CN211940424U - Polishing pad removing device - Google Patents
Polishing pad removing device Download PDFInfo
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- CN211940424U CN211940424U CN201922304915.2U CN201922304915U CN211940424U CN 211940424 U CN211940424 U CN 211940424U CN 201922304915 U CN201922304915 U CN 201922304915U CN 211940424 U CN211940424 U CN 211940424U
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- polishing pad
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- pad fixing
- polishing
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model provides a polishing pad removing device, which comprises a polishing pad fixing component, a rotating component and a sleeve component, wherein the rotating component is connected with one end of the polishing pad fixing component, and the sleeve component is arranged outside the connecting end of the polishing pad fixing component; and the polishing pad fixing component is provided with a polishing pad fixing groove. The device passes through the setting of the fixed subassembly of polishing pad and runner assembly, can get off the polishing pad quickly separating who closely combines with the chassis, and easy operation has improved work efficiency, takes hardly the manpower, the injury minimizing that will probably cause.
Description
Technical Field
The utility model belongs to the technical field of the chemical mechanical polishing, a polishing pad remove device is related to.
Background
In a semiconductor process, Chemical Mechanical Polishing (CMP) is an important process, which may also be referred to as chemical mechanical planarization, and particularly refers to a process of removing excess material from a semiconductor wafer by using a combination of chemical and mechanical actions and obtaining a flat surface, which is a technique combining chemical reaction and mechanical polishing.
Conventional CMP systems include a polishing head with a retaining ring that holds a substrate and rotates it against a polishing pad surface that rotates in the same direction. During rotation of the substrate against the polishing pad, a silica slurry or other abrasive suspended in a low level etchant is dispensed onto the polishing pad, combined with the chemical reaction of the slurry and mechanical abrasion from the polishing pad to remove vertical asperities from the substrate surface and form a smooth surface. CN 102773787a discloses a chemical mechanical polishing system, which comprises a wafer polishing unit, a polishing solution processing system and a post-polishing cleaning unit, wherein the wafer polishing unit comprises a polishing platform, a polishing pad disposed on the polishing platform, a polishing head for fixing and rotating a wafer, and a polishing solution supply device, the polishing solution processing system comprises a centrifugal separation device and a filtering device for receiving and processing the used polishing solution, so as to extract an alkali solution, and the surface of the polished wafer is cleaned by using the extracted alkali solution; the system only describes the polishing and cleaning of wafers and does not involve assembly and disassembly of the system.
The polishing pad needs to be separated from the chassis after the polishing pad is used, and the polishing pad has large acting force with the chassis and large surface area, so that the process is time-consuming, labor-consuming and easy to hurt operators. CN 1765579a discloses an apparatus and method for removing a CMP polishing pad from a carrier, said apparatus comprising a rod attachable to the CMP polishing pad, a motor attached to the rod to cause dry rotation and slippage, by attaching the CMP polishing pad to a rod, rotating the rod to roll up the polishing pad, and laterally slipping the rod during rotation. Although this equipment can reduce the manpower that the polishing pad got rid of, the operation is inconvenient, needs rotate simultaneously and slide, and the concrete structure of equipment is comparatively complicated, receives polishing pad kind and size influence great.
In summary, for removing the polishing pad in the polishing system, it is also necessary to simplify the structure of the apparatus, reduce the manpower consumption, and improve the removal efficiency of the polishing pad.
SUMMERY OF THE UTILITY MODEL
Problem to prior art existence, the utility model aims to provide a polishing pad remove device, the setting of subassembly and runner assembly is fixed through the polishing pad to the device, can get off the polishing pad quickly separating who closely combines with the chassis, and easy operation has improved work efficiency, hardly takes the manpower, the injury minimizing that will probably cause.
To achieve the purpose, the utility model adopts the following technical proposal:
the utility model provides a polishing pad removing device, which comprises a polishing pad fixing component, a rotating component and a sleeve component, wherein the rotating component is connected with one end of the polishing pad fixing component, and the sleeve component is arranged outside the connecting end of the polishing pad fixing component;
and the polishing pad fixing component is provided with a polishing pad fixing groove.
In the utility model, because the polishing pad in the chemical mechanical polishing system needs to be replaced in time, the device is used for quickly removing the polishing pad from the chassis; the polishing pad fixing component in the device is provided with a polishing pad fixing groove for fixing a small part of the polishing pad, the rotating component can drive the polishing pad fixing component to rotate, and the polishing pad and the base plate are gradually separated and wound on the polishing pad fixing component in the rotating process; the method is simple and convenient, greatly improves the separation speed of the polishing pad, fully reduces the required manpower and minimizes the possible damage.
Following conduct the utility model discloses preferred technical scheme, nevertheless do not conduct the utility model provides a technical scheme's restriction, through following technical scheme, can reach and realize better the utility model discloses a technical purpose and beneficial effect.
As the preferred technical scheme of the utility model, the cross sectional shape of polishing pad fixed subassembly is circular or oval.
In a preferred embodiment of the present invention, the polishing pad holding member has a circular cross-sectional shape, and the circular cross-sectional shape has a diameter of 20 to 30mm, for example, 20mm, 22mm, 24mm, 25mm, 27mm, 28mm, or 30mm, but the present invention is not limited to the above-mentioned values, and other values not listed in the above-mentioned range are also applicable.
As the preferred technical scheme of the utility model, the shape of polishing pad fixed slot is rectangle or oval.
In a preferred embodiment of the present invention, the polishing pad fixing groove has a rectangular shape, and the length of the rectangular shape is 50 to 70mm, for example, 50mm, 55mm, 60mm, 65mm, or 70mm, but the present invention is not limited to the above-mentioned values, and other values not shown in the above-mentioned value range are also applicable; the width is 10 to 20mm, for example, 12mm, 15mm, 16mm, 18mm or 20mm, but the width is not limited to the recited values, and other values not recited in the range of the values are also applicable.
The utility model discloses in, for the convenience of the coiling of polishing pad on fixed subassembly, generally select the cross-section to be circular or oval cylinder, set up the fixed slot on it and then can compress tightly the part of putting into the fixed slot after fixed and rotatory a week of polishing pad that the minority was torn to this drives all the other polishing pads and chassis separation for the fixed point.
As the utility model discloses preferred technical scheme, the runner assembly comprises the triplex, is handle section, linkage segment and drive section respectively, constitutes two right angles and turns round, all perpendicular with the linkage segment to means and drive section, both extending direction are opposite.
The utility model discloses in, the structural style of runner assembly is similar with common crank, and the hand grip hand end rotates, drives the rotation of the fixed subassembly of polishing pad by the drive section, labour saving and time saving, and is easy and simple to handle.
As the utility model discloses preferred technical scheme, the drive section of runner assembly links to each other with the fixed subassembly of polishing pad through first bearing.
The utility model discloses in, the runner assembly passes through the bearing with the fixed subassembly of polishing pad and is connected fixedly, convenient equipment and dismantlement, and on the bearing can be fixed in runner assembly's drive section through welding or threaded connection, the preferred selection latter.
In a preferred embodiment of the present invention, the cross-sectional diameter of the rotating assembly is 30 to 40mm, such as 30mm, 32mm, 34mm, 35mm, 36mm, 38mm or 40mm, but not limited to the values listed, and other values not listed in the numerical range are also applicable.
As the utility model discloses preferred technical scheme, the sleeve subassembly passes through the outside that the fixed cover of second bearing located the link of the fixed subassembly of polishing pad.
In a preferred embodiment of the present invention, the diameter of the sleeve assembly is 40 to 50mm, for example, 40mm, 42mm, 44mm, 45mm, 46mm, 48mm or 50mm, but the present invention is not limited to the above-mentioned values, and other values not shown in the above-mentioned range are also applicable.
The utility model discloses in, sleeve component's setting can provide hand position when the device operation, and when avoiding rotatory runner assembly, the device both ends are uneven, influence the stability of the junction of the fixed subassembly of runner assembly and polishing pad to influence getting rid of polishing pad.
The utility model discloses in, polishing pad fixed subassembly, runner assembly and sleeve subassembly all adopt the stainless steel to make.
Compared with the prior art, the utility model discloses following beneficial effect has:
the device passes through the setting of the fixed subassembly of polishing pad, runner assembly and polishing pad fixed slot, can get off the polishing pad quickly separating who closely combines with the chassis, and easy operation has improved work efficiency, hardly takes the manpower, the injury minimizing that will probably cause.
Drawings
Fig. 1 is a schematic structural view of a polishing pad removal apparatus according to embodiment 1 of the present invention;
wherein, 1-polishing pad fixing component, 2-rotating component, 3-sleeve component and 4-polishing pad fixing groove.
Detailed Description
To better explain the technical solution of the present invention, it is convenient to understand the technical solution of the present invention, and the following is further detailed description of the present invention, but the following embodiments are only simple examples of the present invention, and do not represent or limit the protection scope of the present invention, and the protection scope of the present invention is subject to the claims.
The utility model provides a polishing pad removing device, which comprises a polishing pad fixing component 1, a rotating component 2 and a sleeve component 3, wherein the rotating component 2 is connected with one end of the polishing pad fixing component 1, and the sleeve component 3 is arranged outside the connecting end of the polishing pad fixing component 1;
and the polishing pad fixing component 1 is provided with a polishing pad fixing groove 4.
The following are typical but non-limiting examples of the present invention:
example 1:
the embodiment provides a polishing pad removing apparatus, the structural schematic diagram of which is shown in fig. 1, and the polishing pad removing apparatus comprises a polishing pad fixing assembly 1, a rotating assembly 2 and a sleeve assembly 3, wherein the rotating assembly 2 is connected with one end of the polishing pad fixing assembly 1, and the sleeve assembly 3 is arranged outside the connecting end of the polishing pad fixing assembly 1;
and the polishing pad fixing component 1 is provided with a polishing pad fixing groove 4.
The polishing pad holding member 1 has a circular cross-sectional shape and a cross-sectional diameter of 25 mm.
The polishing pad fixing groove 4 is rectangular, and has a length of 60mm and a width of 15 mm.
The rotating assembly 2 consists of three parts, namely a handle section, a connecting section and a driving section which form two right-angle turns, wherein the handle means and the driving section are both vertical to the connecting section, and the extending directions of the handle section and the driving section are opposite.
The driving section of the rotating assembly 2 is connected with the polishing pad fixing assembly 1 through a first bearing.
The cross section of the rotating assembly 2 is circular, and the diameter is 30 mm.
The sleeve component 3 is fixedly sleeved outside the connecting end of the polishing pad fixing component 1 through a second bearing.
The cross section of the sleeve component 3 is circular, and the diameter is 45 mm.
Example 2:
the embodiment provides a polishing pad removing apparatus, which comprises a polishing pad fixing component 1, a rotating component 2 and a sleeve component 3, wherein the rotating component 2 is connected with one end of the polishing pad fixing component 1, and the sleeve component 3 is arranged outside the connecting end of the polishing pad fixing component 1;
and the polishing pad fixing component 1 is provided with a polishing pad fixing groove 4.
The polishing pad holding member 1 has a circular cross-sectional shape and a cross-sectional diameter of 30 mm.
The polishing pad fixing groove 4 is oval, the major axis is 70mm, and the minor axis is 20 mm.
The rotating assembly 2 consists of three parts, namely a handle section, a connecting section and a driving section which form two right-angle turns, wherein the handle means and the driving section are both vertical to the connecting section, and the extending directions of the handle section and the driving section are opposite.
The driving section of the rotating assembly 2 is connected with the polishing pad fixing assembly 1 through a first bearing.
The cross section of the rotating assembly 2 is circular, and the diameter is 36 mm.
The sleeve component 3 is fixedly sleeved outside the connecting end of the polishing pad fixing component 1 through a second bearing.
The sleeve assembly 3 is circular in cross-section and 50mm in diameter.
Example 3:
the embodiment provides a polishing pad removing apparatus, which comprises a polishing pad fixing component 1, a rotating component 2 and a sleeve component 3, wherein the rotating component 2 is connected with one end of the polishing pad fixing component 1, and the sleeve component 3 is arranged outside the connecting end of the polishing pad fixing component 1;
and the polishing pad fixing component 1 is provided with a polishing pad fixing groove 4.
The polishing pad fixing assembly 1 has an oval cross-sectional shape, and the major axis and the minor axis of the cross-sectional shape are respectively 30mm and 20 mm.
The polishing pad fixing groove 4 is rectangular, and has a length of 50mm and a width of 10 mm.
The rotating assembly 2 consists of three parts, namely a handle section, a connecting section and a driving section which form two right-angle turns, wherein the handle means and the driving section are both vertical to the connecting section, and the extending directions of the handle section and the driving section are opposite.
The driving section of the rotating assembly 2 is connected with the polishing pad fixing assembly 1 through a first bearing.
The cross section of the rotating assembly 2 is square, and the side length is 32 mm.
The sleeve component 3 is fixedly sleeved outside the connecting end of the polishing pad fixing component 1 through a second bearing.
The cross section of the sleeve component 3 is square, and the side length is 40 mm.
In the above embodiment, the polishing pad on the chassis is removed by using the device, the torn corner polishing pad is placed in the polishing pad fixing groove to be fixed, manual operation is performed, the handle section in the rotating assembly is held by a hand to rotate, so that the rotating assembly drives the polishing pad fixing assembly to rotate, the sleeve assembly is held by the other hand, the overall stability of the device is maintained, the polishing pad tightly adhered to the chassis is torn and wound on the polishing pad fixing assembly in the rotating process of the polishing pad fixing assembly, removal of the polished polishing pad is quickly realized, the operation process is simple, the work efficiency is high, manpower is hardly consumed, and the possibility of injuring an operator is minimized.
Comparative example 1:
this comparative example provides a polishing pad removal apparatus whose structure is similar to that in example 1 except that: the polishing pad fixing assembly 1 is not provided with the polishing pad fixing groove 4.
In this comparison example, because not set up the polishing pad fixed slot on the fixed subassembly of polishing pad, the polishing pad needs operating personnel manual pressure tearing and coiling in-process, greatly influences the removal rate of polishing pad, and the operating stability of device is poor, need consume a large amount of manpowers moreover, increases the human cost.
Synthesize above-mentioned embodiment and comparative example and can see that the device passes through the setting of the fixed subassembly of polishing pad, runner assembly and polishing pad fixed slot, can get off the polishing pad quickly separating who closely combines with the chassis, and easy operation has improved work efficiency, does not hardly take the manpower, the injury minimizing that will probably cause.
The applicant states that the present invention is described in the above embodiments, but the present invention is not limited to the above detailed device, i.e. the present invention must not be implemented by relying on the above detailed device. It should be clear to those skilled in the art that any improvement of the present invention, to the addition of the equivalent replacement and auxiliary devices of the present invention, the selection of the specific mode, etc., all fall within the scope of protection and disclosure of the present invention.
Claims (10)
1. A polishing pad removing device is characterized by comprising a polishing pad fixing component, a rotating component and a sleeve component, wherein the rotating component is connected with one end of the polishing pad fixing component, and the sleeve component is arranged outside the connecting end of the polishing pad fixing component;
and the polishing pad fixing component is provided with a polishing pad fixing groove.
2. The polishing pad removal apparatus of claim 1, wherein the polishing pad holding assembly has a circular or elliptical cross-sectional shape.
3. The polishing pad removal apparatus according to claim 2, wherein the polishing pad holding member has a circular cross-sectional shape, and the circular cross-sectional shape has a diameter of 20 to 30 mm.
4. The polishing pad removing device according to claim 1, wherein the polishing pad fixing groove has a rectangular or oval shape.
5. The polishing pad removing apparatus according to claim 4, wherein the polishing pad fixing groove has a rectangular shape, and the rectangular shape has a length of 50 to 70mm and a width of 10 to 20 mm.
6. The pad removal apparatus of claim 1, wherein the pivot assembly comprises three sections, a handle section, a connecting section, and a drive section, forming two right angle turns, the handle section and the drive section both extending perpendicular to the connecting section and in opposite directions.
7. The polishing pad removal apparatus of claim 6, wherein the drive section of the rotating assembly is coupled to the polishing pad holding assembly by a first bearing.
8. The polishing pad removal apparatus of claim 1, wherein the cross-sectional diameter of the rotating assembly is 30 to 40 mm.
9. The polishing pad removal apparatus of claim 1, wherein the sleeve assembly is fixedly sleeved outside the connection end of the polishing pad fixing assembly by a second bearing.
10. The polishing pad removal apparatus of claim 1, wherein the sleeve assembly has a diameter of 40 to 50 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922304915.2U CN211940424U (en) | 2019-12-18 | 2019-12-18 | Polishing pad removing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922304915.2U CN211940424U (en) | 2019-12-18 | 2019-12-18 | Polishing pad removing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211940424U true CN211940424U (en) | 2020-11-17 |
Family
ID=73186740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922304915.2U Active CN211940424U (en) | 2019-12-18 | 2019-12-18 | Polishing pad removing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211940424U (en) |
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2019
- 2019-12-18 CN CN201922304915.2U patent/CN211940424U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 201616 No. 1-15, Lane 150, dingsong Road, Songjiang District, Shanghai Patentee after: Shanghai Chaosi Semiconductor Co.,Ltd. Patentee after: CHONGQING ADVANCED SILICON TECHNOLOGY Co.,Ltd. Address before: No.158, Lane 258, Shuangjin Road, Shihudang Town, Songjiang District, Shanghai, 201617 Patentee before: SHANGHAI ADVANCED SILICON TECHNOLOGY Co.,Ltd. Patentee before: CHONGQING ADVANCED SILICON TECHNOLOGY Co.,Ltd. |
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| CP03 | Change of name, title or address |