CN211999960U - Galvanizing bath with plating solution temperature control device - Google Patents

Galvanizing bath with plating solution temperature control device Download PDF

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Publication number
CN211999960U
CN211999960U CN202020570978.2U CN202020570978U CN211999960U CN 211999960 U CN211999960 U CN 211999960U CN 202020570978 U CN202020570978 U CN 202020570978U CN 211999960 U CN211999960 U CN 211999960U
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plating solution
plating
tank
cooling
temperature
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CN202020570978.2U
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Chinese (zh)
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李承义
秦存伟
朱莉松
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Taicang Shimei Electroplating Co ltd
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Taicang Shimei Electroplating Co ltd
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Abstract

The utility model relates to the technical field of galvanizing equipment, in particular to a galvanizing bath with a plating solution temperature control device, which comprises a galvanizing bath, wherein a first temperature sensor is arranged in the galvanizing bath, and the first temperature sensor is connected with a controller and is used for detecting the temperature in the galvanizing bath; a cooling jacket is sleeved on the plating solution pool, and a cavity is formed between the cooling jacket and the outer wall of the plating solution pool; the cooling tank is connected with a cooling circulating pump, the water outlet end of the cooling circulating pump is connected with the water inlet of the cooling jacket through a pipeline, and the water outlet of the cooling jacket is connected with a recovery tank through a pipeline. When the temperature of the plating solution is higher than a set value, cold water in the cooling tank flows into the cavity, so that the plating solution in the plating tank can be cooled, and the electroplating quality of a workpiece is prevented from being influenced by overhigh temperature of the plating solution. When the temperature of the plating solution is lower than a set value, the cooling circulating pump stops working, the temperature of the plating solution automatically rises, and the automatic control of the temperature of the plating solution can be realized, so that the electroplating quality of workpieces can be effectively improved.

Description

Galvanizing bath with plating solution temperature control device
Technical Field
The utility model belongs to the technical field of the galvanizing unit technique and specifically relates to a galvanizing bath with plating solution temperature control device is related to.
Background
In order to improve the corrosion resistance of steel, it is usually necessary to perform a galvanization treatment on the surface of the steel, and the surface of the steel is covered with a layer of metallic zinc. Electrogalvanizing, also known as cold galvanizing, is a process of forming a uniform, dense, well-bonded metal or alloy deposit on the surface of a workpiece by electrolysis.
Because zinc is not easy to change in dry air and a basic zinc carbonate film can be generated in a humid environment, the film can protect internal parts from being corroded and damaged, even if a zinc layer is damaged by some factor, the zinc and steel can be combined for a period of time to form a micro battery, and a steel substrate becomes a cathode to be protected.
In the processing process, the temperature of the plating solution in the plating solution production line is one of important parameters to be controlled in the electroplating process, and if the temperature fluctuation is large, the electroplating quality of a workpiece can be directly influenced. Whether the plating solution is a normal-temperature plating solution, a heating plating solution or a cooling plating solution, the temperature of the plating solution needs to be detected in time to ensure that the plating solution works within a temperature range specified by the process, so that the normal operation of the electroplating process is ensured.
In the actual production process, manual control equipment is mostly adopted to adjust the temperature of the plating solution, a mechanical meter is used for detecting the temperature, an operator needs to observe the temperature of the plating solution at any time and then manually operate to control the temperature; the manual control plating solution temperature has not only increased operating personnel's work load, moreover because the interference of human factor leads to plating solution temperature fluctuation, is difficult to realize the accurate control of plating solution temperature, seriously influences the electroplating quality of work piece.
SUMMERY OF THE UTILITY MODEL
To the deficiency that prior art exists, one of the purposes of the utility model is to provide a galvanizing bath with plating solution temperature control device, it can effectively improve the electroplating quality of work piece.
The above utility model discloses an above-mentioned utility model purpose can realize through following technical scheme: a galvanizing pool with a plating solution temperature control device comprises a plating pool, wherein a first temperature sensor is arranged in the plating pool, and the first temperature sensor is connected with a controller and is used for detecting the temperature in the plating pool in real time; a cooling sleeve is sleeved on the outer wall of the plating bath, a cavity is formed between the cooling sleeve and the outer wall of the plating bath, and a water inlet and a water outlet which are communicated with the cavity are formed in the cooling sleeve; one side of the plating liquid pool is provided with a cooling pool, the cooling pool is connected with a cooling circulating pump, the controller is connected with the cooling circulating pump and is used for controlling the on-off of the cooling circulating pump, the water outlet end of the cooling circulating pump is connected with the water inlet of the cooling jacket through a pipeline, and the water outlet of the cooling jacket is connected with a recovery pool through a pipeline.
Through adopting above-mentioned technical scheme, the plating bath takes place chemical reaction with the work piece in electroplating process and produces the heat, make plating solution temperature constantly rise, temperature information of plating bath in the galvanizing bath can be gathered in real time to first temperature sensor, and will gather temperature information and send to the controller, when the temperature of plating bath is higher than the setting value, the controller automatic start cooling circulating pump, cold water in with the cooling bath flows to the cavity between cooling jacket and the plating bath pond in through the pipeline, cold water contacts with the outer wall of plating bath, the heat of plating bath passes through the lateral wall transmission of plating bath and gives cold water, cold water intensifies and flows the heat in the delivery port through the cooling jacket to the recovery pond, can effectively play the effect of cooling to the plating bath in the plating bath, avoid the high temperature of plating bath and influence the electroplating quality of work piece. When the temperature of the plating solution is lower than a set value, the controller controls the cooling circulating pump to stop working, the temperature of the plating solution automatically rises, and the automatic control of the temperature of the plating solution can be realized, so that the electroplating quality of workpieces can be effectively improved.
The present invention may be further configured in a preferred embodiment as: the inner bottom wall of the plating solution tank is provided with a cooling pipe, one end of the cooling pipe is connected with a cooling circulating pump through a pipeline, and the other end of the cooling pipe is connected with a recovery tank through a pipeline.
Through adopting above-mentioned technical scheme, when the temperature of plating bath is higher than the setting value, the setting of cooling tube, controller automatic start cooling circulating pump flows the cooling water in the cooling bath to the cavity between cooling tube and cooling jacket and the plating bath pond through the pipeline in, and the cooling tube directly contacts with the plating bath, and the cold water in the cooling tube can further take away the heat of plating bath, can further play cooling's effect to the plating bath to can further improve the quality that the work piece was electroplated.
The present invention may be further configured in a preferred embodiment as: the cooling pipe is arranged in an S shape.
Through adopting above-mentioned technical scheme, the cooling tube is the S-shaped setting, effectively increases the area of contact of cooling tube and plating bath to can further improve the cooling effect of plating bath, can avoid plating bath temperature too high and influence the electroplating quality of work piece.
The present invention may be further configured in a preferred embodiment as: a galvanizing liquid tank is arranged on one side of the galvanizing liquid tank and connected with a galvanizing liquid pump, and the controller is connected with the galvanizing liquid pump and is used for controlling the on-off of the galvanizing liquid pump; the water outlet end of the plating liquid pump is connected with a liquid inlet pipe, the water outlet end of the liquid inlet pipe is arranged above the plating liquid pool, the bottom of the plating liquid pool is connected with a liquid outlet pipe, and one end of the liquid outlet pipe, far away from the plating liquid pool, is connected with a recovery tank; the liquid outlet pipe is provided with a valve, and the controller is connected with the valve and is used for controlling the opening and closing of the valve.
Through adopting above-mentioned technical scheme, after the temperature of plating bath exceeded the setting value and maintained a period, controller automatic start plating liquid pump, the plating bath in the galvanizing tank pours into the plating bath into through the pipeline under the drive effect of plating bath pump in, the valve is started to the controller simultaneously, and the plating bath in the plating bath flows to the accumulator through the liquid outlet, can cool off the plating bath in the plating bath fast to can further avoid plating bath temperature too high and influence the electroplating quality of work piece.
The present invention may be further configured in a preferred embodiment as: an overflow pipe is arranged in the plating solution tank, and the water outlet end of the overflow pipe is communicated with the recovery tank through a pipeline.
By adopting the technical scheme, the arrangement of the overflow pipe can avoid the waste of the plating solution caused by the overflow of the plating solution in the plating solution tank, and the cost can be saved.
The present invention may be further configured in a preferred embodiment as: the plating bath is internally provided with a second temperature sensor which is connected with the controller and used for detecting the temperature in the plating bath in real time, the second temperature sensor is arranged at the bottom of the plating bath, and the first temperature sensor is arranged in the middle of the plating bath.
Through adopting above-mentioned technical scheme, first temperature sensor sets up in the position of difference with second temperature sensor, can be accurate, direct test goes out the temperature of the plating bath in the plating bath pond.
The present invention may be further configured in a preferred embodiment as: and a connecting pipe is arranged between the recovery tank and the galvanizing liquid tank, and a one-way valve is arranged on the connecting pipe.
Through adopting above-mentioned technical scheme, the plating bath of accumulator flows into in the galvanizing kettle through the connecting pipe after the cooling for the plating bath can recycle. And the one-way valve is arranged, so that the plating solution in the recovery tank can only flow into the galvanizing solution tank, and the plating solution in the galvanizing solution tank is prevented from flowing back.
The present invention may be further configured in a preferred embodiment as: and a third temperature sensor is arranged in the recovery tank, is connected with the controller and is used for detecting the temperature in the recovery tank, and the controller is connected with the one-way valve and is used for controlling the opening and closing of the one-way valve.
Through adopting above-mentioned technical scheme, the temperature in the accumulator can real-time detection by third temperature sensor to send the temperature information that it detected to the controller, when the temperature in the accumulator was cooled down to the setting value, start the check valve, in the plating solution inflow accumulator in the galvanizing solution jar, can avoid the higher and influence its normal use of plating solution temperature in the galvanizing solution jar, and can reach the effect of the operation of being convenient for.
To sum up, the utility model discloses a following at least one useful technological effect:
1. through the arrangement of the first temperature sensor and the cooling sleeve, the temperature of the plating solution can be automatically controlled, so that the electroplating quality of the workpiece can be effectively improved;
2. through the setting of zinc-plating fluid jar, accumulator, can cool off the plating bath in the plating bath pond fast to can further avoid plating bath temperature too high and influence the electroplating quality of work piece.
Drawings
Fig. 1 is a schematic view of the overall structure shown in the embodiment of the present invention;
fig. 2 is another schematic structural diagram of the embodiment of the present invention;
fig. 3 is a schematic structural diagram of a temperature control device according to an embodiment of the present invention.
In the figure, 1, a plating bath; 11. a first temperature sensor; 12. a second temperature sensor; 2. a cooling jacket; 21. a water inlet; 22. a water outlet; 23. a cavity; 3. a cooling pool; 31. a cooling circulation pump; 4. a recovery tank; 5. a cooling tube; 6. a zinc plating liquid tank; 61. plating a liquid pump; 62. a liquid inlet pipe; 63. a liquid outlet pipe; 7. a recovery tank; 71. a third temperature sensor; 72. a connecting pipe; 73. a one-way valve; 8. an overflow pipe; 9. and a controller.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1 and 2, for the utility model discloses a galvanizing bath with plating solution temperature control device, including plating bath 1, the cover is equipped with cooling jacket 2 on the outer wall of plating bath 1, is formed with cavity 23 between the lateral wall of cooling jacket 2 and plating bath 1, is provided with water inlet 21 and the delivery port 22 that is linked together with cavity 23 on the cooling jacket 2. A cooling bath 3 is provided on one side of the plating bath 1, a cooling circulation pump 31 is connected to the cooling bath 3, and a controller 9 (see fig. 3) is connected to the cooling circulation pump 31. The water outlet end of the cooling circulating pump 31 is connected with the water inlet 21 of the cooling jacket 2 through a pipeline, and the water outlet 22 of the cooling jacket 2 is connected with the recovery tank 4 through a pipeline.
Referring to fig. 2, a cooling pipe 5 is disposed on the inner bottom wall of the plating bath 1, in this embodiment, the cooling pipe 5 is disposed in an S shape along the horizontal direction, a water inlet end of the cooling pipe 5 is connected with a cooling circulation pump 31 through a pipeline, and a water outlet end of the cooling pipe 5 is connected with a recovery bath 4 through a pipeline.
Referring to fig. 2 and 3, a first temperature sensor 11 and a second temperature sensor 12 are arranged in the plating bath 1, the first temperature sensor 11 is arranged in the middle of the plating bath 1, and the second temperature sensor 12 is arranged at the bottom of the plating bath 1. The first temperature sensor 11 is connected with the controller 9 and is used for detecting the temperature of the plating solution in the plating bath 1 in real time, the second temperature sensor 12 is connected with the controller 9 and is used for detecting the temperature of the plating solution in the plating bath 1 in real time, and the first temperature sensor 11 and the second temperature sensor 12 are different in position and can detect the temperature of the plating solution in different positions in the plating bath 1.
Referring to fig. 1 and 2, a galvanizing solution tank 6 is disposed on one side of the galvanizing solution tank 1, the galvanizing solution tank 6 is connected with a galvanizing solution pump 61, and a controller 9 (see fig. 3) is connected with the galvanizing solution pump 61 and is used for controlling the on-off of the galvanizing solution pump 61. The water outlet end of the plating liquid pump 61 is connected with a liquid inlet pipe 62, the water outlet end of the liquid inlet pipe 62 is arranged above the plating liquid tank 1, the bottom of the plating liquid tank 1 is connected with a liquid outlet pipe 63, and one end of the liquid outlet pipe 63, which is far away from the plating liquid tank 1, is connected with a recovery tank 7.
Referring to fig. 2 and 3, a connecting pipe 72 is connected between the recycling tank 7 and the galvanizing liquid tank 6, a one-way valve 73 is arranged on the connecting pipe 72, the one-way valve 73 enables the plating solution to flow into the galvanizing liquid tank 6 only from the recycling tank 7, and the controller 9 is connected with the one-way valve 73 and is used for controlling the on-off of the one-way valve 73. A third temperature sensor 71 is provided in the recovery tank 7, and the third temperature sensor 71 is connected to the controller 9 and detects the temperature in the recovery tank 7.
Referring to fig. 1 and 2, an overflow pipe 8 is arranged in the plating solution tank 1, in this embodiment, the top end of the overflow pipe 8 is located above the plating solution and is arranged in a funnel shape, and the water outlet end at the bottom of the overflow pipe 8 is communicated with the recovery tank 7 through a pipeline.
Referring to fig. 2 and fig. 3, when the temperature of the plating solution in the plating bath pool 1 lasts for two minutes and is higher than a set value, the controller 9 automatically starts the plating solution pump 61, the plating solution in the zinc plating solution tank 6 is injected into the plating bath pool 1 through a pipeline under the driving action of the plating solution pump 61, and meanwhile, the controller 9 starts a valve, the plating solution in the plating bath pool 1 flows into the recovery tank 7 through the drain pipe 63, so that the plating solution in the plating bath pool 1 can be rapidly cooled, and the electroplating quality of a workpiece can be further prevented from being influenced by the overhigh temperature of the plating solution.
Referring to fig. 1 and 2, when the liquid inlet speed of the liquid inlet pipe 62 is greater than the liquid outlet speed of the liquid outlet pipe 63, the plating solution in the plating solution tank 1 is increased, the overflow pipe 8 can effectively prevent the plating solution in the plating solution tank 1 from overflowing, and the excessive plating solution flows into the recovery tank 7. The third temperature sensor 71 (see fig. 3) can detect the temperature of the plating solution in the recovery tank 7 in real time, and when the temperature of the plating solution drops to a set value, the check valve 73 is actuated to cause the plating solution in the recovery tank 7 to flow into the galvanizing liquid tank 6, so that the plating solution can be recycled.
The implementation principle of the embodiment is as follows:
when the temperature of the plating solution is higher than a set value, the controller 9 automatically starts the cooling circulating pump 31, the cold water in the cooling tank 3 flows into the cooling pipe 5 and the cavity 23 through the pipeline, the cold water flowing into the cavity 23 is contacted with the outer wall of the plating solution tank 1, the heat of the plating solution is transferred to the cold water through the side wall of the plating solution tank 1, and the cold water is heated to flow the heat into the recovery tank 4 through the water outlet of the cooling jacket 2; meanwhile, the cold water flowing into the cooling pipe 5 further takes away the heat of the plating solution, so that the plating solution in the plating solution pool 1 can be effectively cooled, and the electroplating quality of the workpiece is prevented from being influenced by overhigh temperature of the plating solution.
When the temperature of the plating solution lasts for two minutes and is higher than the set value, the controller 9 automatically starts the plating solution pump 61, the plating solution in the zinc plating solution tank 6 is injected into the plating solution tank 1 through a pipeline under the driving action of the plating solution pump 61, meanwhile, the controller 9 starts a valve, the plating solution in the plating solution tank 1 flows into the recovery tank 7 through the liquid outlet pipe 63, the plating solution in the plating solution tank 1 can be rapidly cooled, and therefore the electroplating quality of a workpiece can be further prevented from being influenced by overhigh temperature of the plating solution.
When the temperature of the plating solution is lower than a set value, the controller 9 controls the cooling circulating pump 31 to stop working, the temperature of the plating solution automatically rises, and the automatic control of the temperature of the plating solution can be realized, so that the electroplating quality of workpieces can be effectively improved.
The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.

Claims (8)

1. A galvanizing bath with a plating solution temperature control device is characterized in that: the device comprises a plating solution tank (1), wherein a first temperature sensor (11) is arranged in the plating solution tank (1), and the first temperature sensor (11) is connected with a controller (9) and is used for detecting the temperature in the plating solution tank (1) in real time; the outer wall of the plating solution tank (1) is sleeved with a cooling jacket (2), a cavity (23) is formed between the cooling jacket (2) and the outer wall of the plating solution tank (1), and a water inlet (21) and a water outlet (22) which are communicated with the cavity (23) are formed in the cooling jacket (2); one side of plating bath (1) is provided with cooling tank (3), cooling tank (3) are connected with cooling circulation pump (31), controller (9) are connected with cooling circulation pump (31) and are used for controlling opening and close of cooling circulation pump (31), the play water end of cooling circulation pump (31) is connected with water inlet (21) of cooling jacket (2) through the pipeline, delivery port (22) of cooling jacket (2) have recovery pond (4) through the pipe connection.
2. The galvanizing bath with a plating solution temperature control device according to claim 1, characterized in that: the inner bottom wall of the plating solution tank (1) is provided with a cooling pipe (5), one end of the cooling pipe (5) is connected with a cooling circulating pump (31) through a pipeline, and the other end of the cooling pipe (5) is connected with a recovery tank (4) through a pipeline.
3. The galvanizing bath with a plating solution temperature control device according to claim 2, characterized in that: the cooling pipe (5) is arranged in an S shape.
4. The galvanizing bath with a plating solution temperature control device according to claim 1, characterized in that: a galvanizing liquid tank (6) is arranged on one side of the galvanizing liquid tank (1), the galvanizing liquid tank (6) is connected with a galvanizing liquid pump (61), and the controller (9) is connected with the galvanizing liquid pump (61) and is used for controlling the on-off of the galvanizing liquid pump (61); the water outlet end of the plating liquid pump (61) is connected with a liquid inlet pipe (62), the water outlet end of the liquid inlet pipe (62) is arranged above the plating liquid tank (1), the bottom of the plating liquid tank (1) is connected with a liquid outlet pipe (63), and one end, far away from the plating liquid tank (1), of the liquid outlet pipe (63) is connected with a recovery tank (7); the liquid outlet pipe (63) is provided with a valve, and the controller (9) is connected with the valve and is used for controlling the opening and closing of the valve.
5. The galvanizing bath with plating solution temperature control device according to claim 4, characterized in that: an overflow pipe (8) is arranged in the plating solution tank (1), and the water outlet end of the overflow pipe (8) is communicated with the recovery tank (7) through a pipeline.
6. The galvanizing bath with a plating solution temperature control device according to claim 1, characterized in that: the automatic plating device is characterized in that a second temperature sensor (12) is arranged in the plating liquid pool (1), the second temperature sensor (12) is connected with the controller (9) and used for detecting the temperature in the plating liquid pool (1) in real time, the second temperature sensor (12) is arranged at the bottom of the plating liquid pool (1), and the first temperature sensor (11) is arranged in the middle of the plating liquid pool (1).
7. The galvanizing bath with plating solution temperature control device according to claim 4, characterized in that: a connecting pipe (72) is arranged between the recovery tank (7) and the galvanizing liquid tank (6), and a one-way valve (73) is arranged on the connecting pipe (72).
8. The galvanizing bath with plating solution temperature control device according to claim 7, characterized in that: be provided with third temperature sensor (71) in accumulator (7), third temperature sensor (71) are connected and are used for detecting the temperature in accumulator (7) with controller (9), controller (9) are connected and are used for controlling opening and close of check valve (73) with check valve (73).
CN202020570978.2U 2020-04-16 2020-04-16 Galvanizing bath with plating solution temperature control device Active CN211999960U (en)

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Application Number Priority Date Filing Date Title
CN202020570978.2U CN211999960U (en) 2020-04-16 2020-04-16 Galvanizing bath with plating solution temperature control device

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Application Number Priority Date Filing Date Title
CN202020570978.2U CN211999960U (en) 2020-04-16 2020-04-16 Galvanizing bath with plating solution temperature control device

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CN211999960U true CN211999960U (en) 2020-11-24

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113355720A (en) * 2021-06-28 2021-09-07 江苏澳光电子有限公司 Synchronous drive type electroplating bath electroplating solution cooling structure
CN113445114A (en) * 2021-06-28 2021-09-28 江苏澳光电子有限公司 Plating bath plating solution cooling structure
CN117822083A (en) * 2024-03-06 2024-04-05 苏州尊恒半导体科技有限公司 Wafer plating solution circulation temperature control system

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113355720A (en) * 2021-06-28 2021-09-07 江苏澳光电子有限公司 Synchronous drive type electroplating bath electroplating solution cooling structure
CN113445114A (en) * 2021-06-28 2021-09-28 江苏澳光电子有限公司 Plating bath plating solution cooling structure
CN113355720B (en) * 2021-06-28 2023-04-11 江苏澳光电子有限公司 Synchronous drive formula plating bath plating solution cooling structure
CN113445114B (en) * 2021-06-28 2023-04-25 江苏澳光电子有限公司 Electroplating bath electroplating solution cooling structure
CN117822083A (en) * 2024-03-06 2024-04-05 苏州尊恒半导体科技有限公司 Wafer plating solution circulation temperature control system
CN117822083B (en) * 2024-03-06 2024-05-07 苏州尊恒半导体科技有限公司 Wafer plating solution circulation temperature control system

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