitor and the first end of the first inductor are connected to a voltage stabilization control pin of the first voltage stabilization chip in a sharing mode, and the second end of the first capacitor is connected to digital ground;
the second end of the first inductor, the second end of the first resistor, the first end of the second capacitor, the first end of the third capacitor, the first end of the fourth capacitor, the first end of the fifth capacitor and the first end of the sixth capacitor are connected to the detection component in common;
the second end of the second capacitor, the second end of the third capacitor, the second end of the fourth capacitor, the second end of the fifth capacitor, the second end of the sixth capacitor, the first end of the third resistor and the first end of the seventh capacitor are connected to a digital ground in common;
and the second end of the third resistor and the second end of the seventh capacitor are connected to the chassis ground in common.
In one embodiment, the result output component comprises:
a velocity detection component coupled to the probe assembly and configured to detect an actual propagation velocity of the ultrasonic pulse waves in the bone; and
a result output component coupled to the velocity detection component and configured to derive a bone density of the bone based on a difference between the actual propagation velocity and the preset propagation velocity.
In one embodiment thereof, the result output means comprises:
the speed processing chip, the fourth resistor and the fifth resistor;
the signal input pin of the speed processing chip is connected with the speed detection component;
a first signal output pin of the speed processing chip and a first end of the fourth resistor are connected in common to form a first signal output end of the result output component, and a second end of the fourth resistor is grounded;
a second signal output pin of the speed processing chip and a first end of the fifth resistor are connected in common to form a second signal output end of the result output component, and a second end of the fifth resistor is grounded;
and the first signal output end of the result output component and the second signal output end of the result output component are used for outputting the detection result.
In one embodiment, the method further comprises:
and the analog-to-digital conversion component is connected with the result output component and is configured to perform analog-to-digital conversion on the detection result.
Compared with the prior art, the embodiment of the application has the advantages that: the ultrasonic bone density detection circuit can access stable electric energy by detecting the voltage variation of the power supply signal, and accurately acquire the bone density of the bone according to the propagation speed of the ultrasonic pulse wave in the bone; the ultrasonic bone density detection circuit in the embodiment has a stable electric energy input function, and prevents the interference of power supply fluctuation to the bone density detection process of a human body.
Drawings
Fig. 1 is a schematic structural diagram of an ultrasonic bone density detection circuit according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of an ultrasonic bone density detection circuit according to an embodiment of the present application;
fig. 3 is a schematic circuit diagram of a voltage regulator module according to an embodiment of the present disclosure;
FIG. 4 is a schematic structural diagram of a result output component according to an embodiment of the present application;
fig. 5 is a schematic circuit diagram of a result output unit according to an embodiment of the present application;
FIG. 6 is a schematic diagram of another structure of an ultrasonic bone density detection circuit according to an embodiment of the present application;
fig. 7 is a schematic circuit diagram of an analog-to-digital conversion module according to an embodiment of the present disclosure;
fig. 8 is a schematic structural diagram of a power detection assembly according to an embodiment of the present disclosure;
fig. 9 is a schematic circuit structure diagram of a voltage detection component according to an embodiment of the present application.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It should be noted that the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
Fig. 1 shows a schematic structural diagram of an ultrasonic bone density detection circuit 10 provided in a preferred embodiment of the present application, and for convenience of illustration, only the parts related to the present embodiment are shown, which are detailed as follows:
the ultrasonic bone density detection circuit 10 includes: a power input component 101, a power detection component 102, a detection component 103, and a result output component 104.
The power input component 101 is configured to receive a power signal output by a power device when the power device is connected.
Optionally, the power supply device is a battery or a mains supply; when the power supply device is electrically connected to the power input assembly 101, the power input assembly 101 transmits the power signal and supplies power to the ultrasonic bone density detection process.
The power detection component 102 is connected to the power input component 101, and is configured to detect a voltage variation of the power signal and output the power signal when the voltage of the power signal is within a preset voltage range.
Optionally, the preset voltage range is: greater than 198V and less than or equal to 242V; specifically, if the power detection module 102 detects that the voltage of the power signal is not within the preset voltage range, the power signal is not output, and the ultrasonic bone density detection circuit 10 is in a stop state; when the voltage of the power supply signal is larger than the voltage range which is not in the preset voltage range, the voltage fluctuation range of the power supply signal is too large, and the detection process of the bone density is interfered.
The detection component 103 is connected to the power detection component 102, is disposed in a predetermined region of the skin of the human body, and is configured to output an ultrasonic pulse wave having a predetermined frequency according to the power signal.
The skeleton of the human body is wrapped by skin, and the ultrasonic pulse wave can be directly output to the skeleton after the detection component 103 is contacted with the skin of the human body; illustratively, the preset area is a preset area of skin on an arm of a human body; the preset frequency is set in advance, for example, the preset frequency is 21000 Hz.
When the detection component 103 receives a power supply signal, the detection component 103 is powered on and outputs ultrasonic pulse waves to the bone; according to the embodiment, the power detection assembly 102 can prevent unstable electric energy from being output to the detection assembly 103, and the output stability of ultrasonic pulse waves is improved.
The result output component 104 is connected with the detection component 103, and is configured to detect an actual propagation velocity of the ultrasonic pulse wave in the bone, and derive a bone density of the bone based on a difference between the actual propagation velocity and a preset propagation velocity.
Specifically, the result output component 104 obtains the bone density of the bone according to the standard deviation between the actual propagation speed and the preset propagation speed; such as standard deviations of-13, -12, etc.; the bone density of the human bone can be quantitatively analyzed according to the size of the standard deviation.
When the bone density in the bone is different, the propagation speed of the ultrasonic pulse wave in the bone is correspondingly changed; illustratively, acquiring a preset propagation rate according to the characteristic attribute of the skeleton; wherein the characteristic attributes of the bone include: sex of a human body to which the skeleton belongs, age of a human body to which the skeleton belongs, and the like; the preset propagation speed is used as a reference quantity, the bone density of the skeleton is represented in a speed difference mode, and the detection process of the bone density of the skeleton is simplified.
As an alternative implementation, fig. 2 shows another structural schematic of the bone density detection circuit 10 provided in this embodiment, and compared with the structural schematic of the bone density detection circuit 10 in fig. 1, the bone density detection circuit 10 further includes: a power supply alarm component 105, wherein the power supply alarm component 105 is connected with the power supply input component 101 and is configured to send out a first alarm signal when the power supply input component 101 is detected to be in an abnormal power supply input state.
Specifically, when the power supply alarm component 105 detects that the power supply input component 101 is in a normal power supply input state, the first alarm signal is not sent out.
Exemplary, abnormal power input states include: the leakage current of the power input assembly 101 is larger than the preset safe current, and the voltage of the power signal output by the power supply equipment is larger than the rated voltage of the power input assembly 101; optionally, the first alarm signal belongs to a photoelectric signal; therefore, the present embodiment can indicate the abnormal power input state of the power input component 101 in real time through the power alarm component 105, thereby ensuring the power input safety of the power input component 101.
As an alternative embodiment, the probe assembly comprises two probes; the two probes are respectively arranged in the preset area of the skin of the human body, and ultrasonic pulse waves can be input in all directions by combining the two probes.
As an alternative embodiment, referring to fig. 2, the bone density detection circuit 10 further includes a probe alarm assembly 106, wherein the probe alarm assembly 106 is connected to the probe and configured to issue a second alarm signal when a physical failure of the probe is detected.
Specifically, when the probe alarm assembly 106 detects that the probe has not physically failed, the second alarm signal is not issued.
Illustratively, physical failure of the probe includes: residues exist in the probe, the probe is damaged by high temperature, and the like; the present embodiment can indicate the failure state of each probe in real time through the probe alarm assembly 106 so that each probe can stably output ultrasonic pulse waves.
As an alternative embodiment, referring to fig. 2, the bone density detecting circuit 10 further includes: and the voltage stabilizing component 107, wherein the voltage stabilizing component 107 is connected between the power supply detecting component 102 and the detecting component 103 and is configured to stabilize the power supply signal.
After the voltage of the power signal is stabilized by the voltage stabilizing component 107, the detecting component 103 can be powered up at a rated power.
As an alternative implementation, fig. 3 shows a schematic circuit structure of the voltage regulation component 107 provided in this embodiment, and referring to fig. 3, the voltage regulation component 101 includes: the circuit comprises a first voltage-stabilizing chip U1, a first capacitor C1, a second capacitor C2, a third capacitor C3, a fourth capacitor C4, a fifth capacitor C5, a sixth capacitor C6, a seventh capacitor C7, a first resistor R1, a second resistor R2, a third resistor R3 and a first inductor L1.
The power input pin VIN of the first voltage regulation chip U1 and the enable pin EN of the first voltage regulation chip U1 are commonly connected to the power detection assembly 102, and the ground pin of the first voltage regulation chip U1 is connected to the digital ground GND.
The first end of the first resistor R1 and the first end of the second resistor R2 are connected to the voltage feedback pin FB of the first voltage regulation chip U1, the second end of the second resistor R2 is connected to the digital ground GND, and the internal power of the first voltage regulation chip U1 can be kept constant through the voltage feedback pin FB.
The first end of the first capacitor C1 and the first end of the first inductor L1 are commonly connected to the regulated control pin SW of the first regulated chip U1, and the second end of the first capacitor C1 is connected to the digital ground GND.
The second end of the first inductor L1, the second end of the first resistor R1, the first end of the second capacitor C2, the first end of the third capacitor C3, the first end of the fourth capacitor C4, the first end of the fifth capacitor C5, and the first end of the sixth capacitor C6 are commonly connected to the probe assembly 103.
The second terminal of the second capacitor C2, the second terminal of the third capacitor C3, the second terminal of the fourth capacitor C4, the second terminal of the fifth capacitor C5, the second terminal of the sixth capacitor C6, the first terminal of the third resistor R3, and the first terminal of the seventh capacitor C7 are all connected to the digital ground GND.
The second end of the third resistor R3 and the second end of the seventh capacitor C7 are connected to the chassis ground; the second terminal of the third resistor R3 and the seventh capacitor C7 are connected to the chassis ground, respectively, so as to prevent leakage current from occurring in the voltage regulator 101.
Illustratively, the model of the first voltage regulation chip U1 is: LM 3671.
As an alternative implementation, fig. 4 shows a schematic circuit structure of the result output component 104 provided in this embodiment, please refer to fig. 4, where the result output component 104 includes: a speed detection section 1041 and a result output section 1042; the speed detection component 1041 is connected with the detection assembly 103 and is configured to detect the actual propagation speed of the ultrasonic pulse wave in the bone; the speed detection unit 1041 can monitor the actual propagation speed variation of the ultrasonic pulse wave in the bone in real time.
The result output unit 1042 is connected to the velocity detection unit 1041 and is configured to derive a bone density of the bone based on a difference between the actual propagation velocity and a preset propagation velocity.
As an alternative implementation, fig. 5 shows a schematic circuit structure of the result output unit 1042 provided in this embodiment, please refer to fig. 5, where the result output unit 1042 includes: a speed processing chip U2, a fourth resistor R4 and a fifth resistor R5.
The signal input pin of the speed processing chip U2 is connected to the speed detection section 1041; as shown in fig. 5, the signal input pins of the speed processing chip U2 include: INA and INB.
The first signal output pin OUTB/of the speed processing chip U2 and the first terminal of the fourth resistor R4 are commonly connected to form the first signal output terminal of the result output unit 1042, and the second terminal of the fourth resistor R4 is connected to the ground GND.
The second signal output pin OUTA/of the speed processing chip U2 and the first terminal of the fifth resistor R5 are commonly connected to form the second signal output terminal of the result output unit 1042, and the second terminal of the fifth resistor R5 is connected to the ground GND.
The first signal output terminal of the result output unit 1042 and the second signal output terminal of the result output unit 1042 are configured to output the detection result.
Illustratively, the model number of the speed processing chip U2 is: MIC 4426; the speed processing chip U2 can obtain the detection result of the bone density according to the difference between the speeds.
As an alternative implementation, fig. 6 shows another structural schematic of the bone density detection circuit 10 provided in this embodiment, and compared with the structural schematic of the bone density detection circuit 10 in fig. 1, the bone density detection circuit 10 in fig. 6 further includes: an analog-to-digital conversion component 108; the analog-to-digital conversion component 108 is connected to the result output component 104 and configured to perform analog-to-digital conversion on the detection result.
Optionally, the analog-to-digital conversion component 108 is connected to the mobile terminal, and the analog-to-digital conversion component 108 outputs the detection result after analog-to-digital conversion to the mobile terminal; illustratively, the mobile terminal is a mobile phone or a tablet computer.
After the result output component 104 obtains the detection result of the bone density according to the difference between the actual propagation velocity and the preset propagation velocity, the detection result output by the result output component 104 is an analog quantity, the analog-to-digital conversion component 108 converts the analog quantity into a digital quantity, and the mobile terminal can be compatible with the detection result of the accessed bone density.
As an alternative implementation, fig. 7 shows a schematic circuit structure of the analog-to-digital conversion assembly 108 provided in this embodiment, please refer to fig. 7, where the analog-to-digital conversion assembly 108 includes: the circuit comprises a first analog-to-digital conversion chip U3, a sixth resistor R6, a seventh resistor R7, an eighth capacitor C8, a ninth capacitor C9, a tenth capacitor C10 and an eleventh capacitor C11.
A first end of the seventh resistor R7, a first end of the ninth capacitor C9, a first end of the tenth capacitor C10, and a first end of the eleventh capacitor C11 are commonly connected to the power input pin AVCC of the first analog-to-digital conversion chip U3, a second end of the seventh resistor R7 is connected to a first direct-current power supply, and optionally, the first direct-current power supply is a 5V direct-current power supply; the second terminal of the ninth capacitor C9 is grounded to GND, the second terminal of the tenth capacitor C10 is grounded to GND, and the second terminal of the eleventh capacitor C11 is grounded to GND.
The reference power input pin VREF of the first analog-to-digital conversion chip U3 and the first terminal of the eighth capacitor C8 are commonly connected to the result output component 104, and the second terminal of the eighth capacitor C8 is grounded GND.
A first terminal of the sixth resistor R6 and the first signal input pin AIN of the first analog-to-digital conversion chip U3 are commonly connected to the result output device 104, and a second terminal of the sixth resistor R6 and the second signal input pin AIN/of the first analog-to-digital conversion chip U3 are commonly connected to the result output device 104.
The signal output pin of the first analog-to-digital conversion chip U3 is used for outputting a detection result after analog-to-digital conversion; as shown in fig. 7, the signal output pin of the first analog-to-digital conversion chip U3 includes: ENCODE, D11, D10, D9, D8, D7, D6, D5, D4, D3, D2, D1, and D0.
Illustratively, the model of the first analog-to-digital conversion chip U3 is: AD6640, when the result output component 104 outputs the detection result to the first analog-to-digital conversion chip U3, the first analog-to-digital conversion chip U3 can perform analog-to-digital conversion on the detection result.
As an alternative implementation, fig. 8 shows a schematic structure of the power detection component 102 provided in this embodiment, please refer to fig. 8, where the power detection component 102 includes: a voltage detection part 1021 and a switch part 1022, the voltage detection part 1021 being connected to the power input component 101, configured to detect a voltage variation amount of the power signal, and output a turn-on signal when the voltage of the power signal is within a preset voltage range; wherein the voltage detecting section 1021 can detect the voltage variation amount of the power supply signal with high accuracy.
The switch unit 1022 is connected to the power input unit 101, the voltage detection unit 1021, and the detection unit 103, and configured to be turned on according to the turn-on signal and output a power signal.
When the switch part 1022 does not receive the on signal, the switch part 1022 is turned off and cannot output the power signal; the present embodiment controls the power input process of the detection component 103 through the switch component 1022.
As an alternative implementation, fig. 9 shows a schematic circuit structure of the voltage detection unit 1021 provided in this embodiment, and referring to fig. 9, the voltage detection unit 1021 includes: a voltage detection chip U4, a twelfth capacitor C12, a thirteenth capacitor C13 and a fourteenth capacitor C14; the power input pin VIN of the voltage detection chip U4, the first terminal of the twelfth capacitor C12, the first terminal of the thirteenth capacitor C13, and the first terminal of the fourteenth capacitor C14 are all connected to the power input element 101, and the ground pin of the voltage detection chip U4, the second terminal of the twelfth capacitor C12, the second terminal of the thirteenth capacitor C13, and the second terminal of the fourteenth capacitor C14 are all connected to the ground GND.
The signal output pin OUT of the voltage detection chip U4 is connected to the switching component 1022. Illustratively, the model of the voltage detection chip U4 is: ME2802 series.
The preset voltage range is pre-stored in the voltage detection chip U4, and the voltage detection chip U4 can detect whether the voltage of the power signal is within the preset voltage range.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.
Claims (10)
1. An ultrasonic bone density detection circuit, comprising:
a power input component configured to receive a power signal output by a power device upon access by the power device;
the power supply detection component is connected with the power supply input component and is configured to detect the voltage variation of the power supply signal and output the power supply signal when the voltage of the power supply signal is within a preset voltage range;
the detection component is connected with the power supply detection component, arranged in a preset area of human skin and configured to output ultrasonic pulse waves with preset frequency according to the power supply signal; and
and the result output component is connected with the detection component and is used for detecting the actual propagation speed of the ultrasonic pulse wave in the bone and deriving the bone density of the bone based on the difference between the actual propagation speed and the preset propagation speed.
2. The bone density detection circuit of claim 1, wherein the power supply detection assembly comprises:
a voltage detection part connected with the power input component and configured to detect a voltage variation of the power signal and output a turn-on signal when the voltage of the power signal is within a preset voltage range; and
and the switch component is connected with the voltage detection component, the power input component and the detection component, is configured to be conducted according to the conducting signal and outputs the power signal.
3. The bone density detection circuit of claim 1, further comprising:
the power supply alarm component is connected with the power supply input component and is configured to send out a first alarm signal when the power supply input component is detected to be in an abnormal power supply input state.
4. The bone density detection circuit of claim 1, wherein the probe assembly includes two probes.
5. The bone density detection circuit of claim 4, further comprising:
a probe alarm assembly coupled to the probe and configured to emit a second alarm signal upon detection of a physical failure of the probe.
6. The bone density detection circuit of claim 1, further comprising:
and the voltage stabilizing component is connected between the power supply detection component and the detection component and is configured to stabilize the power supply signal.
7. The bone density detection circuit of claim 6, wherein the voltage regulation assembly comprises:
the first capacitor is connected with the first voltage stabilizing chip, and the second capacitor is connected with the first capacitor;
the power supply input pin of the first voltage stabilizing chip and the enabling pin of the first voltage stabilizing chip are connected to the power supply detection assembly in a sharing mode, and the grounding pin of the first voltage stabilizing chip is connected with a digital ground;
the first end of the first resistor and the first end of the second resistor are connected to a voltage feedback pin of the first voltage stabilizing chip in a sharing mode, and the second end of the second resistor is connected to digital ground;
the first end of the first capacitor and the first end of the first inductor are connected to a voltage stabilization control pin of the first voltage stabilization chip in a sharing mode, and the second end of the first capacitor is connected to digital ground;
the second end of the first inductor, the second end of the first resistor, the first end of the second capacitor, the first end of the third capacitor, the first end of the fourth capacitor, the first end of the fifth capacitor and the first end of the sixth capacitor are connected to the detection component in common;
the second end of the second capacitor, the second end of the third capacitor, the second end of the fourth capacitor, the second end of the fifth capacitor, the second end of the sixth capacitor, the first end of the third resistor and the first end of the seventh capacitor are connected to a digital ground in common;
and the second end of the third resistor and the second end of the seventh capacitor are connected to the chassis ground in common.
8. The bone density detection circuit of claim 1, wherein the result output component comprises:
a velocity detection component coupled to the probe assembly and configured to detect an actual propagation velocity of the ultrasonic pulse waves in the bone; and
a result output component coupled to the velocity detection component and configured to derive a bone density of the bone based on a difference between the actual propagation velocity and the preset propagation velocity.
9. The bone density detection circuit of claim 8, wherein the result output component comprises:
the speed processing chip, the fourth resistor and the fifth resistor;
the signal input pin of the speed processing chip is connected with the speed detection component;
a first signal output pin of the speed processing chip and a first end of the fourth resistor are connected in common to form a first signal output end of the result output component, and a second end of the fourth resistor is grounded;
a second signal output pin of the speed processing chip and a first end of the fifth resistor are connected in common to form a second signal output end of the result output component, and a second end of the fifth resistor is grounded;
and the first signal output end of the result output component and the second signal output end of the result output component are used for outputting the detection result.
10. The bone density detection circuit of claim 1, further comprising:
and the analog-to-digital conversion component is connected with the result output component and is configured to perform analog-to-digital conversion on the detection result.
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| CN202020141587.9U CN212066740U (en) | 2020-01-20 | 2020-01-20 | Ultrasonic bone mineral density detection circuit |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI751050B (en) * | 2021-03-05 | 2021-12-21 | 興友科技股份有限公司 | The method of bioimpedance technology to assess local or whole body bone density |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI751050B (en) * | 2021-03-05 | 2021-12-21 | 興友科技股份有限公司 | The method of bioimpedance technology to assess local or whole body bone density |
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