CN212064536U - Lamination device for processing multilayer circuit board - Google Patents

Lamination device for processing multilayer circuit board Download PDF

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Publication number
CN212064536U
CN212064536U CN202020832778.XU CN202020832778U CN212064536U CN 212064536 U CN212064536 U CN 212064536U CN 202020832778 U CN202020832778 U CN 202020832778U CN 212064536 U CN212064536 U CN 212064536U
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fixedly connected
base
outer side
side wall
circuit board
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CN202020832778.XU
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Chinese (zh)
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梁东兵
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Advanced Electronic Zhuhai Co ltd
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Advanced Electronic Zhuhai Co ltd
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Abstract

The utility model relates to a compression fittings is used in processing of multilayer circuit board, including base and infrared detector, a plurality of locking universal wheels of bottom fixedly connected with of base, four diagonal angles departments of base are connected with the same piece through the support column and place the board, place the first motor of board bottom fixedly connected with, first motor output fixedly connected with output shaft, the lead screw that is connected with two symmetry settings is rotated at the base top, two the lead screw top runs through and places the board and through engagement mechanism and output shaft, two the equal threaded connection of lead screw lateral wall has the movable block, two the movable block all is connected with the grip block through coupling mechanism. The utility model discloses a cooperation of lead screw, movable block, first connecting block, second connecting block, meshing mechanism, grip block and buffer board is used, has realized the centre gripping to the circuit board, has avoided the circuit board to take place the phenomenon of skew at the pressfitting in-process, has improved the stability of device.

Description

Lamination device for processing multilayer circuit board
[ technical field ] A method for producing a semiconductor device
The utility model relates to a circuit board processing technology field especially relates to a compression fittings is used in processing of multilayer circuit board.
[ background of the invention ]
The multilayer circuit board has at least three conductive layers, two of which are on the outer surface and the rest is combined in the insulating board, and usually, when the multilayer circuit board is pressed, a plurality of circuit boards coated with bonding layers are arranged in a limiting seat and then pressed.
In the process of pressing the circuit boards, board stacking is a very important process, and the circuit boards are scrapped due to pressing without alignment, so that the circuit boards need to be adjusted and aligned before being pressed, and therefore, a pressing device for processing multilayer circuit boards is needed to solve the problem.
[ Utility model ] content
The utility model aims at solving the existing problems in the prior art and providing a laminating device for processing multilayer circuit board.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a pressing device for processing a multilayer circuit board comprises a base and an infrared detector, wherein the bottom of the base is fixedly connected with a plurality of locking universal wheels, the four opposite corners of the base are connected with a same placing plate through supporting columns, the bottom of the placing plate is fixedly connected with a first motor, the output end of the first motor is fixedly connected with an output shaft, the top of the base is rotationally connected with two symmetrically arranged lead screws, the tops of the two lead screws penetrate through the placing plate and are connected with the output shaft through the meshing mechanism, the outer side walls of the two lead screws are both in threaded connection with moving blocks, the two moving blocks are both connected with a clamping plate through a connecting mechanism, the bottom of the clamping plate is connected with the top of the base in a sliding way, the clamping plate is connected with a buffer plate through a buffer mechanism, the bottom of the buffer plate is connected with the top of the base in a sliding mode, and the base is connected with the infrared detector through the adjusting mechanism.
Preferably, the meshing mechanism comprises second gears fixedly connected to the tops of the output shafts, the tops of the two lead screws are fixedly connected with first gears, the first gears are located between the two second gears, and the second gears are respectively meshed with the two first gears.
Preferably, the connecting mechanism comprises a first connecting block fixedly connected to the outer side wall of the moving block, the outer side wall of the clamping plate is fixedly connected with a second connecting block, and the first connecting block is connected with the second connecting block through a connecting rod.
Preferably, the first connecting block and the outer side wall of the second connecting block are fixedly connected with pin shafts, rotating ports are formed in two ends of each connecting rod, and the inner side walls of the rotating ports are respectively rotatably sleeved with the outer side walls of the pin shafts.
Preferably, buffer gear includes the telescopic link of fixed connection at the grip block lateral wall, the one end and the buffer block lateral wall fixed connection of grip block are kept away from to the telescopic link, telescopic link lateral wall cover is equipped with reset spring, reset spring's both ends respectively with grip block lateral wall and buffer block lateral wall fixed connection.
Preferably, adjustment mechanism includes the second motor of fixed connection at the base lateral wall, the mounting groove has been seted up on the base, the mounting groove inside wall rotates and is connected with the threaded rod, the tip and the second motor output fixed connection of threaded rod, the threaded hole is seted up to infrared detector bottom, threaded hole inside wall and threaded rod lateral wall threaded connection.
Compared with the prior art, the utility model has the following advantage:
1. the utility model discloses a cooperation of lead screw, movable block, first connecting block, second connecting block, meshing mechanism, grip block and buffer board is used, has realized the centre gripping to the circuit board, has avoided the circuit board to take place the phenomenon of skew at the pressfitting in-process, has improved the stability of device.
2. The utility model discloses a cooperation of second motor, threaded rod, mounting groove, infrared detector and screw hole is used, has realized the regulation to the infrared detector position for the device can process the not circuit board of equidimension, has improved the application scope of device.
[ description of the drawings ]
Fig. 1 is a schematic view of a front connection structure of a pressing device for processing a multilayer circuit board according to the present invention;
fig. 2 is an enlarged view of a position a of the pressing device for processing a multilayer circuit board according to the present invention;
fig. 3 is a schematic view of a connection structure between an infrared detector and a threaded hole in the pressing device for processing a multilayer circuit board according to the present invention;
fig. 4 is the utility model provides a base and place board connection structure sketch map in lamination device for processing of multilayer circuit board.
In the figure: the device comprises a base 1, a locking universal wheel 2, a supporting column 3, a placing plate 4, a lead screw 5, a first gear 6, a first motor 7, an output shaft 8, a second gear 9, a moving block 10, a connecting rod 11, a clamping plate 12, a telescopic rod 13, a reset spring 14, a buffer plate 15, a mounting groove 16, a threaded rod 17, a second motor 18, an infrared detector 19 and a threaded hole 20.
[ detailed description ] embodiments
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Referring to fig. 1-4, a laminating device for processing a multilayer circuit board comprises a base 1 and an infrared detector 19, wherein the bottom of the base 1 is fixedly connected with a plurality of locking universal wheels 2, four opposite corners of the base 1 are connected with a same placing plate 4 through supporting columns 3, the bottom of the placing plate 4 is fixedly connected with a first motor 7, and the output end of the first motor 7 is fixedly connected with an output shaft 8;
the top of the base 1 is rotatably connected with two symmetrically arranged lead screws 5, the tops of the two lead screws 5 penetrate through the placing plate 4 and are connected with the output shaft 8 through an engaging mechanism, the engaging mechanism comprises second gears 9 fixedly connected to the tops of the output shaft 8, the tops of the two lead screws 5 are both fixedly connected with first gears 6, the first gears 6 are located between the two second gears 9, the second gears 9 are respectively engaged with the two first gears 6, and the outer side walls of the two lead screws 5 are both in threaded connection with moving blocks 10;
the two moving blocks 10 are both connected with a clamping plate 12 through a connecting mechanism, the connecting mechanism comprises a first connecting block fixedly connected to the outer side wall of each moving block 10, the outer side wall of each clamping plate 12 is fixedly connected with a second connecting block, the first connecting block is connected with the second connecting block through a connecting rod 11, the outer side walls of the first connecting block and the second connecting block are both fixedly connected with a pin shaft, rotating ports are formed in two ends of each connecting rod 11, and the inner side walls of the two rotating ports are respectively rotatably sleeved with the outer side wall of the pin shaft;
the bottom of the clamping plate 12 is slidably connected with the top of the base 1, the clamping plate 12 is connected with a buffer plate 15 through a buffer mechanism, the buffer mechanism comprises a telescopic rod 13 fixedly connected with the outer side wall of the clamping plate 12, one end, away from the clamping plate 12, of the telescopic rod 13 is fixedly connected with the outer side wall of the buffer plate 15, a reset spring 14 is sleeved on the outer side wall of the telescopic rod 13, two ends of the reset spring 14 are respectively fixedly connected with the outer side wall of the clamping plate 12 and the outer side wall of the buffer plate 15, the bottom of the buffer plate 15 is slidably connected with the top of the base 1, the circuit board is slowly clamped through the cooperation of the reset spring 14 and the telescopic rod 13, the circuit board;
base 1 passes through adjustment mechanism and is connected with infrared detector 19, wherein, infrared detector 19 is prior art, does not do much here and give unnecessary details, and adjustment mechanism includes the second motor 18 of fixed connection at the 1 lateral wall of base, has seted up mounting groove 16 on the base 1, and 16 inside walls of mounting groove rotate and are connected with threaded rod 17, the tip and the 18 output end fixed connection of second motor of threaded rod 17, and threaded hole 20 is seted up to infrared detector 19 bottom, and threaded hole 20 inside walls and threaded rod 17 lateral wall threaded connection.
The utility model discloses specific theory of operation as follows:
in an initial state, a plurality of circuit boards are placed between two buffer plates 15, a second motor 18 is started, the second motor 18 works to drive a threaded rod 17 to rotate, wherein two external threads in opposite directions are formed on the outer side wall of the threaded rod 17, and a threaded port 20 at the bottom of an infrared detector 19 is in threaded connection with the outer side wall of the threaded rod 17;
the threaded rod 17 rotates to enable the two infrared detectors 19 to move towards the opposite side or the back of the back, and therefore the device can process circuit boards of different sizes;
when a plurality of circuit boards are stacked together, when the circuit boards are not aligned, the phenomenon that one end of each circuit board protrudes out and the other end of each circuit board is sunken can be caused, and the circuit boards can be aligned and detected by the two infrared detectors 19 until the circuit boards are aligned;
after the circuit boards are aligned, the first motor 7 is started, the first motor 7 works to drive the output shaft 8 to rotate, further drive the second gear 9 to rotate, and the second gear 9 is meshed with the two first gears 6 to realize the rotation of the two lead screws 5;
the two lead screws 5 rotate to drive the moving block 10 to move up and down, the moving block 10 moves up and down to drive the clamping plate 12 to move towards the opposite side through the connecting rod 11, the circuit board is clamped, and the phenomenon that the circuit board is scrapped due to deviation when the circuit board is pressed is avoided.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims (6)

1. A pressing device for processing a multilayer circuit board comprises a base (1) and an infrared detector (19), and is characterized in that the bottom of the base (1) is fixedly connected with a plurality of locking universal wheels (2), four diagonal positions of the base (1) are connected with a same placing plate (4) through supporting columns (3), the bottom of the placing plate (4) is fixedly connected with a first motor (7), an output shaft (8) is fixedly connected with an output end of the first motor (7), the top of the base (1) is rotatably connected with two symmetrically arranged lead screws (5), the tops of the two lead screws (5) penetrate through the placing plate (4) and are connected with the output shaft (8) through a meshing mechanism, the outer side walls of the two lead screws (5) are both in threaded connection with moving blocks (10), and the two moving blocks (10) are both connected with a clamping plate (12) through a connecting mechanism, grip block (12) bottom and base (1) top sliding connection, grip block (12) are connected with buffer board (15) through buffer gear, buffer board (15) bottom and base (1) top sliding connection, base (1) are connected with infrared detector (19) through adjustment mechanism.
2. The pressing device for processing the multilayer circuit board according to claim 1, wherein the engaging mechanism comprises a second gear (9) fixedly connected to the top of the output shaft (8), the top of each of the two lead screws (5) is fixedly connected with a first gear (6), the first gear (6) is located between the two second gears (9), and the second gears (9) are respectively engaged with the two first gears (6).
3. The pressing device for processing the multilayer circuit board according to claim 1, wherein the connecting mechanism comprises a first connecting block fixedly connected to an outer side wall of the moving block (10), a second connecting block fixedly connected to an outer side wall of the clamping plate (12), and the first connecting block and the second connecting block are connected through a connecting rod (11).
4. The pressing device for processing the multilayer circuit board according to claim 3, wherein the outer side walls of the first connecting block and the second connecting block are fixedly connected with a pin shaft, the two ends of the connecting rod (11) are respectively provided with a rotating port, and the inner side walls of the two rotating ports are respectively rotatably sleeved with the outer side wall of the pin shaft.
5. The pressing device for processing the multilayer circuit board according to claim 1, wherein the buffer mechanism comprises a telescopic rod (13) fixedly connected to an outer side wall of the clamping plate (12), one end of the telescopic rod (13) far away from the clamping plate (12) is fixedly connected to an outer side wall of the buffer plate (15), a return spring (14) is sleeved on an outer side wall of the telescopic rod (13), and two ends of the return spring (14) are respectively fixedly connected to an outer side wall of the clamping plate (12) and an outer side wall of the buffer plate (15).
6. The pressing device for processing the multilayer circuit board as claimed in claim 1, wherein the adjusting mechanism includes a second motor (18) fixedly connected to an outer side wall of the base (1), the base (1) is provided with a mounting groove (16), an inner side wall of the mounting groove (16) is rotatably connected with a threaded rod (17), an end portion of the threaded rod (17) is fixedly connected with an output end of the second motor (18), a threaded hole (20) is formed at a bottom of the infrared detector (19), and an inner side wall of the threaded hole (20) is in threaded connection with an outer side wall of the threaded rod (17).
CN202020832778.XU 2020-05-18 2020-05-18 Lamination device for processing multilayer circuit board Active CN212064536U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020832778.XU CN212064536U (en) 2020-05-18 2020-05-18 Lamination device for processing multilayer circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020832778.XU CN212064536U (en) 2020-05-18 2020-05-18 Lamination device for processing multilayer circuit board

Publications (1)

Publication Number Publication Date
CN212064536U true CN212064536U (en) 2020-12-01

Family

ID=73521071

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020832778.XU Active CN212064536U (en) 2020-05-18 2020-05-18 Lamination device for processing multilayer circuit board

Country Status (1)

Country Link
CN (1) CN212064536U (en)

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