CN212032188U - Passive annular temperature measurement label and temperature measurement end cap subassembly - Google Patents
Passive annular temperature measurement label and temperature measurement end cap subassembly Download PDFInfo
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- CN212032188U CN212032188U CN202020832904.1U CN202020832904U CN212032188U CN 212032188 U CN212032188 U CN 212032188U CN 202020832904 U CN202020832904 U CN 202020832904U CN 212032188 U CN212032188 U CN 212032188U
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Abstract
The utility model discloses a passive annular temperature measurement label and temperature measurement end cap subassembly, including annular substrate, passive RFID temperature measurement chip and fix the arc radiation strip at the annular substrate surface, set up the impedance adjustment window that extends along annular substrate circumference on the arc radiation strip, passive RFID temperature measurement chip welds in impedance adjustment window department. The passive annular temperature measurement tag is easy to install, convenient to debug and simple in structure, and can be used for batch processing factories and applications. The annular substrate enables the whole passive annular temperature measurement label to form a similar half-wave oscillator structure, the length of the arc-shaped radiation strip is adjusted, and the resonant frequency of the passive annular temperature measurement label can be changed. And changing the size of the impedance adjusting window so as to change the input impedance of the arc-shaped radiating strip, so as to be conjugate matched with the impedance of the passive RFID temperature measuring chip.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to a passive annular temperature measurement label and temperature measurement end cap subassembly belongs to rfid temperature measurement field.
[ background of the invention ]
The high-voltage ring main unit is a special electrical connection device which is widely used in industrial and mining enterprises, residential districts, ports, high-rise buildings and other alternating-current 10KV power distribution systems, completes collection and classification of cable lines and has the functions of control measurement and the like. The plug is a main part for connecting a high-voltage cable in the high-voltage ring main unit, and plays roles in connection, insulation, shielding, protection and the like. In practical application, the cable connection part has contact resistance, so that heat is easy to accumulate, and accidents such as explosion or fire and the like are caused due to overhigh temperature. It is therefore highly desirable to monitor the internal temperature of the plug.
At present, the temperature measurement under high pressure environment has the following common methods:
wax sheet temperature measurement technology:
has the advantages of simple structure and low cost. The defects are low accuracy, poor reliability and incapability of realizing real-time monitoring. Moreover, the invisible parts of the circuit breaker contact, the cable joint and the like in the high-voltage cabinet which are easy to heat and run cannot be measured.
Thermal infrared temperature measurement technology:
the method has the advantages of large measurement range, high accuracy and high reliability. The defects are that the equipment is expensive, the manpower is needed for regular patrol and measurement, and the real-time monitoring of the temperature cannot be realized. And for the hidden position of the cable joint, the infrared thermometer can not measure the temperature. In addition, the infrared thermometer is greatly interfered by sunlight and generally needs to measure at night or in rainy days.
The fiber grating temperature measurement technology comprises the following steps:
the grating sheet is used as a temperature sensor and is adhered to the surface of a measured point, and the temperature measuring instrument (a spectrum analyzer) is connected with the temperature sensor through an optical fiber. The defect is that the optical fiber is easy to break and cannot resist high temperature, and after dust is accumulated on the optical fiber, the insulating property of the optical fiber is reduced in a humid environment, so that the optical fiber is subjected to surface discharge, potential safety hazards exist, the workload of installation and debugging is large, and the manufacturing cost is high.
Now along with the development of the RFID technology and the appearance of the temperature measuring chip, the passive wireless monitoring of the temperature at the cable can be realized by combining the RFID technology and the temperature measuring chip, and secondary accidents can be avoided. However, because the cable plug is internally provided with metal parts and the electromagnetic environment is poor, the conventional temperature measurement label is generally used on the surface of the black rubber protective sleeve outside the cable plug, so that the internal temperature of the plug cannot be actually measured, the temperature data has obvious deviation, and the practical significance is very low.
[ Utility model ] content
The utility model aims to solve the technical problem that overcome prior art not enough and provide one kind and can realize real-time temperature measurement, safety, simple structure, low cost's passive annular temperature measurement label and temperature measurement end cap subassembly.
Solve the technical problem, the utility model discloses a following technical scheme:
the utility model provides a passive annular temperature measurement label, includes annular substrate, passive RFID temperature measurement chip and fixes the arc radiation strip at annular substrate surface, sets up the impedance adjustment window that extends along annular substrate circumference on the arc radiation strip, and passive RFID temperature measurement chip welds in impedance adjustment window department.
The utility model has the advantages that:
the passive annular temperature measurement tag is easy to install, convenient to debug and simple in structure, and can be used for batch processing factories and applications. The annular substrate enables the whole passive annular temperature measurement label to form a similar half-wave oscillator structure, the length of the arc-shaped radiation strip is adjusted, and the resonant frequency of the passive annular temperature measurement label can be changed. And changing the size of the impedance adjusting window so as to change the input impedance of the arc-shaped radiating strip, so as to be conjugate matched with the impedance of the passive RFID temperature measuring chip.
The annular substrate is FPC.
Arc radiation strip's shape is convex, and the shape of annular substrate is ring shape, and arc radiation strip sets up with annular substrate is concentric.
The utility model provides a temperature measurement end cap subassembly, includes end cap and passive annular temperature measurement label, and the end cap includes the end cap body and fixes the metal head on the end cap body, and the metal head runs through the centre bore of annular substrate, and the one side that the annular substrate deviates from the arc radiation strip is fixed on the lateral wall of end cap body.
The shape of metal head is the pipe form, and the shape of annular substrate is ring shape, and annular substrate and the coaxial setting of metal head, interval are not less than 5mm between the outer wall of the interior rampart of annular substrate and metal head.
The interval is not more than 1cm between the outer wall of the interior rampart of annular substrate and metal head.
Other features and advantages of the present invention will be disclosed in more detail in the following detailed description and the accompanying drawings.
[ description of the drawings ]
The invention will be further explained with reference to the drawings:
fig. 1 is a first schematic diagram of an explosion of a high-voltage ring main unit according to an embodiment of the present invention;
FIG. 2 is a partially enlarged schematic view of FIG. 1;
fig. 3 is a second schematic diagram of an explosion of the high-voltage ring main unit according to the embodiment of the present invention;
fig. 4 is a schematic view of the passive annular temperature measurement tag according to the embodiment of the present invention.
[ detailed description ] embodiments
The technical solutions of the embodiments of the present invention are explained and explained below with reference to the drawings of the embodiments of the present invention, but the embodiments described below are only preferred embodiments of the present invention, and not all embodiments. Based on the embodiments in the embodiment, other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention.
In the following description, the appearances of the indicating orientation or positional relationship, such as the terms "inner", "outer", "upper", "lower", "left", "right", etc., are only for convenience in describing the embodiments and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the invention.
Example (b):
referring to fig. 1-4, the embodiment provides a high-voltage ring main unit, including the body 3 and the temperature measurement end cap subassembly of waiting to measure the temperature, the temperature measurement end cap subassembly includes end cap and passive annular temperature measurement label, and the passive annular temperature measurement label is installed on the end cap, and the end cap is pegged graft in the mouth of pipe department of waiting to measure the temperature body 3 to set up passive annular temperature measurement label in the body 3 of waiting to measure the temperature position and carry out the temperature measurement.
Specifically, the plug comprises a plug body 11 and a metal head 12 fixed on the plug body 11, wherein the metal head 12 is approximately in a circular tube shape, the plug body 11 is sleeved on the outer wall of the metal head 12, the left end of the metal head 12 is arranged in the plug body 11, and the right end of the metal head 12 is exposed out of the plug body 11.
The passive loop temperature tag includes a loop substrate 212, a passive RFID temperature sensing chip 22, and an arcuate radiating strip 211. The metal head 12 penetrates through a center hole of the annular substrate 212, the left side face of the annular substrate 212 is fixed to the right end face of the plug body 11 through high-temperature-resistant glue in an attaching mode so as to guarantee connection strength, and the arc-shaped radiation strip 211 is fixed to the right side face of the annular substrate 212 in an attaching mode. The annular substrate 212 enables the whole passive annular temperature measurement tag to form a similar half-wave oscillator structure, the length of the arc-shaped radiation strip 211 is adjusted, the resonant frequency of the passive annular temperature measurement tag can be changed, and therefore the resonant frequency is adjusted to be within a UHF frequency range. In addition, the plug body 11 is used as a matrix, the size of the annular substrate 212 is reduced, and the volume of the passive annular temperature measurement tag is reduced. The passive RFID temperature measurement chip 22 wirelessly monitors the temperature measurement position in the temperature measurement pipe body 3.
Preferably, the arc-shaped radiating strip 211 is arc-shaped, the annular substrate 212 is annular, and the arc-shaped radiating strip 211 and the annular substrate 212 are concentrically arranged, so that the radiation capability of the passive annular temperature measurement tag is isotropic in the radial direction of the passive annular temperature measurement tag, and therefore the installation of the plug does not need to consider directionality, and the installation difficulty is reduced.
Preferably, the arc-shaped radiating strip 211 is provided with an impedance adjusting window 213 extending along the circumferential direction of the annular substrate 212, and the passive RFID temperature measuring chip 22 is soldered at the impedance adjusting window 213. The input impedance of the arc-shaped radiating strip 211 is changed by changing the design length of the impedance adjusting window 213 or changing the position of the passive RFID temperature measuring chip 22 on the impedance adjusting window 213 so as to be conjugate-matched with the impedance of the passive RFID temperature measuring chip 22.
In this embodiment the ring substrate 212 and the metal head 12 are arranged coaxially. The distance between the inner annular wall of the annular substrate 212 and the outer wall of the metal head 12 is not too small, so as to ensure higher signal gain and radial radiation performance of the passive annular temperature measurement tag. The distance is not too large, and the passive RFID temperature measuring chip 22 is required to fully sense the temperature of the metal head 12, so that the temperature of a cable heating point is measured.
For the above reasons, the distance between the inner annular wall of the annular substrate 212 and the outer wall of the metal head 12 in this embodiment is between 5mm and 1 mm.
In addition, in the present embodiment, the annular substrate 212 is an FPC that is resistant to high temperature and has good flame retardancy.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and those skilled in the art should understand that the present invention includes but is not limited to the contents described in the drawings and the above specific embodiments. Any modification which does not depart from the functional and structural principles of the present invention is intended to be included within the scope of the claims.
Claims (6)
1. A passive annular temperature measurement label is characterized in that: including annular substrate, passive RFID temperature measurement chip and fix the arc radiation strip at annular substrate surface, set up the impedance adjustment window that extends along annular substrate circumference on the arc radiation strip, passive RFID temperature measurement chip welds in impedance adjustment window department.
2. The passive loop temperature tag of claim 1, wherein: the annular substrate is an FPC.
3. The passive loop temperature tag of claim 1, wherein: the arc-shaped radiation strip is arc-shaped, the annular substrate is circular, and the arc-shaped radiation strip and the annular substrate are concentrically arranged.
4. The utility model provides a temperature measurement end cap subassembly which characterized in that: the passive annular temperature measurement tag comprises a plug and the passive annular temperature measurement tag as claimed in claim 1, 2 or 3, wherein the plug comprises a plug body and a metal head fixed on the plug body, the metal head penetrates through a central hole of an annular substrate, and one surface of the annular substrate, which is far away from an arc-shaped radiation strip, is fixed on the side wall of the plug body.
5. The temperature measuring plug assembly according to claim 4, wherein: the metal head is in a circular tube shape, the annular substrate is in a circular ring shape, the annular substrate and the metal head are coaxially arranged, and the distance between the inner annular wall of the annular substrate and the outer wall of the metal head is not less than 5 mm.
6. The temperature measuring plug assembly according to claim 5, wherein: and the distance between the inner annular wall of the annular substrate and the outer wall of the metal head is not more than 1 cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020832904.1U CN212032188U (en) | 2020-05-19 | 2020-05-19 | Passive annular temperature measurement label and temperature measurement end cap subassembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020832904.1U CN212032188U (en) | 2020-05-19 | 2020-05-19 | Passive annular temperature measurement label and temperature measurement end cap subassembly |
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| CN212032188U true CN212032188U (en) | 2020-11-27 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112903140A (en) * | 2021-01-14 | 2021-06-04 | 深圳市金瑞铭科技有限公司 | Cable multi-point temperature measuring device based on RFID technology |
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2020
- 2020-05-19 CN CN202020832904.1U patent/CN212032188U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112903140A (en) * | 2021-01-14 | 2021-06-04 | 深圳市金瑞铭科技有限公司 | Cable multi-point temperature measuring device based on RFID technology |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: He Xiao Inventor after: Tang Xingfan Inventor after: Liu Jian Inventor after: Zhu Hongfeng Inventor after: Yi Jun Inventor before: He Xiao Inventor before: Tang Xingfan Inventor before: Liu Jian Inventor before: Zhu Hongfeng Inventor before: Yi Jun |
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| CB03 | Change of inventor or designer information |