CN211989984U - Silicon wafer cleaning device - Google Patents

Abstract

The application provides a silicon wafer cleaning device, comprising a cleaning tank for cleaning silicon wafers, a plurality of liquid storage tanks, and an infusion pipe connecting the liquid storage tank and the cleaning tank, and the liquid storage tanks are respectively used for storage For different cleaning agents, at least part of the liquid storage tank is provided with a stirrer, and the infusion pipes connected to the different liquid storage tanks are arranged independently of each other; the silicon wafer cleaning device also includes a liquid disposed on the infusion pipe. Pumps, control valves and flow meters. The silicon wafer cleaning device of the present application can effectively clean the silicon wafers after diamond wire cutting, improve the stability of the silicon wafer cleaning process, reduce the proportion of dirty wafers, reduce the waste of cleaning agents, and achieve lean production; On-site personnel workload, reducing safety hazards.

Description

Wafer cleaning device

technical field

The present application relates to the field of photovoltaic production equipment, in particular to a silicon wafer cleaning device.

Background technique

Crystalline silicon solar cells still occupy an important position in the photovoltaic market at this stage, and the processing quality of silicon wafers will directly affect the conversion efficiency of subsequent cells and photovoltaic modules. At present, a large amount of silicon powder, organic matter, metal ions and other impurities will remain on the surface of silicon wafers cut by diamond wire. The conversion efficiency is greatly reduced. Therefore, the cleaning of silicon wafers is particularly important for the performance of crystalline silicon solar cells.

The existing silicon wafer cleaning process mainly includes steps such as pre-cleaning, chemical cleaning, rinsing, drying, etc. Among them, chemical cleaning is the most critical step that determines the cleaning effect of the silicon wafer. Specifically, chemical cleaning agents such as special cleaning agents for silicon wafers, hydrogen peroxide, potassium hydroxide, etc. are used for chemical cleaning. The addition of the above chemical agents needs to be carried out in stages, that is, liquid replenishment needs to be carried out according to the cleaning quantity of silicon wafers.

At present, many manufacturers still directly use the manual mode to add the above chemicals. It is difficult to precisely control the amount and time of addition of the chemicals, which affects the cleaning effect, and is prone to splashing of the chemicals, posing a potential safety hazard. More importantly, the manual addition mode has a relatively long interval, and the concentration of the agent gradually decreases with the increase of the number of silicon wafers to be cleaned, resulting in a large change in the cleaning effect of the silicon wafers, that is, it is easy to have more impurities on the surface of some silicon wafers, which affects the follow-up. The quality of the cells is stable. The industry has also disclosed a technical solution for cleaning silicon wafers by using automatic liquid replenishment, but its structural design still needs to be further improved.

Utility model content

The purpose of the present application is to provide a silicon wafer cleaning device, which can effectively clean the silicon wafers after diamond wire cutting, improve the cleaning quality, reduce the waste of cleaning agents, and reduce potential safety hazards.

In order to achieve the above purpose, the present application provides a silicon wafer cleaning device, which includes a cleaning tank for cleaning silicon wafers, a plurality of liquid storage tanks, an infusion pipe connecting the liquid storage tank and the cleaning tank, and a plurality of the liquid storage tanks. The tanks are respectively used to store different cleaning agents, at least part of the liquid storage tanks are provided with agitators, and the infusion pipes connected to the different liquid storage tanks are arranged independently of each other; the silicon wafer cleaning device also includes Liquid pumps, control valves and flow meters on infusion lines.

As a further improvement of the present application, the liquid storage tank is also provided with a filter connected to the end of the infusion tube.

As a further improvement of the present application, the inner diameter of the infusion tube is set to be 5-10 mm.

As a further improvement of the present application, the volume of the liquid storage tank is set to 250-300 L, and the liquid storage tank is provided with a liquid level detection mechanism.

As a further improvement of the present application, a liquid injection port is provided on the side of the liquid storage tank away from the infusion tube.

As a further improvement of the present application, the cleaning tank has a bottom wall and a peripheral wall, and the cleaning tank is provided with an ultrasonic component close to the bottom wall and/or the peripheral wall, and a bubbling component located adjacent to the bottom wall.

As a further improvement of the present application, the bubbling assembly includes a bubbling tube extending along the edge of the bottom wall, and the inner diameter of the bubbling tube is set to be 5-10 mm.

As a further improvement of the present application, the silicon wafer cleaning device includes at least two mutually independent cleaning tanks.

As a further improvement of the present application, the infusion pipe includes a main pipeline connected to the liquid storage tank and a branch pipeline connected to the main pipeline and the cleaning tank, the liquid pump is arranged on the main pipeline, and each The branch pipelines are all provided with the corresponding control valves and flow meters.

As a further improvement of the present application, the silicon wafer cleaning device further includes a control system, the control system is used to edit and save the cleaning program, and control the cleaning of the silicon wafer according to the cleaning program.

The beneficial effects of the present application are: the silicon wafer cleaning device of the present application realizes the automatic addition of different cleaning agents through several liquid storage tanks, and stirs the cleaning agents in the corresponding liquid storage tanks through the agitator to ensure the uniformity of the liquid medicine . Using the above silicon wafer cleaning device can effectively clean the silicon wafer after diamond wire cutting, improve the cleaning quality of the silicon wafer, reduce the proportion of dirty wafers, and reduce the waste of cleaning agents; it can also reduce the workload of on-site personnel and reduce safety hazards. .

Description of drawings

FIG. 1 is a partial structural schematic diagram of a preferred embodiment of the silicon wafer cleaning device of the present application;

FIG. 2 is a partial structural schematic diagram of another preferred embodiment of the silicon wafer cleaning apparatus of the present application.

100-wafer cleaning device; 1-cleaning tank; 11-bottom wall; 12-peripheral wall; 13-ultrasonic assembly; 14-bubbling assembly; 2-liquid storage tank; 21-stirrer; 210-stirring motor; 21- Bottom of box; 23-box cover; 24-side wall; 25-filter; 26-liquid injection port; 3-infusion pipe; 31-liquid pump; 32-control valve; 33-flow meter; 301-main pipeline; 302- branch pipeline.

Detailed ways

The present application will be described in detail below with reference to the embodiments shown in the accompanying drawings. However, this embodiment does not limit the present application, and the structural, method, or functional transformations made by those of ordinary skill in the art according to this embodiment are all included in the protection scope of the present application.

Referring to FIG. 1 , the silicon wafer cleaning device 100 provided by the present application is used for cleaning silicon wafers cut by diamond wire, and includes a cleaning tank 1 , a plurality of liquid storage tanks 2 , and a connection between the liquid storage tank 2 and the cleaning tank 1 . the infusion tube 3.

A plurality of the liquid storage tanks 2 are respectively used to store different cleaning agents, and the infusion pipes 3 connected to the different liquid storage tanks 2 are arranged independently of each other. In other words, each cleaning agent is added to the cleaning tank 1 through an independent pipeline, and will not be mixed in the infusion pipe 3, which is beneficial to accurately control the addition amount of various cleaning agents; at the same time, it also avoids premixing of different cleaning agents, It can be used to add some pharmaceuticals that are not suitable for mixing in advance. For the silicon wafer cleaning process, the required cleaning agents usually include hydrogen peroxide, KOH solution and cleaning agent, so the liquid storage tanks 2 can be set to three to store the above hydrogen peroxide, KOH solution and cleaning agent respectively. Among them, some components may be introduced into the cleaning agent, which is not suitable for long-term stable existence in strong alkali solution. If hydrogen peroxide, KOH solution and cleaning agent are mixed in advance, the cleaning effect of silicon wafers may be deteriorated, and the above-mentioned various Consumption of cleaning agents.

At least part of the liquid storage tank 2 is provided with a stirrer 21. The stirrer 21 can be configured according to the characteristics of each cleaning agent. The stratification and crystallization of the cleaning agent are avoided, and the cleaning agent can maintain a good uniformity in the liquid storage tank 2 .

The liquid storage tank 2 includes a tank bottom 22 , a tank cover 23 , a side wall 24 connecting the tank bottom 22 and the tank cover 23 , and the agitator 21 has a stirring motor 210 disposed on the tank cover 23 . The infusion pipe 3 is connected to the side wall 24 adjacent to the tank bottom 22 and is spaced from the tank bottom 22 , and the liquid storage tank 2 is also provided with a filter 25 connected to the end of the infusion pipe 3 . , so as to avoid block and granular impurities in the liquid storage tank 2 from entering the infusion pipe 3 .

The liquid storage tank 2 is further provided with a liquid injection port 26 on the side away from the infusion pipe 3, that is, the liquid injection port 26 is relatively arranged on the other side of the infusion pipe 3, so that the corresponding After the cleaning agent is added, it can be mixed with the remaining liquid in the liquid storage tank 2 , and then transported to the cleaning tank 1 through the infusion pipe 3 . Here, the liquid injection port 26 is provided on the tank cover 23 , and the liquid injection port 26 can be connected to an external liquid supply system, or the corresponding cleaning agent can be manually added to the liquid storage tank 2 from the liquid injection port 26 Inside.

The volume of the liquid storage tank 2 is set to 250-300 L, and the liquid storage tank is provided with a liquid level detection mechanism and a low liquid level alarm mechanism. The liquid storage tank 2 can be made of transparent plastic material to facilitate on-site liquid level observation, and a volume scale can also be provided on the side wall 22 of the liquid storage tank 2 . In particular, for cleaning agents that are easily decomposed under light conditions, it is necessary to use non-transparent materials to prepare the corresponding liquid storage tank 2 . In addition, a drain pipe (not shown) can also be provided at the bottom of the liquid storage tank 2 to facilitate cleaning of the liquid storage tank 2 .

The infusion tube 3 is made of corrosion-resistant plastic pipes, and the inner diameter of the infusion tube 3 is set to 5-10 mm. The silicon wafer cleaning device 100 further includes a control system and a liquid pump 31, a control valve 32, and a flow meter arranged on the infusion pipe 3. The control system is used to edit and save the cleaning program, and according to the cleaning program To control the cleaning of the silicon wafer, the liquid pump 31 , the control valve 32 and the flow meter 33 are all connected to the control system and work according to the instructions issued by the control system. The flow rate of the liquid pump 31 can be adjusted according to production requirements, and the adjustment range of the flow rate generally does not exceed 10L/min.

Wherein, the cleaning procedure includes the following information: silicon wafer type; initial addition amount of cleaning agents in each of the liquid storage tanks 2 ; dynamic replenishment amount of each cleaning agent; Of course, the control system can store multiple sets of cleaning programs to facilitate field operations.

For example, the initial addition amount of KOH solution is set to 500mL, and 20mL of KOH solution is replenished every time 10,000 wafers are cleaned, that is, the dynamic replenishment amount is 20mL/10,000 wafers; the initial addition amount of cleaning agent is set to 7000mL , the dynamic replenishment volume is set to 250mL/10,000 tablets; the liquid change cycle is set to 80,000 tablets. Preferably, when the tank is prepared for the first time, deionized water with about half capacity can be added into the cleaning tank 1 first, and then various cleaning agents can be added.

The cleaning tank 1 can be made of corrosion-resistant materials such as stainless steel or polyethylene. The cleaning tank 1 has a bottom wall 11 and a peripheral wall 12 . The cleaning tank 1 is provided with an ultrasonic assembly 13 close to the bottom wall 11 and/or the peripheral wall 12 , and a bubbling assembly 14 disposed adjacent to the bottom wall 11 . The bubbling assembly 14 specifically includes a bubbling tube extending along the edge of the bottom wall 11, the inner diameter of the bubbling tube is set to 5-10 mm, and the bubbling tube is provided with a number of small holes, which pass through the outside. The incoming compressed air can mix the cleaning solution in the cleaning tank 1 evenly.

As shown in FIG. 2 , in another embodiment of the present application, the silicon wafer cleaning apparatus 100 includes at least two mutually independent cleaning tanks 1 to improve cleaning efficiency. The infusion pipe 3 includes a main pipeline 301 connected to the liquid storage tank 2, and a branch pipeline 302 connecting the main pipeline 301 and each cleaning tank 1. The liquid pump 31 is arranged on the main pipeline 301, and Each of the branch pipes 302 is provided with the corresponding control valve 32 and the flow meter 33 to control the addition and replenishment of cleaning chemicals in the corresponding cleaning tank 1 according to the instructions of the control system. It should be noted that, for the convenience of illustration, only one of the liquid storage tanks 2 and the infusion tube 3 connected to the liquid storage tank 2 are shown.

To sum up, the silicon wafer cleaning device 100 of the present application can realize the automatic addition of different cleaning agents, avoid mixing of different cleaning agents in advance, and stir the cleaning agents in the corresponding liquid storage tank 2 through the agitator 21 to ensure that the cleaning agents are mixed. Liquid uniformity. The silicon wafer cleaning device 100 can effectively clean the silicon wafers cut by the diamond wire, improve the cleaning quality of the silicon wafers, reduce the proportion of dirty wafers, and reduce the waste of cleaning agents; it can also reduce the workload of on-site personnel and reduce safety. hidden danger.

It should be understood that although this specification is described in terms of embodiments, not every embodiment only includes an independent technical solution, and this description in the specification is only for the sake of clarity, and those skilled in the art should take the specification as a whole, and each The technical solutions in the embodiments can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

The series of detailed descriptions listed above are only specific descriptions for the feasible embodiments of the present application, and they are not intended to limit the protection scope of the present application. Changes should be included within the scope of protection of this application.

Claims (10)

1. a silicon wafer cleaning device, comprising a cleaning tank for cleaning silicon wafers, it is characterized in that: the silicon wafer cleaning device also comprises several liquid storage tanks, infusion pipes connecting the liquid storage tank and the cleaning tank, Several of the liquid storage tanks are respectively used to store different cleaning agents, at least some of the liquid storage tanks are provided with agitators, and the infusion pipes connected to the different liquid storage tanks are arranged independently of each other; the silicon wafer cleaning device is also It includes a liquid pump, a control valve and a flow meter arranged on the infusion pipe. 2 . The silicon wafer cleaning device according to claim 1 , wherein the liquid storage tank is further provided with a filter connected to the end of the infusion tube. 3 . 3 . The silicon wafer cleaning device according to claim 1 , wherein the inner diameter of the infusion tube is set to be 5-10 mm. 4 . 4 . The silicon wafer cleaning device according to claim 1 , wherein the volume of the liquid storage tank is set to 250-300 L, and the liquid storage tank is provided with a liquid level detection mechanism. 5 . 5 . The silicon wafer cleaning device according to claim 1 , wherein a liquid injection port is provided on a side of the liquid storage tank away from the infusion tube. 6 . 6 . The silicon wafer cleaning device according to claim 1 , wherein the cleaning tank has a bottom wall and a peripheral wall, and an ultrasonic component close to the bottom wall and/or the peripheral wall is arranged in the cleaning tank, and an ultrasonic component adjacent to the bottom wall and/or the peripheral wall is arranged in the cleaning tank. The bubbling assembly provided on the bottom wall. 7 . The silicon wafer cleaning device according to claim 6 , wherein the bubbling assembly comprises a bubbling tube extending along the edge of the bottom wall, and the inner diameter of the bubbling tube is set to 5-10 mm. 8 . . 8 . The silicon wafer cleaning device according to claim 1 , wherein the silicon wafer cleaning device comprises at least two mutually independent cleaning tanks. 9 . 9 . The silicon wafer cleaning device according to claim 1 , wherein the infusion pipe comprises a main pipeline connected to the liquid storage tank, a branch pipeline connecting the main pipeline and the cleaning tank, and the liquid pump It is arranged on the main pipeline, and each of the branch pipelines is provided with the corresponding control valve and flow meter. 10 . The silicon wafer cleaning device according to claim 1 , wherein the silicon wafer cleaning device further comprises a control system, the control system is used to edit and save the cleaning program, and control the silicon wafer according to the cleaning program. 11 . cleaning.

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