CN212012590U - Heat dissipation packaging structure of crystal oscillator - Google Patents
Heat dissipation packaging structure of crystal oscillator Download PDFInfo
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- CN212012590U CN212012590U CN202020854549.8U CN202020854549U CN212012590U CN 212012590 U CN212012590 U CN 212012590U CN 202020854549 U CN202020854549 U CN 202020854549U CN 212012590 U CN212012590 U CN 212012590U
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Abstract
The utility model discloses a heat dissipation packaging structure of crystal oscillator, which comprises a crystal oscillator body and a shell, wherein the lower end of the crystal oscillator body is provided with an installation supporting plate, an operator can fix the crystal oscillator body by utilizing an installation bolt and a fastening nut, the outer part of a connecting joint is provided with a sheath which can protect the connecting joint, the inner part of the crystal oscillator body is provided with a heat dissipation plate, the heat dissipation effect of the crystal oscillator body can be improved by a heat dissipation groove and a heat dissipation adhesive on the surface of the heat dissipation plate, the surface of the crystal oscillator body is provided with a vent which can form air convection with the external environment, hot air is conveniently discharged out of the crystal oscillator body, the heat dissipation effect is good, the use of the crystal oscillator body is prevented from being influenced by higher temperature, the lower end of an upper protection cover is provided with an installation block which is arranged at the upper end of the crystal oscillator body, and the installation block is matched with the connection block, the, and a dust screen is arranged on one side of the ventilation opening, so that air can be filtered.
Description
Technical Field
The utility model relates to a crystal oscillator heat dissipation equipment technical field specifically is a crystal oscillator's heat dissipation packaging structure.
Background
A crystal oscillator is a crystal oscillator in which a thin plate (referred to simply as a wafer) is cut from a quartz crystal at a certain azimuth angle, a quartz crystal resonator (referred to simply as a quartz crystal or a crystal oscillator), and a crystal element having an LC circuit built in a package is referred to as a crystal oscillator.
Along with the development of science and technology, the use of crystal oscillator is more and more extensive, but when the crystal oscillator body used, long-time the use can produce higher temperature, and higher temperature can influence the use of crystal oscillator body, and the crystal oscillator body of being not convenient for installs, and the result of use is not good.
To the above problem, the utility model provides a heat dissipation packaging structure of crystal oscillator.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat dissipation packaging structure of crystal oscillator possesses the convenience and dispels the heat to the crystal oscillator body, does not influence the use of crystal oscillator body, is convenient for install, the better advantage of protecting effect to the problem in the background art has been solved.
In order to achieve the above object, the utility model provides a following technical scheme: a heat dissipation packaging structure of a crystal oscillator comprises a crystal oscillator body and a shell, wherein the shell is arranged on one side of the crystal oscillator body, the crystal oscillator body comprises a ventilation opening, a mounting supporting plate, a connecting joint, a connecting block and a heat dissipation plate, the ventilation opening is arranged on the surface of the crystal oscillator body, the mounting supporting plate is arranged at the lower end of the crystal oscillator body, the connecting joint is fixedly arranged at the lower end of the crystal oscillator body, the connecting block is arranged at the upper end of the crystal oscillator body, and the heat dissipation plate is arranged inside the crystal oscillator body;
the shell comprises an upper protective cover and a dustproof net, the upper protective cover is arranged at the upper end of the crystal oscillator body, and the dustproof net is arranged on one side of the crystal oscillator body.
Preferably, the mounting support plate comprises a mounting bolt, a fastening nut and a protective layer, the mounting bolt penetrates through the mounting support plate, the fastening nut is in threaded connection with the mounting bolt, and the protective layer is arranged at the lower end of the mounting support plate.
Preferably, the outer surface of the connection joint is provided with a sheath.
Preferably, the heating panel includes the radiating groove and the heat dissipation glues, and the radiating groove sets up the surface at the heating panel, and the heat dissipation glues the setting in one side of radiating groove.
Preferably, go up the protection casing and include enhancement layer and installation piece, the enhancement layer sets up the inner wall at last protection casing, and the installation piece sets up the lower extreme at last protection casing, and installation piece and connecting block phase-match.
Preferably, the connecting blocks are arranged in two groups, and the two groups of connecting blocks are symmetrically distributed about the longitudinal center line of the crystal oscillator body.
Preferably, the housing is a member made of a ceramic material.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model provides a heat dissipation packaging structure of crystal oscillator is provided with the installation layer board at the lower extreme of crystal oscillator body, and operating personnel can fix the crystal oscillator body through utilizing construction bolt and fastening nut, and is provided with the protective layer at the lower extreme of installation layer board, can reduce the wearing and tearing to the circuit board, and is provided with the sheath in attach fitting's outside, can protect attach fitting.
2. The utility model provides a heat dissipation packaging structure of crystal oscillator is provided with the heating panel in the inside of crystal oscillator body, and through the radiating groove on heating panel surface and heat dissipation glue, can improve the radiating effect of crystal oscillator body, and be provided with the vent on the surface of crystal oscillator body, can form the air convection with external environment, conveniently discharge the crystal oscillator body with steam, the radiating effect is good, avoids the higher use that influences the crystal oscillator body of temperature.
3. The utility model provides a heat dissipation packaging structure of crystal oscillator is provided with the installation piece at the lower extreme of last protection casing, and the connecting block setting is in the upper end of crystal oscillator body, and installation piece and connecting block phase-match, can make last protection casing fixed mounting in the upper end of crystal oscillator body, and is provided with the dust screen in one side of vent, can filter by the air, prevents that impurity such as dust from getting into.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the structure of the housing of the present invention;
FIG. 3 is a schematic structural diagram of the crystal oscillator body of the present invention;
fig. 4 is an enlarged view of a point a in fig. 2 according to the present invention;
fig. 5 is a schematic view of the heat dissipation plate structure of the present invention.
In the figure: 1. a crystal oscillator body; 11. a vent; 12. mounting a supporting plate; 121. installing a bolt; 122. fastening a nut; 123. a protective layer; 13. connecting a joint; 131. a sheath; 14. connecting blocks; 15. a heat dissipation plate; 151. a heat sink; 152. heat dissipation glue; 2. a housing; 21. an upper protective cover; 211. a reinforcing layer; 212. mounting blocks; 22. a dust screen.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 and 2, a heat dissipation package structure of a crystal oscillator includes a crystal oscillator body 1 and a housing 2, the housing 2 is disposed on one side of the crystal oscillator body 1, the crystal oscillator body 1 includes a vent 11, a mounting plate 12, a connection joint 13, a connection block 14 and a heat dissipation plate 15, the vent 11 is disposed on the surface of the crystal oscillator body 1, and can form air convection with the external environment, so as to conveniently discharge hot air out of the crystal oscillator body 1, the heat dissipation effect is good, and avoid the influence of high temperature on the use of the crystal oscillator body 1, the mounting plate 12 is disposed at the lower end of the crystal oscillator body 1, the connection joint 13 is fixedly mounted at the lower end of the crystal oscillator body 1, the connection block 14 is disposed at the upper end of the crystal oscillator body 1, and the heat dissipation plate 15; the shell 2 comprises an upper protective cover 21 and a dustproof net 22, the upper protective cover 21 is arranged at the upper end of the crystal oscillator body 1, and the dustproof net 22 is arranged on one side of the crystal oscillator body 1.
Referring to fig. 3, the mounting plate 12 includes a mounting bolt 121, a fastening nut 122 and a protection layer 123, the mounting bolt 121 penetrates through the mounting plate 12, the fastening nut 122 is in threaded connection with the mounting bolt 121, and the protection layer 123 is disposed at the lower end of the mounting plate 12; the outer surface of the connection joint 13 is provided with a sheath 131; the mounting support plate 12 is provided at the lower end of the crystal oscillator body 1, the operator can fix the crystal oscillator body 1 by using the mounting bolt 121 and the fastening nut 122, the protective layer 123 is provided at the lower end of the mounting support plate 12, abrasion to the circuit board can be reduced, and the protective cover 131 is provided outside the joint 13, so that the joint 13 can be protected.
Referring to fig. 4, the upper shield 21 includes a reinforcing layer 211 and a mounting block 212, the reinforcing layer 211 is disposed on an inner wall of the upper shield 21, the mounting block 212 is disposed at a lower end of the upper shield 21, and the mounting block 212 is matched with the connecting block 14; two groups of connecting blocks 14 are arranged, and the two groups of connecting blocks 14 are symmetrically distributed about the longitudinal center line of the crystal oscillator body 1; the housing 2 is a member made of a ceramic material; the lower extreme of last protection casing 21 is provided with installation piece 212, and connecting block 14 sets up the upper end at crystal oscillator body 1, and installation piece 212 and connecting block 14 phase-match can make upper protection casing 21 fixed mounting in the upper end of crystal oscillator body 1, and is provided with dust screen 22 in one side of vent 11, can filter by the air, prevents that impurity such as dust from getting into.
Referring to fig. 5, the heat dissipation plate 15 includes a heat dissipation groove 151 and a heat dissipation adhesive 152, the heat dissipation groove 151 is disposed on the surface of the heat dissipation plate 15, and the heat dissipation adhesive 152 is disposed on one side of the heat dissipation groove 151; the heat dissipation plate 15 is provided inside the crystal oscillator body 1, and the heat dissipation effect of the crystal oscillator body 1 can be improved by the heat dissipation grooves 151 and the heat dissipation paste 152 on the surface of the heat dissipation plate 15.
In summary, the following steps: the heat dissipation packaging structure of the crystal oscillator is characterized in that the lower end of the crystal oscillator body 1 is provided with the mounting support plate 12, an operator can fix the crystal oscillator body 1 by utilizing the mounting bolts 121 and the fastening nuts 122, the lower end of the mounting support plate 12 is provided with the protective layer 123 which can reduce the abrasion to a circuit board, the outer part of the connecting joint 13 is provided with the sheath 131 which can protect the connecting joint 13, the inside of the crystal oscillator body 1 is provided with the heat dissipation plate 15, the heat dissipation effect of the crystal oscillator body 1 can be improved by the heat dissipation groove 151 and the heat dissipation glue 152 on the surface of the heat dissipation plate 15, the surface of the crystal oscillator body 1 is provided with the vent 11 which can form air convection with the external environment, the hot air can be conveniently discharged out of the crystal oscillator body 1, the heat dissipation effect is good, the use of the crystal oscillator body 1 is prevented from being influenced by higher temperature, the lower, the connecting block 14 sets up in the upper end of crystal oscillator body 1, and installs piece 212 and connecting block 14 phase-match, can make upper shield 21 fixed mounting in the upper end of crystal oscillator body 1, and is provided with dust screen 22 in one side of vent 11, can filter by the air, prevents that impurity such as dust from getting into.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a heat dissipation packaging structure of crystal oscillator, includes crystal oscillator body (1) and shell (2), and shell (2) set up the one side at crystal oscillator body (1), its characterized in that: the crystal oscillator comprises a crystal oscillator body (1) and is characterized in that the crystal oscillator body (1) comprises a ventilation opening (11), a mounting supporting plate (12), a connecting joint (13), a connecting block (14) and a heat dissipation plate (15), the ventilation opening (11) is arranged on the surface of the crystal oscillator body (1), the mounting supporting plate (12) is arranged at the lower end of the crystal oscillator body (1), the connecting joint (13) is fixedly arranged at the lower end of the crystal oscillator body (1), the connecting block (14) is arranged at the upper end of the crystal oscillator body (1), and the heat dissipation plate (15) is arranged inside the crystal oscillator body (1); the shell (2) comprises an upper protective cover (21) and a dustproof net (22), the upper protective cover (21) is arranged at the upper end of the crystal oscillator body (1), and the dustproof net (22) is arranged on one side of the crystal oscillator body (1).
2. The heat dissipation package structure of a crystal oscillator according to claim 1, wherein: the mounting support plate (12) comprises a mounting bolt (121), a fastening nut (122) and a protective layer (123), the mounting bolt (121) penetrates through the mounting support plate (12), the fastening nut (122) is in threaded connection with the mounting bolt (121), and the protective layer (123) is arranged at the lower end of the mounting support plate (12).
3. The heat dissipation package structure of a crystal oscillator according to claim 1, wherein: the outer surface of the connecting joint (13) is provided with a sheath (131).
4. The heat dissipation package structure of a crystal oscillator according to claim 1, wherein: the heat dissipation plate (15) comprises a heat dissipation groove (151) and heat dissipation glue (152), wherein the heat dissipation groove (151) is formed in the surface of the heat dissipation plate (15), and the heat dissipation glue (152) is arranged on one side of the heat dissipation groove (151).
5. The heat dissipation package structure of a crystal oscillator according to claim 1, wherein: go up protection casing (21) including enhancement layer (211) and installation piece (212), enhancement layer (211) set up the inner wall at last protection casing (21), and installation piece (212) set up the lower extreme at last protection casing (21), and installation piece (212) and connecting block (14) phase-match.
6. The heat dissipation package structure of a crystal oscillator according to claim 1, wherein: the two groups of connecting blocks (14) are arranged, and the two groups of connecting blocks (14) are symmetrically distributed about the longitudinal central line of the crystal oscillator body (1).
7. The heat dissipation package structure of a crystal oscillator according to claim 1, wherein: the housing (2) is made of a ceramic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020854549.8U CN212012590U (en) | 2020-05-21 | 2020-05-21 | Heat dissipation packaging structure of crystal oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020854549.8U CN212012590U (en) | 2020-05-21 | 2020-05-21 | Heat dissipation packaging structure of crystal oscillator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212012590U true CN212012590U (en) | 2020-11-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020854549.8U Active CN212012590U (en) | 2020-05-21 | 2020-05-21 | Heat dissipation packaging structure of crystal oscillator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212012590U (en) |
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2020
- 2020-05-21 CN CN202020854549.8U patent/CN212012590U/en active Active
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| GR01 | Patent grant | ||
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| TR01 | Transfer of patent right |
Effective date of registration: 20220523 Address after: 523000 building A1, Huazhi electronic equipment intelligent manufacturing park, No. 38, Jingfu East Road, Yangwu village, Dalang Town, Dongguan City, Guangdong Province Patentee after: Jiagao Electronics (Dongguan) Co.,Ltd. Address before: 518103 Juyuan Industrial Zone, qiaotang Road, Tangwei community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: Jiagao Electronics (Shenzhen) Co.,Ltd. |