CN211959858U - Shock resistance mounting base that electronic components used - Google Patents
Shock resistance mounting base that electronic components used Download PDFInfo
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- CN211959858U CN211959858U CN202020624608.2U CN202020624608U CN211959858U CN 211959858 U CN211959858 U CN 211959858U CN 202020624608 U CN202020624608 U CN 202020624608U CN 211959858 U CN211959858 U CN 211959858U
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Abstract
The utility model discloses an anti-seismic mounting base that electronic components used, built-in installation cell body nested install within external installation cell body and through along vertical direction, the damping spring that the horizontal direction evenly arranged is connected, the inboard level of built-in installation cell body concreties and has multiunit parallel arrangement's installation crossbeam, the installation board level concreties and installs on the installation crossbeam, the installation bed course has been laid to the installed plate upper surface, the installation bed course has been arranged by the upper and lower level order through the mode that bonds and has been absorbed water layer, soft fine hair layer, rubber layer, electronic components fixed mounting is on the installation bed course with the mounting panel, heat abstractor includes that hair-dryer and multiunit arrange the spout of blowing that upwards arranges in built-in installation groove inboard bottom and opening, the hair-dryer with each group the spout of blowing is linked. The utility model discloses have collect shock attenuation, heat dissipation, dehumidification integrative and can high-efficient shock attenuation, make things convenient for rational arrangement electronic components's beneficial effect.
Description
Technical Field
The utility model relates to an electronic components installs technical field, specific shock resistance mounting base that electronic components used that says so.
Background
Due to the rapid development of the scientific and technological level, more and more production and living fields can use electronic components, and the electronic components can meet specific production requirements or improve the quality of life to become the mainstream of the current society. But the working effect of electronic component receives temperature, humidity, vibrations influence great, but the structure that exists at present for installing electronic components is difficult to solve multiple factor simultaneously again and to electronic components's influence effect to traditional electronic component's mounting structure also is difficult to carry out the reasonable installation of integration to electronic components of different models, kind and many quantity.
SUMMERY OF THE UTILITY MODEL
To the above-mentioned weak point that exists among the prior art, the utility model aims at providing a shock resistance mounting base that shock attenuation, heat dissipation, dehumidification are integrative and can high-efficient shock attenuation, make things convenient for rational arrangement of electronic components.
The utility model discloses a realize that the technical scheme that above-mentioned purpose adopted is: an anti-seismic mounting base for electronic components comprises an external mounting groove body, an internal mounting groove body, a mounting beam, a mounting plate, a mounting cushion layer and a heat dissipation device, wherein the internal mounting groove body is nested in the external mounting groove body and is connected with the external mounting groove body through damping springs uniformly arranged in the vertical direction and the horizontal direction, a plurality of groups of mounting beams arranged in parallel are horizontally and fixedly connected to the inner side of the internal mounting groove body, the mounting plate is horizontally and fixedly mounted on the upper surface of the mounting beam, the mounting cushion layer is laid on the upper surface of the mounting plate, a water absorption layer, a soft velvet layer and a rubber layer are horizontally and sequentially arranged from top to bottom in a bonding mode, the electronic components are fixedly mounted on the mounting plate of the mounting cushion layer and are in direct contact with the water absorption layer, the heat dissipation device comprises a blower and a plurality of groups of air blowing nozzles arranged at the bottom of, the blower is communicated with the blowing nozzles of each group.
Further, external installation cell body, built-in installation cell body all are provided with the ascending mounting groove of opening, the inboard size of mounting groove of external installation cell body is greater than the peripheral size of built-in installation cell body, the top edge of built-in installation cell body sets up to the type of falling U structure and wraps up the top of external installation cell body wherein.
Furthermore, a part of the horizontally arranged damping springs are arranged around a gap formed by combining the built-in installation groove body and the external installation groove body and are respectively connected to the outer side wall of the built-in installation groove body and the inner side wall of the external installation groove body, and the other part of the horizontally arranged damping springs are connected with the inner side wall and the outer side wall of the top of the external installation groove body at one end and are connected in an inverted U-shaped structure at the top of the built-in installation groove body at the other end.
Furthermore, a part of the damping springs are vertically arranged in a gap formed by combining the built-in installation groove body and the external installation groove body, two ends of the damping springs are respectively connected with the lower surface of the built-in installation groove body and the upper surface of the installation groove in the external installation groove body, and the other part of the damping springs are vertically arranged, one ends of the damping springs are vertically connected in an inverted U-shaped structure at the top of the built-in installation groove body, and the other ends of the damping springs are vertically connected to the top of the external installation groove body.
Furthermore, the two ends of the installation beam are horizontally and fixedly connected with the inner side wall of the built-in installation groove body through fixing bolts, the installation plates are fixedly connected with the installation beam through the fixing bolts, and each group of installation plates at least needs to be fixedly connected to more than two groups of installation beams.
Furthermore, the arrangement position of the surface mounting cushion layer on the mounting plate is provided with an arrangement groove, the mounting cushion layer is arranged in the arrangement groove, and the electronic component is fixedly mounted on the upper surfaces of the mounting cushion layer and the mounting plate through fixing bolts.
Further, the blower is fixedly arranged on the inverted U-shaped structure of the built-in installation groove body, an air inlet of the blower is communicated with the external environment, and an air outlet of the blower is communicated with the blowing nozzles of each group through an air conveying pipeline.
The utility model has the advantages that: according to the dehumidifying device, a plurality of groups of damping springs are arranged in the horizontal and water quality directions, the air blowing nozzles are vertically and upwardly arranged at the bottom of the inner side of the built-in mounting groove, and the dehumidifying effect of the electronic components is achieved on the dehumidifying layer only when the electronic components are directly mounted, so that the integrated treatment of damping and heat dissipation of the electronic components is realized; the damping spring can effectively buffer the vibration from the horizontal direction and the vertical direction to play a role in fighting, and the soft pile layer and the rubber layer arranged on the mounting cushion layer can further perform anti-seismic treatment on the electronic component, so that the damping cushion has the beneficial effect of efficient damping; the combination arrangement of the multiple groups of mounting beams and the mounting plates can realize the reasonable mounting of different electronic components and multiple groups of electronic components in the built-in mounting groove body.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged detail view of portion A of FIG. 1;
fig. 3 is a schematic top view of the structure of the present invention.
In the figure: the air blowing device comprises an external installation groove body 1, an internal installation groove body 2, an installation beam 3, an installation plate 4, an installation cushion layer 5, a water absorption layer 501, a soft velvet layer 502, a rubber layer 503, a damping spring 6, an electronic component 7, an air blower 8, an air blowing nozzle 9, an inverted U-shaped structure 10 and an air conveying pipeline 11.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, an earthquake-resistant mounting base for electronic components comprises an external mounting groove body 1, an internal mounting groove body 2, a mounting beam 3, a mounting plate 4, a mounting cushion 5 and a heat dissipation device, wherein the internal mounting groove body 2 is nested in the external mounting groove body 1 and is connected with the external mounting groove body through damping springs 6 uniformly arranged along the vertical direction and the horizontal direction, a plurality of groups of parallel mounting beams 3 are horizontally and fixedly connected to the inner side of the internal mounting groove body 2, the mounting plate 4 is horizontally and fixedly mounted on the upper surface of the mounting beam 3, the mounting cushion 5 is laid on the upper surface of the mounting plate 4, a water absorbing layer 501, a soft velvet layer 502 and a rubber layer 503 are sequentially arranged on the mounting cushion 5 from top to bottom in a bonding mode, the electronic components 7 are fixedly mounted on the mounting plate 4 of the mounting cushion 5 and are directly contacted with the water absorbing layer 501, the heat dissipation device comprises a blower 8 and a plurality of groups The nozzles 9 and the blower 8 are communicated with each group of blowing nozzles 9.
In the utility model, the external installation groove body 1 and the internal installation groove body 2 are both provided with installation grooves with upward openings, the inner side size of the installation groove of the external installation groove body 1 is larger than the peripheral size of the internal installation groove body 2, the top edge of the internal installation groove body 2 is arranged into an inverted U-shaped structure 10 and wraps the top of the external installation groove body 1 therein, and the stable nested combination of the external installation groove body 1 and the internal installation groove body 2 is ensured;
one part of horizontally arranged damping springs 6 are arranged around a gap formed by combining the internal installation groove body 2 and the external installation groove body 1 and are respectively connected to the outer side wall of the internal installation groove body 2 and the inner side wall of the external installation groove body 1, one end of the other part of horizontally arranged damping springs 6 is connected with the inner side wall and the outer side wall of the top of the external installation groove body 1, and the other end of the horizontally arranged damping springs 6 are connected in an inverted U-shaped structure 10 at the top of the internal installation groove body 2, so that the internal installation groove body 2 and electronic components 7 installed in the internal installation groove body are prevented from being influenced;
one part of the damping springs 6 which are vertically arranged are arranged in a gap formed by combining the built-in installation groove body 2 and the external installation groove body 1, two ends of each damping spring 6 are respectively connected with the lower surface of the built-in installation groove body 2 and the upper surface of the installation groove in the external installation groove body 1, one end of each damping spring 6 which is vertically arranged is vertically connected into the inverted U-shaped structure 10 at the top of the built-in installation groove body 2, the other end of each damping spring 6 is vertically connected to the top of the external installation groove body 1, and the built-in installation groove body 2 and the electronic components 7 installed in the built-in;
the two ends of the mounting cross beam 3 are horizontally and fixedly connected with the inner side wall of the built-in mounting groove body 2 through fixing bolts, the mounting plates 4 are fixedly connected with the mounting cross beam 3 through the fixing bolts, each group of mounting plates 4 at least needs to be fixedly connected on more than two groups of mounting cross beams 3, the mounting stability of the mounting plates 4 and electronic components 7 mounted on the mounting plates is guaranteed, meanwhile, the reasonable mounting of different electronic components 7 and multiple groups of electronic components 7 in the built-in mounting groove body 2 can be realized through the combined arrangement of the groups of mounting cross beams 3 and the mounting plates 4;
an arrangement groove is formed in the arrangement position of the mounting cushion layer 5 on the upper surface of the mounting plate 4, the mounting cushion layer 5 is arranged in the arrangement groove, the electronic component 7 is fixedly mounted on the upper surfaces of the mounting cushion layer 5 and the mounting plate 4 through fixing bolts, and the electronic component 7 is mounted on the water absorption layer 501, the soft wool layer 502 and the rubber layer 503, so that the electronic component 7 can absorb water, and meanwhile, the shock resistance of the electronic component 7 is further improved;
the blower 8 is fixedly arranged on an inverted U-shaped structure 10 of the built-in installation groove body 2, an air inlet of the blower 8 is communicated with the external environment, an air outlet of the blower 8 is communicated with the blowing nozzles 9 of each group through an air conveying pipeline 11, the blower 8 pressurizes external cold air and sprays the air upwards through the blowing nozzles 9, and the electronic component 7 in working operation is cooled.
The utility model discloses a theory of operation is: when the mounting device is used, the mounting plate 4 is reasonably mounted on the mounting beam 3 according to the quantity and the type of the mounted electronic components 7, the electronic components 7 to be mounted are mounted on the mounting plate 4, and the electronic components 7 are ensured to be positioned on the mounting cushion layer 5;
the built-in installation groove body 2 and the electronic components 7 installed in the built-in installation groove body are prevented from being influenced by vibration in the horizontal and vertical directions preliminarily;
the electronic component 7 is arranged on the water absorbing layer 501, the soft velvet layer 502 and the rubber layer 503, so that the electronic component 7 can absorb water, and the shock resistance of the electronic component 7 is further improved;
and a blowing nozzle 9 is arranged at the bottom of the inner side of the built-in installation groove body 2 and communicated with a blower 8, so that the electronic component 7 in working operation can be cooled.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. The utility model provides an antidetonation nature mounting base that electronic components used which characterized in that: the mounting structure comprises an external mounting groove body (1), an internal mounting groove body (2), mounting beams (3), a mounting plate (4), a mounting cushion layer (5) and a heat dissipation device, wherein the internal mounting groove body (2) is nested and mounted in the external mounting groove body (1) and is connected with the external mounting groove body through damping springs (6) uniformly arranged in the vertical direction and the horizontal direction, a plurality of groups of parallel mounting beams (3) are horizontally and fixedly connected to the inner side of the internal mounting groove body (2), the mounting plate (4) is horizontally and fixedly mounted on the upper surface of the mounting beams (3), the mounting cushion layer (5) is laid on the upper surface of the mounting plate (4), a water absorbing layer (501), a soft velvet layer (502) and a rubber layer (503) are horizontally and sequentially arranged on the mounting cushion layer (5) from top to bottom in a bonding mode, and electronic components (7) are fixedly mounted on the mounting plate (4) of the mounting cushion layer (5) and are, the heat dissipation device comprises a blower (8) and a plurality of groups of air blowing nozzles (9) which are arranged at the bottom of the inner side of the built-in installation groove body (2) and are provided with upward openings, and the blower (8) is communicated with the air blowing nozzles (9).
2. The shock-resistant mounting base for an electronic component as claimed in claim 1, wherein: the installation structure is characterized in that the external installation groove body (1) and the internal installation groove body (2) are provided with installation grooves with upward openings, the inner side size of each installation groove of the external installation groove body (1) is larger than the peripheral size of the internal installation groove body (2), and the top edge of the internal installation groove body (2) is arranged to be an inverted U-shaped structure (10) and wraps the top of the external installation groove body (1) in the top edge.
3. The shock-resistant mounting base for an electronic component as claimed in claim 2, wherein: one part of the damping spring (6) is horizontally arranged around a gap formed by combining the built-in installation groove body (2) and the external installation groove body (1) and is respectively connected to the outer side wall of the built-in installation groove body (2) and the inner side wall of the external installation groove body (1), and the other part of the damping spring (6) is horizontally arranged, one end of the damping spring is connected with the inner side wall and the outer side wall of the top of the external installation groove body (1), and the other end of the damping spring is connected to the inverted U-shaped structure (10) at the top of the built-in installation groove body (.
4. The shock-resistant mounting base for an electronic component as claimed in claim 2, wherein: one part of the damping spring (6) is vertically arranged in a gap formed by combining the built-in installation groove body (2) and the external installation groove body (1), two ends of the damping spring are respectively connected with the lower surface of the built-in installation groove body (2) and the upper surface of the installation groove in the external installation groove body (1), the other part of the damping spring (6) is vertically arranged, one end of the damping spring is vertically connected in an inverted U-shaped structure (10) at the top of the built-in installation groove body (2), and the other end of the damping spring is vertically connected to the top of the external installation groove body (1).
5. The shock-resistant mounting base for an electronic component as claimed in claim 1, wherein: the installation crossbeam (3) both ends pass through fixing bolt horizontal fixed connection with the inside wall of built-in installation cell body (2), mounting panel (4) pass through fixing bolt fixed connection with installation crossbeam (3), and every mounting panel (4) of group need solidify on installation crossbeam (3) more than two sets of at least.
6. The shock-resistant mounting base for an electronic component as claimed in claim 1, wherein: the mounting plate is characterized in that a layout groove is formed in the layout position of the surface mounting cushion layer (5) on the mounting plate (4), the mounting cushion layer (5) is arranged in the layout groove, and the electronic component (7) is fixedly mounted on the upper surfaces of the mounting cushion layer (5) and the mounting plate (4) through fixing bolts.
7. The shock-resistant mounting base for an electronic component as claimed in claim 2, wherein: the air blower (8) is fixedly installed on an inverted U-shaped structure (10) of the built-in installation groove body (2), an air inlet of the air blower (8) is communicated with the external environment, and an air outlet of the air blower (8) is communicated with the air blowing nozzles (9) of each group through an air conveying pipeline (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020624608.2U CN211959858U (en) | 2020-04-23 | 2020-04-23 | Shock resistance mounting base that electronic components used |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020624608.2U CN211959858U (en) | 2020-04-23 | 2020-04-23 | Shock resistance mounting base that electronic components used |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211959858U true CN211959858U (en) | 2020-11-17 |
Family
ID=73162129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020624608.2U Active CN211959858U (en) | 2020-04-23 | 2020-04-23 | Shock resistance mounting base that electronic components used |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211959858U (en) |
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2020
- 2020-04-23 CN CN202020624608.2U patent/CN211959858U/en active Active
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| TR01 | Transfer of patent right |
Effective date of registration: 20210617 Address after: No.1, floor 1, unit 8, building 2, No.188, Zirui Avenue, high tech Zone, Chengdu, Sichuan 610037 Patentee after: CHENGDU SAIDI TECHNOLOGY Co.,Ltd. Address before: 512000 f1011, 1st floor, R & D office building, guanshao innovation and innovation equipment center, Huake City, 42 Baiwang Road, Wujiang District, Shaoguan City, Guangdong Province Patentee before: Shaoguan Xidian Information Technology Co.,Ltd. |