CN211907390U - Semiconductor lead frame etching sprays and improves and promote etching precision device - Google Patents
Semiconductor lead frame etching sprays and improves and promote etching precision device Download PDFInfo
- Publication number
- CN211907390U CN211907390U CN202020487527.2U CN202020487527U CN211907390U CN 211907390 U CN211907390 U CN 211907390U CN 202020487527 U CN202020487527 U CN 202020487527U CN 211907390 U CN211907390 U CN 211907390U
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- China
- Prior art keywords
- etching
- connecting piece
- swing
- machine body
- lead frame
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- Expired - Fee Related
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- 238000005530 etching Methods 0.000 title claims abstract description 50
- 239000004065 semiconductor Substances 0.000 title claims abstract description 10
- 239000007921 spray Substances 0.000 title abstract description 10
- 210000003734 kidney Anatomy 0.000 claims abstract description 8
- 238000005507 spraying Methods 0.000 claims abstract 2
- 238000000034 method Methods 0.000 claims description 2
- 230000009471 action Effects 0.000 abstract description 6
- 239000007788 liquid Substances 0.000 abstract description 6
- 230000008901 benefit Effects 0.000 abstract description 5
- 239000003814 drug Substances 0.000 abstract description 5
- 241000521257 Hydrops Species 0.000 abstract description 4
- 206010030113 Oedema Diseases 0.000 abstract description 4
- 230000007246 mechanism Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
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Abstract
The utility model relates to a device for improving etching precision of a semiconductor lead frame by etching and spraying, which relates to the technical field of semiconductor production equipment and also comprises a second connecting rod, a nozzle and a swinging connecting piece; the fixed cover in the outside of nozzle is equipped with the swing connecting piece, the equidistant rotatory setting of rear side of several swing connecting piece is on the preceding lateral wall of the whole frame of swing, the fixed connecting rod No. two that is provided with in inside of etching machine body, the kidney slot has been seted up to the tip of swing connecting piece, the swing connecting piece passes through kidney slot swivel sleeve and establishes on No. two connecting rods, the horizontal reciprocating mechanism of original device has been kept, do the arc action simultaneously when driving the nozzle to do horizontal action through the swing connecting piece, the liquid medicine that will spray the work piece is discharged fast in order to increase the benefit of fresh etching solution, inside the better entering circuit, effectively promote lead frame etching precision, clear away base plate face hydrops, effectively improve the yields of high density lead frame.
Description
Technical Field
The utility model relates to a semiconductor production facility technical field, concretely relates to semiconductor lead frame etching sprays and improves and promote etching precision device.
Background
The lead frame is as integrated circuit's chip carrier, it has played the bridge effect of being connected with the outside wire, all need use the lead frame in the most semiconductor integrated package, be important basic material in the electronic information industry, domestic high-end lead frame mainly relies on the import at present, ordinary punching press lead frame can not satisfy the requirement of high accuracy again, can only adopt etching process preparation lead frame, precision is higher like this, and it is limited to adopt ordinary swing to spray the mode etching precision promotion, this other swings that just need adopt the combination formula spray the structure and realize making high accuracy lead frame and satisfy the market demand.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to prior art's defect and not enough, a semiconductor lead frame etching of reasonable in design is sprayed and is improved promotion etching precision device is provided, the horizontal reciprocating mechanism of former device has been kept, do the arc action simultaneously when driving the nozzle through the swing connecting piece and be horizontal action, the liquid medicine that will spray the work piece is discharged fast in order to increase the benefit of fresh etching solution, inside the better entering circuit, effectively promote lead frame etching precision, clear away base plate face hydrops, effectively carry the yields of high density lead frame.
In order to achieve the above purpose, the utility model adopts the following technical proposal: the etching machine comprises an etching machine body, a swinging integral frame, a driving motor, an eccentric wheel and a first connecting rod; the upper side and the lower side of a conveying surface in the etching machine body are symmetrically and movably provided with a swinging integral frame; the upper side of the etching machine body is fixedly provided with a driving motor through a motor bracket, and an output shaft of the driving motor penetrates through the top of the etching machine body and is rotationally arranged on the inner bottom surface of the etching machine body through a bearing; eccentric wheels are respectively and symmetrically fixedly sleeved on the upper side and the lower side of an output shaft of the driving motor, a first connecting rod is fixedly arranged on the swinging integral frames on the upper side and the lower side, and one end of the first connecting rod is rotatably connected with an eccentric shaft of the eccentric wheel on the corresponding position; it also comprises a second connecting rod, a nozzle and a swinging connecting piece; the fixed cover in the outside of nozzle is equipped with the swing connecting piece, and the rear side equidistant rotation of several swing connecting piece sets up on the preceding lateral wall of swing whole frame, and the inside of etching machine body is fixed and is provided with No. two connecting rods, and the kidney slot has been seted up to the tip of swing connecting piece, and the swing connecting piece passes through the rotatory cover of kidney slot and establishes on No. two connecting rods.
After the structure is adopted, the beneficial effects of the utility model are that: a semiconductor lead frame etching spray and improve and promote etching precision device, the horizontal reciprocating mechanism who has kept former device is done the arc action simultaneously when driving the nozzle through the swing connecting piece and doing horizontal action, the liquid medicine that will spray the work piece is discharged fast in order to increase the benefit of fresh etching solution, inside the better entering circuit, effectively promotes lead frame etching precision, clears away base plate face hydrops, effectively promotes high density lead frame's yields, the utility model has the advantages of set up rationally, the cost of manufacture low.
Description of the drawings:
fig. 1 is a schematic diagram of a prior art structure.
Fig. 2 is a schematic structural diagram of the present invention.
Fig. 3 is a schematic structural diagram of an embodiment.
Description of reference numerals:
the etching machine comprises an etching machine body 1, a swinging integral frame 2, a driving motor 3, an eccentric wheel 4, a first connecting rod 5, a second connecting rod 6, a nozzle 7, a swinging connecting piece 8 and a kidney-shaped groove 9.
The specific implementation mode is as follows:
the technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 2 to fig. 3, the following technical solutions are adopted in the present embodiment: the etching machine comprises an etching machine body 1, a swinging integral frame 2, a driving motor 3, an eccentric wheel 4 and a first connecting rod 5; the upper side and the lower side of a conveying surface in the etching machine body 1 are symmetrically and movably provided with a swinging integral frame 2, and the swinging integral frame 2 is made of titanium; the upper side of the etching machine body 1 is fixedly provided with a driving motor 3 through a motor bracket and a bolt, an output shaft of the driving motor 3 penetrates through the top of the etching machine body 1 and then is rotatably arranged on the inner bottom surface of the etching machine body 1 through a bearing, the outer side wall of the bearing is fixedly connected with the etching machine body 1, and the inner side wall of the bearing is fixedly connected with the output shaft of the driving motor 3; eccentric wheels 4 are symmetrically fixedly sleeved on the upper side and the lower side of an output shaft of the driving motor 3 respectively, a first connecting rod 5 is fixedly arranged on the swinging integral frame 2 on the upper side and the lower side, and one end of the first connecting rod 5 is rotatably connected with a far-end eccentric shaft of the eccentric wheel 4 on the corresponding position; it also comprises a second connecting rod 6, a nozzle 7 and a swinging connecting piece 8; the outside of nozzle 7 is equipped with swing connecting piece 8 through the fixed cover of bolt, the equidistant rotatory setting of rear side of several swing connecting piece 8 is on the preceding lateral wall of swing overall frame 2, the inside of etching machine body 1 is provided with No. two connecting rods 6 through the bolt fastening, kidney slot 9 has been seted up to the tip of swing connecting piece 8, swing connecting piece 8 establishes on No. two connecting rods 6 through kidney slot 9 rotation sleeve, No. two connecting rods 6 are fixed, during swing overall frame 2 left and right sides reciprocating motion, swing connecting piece 8 is reciprocating arc motion round its and swing overall frame 2 revolve the contact point.
The working principle of the specific embodiment is as follows: firstly, connecting and installing the swinging connecting piece 8 and the nozzle 7, wherein the nozzle 7 is provided with a sealed water inlet system, then connecting the swinging connecting piece 8 and the nozzle 7 on the front side wall of the swinging integral frame 2 at equal intervals, then installing the second connecting rod 6, connecting the connecting rods with the kidney-shaped grooves 9 on each swinging connecting piece 8, then installing the first connecting rod 5, and connecting the external water pump main pipe with the sealed water inlet system on the nozzle 7; driving motor 3 and external power source switch-on, driving motor 3's output drives eccentric wheel 4 and rotates to make a pole that dries in the air drive swing whole frame 2 and do the reciprocating motion of left-right direction in the inside of etching machine, simultaneously, swing connecting piece 8 drives nozzle 7 and does the arc and sways under No. two connecting rod 6's effect, the liquid medicine that will spray the work piece is discharged fast in order to increase the benefit of fresh etching solution and is gone into inside the better entering circuit, clears away base plate face ponding.
After adopting above-mentioned structure, this embodiment's beneficial effect is as follows:
1. the nozzle 7 is driven to do arc motion through the second connecting rod 6 and the swinging connecting piece 8, a horizontal reciprocating mechanism of the original device is reserved, the swinging connecting piece 8 drives the nozzle 7 to do arc motion simultaneously when doing horizontal motion, and the liquid medicine sprayed to the workpiece is quickly discharged to increase the supplement of fresh etching liquid and better enters the interior of a circuit;
2. effectively promote lead frame etching precision, clear away base plate face hydrops, effectively improve the yields of high density lead frame.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (1)
1. A semiconductor lead frame etching spraying improved etching precision improving device comprises an etching machine body (1), a swinging integral frame (2), a driving motor (3), an eccentric wheel (4) and a first connecting rod (5); the upper side and the lower side of a conveying surface in the etching machine body (1) are symmetrically and movably provided with a swinging integral frame (2); the upper side of the etching machine body (1) is fixedly provided with a driving motor (3) through a motor bracket, and an output shaft of the driving motor (3) penetrates through the top of the etching machine body (1) and then is rotatably arranged on the inner bottom surface of the etching machine body (1) through a bearing; eccentric wheels (4) are symmetrically and fixedly sleeved on the upper side and the lower side of an output shaft of the driving motor (3), a first connecting rod (5) is fixedly arranged on the swinging integral frame (2) on the upper side and the lower side, and one end of the first connecting rod (5) is rotatably connected with an eccentric shaft of the eccentric wheel (4) on the corresponding position; the method is characterized in that: the device also comprises a second connecting rod (6), a nozzle (7) and a swinging connecting piece (8); the fixed cover in outside of nozzle (7) is equipped with swing connecting piece (8), and the rear side equidistant rotation of several swing connecting piece (8) sets up on the preceding lateral wall of swing whole frame (2), and the inside of etching machine body (1) is fixed and is provided with No. two connecting rods (6), and kidney slot (9) have been seted up to the tip of swing connecting piece (8), and swing connecting piece (8) are established on No. two connecting rods (6) through kidney slot (9) rotatory cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020487527.2U CN211907390U (en) | 2020-04-07 | 2020-04-07 | Semiconductor lead frame etching sprays and improves and promote etching precision device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020487527.2U CN211907390U (en) | 2020-04-07 | 2020-04-07 | Semiconductor lead frame etching sprays and improves and promote etching precision device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211907390U true CN211907390U (en) | 2020-11-10 |
Family
ID=73272248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020487527.2U Expired - Fee Related CN211907390U (en) | 2020-04-07 | 2020-04-07 | Semiconductor lead frame etching sprays and improves and promote etching precision device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211907390U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114050117A (en) * | 2021-11-17 | 2022-02-15 | 天水华洋电子科技股份有限公司 | Semi-etching equipment for lead frame of integrated circuit |
| CN116631927A (en) * | 2023-07-19 | 2023-08-22 | 广州丰江微电子有限公司 | Lead frame conveying system with cleaning function |
-
2020
- 2020-04-07 CN CN202020487527.2U patent/CN211907390U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114050117A (en) * | 2021-11-17 | 2022-02-15 | 天水华洋电子科技股份有限公司 | Semi-etching equipment for lead frame of integrated circuit |
| CN114050117B (en) * | 2021-11-17 | 2022-05-03 | 天水华洋电子科技股份有限公司 | Semi-etching equipment for lead frame of integrated circuit |
| CN116631927A (en) * | 2023-07-19 | 2023-08-22 | 广州丰江微电子有限公司 | Lead frame conveying system with cleaning function |
| CN116631927B (en) * | 2023-07-19 | 2024-02-02 | 广州丰江微电子有限公司 | Lead frame conveying system with cleaning function |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201110 |