CN211931100U

CN211931100U - A ballast

Info

Publication number: CN211931100U
Application number: CN202020388203.3U
Authority: CN
Inventors: 轩昂; 汪承伟; 王喆婷
Original assignee: Shanghai Weiyuan Environmental Protection Technology Co ltd
Current assignee: Shanghai Weiyuan Environmental Protection Technology Co ltd
Priority date: 2020-03-24
Filing date: 2020-03-24
Publication date: 2020-11-13
Anticipated expiration: 2030-03-24

Abstract

The utility model provides a ballast, include: the heat dissipation device comprises a shell, a plurality of heat dissipation plates and a plurality of circuit boards; the housing includes: the bottom plate, the cover plate and the four side plates; the bottom plate is matched with the four side plates to form a box body structure, and the cover plate is movably arranged on any side plate and used for sealing the box body structure; the inner walls of the two opposite side plates are provided with slots for mounting circuit boards, the circuit boards are arranged in the shell in a sliding manner perpendicular to the bottom plate, and the circuit boards are connected through lines; the plurality of heat dissipation plates are arranged on the bottom plate and are positioned in the shell; the inside heat dissipation chamber that all is equipped with of each heating panel, be equipped with the louvre with heat dissipation chamber intercommunication on the bottom plate. The utility model discloses in, the piecemeal setting through the circuit board has realized the separately setting of electronic components, can avoid the high fever risk that electronic components excessively concentrates on causing. Meanwhile, due to circuit board partitioning, when the ballast fails, only the failed circuit board needs to be replaced independently, so that the maintenance cost of the ballast is reduced, and the maintenance efficiency is improved.

Description

A ballast

Technical Field

The utility model relates to an economize on electricity environmental protection technology field especially relates to a ballast.

Background

In the existing high-power lamp, high heat generated by a lamp tube or a bulb during operation is conducted to a ballast, so that the ballast is always in a high-temperature operating state. Especially, the lamp with compact structure has small heat dissipating space, and the heat generated by the lamp directly affects various working parameters of the ballast and is in the high temperature state for a long time.

In the existing ballast, an MOS tube and an electronic component on the ballast are arranged on one side surface of a PCB together and then are arranged in a shell, so that the MOS tube is used as a main radiating element, heat on the MOS tube cannot be timely radiated, burning out is easily caused, and the service life is shortened.

SUMMERY OF THE UTILITY MODEL

Based on the technical problem that the background art exists, the utility model provides a ballast.

The utility model provides a ballast, include: the heat dissipation device comprises a shell, a plurality of heat dissipation plates and a plurality of circuit boards;

the housing includes: the bottom plate, the cover plate and the four side plates; the bottom plate is matched with the four side plates to form a box body structure, and the cover plate is movably arranged on any side plate and used for sealing the box body structure;

the inner walls of the two opposite side plates are provided with slots for mounting circuit boards, the circuit boards are arranged in the shell in a sliding manner perpendicular to the bottom plate, and the circuit boards are connected through lines;

the plurality of heat dissipation plates are arranged on the bottom plate and are positioned in the shell; the inside heat dissipation chamber that all is equipped with of each heating panel, be equipped with the louvre with heat dissipation chamber intercommunication on the bottom plate.

Preferably, the circuit board and the heat dissipation plate are arranged parallel to each other.

Preferably, the circuit boards and the heat dissipation plates are alternately arranged.

Preferably, the heat dissipation plate is integrally formed with the base plate.

Preferably, the bottom plate and the cover plate are respectively provided with elastic pads which are in one-to-one correspondence with the circuit boards.

Preferably, an elastic pad is adhered to the inner wall of each slot.

The utility model provides a ballast through the piecemeal setting of circuit board, has realized the separately setting of electronic components, can avoid the electronic components excessively to concentrate the high fever risk that causes. Meanwhile, due to circuit board partitioning, when the ballast fails, only the failed circuit board needs to be replaced independently, so that the maintenance cost of the ballast is reduced, and the maintenance efficiency is improved.

The utility model discloses in, circuit board slidable mounting is in the casing, cooperation lid movable mounting for the change of circuit board is very simple and convenient, has further improved the maintenance efficiency of ballast, and has realized all can overhauling the ballast in any environment, thereby has realized the feasibility of the ballast field maintenance of trouble.

The utility model discloses in, through the setting of heating panel and louvre, increased the area of contact of casing with the air to the radiating efficiency of ballast has been improved greatly.

Drawings

Fig. 1 is a structural diagram of a ballast according to the present invention;

fig. 2 is a side view of fig. 1.

The figure is as follows: the heat dissipation structure comprises a bottom plate 1-1, a cover plate 1-2, four side plates 1-3, heat dissipation holes 1-4, a heat dissipation plate 2, a heat dissipation cavity 2-1, a circuit board 3 and an elastic pad 4.

Detailed Description

Referring to fig. 1 and 2, the present invention provides a ballast, including: the heat sink comprises a shell, a plurality of heat dissipation plates 2 and a plurality of circuit boards 3.

The housing includes: a bottom plate 1-1, a cover plate 1-2 and four side plates 1-3. The bottom plate 1-1 and the four side plates 1-3 are matched to form a box body structure, and the cover plate 1-2 is movably arranged on any side plate 1-3 and used for sealing the box body structure. Specifically, the cover plate 1-2 can be hinged with the side plate 1-3 to form a flip shell, so that the shell can be conveniently opened and closed.

The inner walls of the two opposite side plates 1-3 are provided with slots for mounting circuit boards 3, the circuit boards 3 are arranged in the shell in a sliding way perpendicular to the bottom plate 1-1, and the circuit boards 3 are connected through lines. So, setting up through the piecemeal of circuit board 3, realized electronic components's separately setting, can avoid electronic components excessively to concentrate the high fever risk that causes. Meanwhile, by the circuit board 3 being partitioned, when the ballast fails, only the failed circuit board 3 needs to be replaced independently, so that the maintenance cost of the ballast is reduced, and the maintenance efficiency is improved.

In the embodiment, the circuit board 3 is slidably mounted in the shell and movably mounted in cooperation with the cover body, so that the circuit board 3 is very simple and convenient to replace, the maintenance efficiency of the ballast is further improved, the ballast can be disassembled and repaired in any environment, and the feasibility of field maintenance of the failed ballast is realized.

A plurality of heat radiating plates 2 are mounted on the base plate 1-1 and located inside the case. Each heat dissipation plate 2 is internally provided with a heat dissipation cavity 2-1, and the bottom plate 1-1 is provided with heat dissipation holes 1-4 communicated with the heat dissipation cavities 2-1. Therefore, the contact area between the shell and the air is increased through the arrangement of the heat dissipation plate 2 and the heat dissipation holes 1-4, and the heat dissipation efficiency of the ballast is greatly improved.

Specifically, in the present embodiment, when the cover plate 1-2 is in the closed state, a gap is formed between the heat dissipation plate 2 and the cover plate 1-2, so as to facilitate the connection between the circuit boards 3 and facilitate the opening and closing of the cover plate 1-2.

In this embodiment, the circuit board 3 and the heat dissipation plate 2 are disposed in parallel to each other, so that the circuit board 3 can be easily attached and detached by sliding. Meanwhile, the circuit board 3 and the heat dissipation plate 2 are alternately arranged to improve the heat dissipation efficiency of the circuit board 3.

Specifically, in the present embodiment, the heat sink 2 is integrally formed with the base plate 1-1.

In the embodiment, the bottom plate 1-1 and the cover plate 1-2 are respectively provided with the elastic pads 4 corresponding to the circuit boards 3 one by one, so that the circuit boards 3 are abutted against the bottom plate 1-1 and the cover plate 1-2 through the elastic pads 4, and the vibration damage of the ballast is reduced. Similarly, the inner wall of each slot is adhered with an elastic pad 4.

The above description is only the specific implementation of the preferred embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can be in the technical scope of the present invention, and according to the technical solution of the present invention and the design of the present invention, equivalent replacement or change should be covered within the protection scope of the present invention.

Claims

1. A ballast, comprising: the heat dissipation device comprises a shell, a plurality of heat dissipation plates (2) and a plurality of circuit boards (3);

the housing includes: the device comprises a bottom plate (1-1), a cover plate (1-2) and four side plates (1-3); the bottom plate (1-1) is matched with the four side plates (1-3) to form a box body structure, and the cover plate (1-2) is movably arranged on any side plate (1-3) and used for sealing the box body structure;

slots for mounting the circuit boards (3) are formed in the inner walls of the two opposite side plates (1-3), the circuit boards (3) are arranged in the shell in a sliding mode perpendicular to the bottom plate (1-1), and the circuit boards (3) are connected through lines;

the heat dissipation plates (2) are arranged on the bottom plate (1-1) and are positioned in the shell; each heat dissipation plate (2) is internally provided with a heat dissipation cavity (2-1), and the bottom plate (1-1) is provided with heat dissipation holes (1-4) communicated with the heat dissipation cavities (2-1).

2. A ballast as claimed in claim 1, characterized in that the circuit board (3) and the heat sink (2) are arranged parallel to one another.

3. A ballast as claimed in claim 2, characterized in that the circuit boards (3) are arranged alternately with the heat-radiating plates (2).

4. A ballast as claimed in claim 1, characterized in that the heat-radiating plate (2) is formed integrally with the base plate (1-1).

5. The ballast as claimed in claim 1, wherein the base plate (1-1) and the cover plate (1-2) are provided with elastic pads (4) corresponding to the respective circuit boards (3) one by one, respectively.

6. A ballast as claimed in claim 5, wherein an elastic pad (4) is adhered to the inner wall of each slot.