CN211981921U - Mobile phone motherboard convenient to heat dissipation - Google Patents
Mobile phone motherboard convenient to heat dissipation Download PDFInfo
- Publication number
- CN211981921U CN211981921U CN202021103075.XU CN202021103075U CN211981921U CN 211981921 U CN211981921 U CN 211981921U CN 202021103075 U CN202021103075 U CN 202021103075U CN 211981921 U CN211981921 U CN 211981921U
- Authority
- CN
- China
- Prior art keywords
- mobile phone
- earphone jack
- battery
- heat dissipation
- metal shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 23
- 239000002184 metal Substances 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 239000011889 copper foil Substances 0.000 claims description 17
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 13
- 239000004642 Polyimide Substances 0.000 claims description 13
- 239000002131 composite material Substances 0.000 claims description 13
- 229910021389 graphene Inorganic materials 0.000 claims description 13
- 229920001721 polyimide Polymers 0.000 claims description 13
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 5
- 238000003860 storage Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims description 2
- 238000013461 design Methods 0.000 abstract description 2
- 239000012528 membrane Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a mobile phone motherboard convenient to heat dissipation, including the PCB plate body, the lower extreme middle part of the PCB plate body is equipped with the earphone jack, the right side of earphone jack is equipped with the USB interface, the left side of earphone jack is just being equipped with the microphone pad to the position of cell phone case's sound hole, the top left side of earphone jack is equipped with the chip weld district, chip weld district upper shield is equipped with the metallic shield cover, a plurality of louvres have been seted up on the metallic shield cover, the top right side of earphone jack is equipped with the battery interface, the battery is installed behind the battery interface, the battery cover is located on the metallic shield cover, and there is a certain clearance in the interval between battery and the metallic shield cover, the earphone jack, USB interface and. The utility model has the advantages of reasonable design, can realize the quick heat dissipation to chip and battery on the mainboard.
Description
Technical Field
The utility model relates to a mobile phone technology field especially relates to a mobile phone motherboard convenient to heat dissipation.
Background
With the rapid development of science and technology, mobile phones have become indispensable electronic products in people's lives. The mobile phone motherboard is a core component of a mobile phone, in the working process of the mobile phone motherboard, electronic devices on the mobile phone motherboard can generate a large amount of heat, especially chips such as a battery and a baseband chip, a radio frequency chip, a data and image processing chip and the like on the mobile phone motherboard, and are main heating devices on the mobile phone motherboard, so that the installation positions of the mobile phone chip and the battery on the mobile phone motherboard are reasonably designed, each chip and the battery on the mobile phone motherboard can rapidly dissipate heat, and the problem to be solved at present is solved urgently.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving the technical problem who exists among the prior art at least, creatively provided a radiating mobile phone motherboard of being convenient for very much, structural design is reasonable, can realize the quick heat dissipation to chip and battery on the mainboard.
In order to realize the above object of the utility model, the utility model provides a mobile phone motherboard convenient to heat dissipation, including the PCB plate body, the lower extreme middle part of PCB plate body is equipped with the earphone jack, the right side of earphone jack is equipped with the USB interface, the left side of earphone jack is just being equipped with the microphone pad to the position of cell phone case's sound hole, the top left side of earphone jack is equipped with the chip weld area, chip weld area upper shield is equipped with the metal shielding cover, a plurality of louvres have been seted up on the metal shielding cover, the top right side of earphone jack is equipped with the battery interface, the battery install in behind the battery interface, the battery cover is located on the metal shielding cover, just the battery with there is certain clearance in the interval between the metal shielding cover, earphone jack, USB interface and battery interface respectively with PCB plate body electricity is connected.
Preferably, the heat dissipation holes in the metal shielding case are in a horn shape with a small outside and a large inside.
Preferably, the outer wall of the metal shielding case is provided with a heat conducting film through heat conducting double-sided adhesive, and the lower end of the heat conducting film extends towards the end part of the lower end of the mobile phone shell.
Preferably, the heat conducting film is a copper foil, a graphene polyimide composite film or a double-layer or three-layer film structure formed by bonding the graphene polyimide composite film and the copper foil through a pressure-sensitive adhesive.
Preferably, the heat conducting film is a three-layer film structure formed by bonding a graphene polyimide composite film and a copper foil through a pressure-sensitive adhesive, and the three-layer film structure comprises a first copper foil layer, a graphene polyimide composite film layer and a second copper foil layer which are sequentially stacked and bonded.
Preferably, a first SIM card slot is arranged above the metal shielding case, and a second SIM card slot, a third SIM card slot and a storage card slot are sequentially arranged on the right side of the metal shielding case from bottom to top.
Since the technical scheme is used, the utility model discloses following beneficial effect has:
the utility model discloses a mobile phone motherboard is through being close to the earphone jack with chip weld zone and battery interface, USB interface and microphone setting, because the earphone jack, the cell phone case's that USB interface and microphone correspond position all seted up with the communicating hole in cell-phone outside, regional air mobility is big around the hole, can be quick with the heat exchange to the outside space of cell-phone of chip and battery production on the mainboard of cell-phone inside, thereby carry out the cooling of dispelling the heat fast to chip and battery, effectively improve the radiating effect.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic perspective view of a mobile phone motherboard convenient for heat dissipation in a preferred embodiment of the present invention;
fig. 2 is a schematic side view of a mobile phone motherboard convenient for heat dissipation according to a preferred embodiment of the present invention;
fig. 3 is a schematic view of a partial cross-sectional structure of a mobile phone motherboard convenient for heat dissipation in a preferred embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
In the description of the present invention, unless otherwise specified and limited, it is to be noted that the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, mechanically or electrically connected, or may be connected between two elements through an intermediate medium, or may be directly connected or indirectly connected, and specific meanings of the terms may be understood by those skilled in the art according to specific situations.
The utility model provides a mobile phone mainboard convenient for heat dissipation, as shown in figures 1-3, the mobile phone mainboard comprises a PCB body 1, the middle part of the lower end of the PCB body 1 is provided with an earphone jack 2 for plugging external earphone equipment, the right side of the earphone jack 2 is provided with a USB interface 3 for charging and data transmission of a mobile phone, the left side of the earphone jack 2 is provided with a microphone pad 4 right against the sound hole of a mobile phone shell 100, the left side of the upper part of the earphone jack 2 is provided with a chip welding area, the upper cover of the chip welding area is provided with a metal shielding cover 5, the metal shielding cover 5 is provided with a plurality of heat dissipation holes 6, the right side of the upper part of the earphone jack 2 is provided with a battery interface 7, after a battery 8 is arranged on the battery interface, and a certain gap is arranged between the battery 8 and the metal shielding case 5 at intervals, and the earphone jack 2, the USB interface 3 and the battery interface 7 are respectively and electrically connected with the PCB body 1.
In the embodiment, the chip welding area and the battery interface 7 are arranged close to the earphone jack 2, the USB interface 3 and the microphone, and since the positions of the mobile phone shell 100 corresponding to the earphone jack 2, the USB interface 3 and the microphone are all provided with holes communicated with the outside of the mobile phone, the air fluidity in the surrounding area of the holes is large, the heat generated by the chip 15 and the battery 8 on the mainboard inside the mobile phone can be quickly exchanged to the space outside the mobile phone, so that the chip 15 and the battery 8 can be quickly cooled and dissipated heat, and the heat dissipation effect is effectively improved; because a certain gap is formed between the battery 8 and the metal shielding case 5, the gap is communicated with holes at the lower end of the mobile phone shell 100, such as the openings at the corresponding positions of the earphone jack 1, the USB interface 3 and the microphone, so as to form a heat dissipation channel, further quickly conduct heat generated by the chip 15 and the battery 8 to each hole at the lower end of the mobile phone shell 100, and quickly dissipate heat through heat exchange between the outside and the periphery of the holes; through setting up the chip bonding area, can concentrate chip 15 to weld in the chip bonding area, metal shielding case 5 is established to chip bonding area cover, is favorable to avoiding electromagnetic interference to cause the influence to chip 15 normal work, effectively improves communication quality, and the heat that chip 15 inside metal shielding case 5 produced carries out the heat exchange through metal shielding case 5 itself and louvre 6 and metal shielding case 5 outside.
In the present embodiment, as shown in fig. 3, the heat radiation hole 6 in the metal shield 5 is formed in a horn shape having a small outside and a large inside. Set up like this for when the inside hot-air of metallic shield 5 passed through louvre 6 and toward the diffusion heat dissipation, the air current flowed to the less outside in cross-section from the great inboard in cross-section of louvre 6, made the speed of air current toward the diffusion outward accelerate, effectively improved the radiating effect.
In the present embodiment, as shown in fig. 3, a heat conductive film 10 is bonded to the outer wall of the metal shield case 5 via a double-sided thermal tape 9, and the lower end of the heat conductive film 10 extends toward the lower end of the mobile phone case 100. Heat that gives out through heat conduction membrane 10 to 5 absorptive chips 15 of metal shielding cover conducts heat to each hole department such as earphone jack 2 of the lower extreme tip of cell phone case 100, further promote the radiating effect to chip 15, heat conduction double faced adhesive tape 9 plays the effect of bonding and heat conduction simultaneously, bond heat conduction membrane 10 and shielding metal covering through heat conduction double faced adhesive tape 9, production and processing and maintenance easy maintenance, heat conduction membrane 10 is the thin slice membrane, heat conductivity is good, and occupation space is little.
In the present embodiment, as shown in fig. 3, the heat conductive film 10 is a three-layer film structure in which a graphene polyimide composite film and a copper foil are bonded by a pressure sensitive adhesive, and the three-layer film structure includes a first copper foil layer 101, a graphene polyimide composite film layer 102, and a second copper foil layer 103, which are sequentially stacked and bonded. Graphene polyimide composite membrane has good heat conduction heat dispersion, and the copper foil has good heat conduction heat dispersion equally, through locating graphene polyimide composite membrane presss from both sides between two copper foils, not only can guarantee good heat conduction heat dispersion, simultaneously, because the copper foil has good ductility, the copper foil can protect inside graphene polyimide composite membrane, effectively improves the intensity of whole heat conduction membrane 10.
In this embodiment, as shown in fig. 1 (without a battery installed), a first SIM card slot 11 is disposed above the metal shielding case 5, and a second SIM card slot 12, a third SIM card slot 13, and a memory card slot 14 are sequentially disposed on the right side of the metal shielding case 5 from bottom to top. Through setting up first SIM card slot 11, second SIM card slot 12 and third SIM card slot 13 for three SIM cards can be installed to the cell-phone, furthest's satisfying the user's demand, memory card slot 14 is used for inserting storage cards such as SD card or TF card, extension cell-phone storage space. Above-mentioned each draw-in groove is rationally distributed, arranges closely, effectively reduces occupation space, is favorable to the mobile phone motherboard to miniaturized development.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (6)
1. The utility model provides a mobile phone motherboard convenient to heat dissipation, its characterized in that, includes the PCB plate body, the lower extreme middle part of the PCB plate body is equipped with the earphone jack, the right side of earphone jack is equipped with the USB interface, the left side of earphone jack is just being equipped with the microphone pad to the position of cell phone case's sound hole, the top left side of earphone jack is equipped with the chip weld district, chip weld district upper shield is equipped with metal shielding case, a plurality of louvres have been seted up on the metal shielding case, the top right side of earphone jack is equipped with the battery interface, the battery install in behind the battery interface, the battery cover is located on the metal shielding case, just the battery with there is a certain clearance at the interval between the metal shielding case, earphone jack, USB interface and battery interface respectively with PCB plate body electricity.
2. The motherboard of a mobile phone convenient for heat dissipation of claim 1, wherein the heat dissipation hole of the metal shielding case is in a horn shape with a small outside and a large inside.
3. The mobile phone motherboard for facilitating heat dissipation of claim 1 or 2, wherein the outer wall of the metal shielding case is adhered with a heat conducting film by a heat conducting double-sided adhesive, and a lower end of the heat conducting film extends towards a lower end of the mobile phone shell.
4. The mobile phone motherboard convenient for heat dissipation of claim 3, wherein said thermal conductive film is a copper foil, a graphene polyimide composite film or a double-layer or triple-layer film structure formed by bonding a graphene polyimide composite film and a copper foil through a pressure sensitive adhesive.
5. The mobile phone motherboard convenient for heat dissipation of claim 4, wherein the heat conducting film is a three-layer film structure formed by bonding a graphene polyimide composite film and a copper foil through a pressure sensitive adhesive, and the three-layer film structure comprises a first copper foil layer, a graphene polyimide composite film layer and a second copper foil layer which are sequentially stacked and bonded.
6. The mobile phone motherboard convenient for heat dissipation of claim 5, wherein a first SIM card slot is arranged above the metal shielding case, and a second SIM card slot, a third SIM card slot and a storage card slot are sequentially arranged on the right side of the metal shielding case from bottom to top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021103075.XU CN211981921U (en) | 2020-06-15 | 2020-06-15 | Mobile phone motherboard convenient to heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021103075.XU CN211981921U (en) | 2020-06-15 | 2020-06-15 | Mobile phone motherboard convenient to heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211981921U true CN211981921U (en) | 2020-11-20 |
Family
ID=73368712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021103075.XU Expired - Fee Related CN211981921U (en) | 2020-06-15 | 2020-06-15 | Mobile phone motherboard convenient to heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211981921U (en) |
-
2020
- 2020-06-15 CN CN202021103075.XU patent/CN211981921U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201120 |
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| CF01 | Termination of patent right due to non-payment of annual fee |