CN212020440U - Polishing equipment for producing semiconductor packaging integrated block - Google Patents

Abstract

The utility model relates to the technical field of semiconductor packaging integrated block production, in particular to a polishing device for semiconductor packaging integrated block production, which guarantees the fixing effect under the condition of simplifying the structure of a fixing device, improves the practicability, enhances the stability of the semiconductor packaging integrated block after being fixed, improves the protection effect, simultaneously conveniently cleans collected dust and large-particle objects, and improves the use reliability; the dust collecting device comprises a fixing frame, a dust collecting box, a fixing box, a connecting pipe and a fixing device, wherein the output end of a first motor is connected with a polishing piece through an output shaft, and the output end of a second motor is connected with a dust collecting fan through an output shaft; still include two sets of pillars, two sets of buffer seats, support the otter board, hold box, two sets of spacing seats and place the box, fixing device includes three branch of group, two sets of screwed pipes, two sets of threaded rod, two sets of fixed plates and two sets of handles, and the screwed pipe level sets up, and threaded rod one end inserts and the spiral shell dress is inside the screwed pipe, places the box and places at the fixed incasement.

Description

Polishing equipment for producing semiconductor packaging integrated block

Technical Field

The utility model relates to a semiconductor package integrated package production technical field specifically is a semiconductor package integrated package production is with equipment of polishing.

Background

As is well known, polishing the semiconductor package integrated package is an essential link in the production process of the semiconductor package integrated package, and when polishing the semiconductor package integrated package, a corresponding polishing device is often used to polish the semiconductor package integrated package; the present chinese utility model patent with application number "CN 201920656417.1" discloses "a polishing auxiliary device for semiconductor package integrated package production and processing", which is roughly described as: the dust collecting box comprises a fixing frame, a dust collecting box, a fixing box, a connecting pipe and a fixing device, wherein the fixing device is fixed on the left side and the right side of the fixing frame, a lifting mechanism is vertically arranged on the fixing frame and is positioned above the fixing device, the lifting mechanism is connected with a connecting piece, a first motor is arranged in the connecting piece, the output end of the first motor is connected with a polishing piece through an output shaft, the fixing box is arranged at the top of the fixing frame, a mounting frame and a filter screen are arranged in the fixing box, the filter screen is positioned below the fixing plate, a second motor is arranged on the mounting frame, the output end of the second motor is connected with a dust collecting fan through an output shaft, an output port is arranged at the top of the fixing box, one end of the connecting pipe is communicated with the fixing box; when the polishing auxiliary device for producing and processing the semiconductor packaging integrated block is used, the semiconductor packaging integrated block is fixed through the fixing device, then the lifting mechanism is controlled to drive the connecting piece to move downwards until the polishing piece is contacted with the semiconductor packaging integrated block, then the first motor is controlled to drive the polishing piece to rotate, the polishing piece polishes the semiconductor packaging integrated block, meanwhile, the second motor is controlled to drive the dust suction fan to rotate, gas with fine dust generated in the polishing process sequentially passes through the dust suction piece and the connecting pipe to enter the fixing box, the dust is filtered by the filter screen, the filtered gas is discharged from an output port at the top of the fixing box, and large particles generated in the polishing process fall into the dust collection box; this kind of semiconductor package integrated package production and processing is with auxiliary device that polishes discovers in using, and the simple but structure of fixing device fixed principle is more, and the practicality is relatively poor to semiconductor package integrated package is unsettled state after fixed, and fixed steadiness is limited, and it is easy impaired after dropping, inconvenient dust and the large granule thing of collecting clear up simultaneously, and the use reliability is limited.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a to prior art not enough, the utility model provides a guarantee its fixed effect under the condition of retrenching the fixing device structure, improve the practicality, strengthen the steadiness after the semiconductor package integrated circuit piece is fixed, improve the protection effect, conveniently clear up the dust and the large granule thing of collecting simultaneously, improve the semiconductor package integrated circuit piece production of using the reliability and use the equipment of polishing.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: a polishing device for producing semiconductor packaging integrated blocks comprises a fixing frame, a dust collecting box, a fixing box, a connecting pipe and a fixing device, wherein the fixing device is fixed on the left side and the right side of the fixing frame, a lifting mechanism is vertically arranged on the fixing frame and is positioned above the fixing device, the lifting mechanism is connected with a connecting piece, a first motor is arranged in the connecting piece, the output end of the first motor is connected with a polishing piece through an output shaft, the fixing box is arranged at the top of the fixing frame, a mounting frame and a filter screen are arranged in the fixing box, the filter screen is positioned below the fixed plate, the mounting frame is provided with a second motor, the output end of the second motor is connected with the dust absorption fan through an output shaft, the top of the fixed box is provided with an output port, one end of the connecting pipe is communicated with the fixed box, the other end of the connecting pipe penetrates through the fixed frame and is connected with the dust absorption piece, the connecting part of the connecting pipe and the fixed box is positioned below the filter screen, and the dust collecting box is fixed on the inner bottom wall of the fixed frame; the fixing device comprises three groups of supporting rods, two groups of screwed pipes, two groups of threaded rods, two groups of fixing plates and two groups of handles, the screwed pipes are horizontally arranged, the two groups of screwed pipes are respectively and rotatably connected with the left side and the right side of the fixing frame, the handles are positioned outside the fixing frame and connected with one ends of the screwed pipes, one ends of the threaded rods are inserted into and screwed in the screwed pipes, the fixing plates are positioned inside the fixing frame and connected with the threaded rods, the left ends and the right ends of the three groups of supporting rods are respectively connected with the left side wall and the right side wall in the fixing frame, sliding grooves are respectively formed in the top ends of the three groups of supporting rods, sliding blocks are respectively arranged on the front side, the rear side and the middle part of the bottom end of each fixing plate, the three groups of sliding blocks are respectively and slidably mounted in the three groups of sliding grooves, the, two sets of cushion socket are fixed respectively on two sets of pillar tops, and the contact of lateral wall in the supporting web plate lateral wall and the fixed frame second region, and the supporting web plate bottom left and right sides is connected with the top output of two sets of cushion sockets respectively, place the box and place in fixed incasement, and the connecting pipe is located places the box top, it places in the collection dirt box to hold the box to all be provided with the handle holding the box and placing the box front end, hold the box and place the box top and all be provided with and hold the groove, two sets of spacing seats are fixed respectively on left side wall and interior right side wall in fixed case, and the filter screen is fixed at the second motor through two sets of spacing seats and is placed between the box, and the side contacts bottom the second.

Preferably, spacing seat includes spacing board, backup pad, spacing spring assembly and lower limiting plate, goes up spacing board and backup pad and all fixes on fixed incasement inside wall, spacing spring assembly fixes in the backup pad on the side, and lower limiting plate fixes on the top output of supporting spring assembly, just the side contact on the filter screen top outside and the bottom outside respectively with last spacing board downside and lower limiting plate.

Preferably, the buffer seat comprises a buffer spring group and a buffer plate, the buffer spring group is fixed at the top end of the strut, the buffer plate is fixed at the top output end of the buffer spring group, and the top end of the buffer plate is connected with the outer side of the bottom end of the supporting screen plate.

Preferably, the dust collecting box comprises a box body and a feeding hopper, a placing groove is formed in the front end of the box body, the containing box is inserted into the placing groove, the feeding hopper is fixed to the top end of the box body, and the feeding hopper is communicated with the containing groove.

Preferably, the anti-skid device further comprises two sets of anti-skid pads, and the two sets of anti-skid pads are respectively fixed on the two sets of fixing plates.

Preferably, the device further comprises a protection screen plate, and the protection screen plate is fixed on the output port.

Preferably, the fixing frame further comprises four groups of rubber pads which are respectively fixed on the left front side, the left rear side, the right front side and the right rear side of the bottom end of the fixing frame.

(III) advantageous effects

Compared with the prior art, the utility model provides a semiconductor package integrated package production is with equipment of polishing possesses following beneficial effect:

1. according to the polishing equipment for producing the semiconductor packaging integrated block, the fixing device is simplified into the three groups of supporting rods, the two groups of threaded pipes, the two groups of threaded rods, the two groups of fixing plates and the two groups of handles, so that workers can rotate the two groups of handles to drive the two groups of threaded pipes to rotate, the two groups of threaded rods drive the two groups of fixing plates to move left and right through the threaded structures, the two groups of fixing plates can clamp and fix the semiconductor packaging integrated block, meanwhile, the semiconductor packaging integrated block can be supported through the supporting rods during fixing, the stability of the semiconductor packaging integrated block after fixing is enhanced, meanwhile, the semiconductor packaging integrated block which accidentally drops can be contained through the supporting net plate, the buffer effect of the semiconductor packaging integrated block during dropping is enhanced through the buffer seat, and the protection effect is improved;

2. this semiconductor package integrated package production is with equipment of polishing, can carry out the splendid attire to the dust and the large granule thing of collecting through placing the box and holding the box, and take out from fixed case and dust collecting box in respectively through will placing the box, so that clear up the dust and the large granule thing of collecting, when filtering the dust through the filter screen, the vibration effect of accessible second motor makes the filter screen vibrate under the drive of second motor, make the dust of filter screen downside adhesion can drop and place in the box, use reliability is improved.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the structure between the fixing box and the filter net and the limiting seat;

FIG. 3 is a schematic top view of the fixing device;

FIG. 4 is a right side view of the structure between the pillar and the cushion.

In the figure: 1. a fixing frame; 2. a dust collecting box; 3. a fixed box; 4. a connecting pipe; 5. a fixing device; 6. a lifting mechanism; 7. a first motor; 8. polishing the workpiece; 9. a second motor; 10. a filter screen; 11. a dust collection member; 12. a pillar; 13. a buffer seat; 14. supporting the screen plate; 15. a containing box; 16. a limiting seat; 17. placing the box; 18. a strut; 19. a threaded pipe; 20. a threaded rod; 21. a fixing plate; 22. a handle; 23. a slider; 24. a handle; 25. an upper limiting plate; 26. a support plate; 27. a limiting spring set; 28. a buffer spring group; 29. a buffer plate; 30. a box body; 31. a feed hopper; 32. a non-slip mat; 33. a protective mesh plate; 34. and (7) a rubber pad.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, a polishing apparatus for producing semiconductor package integrated package, comprising a fixing frame 1, a dust collecting box 2, a fixing box 3, a connecting pipe 4 and a fixing device 5, wherein the fixing device 5 is fixed on the left and right sides of the fixing frame 1, a lifting mechanism 6 is vertically arranged on the fixing frame 1, the lifting mechanism 6 is positioned above the fixing device 5, the lifting mechanism 6 is connected with a connecting piece, a first motor 7 is arranged in the connecting piece, the output end of the first motor 7 is connected with a polishing piece 8 through an output shaft, the fixing box 3 is arranged on the top of the fixing frame 1, a mounting frame and a filter screen 10 are arranged in the fixing box 3, the filter screen 10 is positioned below a fixing plate 21, a second motor 9 is arranged on the mounting frame, the output end of the second motor 9 is connected with a dust collecting fan through an output shaft, the top of the fixing box 3 is provided with an, the connecting part of the connecting pipe 4 and the fixed box 3 is positioned below the filter screen 10, and the dust collecting box 2 is fixed on the inner bottom wall of the fixed frame 1; the fixing device comprises three groups of supporting rods (18), two groups of screwed pipes (19), two groups of threaded rods (20), two groups of fixing plates (21) and two groups of handles (22), wherein the screwed pipes (19) are horizontally arranged, the two groups of screwed pipes (19) are respectively and rotatably connected with the left side and the right side of the fixing frame (1), the handles (22) are positioned outside the fixing frame (1), one ends of the threaded rods (20) are inserted into and screwed in the screwed pipes (19), the fixing plates (21) are positioned inside the fixing frame (1), the fixing plates (21) are connected with the threaded rods (20), the left ends and the right ends of the three groups of supporting rods (18) are respectively connected with the left side wall and the right side wall inside the fixing frame (1), sliding grooves are respectively arranged at the top ends of the three groups of supporting rods (18), sliding blocks (23) are respectively arranged at the front side, the rear side and the middle, the two groups of handles 22 are rotated to drive the two groups of threaded pipes 19 to rotate, so that the two groups of threaded rods 20 drive the two groups of fixing plates 21 to move left and right through the threaded structures, so that the two groups of fixing plates 21 clamp and fix the semiconductor package integrated blocks, and simultaneously, the semiconductor package integrated blocks can be supported through the supporting rods 18 during fixing, the stability of the fixed semiconductor package integrated blocks is enhanced, the two groups of supporting columns 12 are respectively fixed on the left and right sides of the bottom wall in the fixing frame 1, the two groups of buffer seats 13 are respectively fixed at the top ends of the two groups of supporting columns 12, the outer side wall of the supporting screen plate 14 is contacted with the inner side wall in the lower half area of the fixing frame 1, the left and right sides of the bottom end of the supporting screen plate 14 are respectively connected with the top output ends of the two groups of buffer seats 13, the carelessly dropped, the placing box 17 is placed in the fixed box 3, the connecting pipe 4 is positioned above the placing box 17, the placing box 15 is placed in the dust collecting box 2, the handles 24 are arranged at the front ends of the placing box 15 and the placing box 17, the top ends of the placing box 15 and the placing box 17 are respectively provided with a containing groove, the placing box 17 and the placing box 15 can contain collected dust and large granular objects, the placing box 17 and the placing box 15 are respectively taken out of the fixed box 3 and the dust collecting box 2 to clean the collected dust and large granular objects, two groups of limiting seats 16 are respectively fixed on the left side wall and the right side wall in the fixed box, the filter screen 10 is fixed between the second motor 9 and the placing box 17 through the two groups of limiting seats 16, the upper side surface of the filter screen 10 is contacted with the bottom end of the second motor 9, the filter screen 10 is driven by the second motor 9 to vibrate through the vibration effect of the second motor 9, the dust adhered to the lower side surface of the filter screen 10 can fall into the placing box 17, the limiting seat 16 comprises an upper limiting plate 25, a supporting plate 26, a limiting spring set 27 and a lower limiting plate, the upper limiting plate 25 and the supporting plate 26 are both fixed on the inner side wall of the fixing box 3, the limiting spring set 27 is fixed on the upper side surface of the supporting plate 26, the lower limiting plate is fixed on the top output end of the supporting spring set, the outer side of the top end and the outer side of the bottom end of the filter screen 10 are respectively in contact with the lower side surface of the upper limiting plate 25 and the upper side surface of the lower limiting plate, the filter screen 10 can be movably fixed in the fixing box 3, the filter screen 10 can vibrate up and down under the action of a spring, the buffer seat 13 comprises a buffer spring set 28 and a buffer plate 29, the buffer spring set 28 is fixed at the top end of the support column 12, the buffer plate 29, the spring action can enhance the buffering effect of the supporting screen plate 14, the dust collecting box 2 comprises a box body 30 and a feed hopper 31, the front end of the box body 30 is provided with a placing groove, the containing box 15 is inserted into the placing groove, the feed hopper 31 is fixed at the top end of the box body 30, and feeder hopper 31 communicates with each other with holding the groove, large granule thing accessible feeder hopper 31 is imported and is collected in the box 15 that holds of box body 30 inside, still include two sets of slipmats 32, two sets of slipmats 32 are fixed respectively on two sets of fixed plates 21, improve the fixed effect of fixed plate 21, still include protection otter board 33, protection otter board 33 is fixed on the delivery outlet, the reinforcing is to delivery outlet and the inside protection effect of fixed case 3, still include four groups of rubber pads 34, four groups of rubber pads 34 are fixed respectively in fixed frame 1 bottom left front side, left rear side, on right front side and the right rear side, the supporting effect and the buffering shock attenuation effect of fixed frame 1 are strengthened.

A polishing device for producing a semiconductor packaging integrated block is characterized in that when the polishing device is used, the semiconductor packaging integrated block is firstly placed between a support rod 18 and two groups of fixing plates 21, then two groups of handles 22 are rotated to drive two groups of threaded pipes 19 to rotate, two groups of threaded rods 20 drive the two groups of fixing plates 21 to move through a threaded structure until two groups of anti-slip pads 32 are in close contact with the semiconductor packaging integrated block, the two groups of fixing plates 21 clamp and fix the semiconductor packaging integrated block, the semiconductor packaging integrated block is supported through the support rod 18 when being fixed, the stability of the fixed semiconductor packaging integrated block is enhanced, after the fixing is completed, a lifting mechanism 6 is controlled to drive a connecting piece to move downwards until the polishing piece 8 is in contact with the semiconductor packaging integrated block, then a first motor 7 is controlled to drive the polishing piece 8 to rotate, and the polishing piece 8 is used for polishing the semiconductor packaging integrated, meanwhile, the second motor 9 is controlled to drive the dust absorption fan to rotate, gas with fine dust generated in the polishing process sequentially enters the fixed box 3 through the dust absorption part 11 and the connecting pipe 4, the dust is filtered by the filter screen 10, the filter screen 10 vibrates under the driving of the second motor 9, dust adhered to the lower side surface of the filter screen 10 can fall into the placing box 17 to be collected, the filtered gas is discharged from an output port at the top of the fixed box 3, and large particles generated in the polishing process are input into the placing box 15 in the box body 30 through the feed hopper 31 to be collected; meanwhile, in the process, the carelessly dropped semiconductor packaging integrated blocks can be contained through the supporting screen plate 14, the buffering effect when the semiconductor packaging integrated blocks drop is enhanced through the spring action of the buffering seat 13, and the protection effect is improved; if will clear up the dust and the large granule thing of collecting, then can hold handle 24 will place box 17 and hold box 15 and take out from fixation box 3 and dust collection box 2 respectively, then to place box 17 and hold the dust and the large granule thing of splendid attire in the box 15 clean can.

The electrical components presented in this document are electrically connected to an external master controller and 220V mains, and the master controller may be a conventional known device for controlling a computer or the like, and in the description in this document, the terms "connected" and "connected" should be understood in a broad sense unless otherwise explicitly specified and limited.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. A polishing device for producing semiconductor packaging integrated blocks comprises a fixing frame (1), a dust collecting box (2), a fixing box (3), a connecting pipe (4) and a fixing device (5), wherein the fixing device (5) is fixed on the left side and the right side of the fixing frame (1), a lifting mechanism (6) is vertically arranged on the fixing frame (1), the lifting mechanism (6) is positioned above the fixing device (5), the lifting mechanism (6) is connected with a connecting piece, a first motor (7) is arranged in the connecting piece, the output end of the first motor (7) is connected with a polishing piece (8) through an output shaft, the fixing box (3) is arranged at the top of the fixing frame (1), a mounting frame and a filter screen (10) are arranged in the fixing box (3), the filter screen (10) is positioned below a fixing plate (21), a second motor (9) is arranged on the mounting frame, the output end of the second motor (9), the top of the fixed box (3) is provided with an output port, one end of the connecting pipe (4) is communicated with the fixed box (3), the other end of the connecting pipe penetrates through the fixed box (1) and is connected with the dust collecting part (11), the communicated part of the connecting pipe (4) and the fixed box (3) is positioned below the filter screen (10), and the dust collecting box (2) is fixed on the inner bottom wall of the fixed box (1); the method is characterized in that: the fixing device comprises two groups of struts (12), two groups of buffer seats (13), a supporting screen plate (14), a containing box (15), two groups of limiting seats (16) and a placing box (17), wherein the fixing device (5) comprises three groups of supporting rods (18), two groups of threaded pipes (19), two groups of threaded rods (20), two groups of fixing plates (21) and two groups of handles (22), the threaded pipes (19) are horizontally arranged, the two groups of threaded pipes (19) are respectively and rotatably connected with the left side and the right side of the fixing frame (1), the handles (22) are positioned on the outer side of the fixing frame (1), the handles (22) are connected with one ends of the threaded pipes (19), one ends of the threaded rods (20) are inserted into and screwed in the threaded pipes (19), the fixing plates (21) are positioned on the inner side of the fixing frame (1), the fixing plates (21) are connected with the threaded rods (20), the left end and the right end of the three groups of supporting rods, sliding grooves are formed in the top ends of the three groups of supporting rods (18), sliding blocks (23) are arranged on the front side, the rear side and the middle portion of the bottom end of the fixing plate (21), the three groups of sliding blocks (23) are respectively installed in the three groups of sliding grooves, the two groups of supporting columns (12) are respectively fixed on the left side and the right side of the bottom wall of the fixing frame (1), the two groups of buffer seats (13) are respectively fixed on the top ends of the two groups of supporting columns (12), the outer side wall of the supporting screen plate (14) is in contact with the inner side wall of the lower half area of the fixing frame (1), the left side and the right side of the bottom end of the supporting screen plate (14) are respectively connected with the top output ends of the two groups of buffer seats (13), the placing box (17) is placed in the fixing box (3), the connecting pipe (4) is positioned above the placing box (17), the placing box (15) is placed in, hold box (15) and place box (17) top and all be provided with and hold the groove, two sets of spacing seats (16) are fixed respectively in fixed box on left side wall and the interior right side wall, and filter screen (10) are fixed between second motor (9) and place box (17) through two sets of spacing seats (16), and the side contacts bottom second motor (9) on filter screen (10).

2. The grinding apparatus for semiconductor package integrated package production according to claim 1, wherein: spacing seat (16) are including last limiting plate (25), backup pad (26), spacing spring assembly (27) and lower limiting plate, go up limiting plate (25) and backup pad (26) and all fix on fixed case (3) inside wall, spacing spring assembly (27) are fixed on backup pad (26) up side, and lower limiting plate fixes on the top output of supporting spring assembly, just filter screen (10) top outside and bottom outside respectively with last limiting plate (25) downside and lower limiting plate side contact.

3. The grinding apparatus for semiconductor package integrated package production according to claim 2, wherein: buffer seat (13) are including buffer spring group (28) and buffer board (29), and buffer spring group (28) are fixed on pillar (12) top, buffer board (29) are fixed on the top output of buffer spring group (28), and buffer board (29) top is connected with support otter board (14) bottom outside.

4. The polishing apparatus for semiconductor package integrated package production according to claim 3, wherein: the dust collection box (2) comprises a box body (30) and a feed hopper (31), a placing groove is formed in the front end of the box body (30), the containing box (15) is inserted into the placing groove, the feed hopper (31) is fixed to the top end of the box body (30), and the feed hopper (31) is communicated with the containing groove.

5. The polishing apparatus for semiconductor package integrated package production as recited in claim 4, wherein: the anti-skid device further comprises two groups of anti-skid pads (32), wherein the two groups of anti-skid pads (32) are respectively fixed on the two groups of fixing plates (21).

6. The polishing apparatus for semiconductor package integrated package production as recited in claim 5, wherein: the device also comprises a protective screen plate (33), wherein the protective screen plate (33) is fixed on the output port.

7. The polishing apparatus for semiconductor package integrated package production as recited in claim 6, wherein: still include four groups of rubber pads (34), four groups of rubber pads (34) are fixed respectively on fixed frame (1) bottom left front side, left rear side, right front side and right rear side.

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