CN211996720U - Semiconductor refrigeration vacuum insulation can - Google Patents
Semiconductor refrigeration vacuum insulation can Download PDFInfo
- Publication number
- CN211996720U CN211996720U CN202020694366.4U CN202020694366U CN211996720U CN 211996720 U CN211996720 U CN 211996720U CN 202020694366 U CN202020694366 U CN 202020694366U CN 211996720 U CN211996720 U CN 211996720U
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- Prior art keywords
- semiconductor refrigeration
- box
- insulation
- cavity
- vacuum insulation
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 46
- 238000009413 insulation Methods 0.000 title claims abstract description 44
- 239000004065 semiconductor Substances 0.000 title claims abstract description 44
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229920005830 Polyurethane Foam Polymers 0.000 claims description 6
- 239000011496 polyurethane foam Substances 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000005187 foaming Methods 0.000 abstract description 6
- 229920002635 polyurethane Polymers 0.000 abstract description 6
- 239000004814 polyurethane Substances 0.000 abstract description 6
- 239000012774 insulation material Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 239000004411 aluminium Substances 0.000 abstract description 3
- 239000012528 membrane Substances 0.000 abstract description 3
- 238000005265 energy consumption Methods 0.000 abstract description 2
- 230000008901 benefit Effects 0.000 description 3
- 239000003814 drug Substances 0.000 description 3
- 238000004321 preservation Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 235000013305 food Nutrition 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 206010000369 Accident Diseases 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 235000012054 meals Nutrition 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
- 229960005486 vaccine Drugs 0.000 description 1
- 235000013311 vegetables Nutrition 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
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- Refrigerator Housings (AREA)
- Packages (AREA)
Abstract
The utility model discloses a semiconductor refrigeration vacuum insulation can relates to insulation can technical field, has solved current insulation can because the high cold insulation time that leads to of box insulation material coefficient of heat transfer is short, has the high shortcoming of energy consumption, and its technical essential includes: a semiconductor refrigeration vacuum insulation box comprises a box body, wherein a protection plate is arranged on the outer side of the box body, a cavity is arranged between the protection plate and the box body, a semiconductor refrigeration module and a vacuum pump are arranged in the cavity, and the semiconductor refrigeration module comprises a cold end and a hot end; the vacuum pump air inlet is fixed and is connected with the pipe, the box is seted up the through-hole that communicates the box inside and cavity, the semiconductor refrigeration module cold junction passes the through-hole and sets up inside the box, semiconductor refrigeration module hot junction sets up in the cavity, the pipe expansion end passes the through-hole and sets up in the box, the box comprises vacuum insulation panels and polyurethane foaming board, and is equipped with the one deck aluminium membrane between vacuum insulation panels and the polyurethane foaming board, plays better thermal-insulated effect of keeping warm.
Description
Technical Field
The utility model relates to an insulation can technical field, more specifically relates to a semiconductor refrigeration vacuum insulation can.
Background
The incubator is a case with heat preservation performance used in taking out and delivering meals. The heat preservation boxes are classified into different types according to the texture of the product, and comprise various heat preservation boxes made of plastic, foam, metal, wood and the like.
In recent years, with rapid development of the logistics industry, the market demand of the insulation box is gradually increased, the functions of the existing logistics insulation boxes in the market are mostly limited to sealing and insulation, most of used filling insulation materials mainly comprise organic materials such as polystyrene boards and polyurethane foams, the materials have low heat resistance temperature, are easy to burn when encountering fire and generate toxic gas, become one of main factors of fire accidents, cause huge loss on the transportation of medical instruments, blood and vaccines, and have the problems of high heat conductivity coefficient, unsatisfactory insulation effect and the like when being used, and the problems that some articles need to be transported and stored for a long time at low temperature, such as some fresh vegetables and fruits, food, medicines and the like, are difficult to meet.
Therefore, on the basis of traditional insulation can, this patent provides a novel insulation can with semiconductor refrigeration module and vacuum pump, and the box is equipped with multiple thermal insulation material, realizes higher fresh-keeping requirement.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that current insulation can is short because box insulation material coefficient of heat transfer leads to the cold insulation time, has the high shortcoming of energy consumption, the utility model aims to provide a system refrigeration vacuum insulation can solves the problem that current insulation can't preserve for a long time at low temperature.
The utility model discloses a following technical scheme realizes:
the utility model provides a semiconductor refrigeration vacuum insulation can includes the box, the protection shield is installed to the box outside, be equipped with the cavity between protection shield and the box, be equipped with semiconductor refrigeration module and vacuum pump in the cavity, semiconductor refrigeration module includes cold junction and hot junction, the vacuum pump is equipped with the pipe, the through-hole of intercommunication box inside and cavity is seted up to the box, the semiconductor refrigeration module cold junction passes the through-hole and sets up inside the box, semiconductor refrigeration module hot junction sets up in the cavity, the vacuum pump pipe expansion end passes the through-hole and sets up in the box.
The cold junction through adopting above-mentioned scheme semiconductor refrigeration module passes through the through-hole and is located the box, and semiconductor refrigeration module moves, reduces the temperature in the box, to the article refrigeration of preserving at the box, the vacuum pump is equipped with the pipe, the pipe expansion end passes the through-hole and sets up in the box, and when the vacuum pump moves, the expansion end that sets up the pipe in the box was managed to find time the air in the box, has avoided food and medicine in the box and the air effect to take place the oxidation rotten, realizes low temperature storage for a long time.
Further, the box body comprises an inner layer and an outer layer.
Further, the inner layer is made of polyurethane foam boards, and the outer layer is made of vacuum insulation boards.
Further, an aluminum film is arranged between the inner layer and the outer layer.
The box body comprises an outer layer consisting of a vacuum heat insulation plate and an inner layer consisting of a polyurethane foam plate from outside to inside. Inner polyurethane foaming board coefficient of heat conductivity is low and has dampproofing and waterproofing stable in structure's performance, can realize that the box keeps warm and insulates against heat and can use for a long time, outer vacuum insulation panel has further promoted thermal insulation performance, and vacuum insulation panel has the quality light, small and thin thickness's characteristics, freight in the transportation has been reduced, the distance between fortune has been improved, economic effect is obvious, it can completely cut off the heat radiation to set up the aluminium membrane between polyurethane foaming board and vacuum insulation panel, even if when ambient temperature is higher, the aluminium membrane can be so that temperature variation range is less in the box.
Furthermore, a power supply module for supplying power to the semiconductor refrigeration module and the vacuum pump is further arranged in the cavity.
Further, the protection plate is a honeycomb plate, and the honeycomb plate is used for protecting the semiconductor refrigeration module and the vacuum pump.
Compared with the prior art, the utility model, following advantage and beneficial effect have:
the utility model relates to a semiconductor refrigeration vacuum insulation can, through set up semiconductor refrigeration module and vacuum pump at the box, reduce the temperature in the box, the box internal gas of managing to find time can be used to the long-time low temperature application of needs, if medicine transportation, aspects such as cold chain transportation, through constitute outer setting by polyurethane foaming board inlayer and by vacuum insulation panels at the box, stopped original insulation can because box insulation material heat transfer coefficient height leads to cold insulation time weak point, shortcoming such as cost of transportation height.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:
FIG. 1 is a schematic view of the internal structure of the present invention;
fig. 2 is a schematic view of the outside of the protection board of the present invention.
Reference numbers and corresponding part names:
the device comprises a vacuum insulation plate 1, an aluminum film 2, a polyurethane foaming plate 3, a protective plate 4, a semiconductor refrigeration module 5, a vacuum pump 6, a guide pipe 61, a through hole 7, a voltage module 8 and a cavity 9.
Detailed Description
To make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the following examples and drawings, and the exemplary embodiments and descriptions thereof of the present invention are only used for explaining the present invention, and are not intended as limitations of the present invention.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to one of ordinary skill in the art that: it is not necessary to employ these specific details to practice the invention. In other instances, well-known structures, circuits, materials, or methods have not been described in detail so as not to obscure the present invention.
Throughout the specification, reference to "one embodiment," "an embodiment," "one example," or "an example" means: the particular features, structures, or characteristics described in connection with the embodiment or example are included in at least one embodiment of the present invention. Thus, the appearances of the phrases "one embodiment," "an embodiment," "one example" or "an example" in various places throughout this specification are not necessarily all referring to the same embodiment or example. Furthermore, the particular features, structures, or characteristics may be combined in any suitable combination and/or sub-combination in one or more embodiments or examples. Further, those of ordinary skill in the art will appreciate that the illustrations provided herein are for illustrative purposes and are not necessarily drawn to scale. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the description of the present invention, it should be understood that the terms "front", "back", "left", "right", "upper", "lower", "vertical", "horizontal", "high", "low", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the scope of the present invention.
Examples
As shown in fig. 1-2, the utility model relates to a semiconductor refrigeration vacuum insulation can, including the box, protection shield 4 is installed in the box outside, is equipped with cavity 9 between protection shield 4 and the box outside, is equipped with semiconductor refrigeration module 5 and vacuum pump 6 in the cavity 9, and the through-hole 7 of intercommunication box inside and cavity 9 is seted up to the box, and through-hole 7 scribbles the adhesive and is used for installing semiconductor refrigeration module 5.
The vacuum pump 6 is coated with an adhesive and is arranged outside the box body, a guide pipe 61 is arranged below the vacuum pump 6, the movable end of the guide pipe 61 penetrates through the through hole 7 and is arranged inside the box body, and the gap between the guide pipe 61 and the through hole 7 is sealed by coating a sealant.
The inner layer of the box body is composed of polyurethane foam plates 3, the outer layer of the box body is a vacuum heat insulation plate 1, and a layer of aluminum film 2 is arranged between the vacuum heat insulation plate 1 and the polyurethane foam plates 3.
And a power supply module is arranged below one side of the box body provided with the protective plate 4 and connected with the semiconductor refrigeration module 5 and the vacuum pump 6.
The protection plate 4 is a honeycomb plate for protecting the semiconductor refrigeration module 5 and the vacuum pump 6, and the honeycomb plate facilitates heat dissipation of the hot end of the semiconductor refrigeration module 5.
The working process is as follows: the power module supplies power for vacuum pump 6 and semiconductor refrigeration module 5, and when semiconductor refrigeration module 5 moved, it reduced the inside temperature of box to pass 5 cold junctions of semiconductor refrigeration module that through-hole 7 was located the box inside, made the article of placing in the box can deposit for a longer time at low temperature environment, and 5 hot junctions of semiconductor refrigeration module lead out the heat temperature through the honeycomb panel. When the vacuum pump 6 operates, the conduit 61 of the vacuum pump 6 positioned in the box body extracts gas in the box body, so that the air content in the box body is reduced, the oxidation reaction is delayed, and the storage time is prolonged.
The above-mentioned embodiments, further detailed description of the objects, technical solutions and advantages of the present invention, it should be understood that the above description is only the embodiments of the present invention, and is not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (7)
1. The semiconductor refrigeration vacuum insulation box comprises a box body and is characterized in that a protection plate (4) is installed on the outer side of the box body, a cavity (9) is formed between the protection plate (4) and the box body, a semiconductor refrigeration module (5) and a vacuum pump (6) are arranged in the cavity (9), and the semiconductor refrigeration module (5) comprises a cold end and a hot end; the air inlet of the vacuum pump (6) is fixedly connected with a guide pipe (61), the box body is provided with a through hole (7) for communicating the interior of the box body with the cavity (9), the cold end of the semiconductor refrigeration module (5) penetrates through the through hole (7) to be arranged in the box body, the hot end of the semiconductor refrigeration module (5) is arranged in the cavity (9), and the movable end of the guide pipe (61) penetrates through the through hole (7) to be arranged in the box body.
2. The semiconductor refrigeration vacuum insulation can of claim 1, wherein the can comprises an inner layer and an outer layer.
3. The semiconductor refrigeration vacuum insulation box according to claim 2, characterized in that the inner layer is composed of polyurethane foam board (3).
4. A semiconductor refrigeration vacuum insulation box according to claim 2, characterized in that the outer layer consists of a vacuum insulation panel (1).
5. The semiconductor refrigeration vacuum insulation can of claim 2, characterized in that an aluminum film (2) is arranged between the inner layer and the outer layer.
6. The semiconductor refrigeration vacuum insulation box according to claim 1, characterized in that a power supply module for supplying power to the semiconductor refrigeration module (5) and the vacuum pump (6) is further arranged in the cavity (9).
7. The semiconductor refrigeration vacuum insulation box according to claim 1, characterized in that the protective plate (4) is a honeycomb plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020694366.4U CN211996720U (en) | 2020-04-29 | 2020-04-29 | Semiconductor refrigeration vacuum insulation can |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020694366.4U CN211996720U (en) | 2020-04-29 | 2020-04-29 | Semiconductor refrigeration vacuum insulation can |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211996720U true CN211996720U (en) | 2020-11-24 |
Family
ID=73410123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020694366.4U Active CN211996720U (en) | 2020-04-29 | 2020-04-29 | Semiconductor refrigeration vacuum insulation can |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211996720U (en) |
-
2020
- 2020-04-29 CN CN202020694366.4U patent/CN211996720U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A semiconductor refrigeration vacuum insulation box Granted publication date: 20201124 Pledgee: Sichuan Tianfu Bank Co.,Ltd. Business Department Pledgor: SICHUAN LINGLINGHAO TECHNOLOGY Co.,Ltd. Registration number: Y2024980001938 |