CN211989984U - Silicon wafer cleaning device - Google Patents
Silicon wafer cleaning device Download PDFInfo
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- CN211989984U CN211989984U CN202020440495.0U CN202020440495U CN211989984U CN 211989984 U CN211989984 U CN 211989984U CN 202020440495 U CN202020440495 U CN 202020440495U CN 211989984 U CN211989984 U CN 211989984U
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- silicon wafer
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- liquid storage
- wafer cleaning
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- 238000004140 cleaning Methods 0.000 title claims abstract description 87
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 67
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 66
- 239000010703 silicon Substances 0.000 title claims abstract description 66
- 239000007788 liquid Substances 0.000 claims abstract description 93
- 238000003860 storage Methods 0.000 claims abstract description 37
- 239000012459 cleaning agent Substances 0.000 claims abstract description 26
- 238000001802 infusion Methods 0.000 claims abstract description 18
- 238000005406 washing Methods 0.000 claims description 14
- 230000005587 bubbling Effects 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000012546 transfer Methods 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 abstract description 49
- 229910003460 diamond Inorganic materials 0.000 abstract description 5
- 239000010432 diamond Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000002699 waste material Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 18
- 239000003814 drug Substances 0.000 description 14
- 239000000243 solution Substances 0.000 description 9
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 239000013589 supplement Substances 0.000 description 4
- 241000197194 Bulla Species 0.000 description 3
- 208000002352 blister Diseases 0.000 description 3
- 239000013043 chemical agent Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The application provides a silicon wafer cleaning device, which comprises a cleaning tank for cleaning a silicon wafer, a plurality of liquid storage tanks and infusion tubes for connecting the liquid storage tanks and the cleaning tank, wherein the liquid storage tanks are respectively used for storing different cleaning agents, at least part of the liquid storage tanks are internally provided with stirrers, and the infusion tubes for connecting the different liquid storage tanks are mutually independently arranged; the silicon wafer cleaning device also comprises a liquid pump, a control valve and a flowmeter which are arranged on the liquid conveying pipe. The silicon wafer cleaning device can effectively clean the silicon wafer cut by the diamond wire, improves the stability of a silicon wafer cleaning process, reduces the proportion of dirty wafers, can reduce the waste of cleaning agents, and realizes the lean production; and the workload of field personnel can be reduced, and the potential safety hazard is reduced.
Description
Technical Field
The application relates to the field of photovoltaic production equipment, in particular to a silicon wafer cleaning device.
Background
Crystalline silicon solar cells still occupy the important position of the photovoltaic market at the present stage, and the processing quality of silicon wafers can directly influence the conversion efficiency of subsequent cells and photovoltaic modules. At present, a large amount of impurities such as silicon powder, organic matters, metal ions and the like can remain on the surface of a silicon wafer cut by adopting a diamond wire, and if the silicon wafer is not completely treated in a cleaning link, the silicon wafer can cause great negative effects on the subsequent battery piece manufacturing process, so that the conversion efficiency of the battery piece is greatly reduced. Therefore, the cleaning of the silicon wafer is very important for the performance of the crystalline silicon solar cell.
The existing silicon wafer cleaning process mainly comprises the steps of pre-cleaning, chemical cleaning, rinsing, drying and the like, wherein the chemical cleaning is the most critical step for determining the silicon wafer cleaning effect. Specifically, chemical agents such as a cleaning agent special for the silicon wafer, hydrogen peroxide and potassium hydroxide are required to be adopted for cleaning, and the chemical agents are required to be added in a segmented manner, namely, liquid supplement is required according to the cleaning quantity of the silicon wafer.
At present, a plurality of manufacturers still directly adopt a manual mode to add the chemical agents, the addition amount and the addition time of the agents are difficult to control accurately, the cleaning effect is influenced, the agents are easy to splash, and potential safety hazards exist. More importantly, the manual adding mode is relatively long in time interval, and the concentration of the medicament is gradually reduced along with the increase of the cleaning quantity of the silicon wafer, so that the cleaning effect of the silicon wafer is greatly changed, namely, more impurities are easily left on the surface of part of the silicon wafer, and the quality stability of the subsequent battery piece is influenced. The industry also discloses a technical scheme for cleaning silicon wafers by adopting automatic liquid supplementing, but the structural design still needs to be further improved.
SUMMERY OF THE UTILITY MODEL
An object of this application is to provide a silicon chip belt cleaning device, can effectively wash the silicon chip behind the buddha's warrior attendant wire-electrode cutting, promote cleaning quality, reduce the waste of washing medicament to reduce the potential safety hazard.
In order to achieve the purpose, the application provides a silicon wafer cleaning device which comprises a cleaning tank for cleaning a silicon wafer, a plurality of liquid storage tanks and infusion tubes for connecting the liquid storage tanks and the cleaning tank, wherein the liquid storage tanks are respectively used for storing different cleaning agents, at least part of the liquid storage tanks are internally provided with stirrers, and the infusion tubes for connecting the different liquid storage tanks are mutually independently arranged; the silicon wafer cleaning device also comprises a liquid pump, a control valve and a flowmeter which are arranged on the liquid conveying pipe.
As a further improvement of the application, a filter connected to the tail end of the infusion tube is further arranged in the liquid storage tank.
As a further improvement of the application, the inner diameter of the infusion tube is set to be 5-10 mm.
As the further improvement of this application, the volume of liquid reserve tank sets up to 250 ~ 300L, just the liquid reserve tank is equipped with liquid level detection mechanism.
As a further improvement of the application, one side of the liquid storage tank, which is far away from the infusion tube, is provided with a liquid injection port.
As a further improvement of the application, the cleaning tank is provided with a bottom wall and a peripheral wall, and an ultrasonic assembly close to the bottom wall and/or the peripheral wall and a bubbling assembly adjacent to the bottom wall are arranged in the cleaning tank.
As a further improvement of this application, the tympanic bulla subassembly includes along the marginal extension setting of diapire the tympanic bulla pipe, the internal diameter of tympanic bulla pipe sets up 5 ~ 10 mm.
As a further improvement of the application, the silicon wafer cleaning device comprises at least two mutually independent cleaning tanks.
As a further improvement of this application, the transfer line is including being connected to the main line, the connection of liquid reserve tank the branch pipeline of main line and washing tank, the liquid pump sets up on the main line, and each it all is equipped with correspondingly to divide the pipeline control valve and flowmeter.
As a further improvement of the application, the silicon wafer cleaning device further comprises a control system, wherein the control system is used for editing and storing the cleaning program and controlling the cleaning of the silicon wafer according to the cleaning program.
The beneficial effect of this application is: this application silicon chip belt cleaning device realizes the automatic of different washing medicaments through a plurality of liquid reserve tanks respectively and adds, and through the agitator stirs the washing medicament in the corresponding liquid reserve tank, guarantees the liquid medicine homogeneity. By adopting the silicon wafer cleaning device, the silicon wafer cut by the diamond wire can be effectively cleaned, the cleaning quality of the silicon wafer is improved, the dirty wafer proportion is reduced, and the waste of cleaning agents can be reduced; and the workload of field personnel can be reduced, and the potential safety hazard is reduced.
Drawings
FIG. 1 is a schematic partial structural view of a preferred embodiment of a silicon wafer cleaning apparatus according to the present application;
FIG. 2 is a schematic partial structural view of another preferred embodiment of the silicon wafer cleaning apparatus of the present application.
100-a silicon wafer cleaning device; 1-a cleaning tank; 11-a bottom wall; 12-a peripheral wall; 13-an ultrasound assembly; 14-a bubbling assembly; 2-a liquid storage tank; 21-a stirrer; 210-a stirring motor; 21-box bottom; 23-a box cover; 24-a side wall; 25-a filter; 26-liquid injection port; 3-a transfusion tube; 31-a liquid pump; 32-a control valve; 33-a flow meter; 301-main pipe; 302-branch line.
Detailed Description
The present application will be described in detail below with reference to embodiments shown in the drawings. The present invention is not limited to the above embodiments, and structural, methodological, or functional changes made by one of ordinary skill in the art according to the present embodiments are included in the scope of the present invention.
Referring to fig. 1, a silicon wafer cleaning apparatus 100 provided by the present application is used for cleaning a silicon wafer after diamond wire cutting, and includes a cleaning tank 1, a plurality of liquid storage tanks 2, and a liquid conveying pipe 3 connecting the liquid storage tanks 2 and the cleaning tank 1.
The liquid storage tanks 2 are used for storing different cleaning agents respectively, and liquid conveying pipes 3 connected with the different liquid storage tanks 2 are arranged independently. In other words, each cleaning agent is added into the cleaning tank 1 through an independent pipeline, so that the cleaning agents are not mixed in the infusion tube 3, and the addition amount of each cleaning agent is favorably and accurately controlled; meanwhile, different cleaning agents are prevented from being mixed in advance, and the detergent can be used for adding certain agents which are not suitable for mixing in advance. In terms of the silicon wafer cleaning process, the required cleaning agents usually include hydrogen peroxide, KOH solution and cleaning agent, and therefore the three liquid storage tanks 2 may be configured to store the hydrogen peroxide, KOH solution and cleaning agent respectively. Certain components may be introduced into the cleaning agent, the cleaning agent is not suitable for being stably existed in a strong alkali solution for a long time, and if hydrogen peroxide, a KOH solution and the cleaning agent are mixed in advance, the cleaning effect of the silicon wafer may be deteriorated, and the consumption of each cleaning agent is increased.
At least part be provided with agitator 21 in the liquid reserve tank 2, agitator 21 can dispose according to the characteristic of each washing medicament, through agitator 21 carries out aperiodic intermittent type stirring in corresponding liquid reserve tank 2, avoids washing medicament layering, crystallization to appear, also makes washing medicament can keep better homogeneity in liquid reserve tank 2.
The liquid storage tank 2 comprises a tank bottom 22, a tank cover 23 and a side wall 24 connecting the tank bottom 22 and the tank cover 23, and the stirrer 21 is provided with a stirring motor 210 arranged on the tank cover 23. The infusion tube 3 is connected at the position of the side wall 24 adjacent to the box bottom 22 and is arranged at an interval with the box bottom 22, and a filter 25 connected to the tail end of the infusion tube 3 is further arranged in the liquid storage box 2 so as to prevent blocky and granular impurities in the liquid storage box 2 from entering the infusion tube 3.
One side that liquid reserve tank 2 kept away from transfer line 3 still is equipped with annotates liquid mouth 26, that is to say, annotate liquid mouth 26 and set up relatively the opposite side of transfer line 3 to make after corresponding washing medicament adds can with behind the surplus liquid medicine mixing in the liquid reserve tank 2, the warp again transfer line 3 carries to washing tank 1. The liquid inlet 26 is disposed on the cover 23, and the liquid inlet 26 may be connected to an external liquid supply system, or a corresponding cleaning agent may be manually added into the liquid storage tank 2 through the liquid inlet 26.
The volume of liquid reserve tank 2 sets up to 250 ~ 300L, just the liquid reserve tank is equipped with liquid level detection mechanism and low liquid level alarm mechanism. The liquid storage tank 2 can be made of transparent plastic materials so as to facilitate on-site liquid level observation, and volume scales can be arranged on the side wall 22 of the liquid storage tank 2. In particular, for cleaning agents that are easily decomposed under light conditions, the corresponding liquid storage tank 2 needs to be made of a non-transparent material. In addition, a drain pipe (not shown) may be provided at the bottom of the liquid storage tank 2 to facilitate cleaning of the liquid storage tank 2.
The infusion tube 3 is made of a corrosion-resistant plastic tube, and the inner diameter of the infusion tube 3 is set to be 5-10 mm. The silicon wafer cleaning device 100 further comprises a control system, and a liquid pump 31, a control valve 32 and a flow meter which are arranged on the infusion tube 3, wherein the control system is used for editing and storing a cleaning program and controlling the cleaning of the silicon wafer according to the cleaning program, and the liquid pump 31, the control valve 32 and the flow meter 33 are all connected to the control system and work according to instructions sent by the control system. The flow rate of the liquid pump 31 can be adjusted according to production requirements, and the flow rate adjustment range is generally not more than 10L/min.
Wherein the cleaning program includes the following information: a silicon wafer type; the initial amount of the cleaning agent added to each of the liquid tanks 2; dynamic replenishment of each cleaning agent; the liquid changing period and the like. Of course, the control system may store multiple sets of cleaning programs to facilitate field operations.
If the initial addition amount of the KOH solution is set to be 500mL, and when 1 ten thousand silicon wafers are cleaned, 20mL of the KOH solution is supplemented, namely the dynamic supplement amount is 20 mL/ten thousand wafers; setting the initial adding amount of the cleaning agent to 7000mL, and setting the dynamic supplement amount to 250 mL/ten thousand pieces; the liquid changing period is set to be 8 ten thousand. Preferably, when the tank is first prepared, about half of the volume of the deionized water may be added into the cleaning tank 1, and then various cleaning agents may be added.
The cleaning tank 1 can be made of corrosion-resistant materials such as stainless steel or polyethylene, and the cleaning tank 1 has a bottom wall 11 and a peripheral wall 12. An ultrasonic assembly 13 close to the bottom wall 11 and/or the peripheral wall 12 and a bubbling assembly 14 adjacent to the bottom wall 11 are arranged in the cleaning tank 1. The bubbling assembly 14 specifically comprises a bubbling pipe extending along the edge of the bottom wall 11, the inner diameter of the bubbling pipe is set to be 5-10 mm, a plurality of small holes are formed in the bubbling pipe, and cleaning solution in the cleaning tank 1 can be uniformly mixed by compressed air introduced from the outside.
Referring to fig. 2, in another embodiment of the present application, the silicon wafer cleaning apparatus 100 includes at least two cleaning tanks 1 independent of each other to improve cleaning efficiency. The infusion tube 3 comprises a main pipeline 301 connected to the liquid storage tank 2 and branch pipelines 302 connected with the main pipeline 301 and the cleaning tanks 1, the liquid pump 31 is arranged on the main pipeline 301, and each branch pipeline 302 is provided with a corresponding control valve 32 and a corresponding flow meter 33 so as to control the addition and supplement of cleaning agents in the corresponding cleaning tank 1 according to instructions of the control system. Here, for convenience of illustration, only one of the liquid storage tanks 2 and the liquid transfer tube 3 connected to the liquid storage tank 2 are shown.
To sum up, this application silicon chip belt cleaning device 100 can realize the automatic interpolation of different washing medicaments, avoids different washing medicaments to mix in advance, and passes through agitator 21 stirs the washing medicament in the corresponding liquid reserve tank 2, guarantees the liquid medicine homogeneity. The silicon wafer cleaning device 100 can effectively clean silicon wafers cut by diamond wires, so that the cleaning quality of the silicon wafers is improved, the dirty wafer proportion is reduced, and the waste of cleaning agents can be reduced; and the workload of field personnel can be reduced, and the potential safety hazard is reduced.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above list of details is only for the concrete description of the feasible embodiments of the present application, they are not intended to limit the scope of the present application, and all equivalent embodiments or modifications that do not depart from the technical spirit of the present application are intended to be included within the scope of the present application.
Claims (10)
1. The utility model provides a silicon chip belt cleaning device, includes the washing tank that is used for carrying out the silicon chip to wash which characterized in that: the silicon wafer cleaning device also comprises a plurality of liquid storage tanks and liquid conveying pipes for connecting the liquid storage tanks and the cleaning tank, wherein the liquid storage tanks are respectively used for storing different cleaning agents, stirrers are arranged in at least part of the liquid storage tanks, and the liquid conveying pipes for connecting the different liquid storage tanks are mutually independently arranged; the silicon wafer cleaning device also comprises a liquid pump, a control valve and a flowmeter which are arranged on the liquid conveying pipe.
2. The silicon wafer cleaning apparatus according to claim 1, wherein: the liquid storage tank is also internally provided with a filter connected with the tail end of the infusion tube.
3. The silicon wafer cleaning apparatus according to claim 1, wherein: the inner diameter of the infusion tube is set to be 5-10 mm.
4. The silicon wafer cleaning apparatus according to claim 1, wherein: the volume of liquid reserve tank sets up to 250 ~ 300L, just the liquid reserve tank is equipped with liquid level detection mechanism.
5. The silicon wafer cleaning apparatus according to claim 1, wherein: one side of the liquid storage tank, which is far away from the infusion tube, is provided with a liquid injection port.
6. The silicon wafer cleaning apparatus according to claim 1, wherein: the cleaning tank is provided with a bottom wall and a peripheral wall, and an ultrasonic assembly close to the bottom wall and/or the peripheral wall and a bubbling assembly adjacent to the bottom wall are arranged in the cleaning tank.
7. The silicon wafer cleaning apparatus according to claim 6, wherein: the bubbling assembly comprises a bubbling pipe extending along the edge of the bottom wall, and the inner diameter of the bubbling pipe is set to be 5-10 mm.
8. The silicon wafer cleaning apparatus according to claim 1, wherein: the silicon wafer cleaning device comprises at least two mutually independent cleaning tanks.
9. The silicon wafer cleaning apparatus according to claim 1, wherein: the transfer line is including being connected to the main line of liquid reserve tank, connecting the branch pipeline of main line and washing tank, the liquid pump sets up on the main line, and each divide the pipeline all to be equipped with correspondingly control valve and flowmeter.
10. The silicon wafer cleaning apparatus according to claim 1, wherein: the silicon wafer cleaning device also comprises a control system, wherein the control system is used for editing and storing the cleaning program and controlling the cleaning of the silicon wafer according to the cleaning program.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020440495.0U CN211989984U (en) | 2020-03-31 | 2020-03-31 | Silicon wafer cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020440495.0U CN211989984U (en) | 2020-03-31 | 2020-03-31 | Silicon wafer cleaning device |
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| Publication Number | Publication Date |
|---|---|
| CN211989984U true CN211989984U (en) | 2020-11-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020440495.0U Active CN211989984U (en) | 2020-03-31 | 2020-03-31 | Silicon wafer cleaning device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115042090A (en) * | 2022-06-15 | 2022-09-13 | 哈尔滨秋冠光电科技有限公司 | Method for self-cleaning wafer by polishing machine |
-
2020
- 2020-03-31 CN CN202020440495.0U patent/CN211989984U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115042090A (en) * | 2022-06-15 | 2022-09-13 | 哈尔滨秋冠光电科技有限公司 | Method for self-cleaning wafer by polishing machine |
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Address after: No. 199, deer mountain road, Suzhou high tech Zone, Jiangsu Province Patentee after: CSI Cells Co.,Ltd. Patentee after: CANADIAN SOLAR MANUFACTURING (LUOYANG) Inc. Patentee after: Atlas sunshine Power Group Co.,Ltd. Address before: No. 199, deer mountain road, Suzhou high tech Zone, Jiangsu Province Patentee before: CSI Cells Co.,Ltd. Patentee before: CANADIAN SOLAR MANUFACTURING (LUOYANG) Inc. Patentee before: CSI SOLAR POWER GROUP Co.,Ltd. |