CN212062823U

CN212062823U - Distributed power saving device for electronic engineering

Info

Publication number: CN212062823U
Application number: CN201922069041.7U
Authority: CN
Inventors: 姜志贤; 薛伟
Original assignee: Yuncheng University
Current assignee: Yuncheng University
Priority date: 2019-11-26
Filing date: 2019-11-26
Publication date: 2020-12-01
Anticipated expiration: 2029-11-26

Abstract

The utility model discloses a belongs to the technical field of power saving devices, in particular to a distributed power saving device for electronic engineering, which comprises a base, wherein the power saving device is arranged on the inner side wall of a control cabinet, the bottom of the outer side wall of the base is provided with a moving mechanism which is matched with a roller through a telescopic rod to conveniently extend the roller to move equipment or withdraw the roller to fix the equipment through a wear pad, the operation is simple, the moving and the fixing are convenient, in addition, a temperature sensor is matched with a microcontroller to monitor the internal temperature of the control cabinet in real time, a cooling fan is conveniently controlled to cool the internal part of the control cabinet, the situation that the power consumption of components is increased due to high temperature can be reduced, meanwhile, the charge capacity change is tracked in real time through the matching arrangement of the microcontroller and the power saving device, the input voltage of a power supply system is optimized through, the waste of voltage and current is reduced, and the practicability is strong.

Description

Distributed power saving device for electronic engineering

Technical Field

The utility model relates to a power saving device technical field specifically is an electronic engineering distributing type power saving device.

Background

With the rapid development of the internet of things, the application range of electronic engineering is wider and wider, the electronic engineering is mainly used for signal generation, information transmission, information exchange and processing, and engineering application in aspects of computer communication, digital communication, satellite communication, optical fiber communication, cellular communication, personal communication, stratospheric communication, multimedia technology, information highways, digital program control exchange and the like, and in order to meet the application of different degrees, a plurality of electronic communication devices need to be installed in the same control cabinet.

In actual work, because each component is in a working state all the time, and the high-temperature working environment can increase the power consumption of the component, the existing power saving device does not have a heat dissipation function, if the heat is not dissipated in time, the functions of the component can be reduced, and meanwhile, the service life is shortened.

SUMMERY OF THE UTILITY MODEL

This section is for the purpose of summarizing some aspects of embodiments of the invention and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and in the abstract of the specification and the title of the application to avoid obscuring the purpose of this section, the abstract of the specification and the title of the application, and such simplifications or omissions are not intended to limit the scope of the invention.

The present invention has been made in view of the above and/or other problems with the conventional power saving device.

Therefore, the present invention provides a distributed power saving device for electronic engineering, which can solve the problems of single function, no heat dissipation function, and reduced device service life in practical operation due to the fact that each device is always in working state and the high temperature working environment increases the power consumption of the device, heat cannot be dissipated in time, and the device function is reduced, and further, the distributed power saving device for electronic engineering is generally connected to other electrical appliances through a connection port, but when the connection port is not connected to a power line, thick dust can be collected around or even inside the connection port, when the connection port needs to be inserted again, the phenomenon of no insertion or poor contact can occur due to the existence of dust, and meanwhile, static electricity is easily generated in the dust, and the power line can be plugged in and unplugged under the environment, there is a problem of a great risk.

For solving the technical problem, according to the utility model discloses an aspect, the utility model provides a following technical scheme:

an electronic engineering distributed power saving device, comprising: the power supply comprises a base, a control cabinet, a power saver, a moving mechanism, a heat dissipation mechanism and a control mechanism, wherein the top of the outer side wall of the base is fixedly connected with the control cabinet, the power saver is arranged on the inner side wall of the control cabinet, the moving mechanism is installed at the bottom of the outer side wall of the base, the heat dissipation mechanism is arranged on the outer side wall of the control cabinet, and the control mechanism is installed in the control cabinet.

As the utility model discloses an electronic engineering distributed power saving device's an preferred scheme, wherein: the base includes mounting groove and abrasion pad, four extreme angle departments in base lateral wall bottom all set up the mounting groove, the abrasion pad bond in base lateral wall bottom, just the mounting groove opening part does not set up the abrasion pad, the abrasion pad is the backing plate that polyvinyl chloride and rubber materials compound formed.

As the utility model discloses an electronic engineering distributed power saving device's an preferred scheme, wherein: the switch board includes louvre and absorber plate, a plurality ofly is all seted up with the right side wall to the switch board left side wall the louvre, and is a plurality of the louvre is followed the switch board lateral wall is linear equidistance and arranges, and is a plurality of the louvre certainly the switch board inner wall outwards is the downward sloping form and sets up, switch board inside wall joint the absorber plate, the outer surface coating of absorber plate has electroplating coating.

As the utility model discloses an electronic engineering distributed power saving device's an preferred scheme, wherein: the moving mechanism comprises a telescopic rod and a roller, the top of the inner side wall of the mounting groove is fixedly connected with the telescopic rod, and the bottom of the telescopic rod is fixedly connected with the roller.

As the utility model discloses an electronic engineering distributed power saving device's an preferred scheme, wherein: control mechanism includes microcontroller and temperature sensor, the draw-in groove joint has been seted up to switch board inside wall bottom microcontroller, temperature sensor install in switch board inside wall top, just microcontroller with temperature sensor electric connection.

As the utility model discloses an electronic engineering distributed power saving device's an preferred scheme, wherein: the heat dissipation mechanism comprises a connecting frame and a heat dissipation fan, a through hole is formed in the central position of the rear side wall of the control cabinet, the connecting frame corresponds to the through hole and is fixedly connected to the rear side wall of the control cabinet, the heat dissipation fan is installed on the inner side wall of the connecting frame, and the heat dissipation fan is electrically connected with the microcontroller.

As the utility model discloses an electronic engineering distributed power saving device's an preferred scheme, wherein: the electricity-saving appliance comprises a wiring port, a connecting seat and a protection plate, the electricity-saving appliance is fixedly connected to the inner side wall of the control cabinet through the connecting seat, the connecting end of the electricity-saving appliance is provided with the wiring port, the protection plate is connected to the outer side wall of the electricity-saving appliance in a sliding mode, the protection plate is an anti-static plate, and the electricity-saving appliance is electrically connected with the microcontroller.

Compared with the prior art: the telescopic rod is matched with the roller to conveniently extend out of the roller to move the equipment or retract the roller to fix the equipment through the wear-resistant pad, the operation is simple, the movement and the fixation are convenient, the microcontroller takes an LINUX embedded operating system as a control platform, each processing task is realized in a multithreading mode, the variability and the operability are strong, the intelligence of the whole system is increased, the temperature sensor is matched with the microcontroller to monitor the internal temperature of the control cabinet in real time, the heat dissipation fan is conveniently controlled to dissipate heat inside the control cabinet, the situation that the power consumption of components is increased due to high temperature can be reduced, meanwhile, the charge capacity change is tracked in real time through the matching of the microcontroller and the electricity saver, the input voltage of a power supply system is optimized through the microcontroller, the voltage of the load is adjusted to be the optimum value, and the waste of voltage and current is reduced, the practicability is stronger.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail with reference to the accompanying drawings and detailed embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor. Wherein:

FIG. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic rear view of the present invention;

fig. 3 is a schematic view of the structure of part a of the present invention.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be implemented in other ways than those specifically described herein, and one skilled in the art may similarly generalize the present invention without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.

Next, the present invention will be described in detail with reference to the schematic drawings, and in the detailed description of the embodiments of the present invention, for convenience of explanation, the sectional view showing the device structure will not be enlarged partially according to the general scale, and the schematic drawings are only examples, and should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.

In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

The utility model provides an electronic engineering distributing type power saving device, through the inside temperature of temperature sensor and microcontroller cooperation real-time supervision switch board, conveniently control radiator fan dispels the heat to switch board inside, can reduce the circumstances that leads to the power consumption increase of components and parts because of the high temperature and take place, and simultaneously, the cooperation through microcontroller and electricity-saving appliance sets up the change of real-time tracking charge capacity, optimize power supply system's input voltage through microcontroller, voltage adjustment with the load is optimum, reduce the waste of voltage electric current, the practicality is stronger, please refer to figure 1, include, base 100, switch board 200, electricity-saving appliance 300, moving mechanism 400, heat dissipation mechanism 500 and control mechanism 600.

Referring to fig. 1 and fig. 2, the base 100 has a mounting groove 110 and a wear pad 120, specifically, the base 100 is a supporting seat made of a metal alloy material, the base 100 is used for connecting the control cabinet 200, the mounting groove 110 is formed at each of four corners of the bottom of the outer side wall of the base 100, the mounting groove 110 is used for connecting the telescopic rod 410, the wear pad 120 is adhered to the bottom of the outer side wall of the base 100, the wear pad 120 is not arranged at the opening of the mounting groove 110, the wear pad 120 is a backing plate formed by compounding polyvinyl chloride and a rubber material, and the wear pad 120 is used for protecting the base 100 and preventing the base 100 from wear and corrosion in a;

with continuing reference to fig. 1 and fig. 2, the control cabinet 200 has heat dissipating holes 210 and heat absorbing plates 220, specifically, twenty heat dissipating holes 210 are formed in the left side wall and the right side wall of the control cabinet 200, the twenty heat dissipating holes 210 are linearly and equidistantly arranged along the outer side wall of the control cabinet 200 from top to bottom, the twenty heat dissipating holes 210 are arranged in a downward inclined manner from the inner wall of the control cabinet 200, the heat dissipating holes 210 are used for assisting in heat dissipation inside the control cabinet 200 in cooperation with a heat dissipating fan 520, the heat absorbing plates 220 are clamped on the front side and the rear side of the inner side wall of the control cabinet 200, the outer surfaces of the heat absorbing plates 220 are coated with an electroplating coating, the heat absorbing plates 220 are used for assisting in absorbing heat and cooling inside the control cabinet 200, and the heat dissipating holes;

referring to fig. 1 and 3, the power saver 300 includes a connection port 310, a connection seat 320, and a protection plate 330, specifically, the power saver 300 is screwed to the inner side wall of the control cabinet 200 through the connection seat 320, the power saver 300 is fastened to the front side wall of the connection seat 320, the power saver 300 is a TQO-KT001 multifunctional power saver, the power saver 300 is used to cooperate with the microcontroller 610 to track the charge capacity change in real time, the input voltage of the power supply system is optimized through the microcontroller 610 in an electromagnetic induction manner, the voltage is adjusted by using an AC-AC direct conversion technique to adjust the voltage of the load to an optimum value, the connection end of the power saver 300 is provided with the connection port 310, the protection plate 330 is slidably connected to the outer side wall of the power saver 300, the protection plate 330 is an anti-static plate, the protection plate 330 is used to protect the connection port 310, and prevent the occurrence of poor contact or excessive static electricity, the electricity saver 300 is electrically connected with the microcontroller 610;

referring to fig. 1 and fig. 2, the moving mechanism 400 has a telescopic rod 410 and a roller 420, specifically, the telescopic rods 410 are screwed to the tops of the inner side walls of the four mounting grooves 110, the telescopic rods 410 are used for connecting the roller 420 and driving the roller 420 to ascend and descend, and the rollers 420 are screwed to the bottom ends of the four telescopic rods 410;

referring to fig. 1 and fig. 2, the heat dissipation mechanism 500 has a connection frame 510 and a heat dissipation fan 520, specifically, a through hole (not labeled) is disposed at a central position of a rear sidewall of the control cabinet 200, the connection frame 510 is screwed to the central position of the rear sidewall of the control cabinet 200 corresponding to the through hole, the heat dissipation fan 520 is screwed to an inner sidewall of the connection frame 510, the heat dissipation fan 520 is electrically connected to the microcontroller 610, and the heat dissipation fan 520 is used for performing auxiliary heat dissipation inside the control cabinet 200 by cooperating with the heat dissipation hole 210;

referring to fig. 1, the control mechanism 600 has a microcontroller 610 and a temperature sensor 620, specifically, the bottom of the inner side wall of the control cabinet 200 is provided with a card slot, the microcontroller 610 is clamped in the card slot, the microcontroller 610 is an FX1N-40MR-001 programmable processing chip, the microcontroller 610 uses an LINUX embedded operating system as a control platform, and adopts a multi-thread mode to realize each processing task, the multi-property and operability are strong, and the intelligence of the whole system is increased, the temperature sensor 620 is screwed on the top of the inner side wall of the control cabinet 200, the microcontroller 610 is electrically connected with the temperature sensor 620, and the temperature sensor 620 is used for monitoring the internal temperature of the control cabinet 200 in real time, and then transmits the detected data signal to the microcontroller 610.

The working principle is as follows: the utility model discloses a when using, conveniently stretch out gyro wheel 420 through telescopic link 410 and gyro wheel 420 cooperation and remove equipment or withdraw gyro wheel 420 and fix equipment through abrasion pad 120, moreover, the steam generator is simple in operation, it is convenient for remove and fix, and microcontroller 610 uses LINUX embedded operating system as control platform, adopt multithreading mode to realize each processing task, variability and maneuverability are stronger, the intelligence of whole system has been increased, temperature sensor 620 and microcontroller 610 cooperation real-time supervision switch board 200 inside temperature, then data signal transmission to microcontroller 610 that will detect, conveniently control radiator fan 520 dispels the heat to switch board 200 inside, the condition that can reduce the power consumption increase that leads to components and parts because of the high temperature takes place, it changes with the real-time tracking charge capacity to set up the cooperation of electricity-saving appliance 300 through microcontroller 610, microcontroller 610 optimizes power supply system's input voltage through controlling each components and parts with the electromagnetic induction mode The voltage is adjusted by adopting an AC-AC direct conversion technology, the voltage of the load is adjusted to be the most suitable value, the waste of voltage and current is reduced, and the practicability is strong.

While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the non-exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.

Claims

1. An electronic engineering distributed power saving apparatus, comprising: base (100), switch board (200), electricity-saving appliance (300), moving mechanism (400), heat dissipation mechanism (500) and control mechanism (600), base (100) lateral wall top rigid coupling switch board (200), electricity-saving appliance (300) are located switch board (200) inside wall, base (100) lateral wall bottom installation moving mechanism (400), heat dissipation mechanism (500) are located switch board (200) lateral wall, control mechanism (600) install in switch board (200).

2. The distributed power saving device of the electronic engineering according to claim 1, wherein the base (100) comprises a mounting groove (110) and a wear pad (120), the mounting groove (110) is formed at each of four corners of the bottom of the outer side wall of the base (100), the wear pad (120) is adhered to the bottom of the outer side wall of the base (100), the wear pad (120) is not arranged at the opening of the mounting groove (110), and the wear pad (120) is a backing plate formed by compounding polyvinyl chloride and a rubber material.

3. The distributed power saving device of claim 1, wherein the control cabinet (200) comprises a plurality of heat dissipation holes (210) and a heat absorbing plate (220), the left side wall and the right side wall of the control cabinet (200) are both provided with the plurality of heat dissipation holes (210), the plurality of heat dissipation holes (210) are linearly arranged at equal intervals along the outer side wall of the control cabinet (200), the plurality of heat dissipation holes (210) are arranged in a downward inclined manner from the inner wall of the control cabinet (200), the inner side wall of the control cabinet (200) is clamped with the heat absorbing plate (220), and the outer surface of the heat absorbing plate (220) is coated with an electroplating coating.

4. The distributed power saving device for electronic engineering according to claim 2, wherein the moving mechanism (400) comprises telescopic rods (410) and rollers (420), the top of the inner side walls of the four mounting grooves (110) are fixedly connected with the telescopic rods (410), and the bottom ends of the four telescopic rods (410) are fixedly connected with the rollers (420).

5. The distributed power saving device for electronic engineering according to claim 1, wherein the control mechanism (600) comprises a microcontroller (610) and a temperature sensor (620), a slot is formed at the bottom of the inner side wall of the control cabinet (200) to be clamped with the microcontroller (610), the temperature sensor (620) is installed at the top of the inner side wall of the control cabinet (200), and the microcontroller (610) is electrically connected with the temperature sensor (620).

6. The distributed power saving device of claim 5, wherein the heat dissipation mechanism (500) comprises a connecting frame (510) and a heat dissipation fan (520), a through hole is formed in the center of the rear side wall of the control cabinet (200), the connecting frame (510) is fixedly connected to the rear side wall of the control cabinet (200) corresponding to the through hole, the heat dissipation fan (520) is installed on the inner side wall of the connecting frame (510), and the heat dissipation fan (520) is electrically connected to the microcontroller (610).

7. The distributed power saving device for electronic engineering according to claim 5, wherein the power saver (300) comprises a wiring port (310), a connecting seat (320) and a protection plate (330), the power saver (300) is fixedly connected to the inner side wall of the control cabinet (200) through the connecting seat (320), the wiring port (310) is arranged at the connecting end of the power saver (300), the protection plate (330) is slidably connected to the outer side wall of the power saver (300), the protection plate (330) is an anti-static plate, and the power saver (300) is electrically connected with the microcontroller (610).