CN211929681U - Dielectric resonance unit and dielectric filter - Google Patents

Dielectric resonance unit and dielectric filter Download PDF

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Publication number
CN211929681U
CN211929681U CN202020617899.2U CN202020617899U CN211929681U CN 211929681 U CN211929681 U CN 211929681U CN 202020617899 U CN202020617899 U CN 202020617899U CN 211929681 U CN211929681 U CN 211929681U
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dielectric
conductive
blind hole
dielectric filter
filter
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CN202020617899.2U
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徐国庆
王斌华
叶荣
阮良莉
庄莉
王立强
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Mobi Antenna Technologies Shenzhen Co Ltd
Shenzhen Shengyu Wisdom Network Technology Co Ltd
Mobi Technology Xian Co Ltd
Mobi Antenna Technologies Jian Co Ltd
Mobi Technology Shenzhen Co Ltd
Xian Mobi Antenna Technology Engineering Co Ltd
Original Assignee
Mobi Antenna Technologies Shenzhen Co Ltd
Shenzhen Shengyu Wisdom Network Technology Co Ltd
Mobi Technology Xian Co Ltd
Mobi Antenna Technologies Jian Co Ltd
Mobi Technology Shenzhen Co Ltd
Xian Mobi Antenna Technology Engineering Co Ltd
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Abstract

The application belongs to the technical field of dielectric filter, especially relates to a dielectric resonance unit and dielectric filter, and it includes: a dielectric body; and a conductive layer coated on the outer surface of the dielectric body; the medium body is provided with a blind hole; at least one non-conductive area is arranged in the blind hole; the initial resonant frequency of the dielectric resonant unit is obtained through detection, conductive substance filling is carried out on the non-conductive area according to the initial resonant frequency, the area of the conductive area in the blind hole is changed, the resonant frequency of the dielectric resonant unit is changed, the frequency selection characteristic of the produced dielectric filter is debugged, the problems that polishing noise is generated and environmental pollution such as metal and dielectric dust is generated due to the fact that a conductive layer on the surface of a medium is mechanically polished to debug the frequency selection characteristic of the dielectric filter are solved, the frequency selection characteristic of the dielectric filter is convenient to debug, the dielectric filter is suitable for automatic debugging production of the dielectric filter, and the dielectric filter is dust-free, noise-free, clean and environment-friendly, and the safety and reliability of frequency selection characteristic debugging of the.

Description

Dielectric resonance unit and dielectric filter
Technical Field
The application belongs to the technical field of dielectric filters, and particularly relates to a dielectric resonance unit and a dielectric filter.
Background
The dielectric filter is a microwave filter which adopts a dielectric resonant cavity (dielectric resonant unit) to achieve frequency selection effect through multi-stage coupling. At present, dielectric filters have been widely used in 5G communication systems due to their excellent performance, such as low insertion loss, good power durability, and good temperature characteristics. In the production process of the dielectric filter, the dielectric filter needs to be debugged to produce the dielectric filter meeting the frequency selection characteristic required by application. The traditional debugging means of the dielectric filter is to adjust the frequency and the coupling by polishing a metal layer on the surface of a medium, the debugging method can generate a large amount of metal, medium dust and polishing noise, the production environment of an enterprise and the health of staff can be threatened, and the environment can be polluted by the treatment of the metal and the medium dust.
Therefore, the traditional technical scheme has the problems of inconvenient mechanical debugging operation, high noise and environmental pollution in the frequency selection characteristic debugging process of the dielectric filter.
SUMMERY OF THE UTILITY MODEL
The application aims to provide a dielectric resonance unit and a dielectric filter, and aims to solve the problems of inconvenience in mechanical debugging operation, high noise and environmental pollution in the frequency selection characteristic debugging of the traditional dielectric filter.
A first aspect of an embodiment of the present application provides a dielectric resonance unit, including:
a dielectric body; and a conductive layer coated on the outer surface of the dielectric body;
the medium body is provided with a blind hole;
at least one non-conductive area is arranged in the blind hole.
In one embodiment, the side wall of the blind hole is provided with a first non-conductive area.
In one embodiment, the bottom of the blind hole is provided with a second non-conductive area.
In one embodiment, the shape of the first non-conductive area includes, but is not limited to, one of a circle, a polygon, an arc, and a spiral.
In one embodiment, the shape of the second non-conductive area includes, but is not limited to, one of a circle, a polygon, an arc, and a spiral.
In one embodiment, the material of the conductive layer includes at least one of gold, silver, copper, and aluminum.
A second aspect of an embodiment of the present application provides a dielectric filter, including: at least one dielectric resonator element as claimed in any one of the preceding claims.
In one embodiment, the dielectric filter further includes: a coupling window disposed on the dielectric body; and the number of the first and second groups,
a first signal port and a second signal port disposed on the dielectric body; the first signal port is used for inputting signals, and the second signal port is used for outputting signals.
The dielectric resonance unit and the dielectric filter of the embodiment of the application comprise a dielectric body; and a conductive layer coated on the outer surface of the dielectric body; the medium body is provided with a blind hole; at least one non-conductive area is arranged in the blind hole; the area of the conductive area in the blind hole is changed by filling the conductive material in the non-conductive area in the blind hole, so that the resonant frequency of the dielectric resonance unit is adjusted, the frequency selection characteristic of the dielectric filter is debugged, the dielectric filter with the required frequency selection characteristic is obtained, the problems that the mechanical polishing of the dielectric surface conductive layer leads to the generation of polishing noise and the generation of environmental pollution such as metal and dielectric dust due to the debugging of the frequency selection characteristic of the dielectric filter are solved, the dielectric filter is more suitable for the automatic debugging production of the dielectric filter, dust-free, noise-free, clean and environment-friendly, the influence on the health of debugging workers is reduced, and the safety and reliability of the frequency selection characteristic debugging of the dielectric filter are improved.
Drawings
Fig. 1 is a schematic structural diagram of a dielectric resonance unit according to an embodiment of the present application;
fig. 2 is another schematic structural diagram of a dielectric resonance unit according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a dielectric filter according to an embodiment of the present application;
fig. 4 is a schematic flowchart of a method for tuning frequency-selective characteristics of a dielectric filter according to an embodiment of the present application;
fig. 5 is a schematic flowchart of another method for tuning frequency-selective characteristics of a dielectric filter according to an embodiment of the present application;
fig. 6 is a schematic flowchart of another method for tuning frequency-selective characteristics of a dielectric filter according to an embodiment of the present application.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, refer to an orientation or positional relationship illustrated in the drawings for convenience in describing the present application and to simplify description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
Fig. 1 shows a schematic structural diagram of a dielectric resonator unit provided in a first embodiment of the present application, and for convenience of description, only the parts related to this embodiment are shown, and detailed descriptions are as follows:
a first aspect of the embodiment of the present application provides a dielectric resonance unit 100, and referring to fig. 1, the dielectric resonance unit 100 in the embodiment includes a dielectric body and a conductive layer coated on an outer surface of the dielectric body, where the dielectric body is provided with a blind hole; at least one non-conductive area 10 is provided in the blind hole.
In this embodiment, different shapes and different numbers of non-conductive regions 10 can be formed by etching the conductive layer in the blind hole to expose the dielectric body. It is also possible to form the plurality of non-conductive areas 10 by leaving a certain space area on the surface of the blind via to be not coated with the conductive material when the conductive layer is coated on the surface of the blind via. The at least one non-conductive region may be disposed on a sidewall of the blind hole or on a bottom of the blind hole or on both the sidewall of the blind hole and the bottom of the blind hole. When the resonant frequency of the dielectric resonant unit 100 is tuned, the conductive layer in the blind hole does not need to be mechanically polished, but the area of the conductive layer in the blind hole is changed by filling the non-conductive area 10 in the blind hole with a conductive substance, so that the resonant frequency of the dielectric resonant unit 100 is changed, and the purpose of tuning the resonant frequency of the dielectric resonant unit 100 is achieved.
When the resonant frequency to medium resonance unit debugs, the problem of the mechanical medium surface conducting layer of polishing with the resonant frequency to medium resonance unit adjust the noise that leads to and produce environmental pollution such as metal and medium dust has been avoided, dustless noiselessness, clean environmental protection avoids the waste of conducting layer material, be convenient for adjust medium resonance unit's resonant frequency, the influence to the debugging staff is reduced, the fail safe nature of carrying out resonant frequency debugging to medium resonance unit has been improved.
In one embodiment, referring to fig. 2, a first non-conductive region 200 is disposed on a sidewall of the blind via.
In this embodiment, the dielectric body may be exposed by etching the conductive layer on the sidewall of the blind via to form the first non-conductive region 200 with different shapes. The first non-conductive region 200 may also be formed by not coating a conductive material on a region of the sidewall of the blind via where a space is reserved when a conductive layer is coated on the surface of the blind via. When the resonant frequency of the dielectric resonant unit 100 is tuned, the conductive layer in the blind hole does not need to be mechanically polished, but the area of the conductive layer in the blind hole is changed by filling the first non-conductive area 200 of the sidewall of the blind hole with a conductive substance, so that the resonant frequency of the dielectric resonant unit 100 is changed, and the resonant frequency of the dielectric resonant unit 100 is tuned.
In one embodiment, referring to fig. 2, a second non-conductive region 300 is disposed at the bottom of the blind hole.
In this embodiment, the dielectric body can be exposed by etching the conductive layer at the bottom of the blind hole to form the second non-conductive region 300 with different shape. Or when the surface of the blind hole is coated with the conductive layer, a certain space region is reserved at the bottom of the blind hole and is not coated with the conductive material to form the second non-conductive region 300. When the resonant frequency of the dielectric resonance unit 100 is tuned, the conductive layer of the blind via does not need to be mechanically polished, but the first non-conductive area 200 of the sidewall of the blind via of the dielectric resonance unit 100 or the second non-conductive area 300 of the bottom of the blind via is filled with a conductive material, so that the resonant frequency of the dielectric resonance unit 100 is changed, and the resonant frequency of the dielectric resonance unit 100 is tuned.
In one embodiment, the dielectric body is made of a dielectric material, which may be a ceramic or the like.
In one embodiment, the material of the conductive layer includes at least one of gold, silver, copper, and aluminum. Specifically, in this embodiment, the conductive layer may be a coating layer formed by coating a conductive material on the surface of the dielectric body. The non-conductive regions, such as the first non-conductive region 200 and the second non-conductive region 300, are non-conductive layers.
In one embodiment, the blind hole may be a cylindrical or prismatic groove body or another groove body, the first non-conductive region 200 and the second non-conductive region 300 are respectively disposed on the side wall and the bottom of the blind hole, and the resonant frequency of the dielectric resonance unit 100 may be adjusted by filling the first non-conductive region 200 or the second non-conductive region 300 with a conductive material.
In one embodiment, the shape of the first non-conductive area 200 includes, but is not limited to, one of a circle, a polygon, an arc, and a spiral.
In a specific implementation, the first non-conductive area 200 may further include a plurality of non-contact non-conductive areas, the plurality of non-contact non-conductive areas are disposed on the sidewall of the blind via, and when the resonant frequency of the dielectric resonant unit 100 is tuned, the resonant frequency may be tuned by filling the plurality of non-contact non-conductive areas with a conductive material.
In one embodiment, the shape of the second non-conductive area 300 includes, but is not limited to, one of a circle, a polygon, an arc, and a spiral.
In a specific implementation, the second non-conductive area 300 may further include a plurality of non-contact non-conductive areas, the plurality of non-contact non-conductive areas are disposed on the bottom of the blind holes, and when the resonant frequency of the dielectric resonant unit 100 is tuned, the resonant frequency may be tuned by filling the plurality of non-contact non-conductive areas with a conductive material.
Alternatively, referring to fig. 2, the first non-conductive area 200 is arc-shaped, and the second non-conductive area 300 is cross-shaped polygon, and the resonant frequency of the dielectric resonance unit 100 can be adjusted by filling the first non-conductive area 200 or the second non-conductive area 300 with a conductive material, for example, filling or coating the first non-conductive area 200 or the second non-conductive area 300 with a conductive material, for example, spraying or dispensing a conductive material onto the first non-conductive area 200 or the second non-conductive area 300, to change the area of the conductive layer in the blind hole.
A second aspect of an embodiment of the present application provides a dielectric filter, including: at least one dielectric resonator element 100 as described in any one of the above.
In a specific implementation, the dielectric filter may include a plurality of dielectric resonant units 100, or may include one dielectric resonant unit 100 and one or more dielectric resonant units not provided with the non-conductive area, and two adjacent dielectric resonant units are connected to each other. The frequency selective characteristic of the dielectric filter is adjusted by filling the non-conductive area of the dielectric resonance unit 100 therein with a conductive substance to adjust the resonance frequency of the dielectric resonance unit 100.
In one embodiment, the dielectric filter further comprises: a coupling window disposed on the dielectric body; the first signal port and the second signal port are arranged on the medium body; the first signal port is used for inputting signals, and the second signal port is used for outputting signals.
In a specific implementation, the two adjacent dielectric resonance units are communicated through the coupling window, including the two adjacent dielectric resonance units 100 or the two adjacent dielectric resonance units without the non-conductive area or the adjacent dielectric resonance units 100 and the dielectric resonance units without the non-conductive area. The first signal port arranged on the medium body can be used as a signal input port of the medium filter to input signals, and the second signal port arranged on the medium body can be used as a signal output port of the medium filter to output signals. The first signal port and the second signal port are respectively arranged on different dielectric resonance units. Optionally, the first signal port is disposed on a first dielectric resonance unit of the plurality of dielectric resonance units, and the second signal port is disposed on a last dielectric resonance unit of the plurality of dielectric resonance units.
In one embodiment, the conductive material includes one of conductive silver paste, conductive cloth, conductive paste, conductive powder, curable conductive liquid, and conductive paint. Conductive silver paste, conductive cloth, conductive adhesive, conductive powder, curable conductive liquid or conductive paint are filled in the first non-conductive area or the second non-conductive area, the area of the conductive layer in the blind hole is changed, and therefore the resonant frequency of the dielectric resonance unit is changed, the frequency selection characteristic of the dielectric filter is further changed, and the frequency selection characteristic of the dielectric filter is debugged.
In one embodiment, referring to fig. 3, the dielectric filter includes: 4 dielectric resonance units 100, that is, a first dielectric resonance unit 101, a second dielectric resonance unit 102, a third dielectric resonance unit 103, and a fourth dielectric resonance unit 104. The side wall of the blind hole of the first dielectric resonance unit 101 is provided with a first non-conductive area 201, the side wall of the blind hole of the second dielectric resonance unit 102 is provided with a first non-conductive area 202, the side wall of the blind hole of the third dielectric resonance unit 103 is provided with a first non-conductive area 203, and the side wall of the blind hole of the fourth dielectric resonance unit 104 is provided with a first non-conductive area 204; the bottom of the blind hole of the first dielectric resonance unit 101 is provided with a second non-conductive region 301, the bottom of the blind hole of the second dielectric resonance unit 102 is provided with a second non-conductive region 302, the bottom of the blind hole of the third dielectric resonance unit 103 is provided with a second non-conductive region 303, and the bottom of the blind hole of the fourth dielectric resonance unit 104 is provided with a second non-conductive region 304.
Further, the dielectric filter further includes a coupling window 401, a coupling window 402, a coupling window 403, and a coupling window 404, through which two adjacent dielectric resonance units are communicated. The first signal port is provided on the dielectric body of the first dielectric resonance unit 101, and the second signal port is provided on the dielectric body of the fourth dielectric resonance unit 104. In the process of producing the dielectric filter, the resonant frequency of a dielectric resonance unit in the dielectric filter needs to be detected and debugged, and when the resonant frequency of the dielectric resonance unit is debugged, a method of mechanically polishing a conductive layer on the surface of a dielectric body to debug the resonant frequency of the dielectric resonance unit can be replaced by filling a conductive object into a first non-conductive area or a second non-conductive area of the dielectric resonance unit, so that the frequency selection characteristic of the dielectric filter is debugged, and the dielectric filter meeting the required frequency selection characteristic is produced.
Referring to fig. 4, a third aspect of the embodiments of the present application provides a frequency-selective characteristic tuning method for a dielectric filter, where the frequency-selective characteristic tuning method is applied to any one of the dielectric filters described above, and the frequency-selective characteristic tuning method includes: step S01 and step S02.
In step S01, an initial resonant frequency of a dielectric resonant unit in the dielectric filter is obtained.
In specific implementation, the frequency-selective characteristic of the produced dielectric filter can be detected through the frequency monitoring device and the auxiliary software to obtain the initial resonant frequency of each dielectric resonant unit in the dielectric filter, and the initial resonant frequency is displayed. It is to be understood that the initial resonance frequency is a resonance frequency of the dielectric resonance unit before the dielectric filter is debugged.
And step S02, conducting filler is filled into the non-conducting area in the blind hole according to the initial resonant frequency of the dielectric resonance unit to adjust the resonant frequency of the dielectric resonance unit.
In one embodiment, referring to fig. 5, step S02, the filling the non-conductive area in the blind hole with the conductive material according to the initial resonant frequency of the resonant unit includes: step S021 and step S022.
Step S021, comparing the initial resonant frequency with a preset reference frequency;
in a specific implementation, the preset reference frequency is a target resonant frequency of the dielectric resonant unit, that is, a resonant frequency of each dielectric resonant unit in the dielectric filter required by an application.
Step S022, if the initial resonant frequency is less than the preset reference frequency, performing a conductive filling process on the first non-conductive area.
In a specific implementation, the first non-conductive area is filled with a conductive substance to increase the resonant frequency of the dielectric resonant unit, so that the resonant frequency is close to or equal to the preset reference frequency.
Referring to fig. 6, in one embodiment, in step S021: after comparing the initial resonant frequency with the preset reference frequency, the method further comprises the following steps: step S023.
In step S023, if the initial resonant frequency is greater than the preset reference frequency, a conductive filling process is performed on the second non-conductive area.
In a specific implementation, the resonant frequency of the dielectric resonant unit is adjusted to be lower by filling the second non-conductive area with a conductive substance, so that the resonant frequency is close to or equal to the preset reference frequency.
The embodiment of the application adjusts the resonant frequency of the medium resonance unit by filling the conductive material in the non-conductive area in the blind hole, thereby adjusting the frequency selection characteristic of the medium filter, effectively avoiding the problems that the mechanical polishing of the surface conductive layer of the medium body causes polishing noise and environmental pollution such as metal and medium dust due to the adjustment of the resonant frequency of the medium resonance unit, facilitating the adjustment of the frequency selection characteristic of the medium filter, being more suitable for the automatic debugging production of the medium filter, being clean and environment-friendly, avoiding material waste, reducing the influence on the health of workers, and improving the safety reliability and the practicability of the frequency selection characteristic debugging of the medium filter.
It should be understood that, the sequence numbers of the steps in the foregoing embodiments do not imply an execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.
It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-mentioned division of the functional units and modules is illustrated, and in practical applications, the above-mentioned function distribution may be performed by different functional units and modules according to needs, that is, the internal structure of the apparatus is divided into different functional units or modules to perform all or part of the above-mentioned functions. Each functional unit and module in the embodiments may be integrated in one processing unit, or each unit may exist alone physically, or two or more units are integrated in one unit, and the integrated unit may be implemented in a form of hardware, or in a form of software functional unit. In addition, specific names of the functional units and modules are only for convenience of distinguishing from each other, and are not used for limiting the protection scope of the present application. The specific working processes of the units and modules in the system may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and reference may be made to the related descriptions of other embodiments for parts that are not described or illustrated in a certain embodiment.
Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.

Claims (8)

1. A dielectric resonator unit, comprising:
a dielectric body; and a conductive layer coated on the outer surface of the dielectric body;
the medium body is provided with a blind hole;
at least one non-conductive area is arranged in the blind hole.
2. A dielectric resonator element according to claim 1, characterized in that the side wall of the blind hole is provided with a first non-conductive area.
3. A dielectric resonator element according to claim 2, characterized in that the bottom of the blind hole is provided with a second non-conductive area.
4. A dielectric resonator element according to claim 2, wherein the shape of the first non-conductive area comprises, but is not limited to, one of a circle, polygon, arc, spiral.
5. A dielectric resonator element according to claim 3, wherein the shape of the second non-conductive area comprises, but is not limited to, one of a circle, polygon, arc, spiral.
6. The dielectric resonator element of claim 1, wherein the material of the conductive layer comprises at least one of gold, silver, copper, and aluminum.
7. A dielectric filter comprising at least one dielectric resonator element according to any one of claims 1 to 6.
8. A dielectric filter as recited in claim 7, wherein the dielectric filter further comprises: a coupling window disposed on the dielectric body; and the number of the first and second groups,
a first signal port and a second signal port disposed on the dielectric body; the first signal port is used for inputting signals, and the second signal port is used for outputting signals.
CN202020617899.2U 2020-04-22 2020-04-22 Dielectric resonance unit and dielectric filter Active CN211929681U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111446533A (en) * 2020-04-22 2020-07-24 摩比天线技术(深圳)有限公司 Dielectric resonance unit, dielectric filter and frequency selection characteristic debugging method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111446533A (en) * 2020-04-22 2020-07-24 摩比天线技术(深圳)有限公司 Dielectric resonance unit, dielectric filter and frequency selection characteristic debugging method

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